Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include a polyethylene component, acrylonitrile-butadiene-styrene polymer(s), and at least one styrene monoolefin copolymer. The invention also relates to articles containing such alloys, and to methods of forming such blends and articles containing the same. These blends have excellent platability and superior physical properties including enhanced stiffness and toughness.

Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include polyolefin homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and a blend of at least one styrene monoolefin copolymer and at least one styrene diolefin copolymer. These blends have excellent platability and superior physical properties including enhanced rigidity, toughness, and dimensional stability.

Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include polyolefin homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and styrenic block copolymers. These blends have excellent platability and superior physical properties including enhanced rigidity, thoughness, and dimensional stability.

Abstract: The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses

Abstract: Substrates comprising blends of at least one polyphenylene ether and at least one poly(alkenylaromatic compound) (e.g., polystyrene) are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably acidified with nitric acid, to improve adhesion to metal coatings subsequently deposited nonelectrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.

Abstract: Process for producing a copper plated resin article by forming a uniform copper coating having excellent adhesive strength on a fiber-reinforced or unreinforced thermoplastic or thermosetting resin article having a heat deformation temperature higher than 165.degree. C. The resin article is heated along with a source of copper formate under a reduced pressure or in a non-oxidative atmosphere to a temperature in the range above 165.degree. C. but lower than the heat deformation temperature of the resin article. The process makes it possible to produce a resin article having formed thereon a copper layer having an excellent adhesive strength by a very simple manner, and the resin article thus obtained can be used in various industrial fields.