Methods Patents (Class 219/162)
  • Patent number: 10537931
    Abstract: A heating method, a heating apparatus, and a method for manufacturing a press-molded article using the heating method are provided. Electrodes are placed on a workplace to extend across a heating target region in a first direction. At least one of the electrodes is moved in a second direction perpendicular to the first direction over the heating target region while applying electric current to the electrodes. A distribution of contact pressure between at least one of the electrodes and the workpiece along the first direction is adjusted, with a plurality of segment regions being defined by dividing the heating target region such that the segment regions are arranged side by side in the first direction, and in accordance with a length of each of the segment regions between the electrodes, to adjust a healing temperature of each of the segment regions of the heating target region.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: January 21, 2020
    Assignee: NETUREN CO., LTD
    Inventors: Hironori Ooyama, Fumiaki Ikuta
  • Patent number: 10424995
    Abstract: A method for manufacturing a laminated core includes a laminating process of obtaining a laminate in which a plurality of core pieces are laminated, and a welding process of forming a weld bead which extends in a thickness direction of the laminate on a side surface of the laminate. In the welding process, a heat input when a center portion in a longitudinal direction of the weld bead is formed is greater than a heat input when an end portion of the weld bead is formed.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: September 24, 2019
    Assignee: MITSUI HIGH-TECH, INC.
    Inventor: Yusuke Hasuo
  • Patent number: 10322264
    Abstract: The present disclosure is directed to a needle introducer. The needle introducer includes a needle guide and a cannula body coupled to the needle guide. The needle guide includes a flared head and a tapered neck. The needle guide forms a first channel extending from a first opening in the flared head to a second opening in the tapered neck. The cannula body includes a beveled tip at a distal end of the cannula body. The cannula body forms a second channel extending from a first opening in a proximal end of the cannula body to a second opening in the distal end of the cannula body. The cannula body is coupled to the needle guide via the tapered neck of the needle guide to connect the first channel to the second channel. The cannula body is configured to maintain an injection portal in the soft tissue.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: June 18, 2019
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventors: Gary Chuang, Hassan Galadari
  • Patent number: 9821508
    Abstract: An automated heat shrink device, useful for forming a connection between two tubular sections having a polymeric outer surface jacket, for example, a connection between two sections of a district heating pipeline, and a method of use thereof. The device is configured such that it requires minimal clearance to either side of the pipeline when being used.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: November 21, 2017
    Assignee: ShawCor Ltd.
    Inventors: Dilip Tailor, Pascal Laferriere, Jeremy Joseph Ellis, Mark Brandon, Pawel Boczkowski, Patrick Marc Arbour
  • Patent number: 9623373
    Abstract: An electrically heatable honeycomb body assembly includes an electrical connection of sheet metal layers at a connection pin. A honeycomb body has a metal casing with an inner periphery, through which the connection pin is led in a bushing and electrically insulated. The sheet metal layers are alternately coarsely structured and finely structured or smooth sheets together forming a stack with uppermost and lowermost layers and channels for an axial gas flow between the layers. The connection pin runs radially approximately perpendicular to the layers and is metallically connected to at least two or all of the layers through at least one intermediate piece. The uppermost sheet metal layer preferably runs approximately parallel to the metal casing over at least 35% of the inner periphery and is separated therefrom only by an air gap. Simple production of an operationally safe and very uniformly electrically heatable honeycomb body is provided.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: April 18, 2017
    Assignee: EMITEC Gesellschaft fuer Emissionstechnologie mbH
    Inventors: Rolf Brueck, Ferdi Kurth, Peter Hirth, Thomas Haerig
  • Patent number: 9393521
