Abstract: A module tray for a semiconductor device includes a case and an insert block. The case includes a base plate, first and second sidewalls extending from opposite sides of the base plate in a vertical direction to define an accommodation space, and first and second fastening grooves respectively formed in inner surfaces of the first and second sidewalls. The first and second fastening grooves have upper ends opened to upper surfaces of the first and second sidewalls, respectively. The insert block has a substrate accommodating space for accommodating a semiconductor substrate. The insert block is detachably inserted into the first and second fastening grooves of the case. The insert block has first and second fastening joints extending in the vertical direction such that the first and second fastening joint are respectively inserted through the upper ends of the first and second fastening grooves.

Abstract: A portable multi-kit assembly for storing electronic parts according to the present invention includes a base in which a plurality of accommodation portions configured to accommodate electronic parts is formed. The plurality of accommodation portions includes a first accommodation portion configured to accommodate a first part. The first part is fastened to the first accommodation portion, and is coupled to a first coupling kit having a shape corresponding to that of the first accommodation portion and accommodated in the first accommodation portion. A grip portion is foiled on the first coupling kit, and allows the first part to be withdrawn from or retracted into the base in such a manner that the grip portion is pushed with a finger.

Abstract: An electrical connector assembly includes an insulative housing, a plurality of contacts retained to the housing, a metallic frame/fastener surrounding the housing, a retainer/clip positioned upon the housing and retaining a CPU thereon. The metallic frame includes four positioning posts at four corners, and the retainer includes a frame part to form a receiving space for receiving the CPU therein, and further includes four metallic retaining supports embedded within four corners of the retainer corresponding to the four positioning posts so as to allow the four positioning posts to extending therethrough in the vertical direction.

Abstract: A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.

Abstract: A tray for semiconductor devices includes a base with a positioning unit. The positioning unit includes a plurality of tiered projections which jointly define and surround an enclosed space for receiving a semiconductor device. Each tiered projection is a two-tier structure including an inclined surface portion and an upright surface portion connected to the inclined surface portion, and a semiconductor device can be received, and limited in position, between the upright surface portions. When the tray bounces due external vibrations such that the semiconductor device received in the enclosed space is moved away from the upright surface portions to the inclined surface portions, the inclined surface portions of the tiered projections can guide and adjust the semiconductor device, returning the semiconductor device to between the upright surface portions, in order for the tray to carry the semiconductor device stably.

Abstract: An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

Abstract: A stepped elastic positioning structure for a semiconductor carrier includes a plurality of transversely and longitudinally arranged walls and a plurality of recesses defined by the walls. On the walls of the semiconductor carrier is formed a plurality of L-shaped stop blocks, each of the stop blocks has an elastically deformable free end which is capable of elastically restricting the semiconductor in the recess, and improving the easiness for putting in or taking out the semiconductor. The end of each of the stop blocks is a stepped structure, plus the elastic deformability of the stop blocks, which makes the recess capable of holding different sized semiconductors.

Abstract: The present invention provides a jointed liquid crystal glass panel package box, which includes a box body and a plurality of brackets mounted to the box body. The box body includes a frame and a hollow plate arranged inside the frame. The frame includes two opposite first frame members, two opposite second frame members, and four L-shaped connection members connecting between the first frame members and the second frame members. The first and second frame members are of a linear configuration. Each first frame member includes a plurality of first frame member units and a plurality of first couplers each connecting between two first frame member units. Each second frame member includes a plurality of second frame member units and a plurality of second couplers each connecting between two second frame member units. A plurality of water-resistant pads is arranged between the first couplers and the first frame member units.

Abstract: The present invention is to provide an engaging structure applicable to a display device and including a housing and an inflatable element, wherein the housing serves as a protective case of the display device and is formed with at least one assembly hole, and the inflatable element is formed with at least one connecting portion, such that, when the housing is assembled into an accommodating space of the inflatable element and the inflatable element is fully inflated, the connecting portion is engaged in the corresponding assembly hole. Thus, the portions of the inflatable element that correspond in position to the accommodating space are tightly pressed against the sides of the housing other than the side where a screen is installed at the display device. Since the inflatable element is lightweight and occupies a tiny space while in a deflated state, it will effectively reduce storage space and transportation costs.

