Abstract: A storage frame structure for an automatic depot includes: several space limiting units, each having a plug-in surface formed with vertical slots and two opposite ends, at least one of the opposite ends being formed with an insert hole; several fixing rods abutting with the limiting units respectively; two side plates connected to the fixing rods in such a manner that the fixing rods extend parallel to one another between the side plates; and two positioning plates, each having two opposite insert ends extending into the vertical slots of an adjacent pair of the limiting units, thereby defining a reception chamber therebetween to retain a material tray stably in the chamber. The storage frame structure has simple construction and is applicable in automation industry (like SMT electronic industry) for material storing and sorting.

Abstract: A grip member in one aspect of the present invention comprises a base portion and one or more pairs of grip portions. Of one and the other of the pair of grip portions, the one grip portion comprises a first spring portion and a second spring portion. The other grip portion comprises a third spring portion and a fourth spring portion. The second and fourth spring portions can grip the shield case by holding the shield case therebetween. The second and fourth spring portions are in contact with the shield case at different positions in regard to at least a direction orthogonal to the joint surface when the second and fourth spring portions grip the shield case.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: An electrode pad packaging system including an electrode pouch, an electrode pad (e.g., a defibrillation electrode pad), a wire and a shell is disclosed. The electrode pad is disposed at least partially within the electrode pouch. The wire extends from the electrode pad and, in a disclosed embodiment, at least a portion of the wire is attached to the shell. The shell is disposed in mechanical cooperation with the electrode pouch (e.g., the shell is secured to a portion of the electrode pouch). The shell includes a valve thereon that is configured to allow air to exit the electrode pouch. The valve may be configured to prevent air from entering the electrode pouch. A method of packaging an electrode pad is also disclosed. The method includes providing an electrode pouch, an electrode pad, a wire and a shell. A valve on the shell allows air to exit the electrode pouch.

Abstract: A packaging assembly for displaying and holding a light fixture and an accessory thereof generally includes a bottom base portion and an upper portion. The bottom base portion has an open compartment dimensioned to receive a base of a light fixture. The upper portion is coupled to the bottom base portion and includes a hollow compartment dimensioned to receive an accessory for the light fixture.

Abstract: A shipping container for electrical storage cells includes a box and a plurality of tray elements adapted to be received in the box. The box defines an interior space having an inner periphery and a height. Each tray element has an outer periphery that substantially conforms to the inner periphery of the interior space of the box, and each tray element has at least one upwardly facing recess that substantially conforms to the shape an individual electrical storage cell.

Abstract: An HGA protecting method and member and method of implementing the protecting method and member in a hard disk drive. The HGA includes an actuator, at least one pair of suspensions coupled to the actuator, a flexure having a stationary end fixed to each of the suspensions and a free end, and a slider attached between the stationary end and the free end of the flexure. The HGA protecting member may include a finger restricting excessive movement of the suspension. The finger may further have a flexure supporting portion supporting the free end of the flexure. The HGA protecting member may also be a removable assembly that may be removed after the HGA after assembly of the hard disk drive is complete.

Abstract: A protective enclosure capable of storing an electronic device while protecting it from damage emanating from impacts, impingements, dust and moisture is provided herein. More specifically, the present invention allows a user to use a portable electronic device without requiring the user to open the enclosure and expose the contents to inclement weather.

Abstract: A carrier tray is provided for holding a semiconductor device that has a two dimensional array of regularly spaced rows and columns of holes having one and only one pitch and one and only one pocket size. The holes are configured to receive a solder ball from a ball grid array package. The carrier tray can engage at least two differently sized ball grid array packages, thereby avoiding the expense and long lag time associated with designing a new product carrier tray for each new semiconductor device.

Abstract: A water soluble thermoplastic wiring board spacer for temporarily supporting an electrical component in fixed spaced relation to a printed wiring board which comprises a toroidally shaped spacer composed of a water soluble injection molded thermoplastic material. The material is preferably a polymer and the preferred polymer is a blend of partially hydrolyzed polyvinyl alcohol resin and fully hydrolyzed polyvinyl alcohol resin. The spacer has a melting temperature determined by the ratio of partially hydrolyzed polyvinyl alcohol resin to fully hydrolyzed polyvinyl alcohol resin and a solubility rate in water determined by the ratio of partially hydrolyzed polyvinyl alcohol resin to fully hydrolyzed polyvinyl alcohol resin. The spacer can have a plurality of spaced apart ridges and recessed surfaces on a surface thereof.

Abstract: A combination of a carrier and cylindrical resistors, the carrier having a base that has a plurality of holding regions, two parallel rails for supporting a resistor in each holding region, each parallel rail having a non-ramped bottom surface, a ramped side surface and an arced surface between the non-ramped bottom surface and the ramped side surface, the two parallel rails being inward of two flexible tangs in each holding region, each of the two flexible tangs having an arm positioned for pushing on each of two wire conductors of each cylindrical resistor, to cause a body of each cylindrical resistor to be pushed against the arched surfaces of the parallel rails.

Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.

Abstract: An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.

Abstract: An exemplary embodiment of the invention is a fixture for mounting a pin grid array device. The fixture includes a base plate and a first support plate movably mounted to the base plate. The first support plate has a hole therein for receiving a pin on the pin grid array device. The hole has a longitudinal axis in a first direction. A contact is positioned in the hole a drive mechanism moves the first support plate in a second direction substantially perpendicular to the first direction to move the contact. The contact engages the pin of the pin grid array device to establish electrical contact.

