Lead Sandwiched Between Panels Patents (Class 206/727)
  • Patent number: 8390104
    Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: March 5, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Satoru Kudose, Kenji Toyosawa
  • Patent number: 8260438
    Abstract: An electrode pad packaging system including an electrode pouch, an electrode pad (e.g., a defibrillation electrode pad), a wire and a shell is disclosed. The electrode pad is disposed at least partially within the electrode pouch. The wire extends from the electrode pad and, in a disclosed embodiment, at least a portion of the wire is attached to the shell. The shell is disposed in mechanical cooperation with the electrode pouch (e.g., the shell is secured to a portion of the electrode pouch). The shell includes a valve thereon that is configured to allow air to exit the electrode pouch. The valve may be configured to prevent air from entering the electrode pouch. A method of packaging an electrode pad is also disclosed. The method includes providing an electrode pouch, an electrode pad, a wire and a shell. A valve on the shell allows air to exit the electrode pouch.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: September 4, 2012
    Assignee: Tyco Healthcare Group LP
    Inventors: Peter Meyer, Lee C. Burnes, Scott Coggins, David Selvitelli
  • Publication number: 20020117408
    Abstract: A package for increasing shelf life of electrodes packaged therein. A first package within which one or more gel-containing electrode pads are sealed. In addition, at least one moisture source is sealed within the package.
    Type: Application
    Filed: February 27, 2001
    Publication date: August 29, 2002
    Inventors: Thomas A. Solosko, Anthony G. Picardo, Steven Thomas Mydynski, Kim J. Hansen, Seiya Ohta
  • Patent number: 6048640
    Abstract: An electrode package includes a pouch having pouch walls forming a sealed pouch enclosure. At least one electrode is within the pouch enclosure and includes an electrode wire having one end connected to the electrode within the pouch, an intermediate portion extending through the pouch walls, and a second end outside the pouch enclosure. A sealing joint is formed at the point where the intermediate portion of the wire extends through the pouch walls. The pouch walls have a plastic layer which surrounds and contacts the intermediate portion of the wire at the sealing joint to form an air tight seal. The invention also includes a method whereby heat and pressure are applied at the sealing joint to cause the plastic layer of the pouch walls to melt and fuse around the wires to create the seal.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: April 11, 2000
    Assignee: Katecho, Inc.
    Inventors: Warren R. Walters, Michael J. Luhrs
  • Patent number: 5984102
    Abstract: The invention provides a sealed package system for housing at least two medical electrode devices and for enabling the periodic testing thereof, comprising a thin, generally flat flexible envelope constructed and arranged to form an interior cavity for enclosing a conductive gel contact surface of each of the electrode devices. A conductive liner is disposed between conductive gel contact surface of each of the electrode devices.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 16, 1999
    Assignee: SurVivaLink Corporation
    Inventor: Sew-Wah Tay
  • Patent number: 5641941
    Abstract: A method and apparatus for operably connecting electronic devices through a closed container is achieved by securing one end of a laminate connector (28) to a first electronic device, e.g., a fireset circuit (22). Device (22) is placed in a housing (12) which defines a housing closure surface (16). A cover (14a), which defines a cover closure surface (18) dimensioned and configured to engage the housing closure surface (16), is placed on the housing (12) to define a housing-cover joint (20a), and the laminate connector (28) is disposed within the housing-cover joint (20a). The housing-cover joint (20a) is sealed with an adhesive and the second end of the laminate connector (28) is connected to a second electronic device. The thinness of the laminate connector allows it to pass through the housing-cover joint (20a) without significant adverse affect on the seal therein or on the pressure-bearing ability of the housing (12) or the cover (14a).
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: June 24, 1997
    Assignee: The Ensign-Bickford Company
    Inventors: Charles A. Dieman, Jr., Andrew C. Johnsen
  • Patent number: 5579919
    Abstract: The invention provides a sealed package system for housing at least one medical electrode apparatus and for enabling the periodic testing thereof, comprising a thin, generally flat flexible envelope constructed and arranged to form an interior cavity for enclosing a conductive gel contact surface of an electrode apparatus, the envelope having at least one continuous layer of a homogeneous, non-conductive, polymeric material, the envelope further having first and second sides; and a structure for conducting current across the envelope to the interior cavity, the conductive structure being electrically connectible to the electrode conductive contact surface.
    Type: Grant
    Filed: March 27, 1995
    Date of Patent: December 3, 1996
    Assignee: SurVivaLink Corporation
    Inventors: Byron L. Gilman, Karl J. F. Kroll