Abstract: Disclosed is a casing for an electronic wireless handheld device defined by a front panel, a rear panel, and a plurality of side panels connecting the front and rear panels wherein, the device is to be received within the casing such that the front and rear exterior surfaces of the device abut the interior surfaces of the front and rear panels respectively. The casing comprises at least one receptacle wherein, each of the at least one receptacle is adapted to receive therewithin at least one accessory of the device and the like.

Abstract: The invention relates to a lead frame magazine cover for closing of an opening of a lead frame magazine by insertion of a magazine cover into the lead frame magazine in a closing direction. The lead frame magazine cover includes a recess. The recess is constructed in the region of a front edge of the magazine cover in the closing direction of the magazine cover.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: The present invention provides a liquid crystal glass panel packaging box, which includes upper and lower cover members. The upper cover member has a top plate and upper side plates connected to the top plate. The lower cover member has a bottom plate and lower side plates connected to the bottom plate to collectively define a receiving chamber having an opening for receiving a liquid crystal glass panel. The bottom plate of the lower cover member having an outside surface that forms a raised portion corresponding to a circumference of the opening of the receiving chamber. The raised portion of the lower cover member of one liquid crystal panel packaging box is receivable in the opening of the receiving chamber of the lower cover member of another liquid crystal panel packaging box to effect stacking of lower cover members of different liquid crystal panel packaging boxes.

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: An EUV pod with pressure sensors disposed between its inner container and outer container, wherein pressure sensors disposed on the inner side of the outer container are used to detect the pressure between the outer container and the inner container, and the pressure data are used to determine whether the inner container is firmly fastened by the outer container.

Abstract: A reticle storing container is disclosed to include an outer container, an inner container, and a purging valve. The outer container comprises a container body and a container base on which at least a first through-hole is disposed, and a first inner space is formed between the container body and the container base for storing the inner container. The inner container comprises a top cover and a bottom base on which at least a second through-hole connected to the first through-hole is disposed, and a second inner space is formed between the top cover and the bottom base for storing a reticle. The purging valve is disposed in the first through-hole on the outer container base and connected to the second through-hole of said inner container, wherein the purging valve comprises a spring and a valve part. Thus, when the valve part is propped up by a purging head, the valve part compresses the spring for the purging valve to be connected to the purging head.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: A device and appertaining method for picking up devices in a component placement device permits even very small components and even a first component of a new belt to be picked up by scanning the structural features of the belt directly in the proximity of the components. The positional tolerances can be disregarded so that even the first component of a new belt can be reliably detected by the pick-up tool.

Abstract: A protective frame for portable electronic devices consists of a main frame and a cover. The main frame is provided with a window, a recessed entry formed in a lower side, at least one positioning projection located at the recessed entry and separated by a groove, and a sliding groove cut in the inner walls of other three sides. The cover is laid on the main frame, having an opening, an engaging projection protruding outward around three sides to slide in and engage with the sliding groove, at least one recessed groove cut in the inner wall to correspond to the positioning projections of the main frame, a positioning projection formed at the end of each recessed groove, and an interlocking groove bored next to the outer edge of each positioning projection. Hence, a portable electronic device can be wrapped up by the protective frame to prevent it from damaged.

Abstract: Disclosed are a holding tray, a substrate alignment system using the same and a method thereof. More specifically, the present invention relates to a holding tray for substrate capable of accomplishing high-precision alignment and conducting a stable deposition. A holding means is included in at least one side of the substrate to hold and support the substrate in a manner that the substrate is vertically held and supported on a flat surface of the holding tray during a vacuum process. The holding tray according to the present invention, the substrate alignment system using the same, and the method thereof include a substrate on which a deposition is made, a frame formed to receive the substrate, a tray formed to receive the frame, and at least one holding means formed to hold the substrate on the frame.

Abstract: A packaging container for a device comprising an enclosure assembled from separable front and back transparent shells the assembled shells defining a cavity for housing the device. A transparent insert configured with outer edges for abutting at least three inner walls of the enclosure and having an aperture conformed to a silhouette of the device for engaging and retaining the device around its periphery and in a generally central position in the cavity so that at least a back, front, top and sides of the device may be directly viewed within the cavity without visual obstruction.

Abstract: The present invention pertains to a sputtering target transport box having a void the size of a sputtering target, wherein supports for mechanical transport are provided to the bottom plate of the transport box, and a wheel for man-powered transport is provided to the edge portion of the bottom plate. Provided thereby is a sputtering target transport box in which the removal and transport of a sputtering target is easy, and which enables the transport of a sputtering target without causing any damage thereto.