    Abstract: A honeycomb body includes sheet metal layers forming a central current path to a radial connecting pin. A metal casing has an inner periphery and a feedthrough guiding and insulating the pin. The layers are alternate coarsely structured and finely structured or smooth sheets forming a stack with uppermost and lowermost layers forming axial gas channels. The pin is metallically connected to two or all of the layers directly or through an intermediate piece by an electrically conductive or welded connection. The current path has an electrical resistance per unit length in the connection region being greater than an average electrical resistance per unit length in the stack. The uppermost layer runs approximately parallel to the casing over 35% or 40% of the inner periphery and is separated from the casing by an air gap. Simple manufacture of a highly uniform, reliably operating, electrically heatable honeycomb body is thus possible.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: July 19, 2016
    Assignee: EMITEC Gesellschaft fuer Emissionstechnologie mbH
    Inventors: Rolf Brueck, Ferdi Kurth, Peter Hirth, Thomas Haerig
  • Publication number: 20150014292
    Abstract: The heating method of honeycomb structure includes a heating step of supplying a power to a honeycomb structure body of a honeycomb structure including the tubular honeycomb structure body having porous partition walls to define and form a plurality of cells and a circumferential wall positioned at an outermost circumference, and heating by electricity conduction, and a catalyst loaded onto the partition walls of the honeycomb structure body, to heat the honeycomb structure body up to a target temperature, and in the heating step, there is provided, at least once, a supply power decrease section where the supply of the power to the honeycomb structure body is stopped or the power to be supplied to the honeycomb structure body is decreased before the lowest temperature in a heating region of the honeycomb structure body reaches the target temperature.
    Type: Application
    Filed: September 25, 2014
    Publication date: January 15, 2015
    Inventors: Takeshi SAKUMA, Katsumi SAIKI
  • Publication number: 20140339210
    Abstract: A direct resistance heating apparatus includes a first electrode and a second electrode, and a moving mechanism configured to move at least one of the first electrode and the second electrode. A direct resistance heating method includes steps of providing a workpiece having a heating target region, a resistance of which per unit length in one direction thereof varying along the one direction, placing a first electrode and a second electrode on the heating target region, and moving at least one of the first electrode and the second electrode such that a time during which the electric current is applied to each part of the heating target region is adjusted in accordance with a change of the resistance per unit length, thereby heating the workpiece such that the each part of the heating target region is heated to a temperature within a target temperature range.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 20, 2014
    Inventors: Kunihiro Kobayashi, Hironori Ooyama, Tokio Sekigawa
  • Publication number: 20140332795
    Abstract: A transparent electrode for an organic light-emitting diode including, on a transparent support made of mineral glass, n individual stacks of thin layers, each individual stack successively including, starting from the glass support, (a) a layer of mixed tin zinc oxide, (b) a crystalline layer of zinc oxide, optionally doped with aluminum, (c) a metallic silver layer, in contact with the zinc oxide layer, and positioned between each silver layer and the mixed tin zinc oxide layer or layers closest thereto is (d) a layer made of silicon nitride or made of silica, optionally doped with a metal. There is also provided It also relates to an an organic light-emitting diode device containing such an electrode and to a process for manufacturing such a device.
    Type: Application
    Filed: December 27, 2012
    Publication date: November 13, 2014
    Inventors: Denis Guimard, Julien Booz, Augustin Palacios-Laloy
  • Patent number: 8878100
    Abstract: Methods are provided for joining two panels by welding together a seam formed at a flange of each panel using a welding tractor adapted to travel along the seam to be welded. A welding tractor adapted for use in the methods is also provided, as is a welded panel product fabricated using the methods provided.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: November 4, 2014
    Assignee: John Bean Technologies Corporation
    Inventors: Larry D. Martin, Brian E. Lone, James P. Gast
  • Publication number: 20140246414
    Abstract: A softening apparatus includes a cooling liquid reservoir for holding a cooling liquid, a first conducting sheave provided outside of the cooling liquid reservoir for applying a voltage to a wire while guiding the wire, and a second conducting sheave provided in the cooling liquid reservoir for letting a current flow through the wire while guiding the wire as the wire is fed via the first conducting sheave. The softening apparatus is also provided with a liquid level detector for detecting a liquid level of the cooling liquid in the cooling liquid reservoir. A heating path length of the wire between the first conducting sheave and the second conducting sheave is controlled based on a result of detection by the liquid level detector.