Abstract: An electrode package includes a pouch having pouch walls forming a sealed pouch enclosure. At least one electrode is within the pouch enclosure and includes an electrode wire having one end connected to the electrode within the pouch, an intermediate portion extending through the pouch walls, and a second end outside the pouch enclosure. A sealing joint is formed at the point where the intermediate portion of the wire extends through the pouch walls. The pouch walls have a plastic layer which surrounds and contacts the intermediate portion of the wire at the sealing joint to form an air tight seal. The invention also includes a method whereby heat and pressure are applied at the sealing joint to cause the plastic layer of the pouch walls to melt and fuse around the wires to create the seal.

Abstract: A protective carrier for a magnetic head magnetic head assembly includes a housing having buffering members attached to the housing. When the carrier is engaged with the magnetic head magnetic head assembly, the buffering members are rotated into the spacings between the magnetic heads so as to prevent direct physical contact of the magnetic heads. When the carrier is disengaged from the magnetic head magnetic head assembly, the buffering members are rotated out of the spacings between the magnetic heads. The carrier prevents collision of the magnetic heads during handling and transportation and consequently reduces production loss.

Abstract: A .mu.BGA carrier for packing and shipping of a plurality of .mu.BGA packages is specially adapted for facilitating the inspection of the solder balls on the bottom surfaces of the .mu.BGA packages. The carrier consists of a tray member having a plurality of first pockets disposed therein for packing and storing the plurality of .mu.BGA packages, and a lid member having a plurality of second pockets formed therein. The second pockets are vertically aligned with corresponding ones of the plurality of first pockets in the tray member when the lid member is placed on top of the tray member. The carrier can be flipped upside-down so that when the tray member is removed the solder balls are facing upwardly to allow inspection of the same.

Abstract: A semiconductor chip tray holding chips in individual bins that can each be independently moved with six degrees of freedom. The bins are held in the tray with a flexural bearing system. The flexural bearing system centers the chips at a nominal position allows compliant motion of the bins. The flexural bearing system is made of four beams, with pairs joined at right angles through flexural bearings.

Abstract: A carrier tape (12) is disclosed including a plurality of longitudinally spaced pockets (22) extending parallel to index holes (20). Each pocket (22) includes side walls (24) and a bottom (26) having provisions (28) for holding a microchip (32). Abutments (38) having semicircular cross sections are integrally formed on the side walls (24) for engaging the free ends of the leads (34) of the microchip (32) to prevent their engagement with the side walls (24). A greater number of abutments (38) at lesser spacings are provided than the leads (34) of the microchip (32) to prevent the leads (34) from hooking between the abutments (38). The abutments (38) are arranged to minimize the number of leads (34) actually engaged and to minimize the actual area contacted by the free ends of the leads (34) with the abutments (38). The shape of the abutments (38) also optically disperses major portions of the reflection of the leads (34).

Abstract: A protector for carrying a flat wire harness with a flat wire part and connectors, includes a bottom porion and a rim porion around the bottom portion. The bottom member is provided for positioning and holding the flat wire harness such that the flat wire apart is stretched and the connectors are fit in recesses formed in the bottom portion. The rim portion extends upward and radially outward from the bottom portion for enabling plural protectors to be stacked vertically with a flat wire harness stored in each bottom portion.

Abstract: A carrier for carrying IC packages having a bevelled flange and bevelled dog combination which firmly engages a flange of the package in order to hold the package extremely securely to the carrier such that any force applied to the carrier is transmitted wholly and accurately to the package and so that the package does not dislodge easily from the carrier when subjected to acceleration or vibration.

Abstract: A tray for housing semiconductor devices of a ball grid type, each having a surface provided with a plurality of wiring solder balls, the surface of each of the semiconductor devices having peripheral edges, and each of the wiring solder balls having a diameter, includes a tray surface, and pockets formed in the tray surface, each pocket having corners and a shape similar to and slightly larger than the surface of each semiconductor device. Each pocket has a bottom surface forming a depression and having a shape similar to and slightly smaller than the surface of each of the semiconductor devices and a depth larger than the diameter of each wiring solder ball. Each of ribs has a root formed on each corner of each pocket for dividing the pockets from each other and each having a width gradually increasing toward the bottom surface of each pocket.

Abstract: An IC carrier has a retainer. This retainer is brought into engagement with an IC package body when an IC package is received in an IC receiving portion of the IC carrier, so that the IC package is assuredly retained by the IC carrier. A plurality of IC leads projecting sidewards from the IC package are fully accommodated within a lead-loosely-inserting space in a non-contacting state relative to the IC carrier.

Abstract: Each of trays forming a tray assembly has a main body having a recess for holding an article to be transported. Connectors protruding from a front and rear sides of the main body mate with each other so that the trays are linked to be flexible relative to each other. Elastic and rockable members formed integral with each main body have locking pawls capable of engaging with the article. Each locking pawl integral with the rockable member and positioned in the recess is always urged to engage with and hold in place the article, such that the pawls can be elastically retracted for an easier loading and unloading of the articles onto and from the recesses.

Abstract: An E-block shipping comb includes a frame adapted to support an E-block assembly. A guide element of the frame is adapted for positioning the E-block assembly in the frame. A movable latch is movable between first and second positions. In the first position, the E-block assembly is free to be placed into or withdrawn from the frame. In the second position, the E-block assembly is held in position in the frame.

Abstract: A tray is provided for supporting electrical connectors of the type having an elongated dielectric housing within which electrical terminals are secured. The housings can vary in length according to the size of the connectors. The tray is adaptable for supporting different sizes of connectors with housings of different lengths. The tray includes a first support for supporting adjacent ends of a plurality of the electrical connectors in a side-by-side array thereof. A second support is movably mounted on the tray to a plurality of different positions spaced from the first support for supporting opposite ends of different sizes of the connectors.