Abstract: A substrate container is generally comprised of a cover, a base, a latching mechanism, and a substrate retention system. Substrate container has corners with flanges disposed at the corners. Each flange has a hole there through to enhance shock absorption capability by the container, and thus provide greater protection to the substrate.

Abstract: A method and article of manufacture for protecting a device from damage caused by physical shocks during shipment, handling, and use of the device are disclosed. A shock-absorbing container is provided with a foam material provided around the device when it is placed in the container. An opening in the container is aligned with respect to the device so as to expose a physical interface of a bay to the physical interface of the device in the container. The device and container are proportioned so that when the container, containing the device, is slid into a bay of a device array or data processing system, the physical interface directly connects with a mating physical interface in the bay without requiring an interposer between the physical interface of the device and the physical interface of the array or data processing system.

Abstract: A protective case or mounting device for a portable digital media device includes a first and a second snap fit cavity adapted to receive and selectively retain a first and a second protrusion element, respectively, associated with any of various accessory mounting or position retention elements. Connection between respective protrusions and snap fit cavities is made by depressible insertion. A portable digital media device may thus be removably engaged to various positioning elements without requiring the device to be removed from a protective case.

Abstract: An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.

Abstract: A carrier for a semiconductor device includes a body having an opening formed therein to receive the semiconductor device and a pair of rollers to hold the semiconductor device between the rollers in the opening.

Abstract: In a packing member that packs an ink cartridge, the packing member is constituted as an adhesive label, a perforation is provided on a portion of the label, an ink cartridge is packed by adhering the label on the cartridge, and the ink cartridge is unpacked by peeling off a central portion of the label along the perforation. A back sheet (release coated paper) of the label is adhered on the ink cartridge in a state in which a portion of the back sheet is left. Thus, unpacking (peeling-off of the label) is facilitated, and adhesive is prevented from remaining.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Abstract: A packaging system for a component is disclosed. The packaging system comprises a box and a compressible and shock-absorbent packing insert. The packing insert is placed in the box after nesting a component within the insert. The insert comprises a main panel, a first end tube hingedly coupled to the main panel, a second end tube hingedly coupled to the main panel opposite the first end tube, a first side tube hingedly coupled to the main panel, the first side tube being adjacent to the first end tube and a second side tube hingedly coupled to the main panel, the second side tube being adjacent to the second end tube and opposite the first side tube wherein the first and second side tube panels and the first and second side tube panels may include at one or more cutouts to enhance the flexing capability of the packing insert.

Abstract: This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.

Abstract: A package (1) for receiving a plurality of electrical socket connectors (4) comprises an elongate housing (2). The housing includes a set of first supporting portions (21) in each of opposite ends thereof, and an intermediate set of second supporting portions (22) between the two sets of first portions. Each first portion includes a rectangular bottom wall (210). A pair of through slots (211) is defined in the bottom wall at opposite longitudinal sides respectively of the first portion. The set of second portions comprises a single bottom wall (220) that spans an entire area of all the second portions. The socket connectors are fittingly received in the first portions and the second portions so that they abut the respective bottom walls. The bottom walls of the first portions and the bottom wall of the second portions cooperatively render the package strong enough to resist deformation.

Abstract: An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having an interior surface, an exterior surface, and an end surface extending between the interior and exterior surfaces. In one embodiment, the interface between the interior surface and the end surface is constructed and arranged having at least a portion of the interface surface substantially conforming to the shape of the angled portion of the leads.

Abstract: A reticle transferring support. The reticle transferring support has a supporting basefor containing a reticle, a plurality of braces for supporting the reticle, and a plurality of holders for fixing the position of the reticle. The braces are spheroids composed of soft plastic, and the position of the braces is adjustable so that the reticle will not be arranged. The holders each have an inclined plane so that the position of the reticle will be fixed automatically.

Abstract: A shield (100) having an outer surface (104) and a plurality of sidewalls (106) is disclosed. The plurality of sidewalls (106) extends from the outer surface (104). At least a portion of the plurality of sidewalls (106) are designed to retain the shield to at least a portion of a substrate (102). Further, at least a portion of the plurality of sidewalls (106) are designed to deflect away from the substrate (102) when pressure is applied to the outer surface (104) in such a manner that the outer surface (104) assumes a concave position (202).

Abstract: A flat rectangular sheet of packaging material that is divided into three panels by two horizontal fold lines, allowing it to be folded to form a standard-sized envelope for mailing or shipping Flash memory cards. The lower panel, which contains several removable rectangular sections that are designed to fit common Flash memory card dimensions, is folded upwards and attached to the central panel after removal of a section. After a Flash memory card has been inserted into the resulting cavity, the top panel of the sheet can be folded down and sealed, resulting in a robust envelope that can then be used to securely ship or mail the Flash memory card.

Abstract: A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the recess toward a bottom area of the recess. The pair of projections have respective support surfaces facing to each other in the first direction. A distance between the support surfaces of the pair in the first direction decreases in the second direction in such a manner that each of the support surfaces contacts simultaneously the electric device to prevent the electric device from moving in the first direction.

Abstract: An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test bed for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon.

Abstract: A tray for receiving semiconductor devices is formed of a main portion having supporting surfaces, and a plurality of columnar bosses formed on the top and bottom supporting surfaces of the main portion to surround and couple with outer perimeters of semiconductor devices. The columnar bosses are formed to be situated adjacent to each other when two trays are piled. The tray can be formed economically without deformation.

Abstract: Disclosed is a product carrier having a desiccant incorporated therein and a method for making the same. The inventive carrier reduces the number of steps required to package a semiconductor device.

Abstract: A carrier for articles has a main body (10) with one or more engagement means (28) for receiving one or more indicators (40, 60). The indicators (40, 60) have one or more contrasting colors compared to the color of the main body (10). The color or shape or both of the indicator provides the user with information regarding the articles, carrier or characteristics of the articles or carrier.

Abstract: A memory card casing includes a plastic framework, and upper and lower metal covers that could be conveniently assembled to two sides of the plastic framework. The metal covers are fastened to each other via fastening means spaced on perpendicular wall portions of the metal covers. Each of the fastening means includes first and second fastening plates. The plastic framework is provided with retaining means, each of which includes a neck portion inward projected from and perpendicular to inner wall surface of the plastic framework and an expanded head portion in front of the neck portion.

Abstract: A package has a holder for holding an ink cartridge, a container for accommodating the holder, and a mount for sealing an opening of the container. The holder is made from recycled materials and the internal shape of the holder conforms to the external shape of the cartridge. The container has a transparent portion and substantially conforms to the holder. The mount is made from recycled materials. The mount is attached to the container in a depressurized environment. The cartridge is visible through the transparent portion of the container. Since the holder and the mount are made from recycled materials, the package is environmentally sound. The holder may hold a used cartridge.

Abstract: The invention describes a wafer protective container for holding integrated circuit (IC) wafers. The wafer protective container comprises a container body, a locking device, a container cover, and a plurality of fasteners assembled together to prevent movement of the IC wafers during transportation. The container body has at least an opening to allow easy loading and unloading of the IC wafers, while the locking device is used to keep the IC wafers in position in the container body. The container cover, which covers the container body, provides more protection for the IC wafers. The container cover has a plurality of notches to enhance ease of opening the IC wafer protective container. Since the fasteners can secure the container cover to the container body, a seal between the container cover and the container body is not broken as a result of rigorous movement during transportation, thus reducing the risk of contaminating the IC wafers.

Abstract: A holder for holding a leadless circuit element includes opposing flanges which can be bent downwardly for bending the flanges into hands and fingers for holding the leadless circuit element within a plastic mold. In still further accord with the device, the device includes an insert displacement connection integral to a frame for allowing the leadless circuit element to be included in a circuit. Further, the assembly is insert molded in plastic.

Abstract: An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enables reception of both quad-flat-pack (QFP) and thin-quad-flat-pack (TQFP) ICs within frames of a variety of existing carriers, or alternatively, may allow both QFP and TQFP ICs to utilize a single IC carrier frame, a feature which currently prevailing embodiments would require two unique IC carriers.

Abstract: A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and covered. The cover does not touch the semiconductor objects because it has a spacer made of non-stick material. The invention stores semiconductor objects for a relatively long period of time in a safe and secure manner with minimal threat of breakage.

Abstract: A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and modified die-pac designs having UV light penetrable die transport portions, or tape-and-reel type die transport structures.

Abstract: A carrier for articles has a main body (10) with one or more engagement means (28) for receiving one or more indicators (40, 60). The indicators (40, 60) have one or more contrasting colors compared to the color of the main body (10). The color or shape or both of the indicator provides the user with information regarding the articles, carrier or characteristics of the articles or carrier.