    Type: Application
    Filed: February 29, 2012
    Publication date: September 4, 2014
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Eiji Kobayashi
  • Patent number: 8796578
    Abstract: A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: August 5, 2014
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Philip R. Germann, Andrew B. Maki
  • Publication number: 20140202997
    Abstract: Surface asperities, such as roughness characteristics, are reduced or otherwise mitigated via the control of surface regions including the asperities in different regimes. In accordance with various embodiments, the height of both high-frequency and low-frequency surface asperities is reduced by controlling characteristics of a surface region under a first regime to flow material from the surface asperities. A second regime is implemented to reduce a height of high-frequency surface asperities in the surface region by controlling characteristics of the surface region under a second regime to flow material that is predominantly from the high-frequency surface asperities, the controlled characteristics in the second regime being different than the controlled characteristics in the first regime. Such aspects may include, for example, controlling melt pools in each regime via energy pulses, to respectively mitigate/reduce the asperities.
    Type: Application
    Filed: January 24, 2013
    Publication date: July 24, 2014
    Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION
    Inventors: Venkata Madhukanth Vadali, Chao Ma, Neil Arthur Duffie, Xiaochun Li, Frank Ewald Pfefferkorn
  • Patent number: 8772674
    Abstract: When applying a current to a plated steel plate, plating often biases. In the present invention, when applying a current, the current is applied with a flux guiding member arranged in proximity to a side surface of the plated steel plate. The direction of the magnetic flux at the side surface of the plated steel plate is corrected, and the bias of the plating is efficiently suppressed.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: July 8, 2014
    Assignee: Asteer Co., Ltd.
    Inventor: Kouji Shimotsu
  • Publication number: 20140151905
    Abstract: A device includes a tube extending in a longitudinal direction and a hollow channel arranged in the tube. An end part of the tube is formed such that first electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a first focus.
    Type: Application
    Filed: December 4, 2012
    Publication date: June 5, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Sternad, Rainer Pelzer
  • Patent number: 8653399
    Abstract: An apparatus and related method are provided for a manufacturing process including heating of a processed part. A resistance heating assembly applies an electrical current to a work part comprising a sheet of high-tensile steel having a heat-resistant plating to improve formability. A heating control system regulates the electrical current to the work part in order to control the temperature of the work part. A temperature detector detects a temperature of the work part and generates feedback to the heating control system in order to regulate the electrical current. An electrical resistance detector measures an electrical resistance within the work part and generates feedback to the heating control system in order to regulate the electrical current.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: February 18, 2014
    Assignee: Honda Motor Co., Ltd
    Inventors: Alan Seid, Masayuki Narita
  • Publication number: 20140027431
    Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 30, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu
  • Publication number: 20140008345
    Abstract: The present invention provides an apparatus and a method for repairing a broken line of an array substrate. The apparatus includes a repair unit and a heating unit. The repair unit forms a repair line on a broken-line defect of a wire on the array substrate. The heating unit heats the repair line, so that the molecules constituting the repair line are arranged in sequence according a predetermined rule. The present invention can achieve the repair for a longer broken-line defect.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 9, 2014
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Wen da Cheng
  • Publication number: 20130277348
    Abstract: Preheated interval welding methods for welding a weld material to a substrate material can include preheating the substrate material to a preheat temperature less than a solidus temperature of the substrate material, melting the weld material to produce molten weld material at a melting distance away from the substrate material, and applying the molten weld material in a plurality of intervals to the substrate material.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 24, 2013
    Inventors: Steven Charles Woods, Mark Lawrence Hunt
  • Patent number: 8519304
    Abstract: A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: August 27, 2013
    Assignee: International Business Machines Corporation
    Inventors: Gerald Keith Bartley, Darryl John Becker, Philip Raymond Germann, Andrew Benson Maki
  • Publication number: 20130129411
    Abstract: A hole that has two opposing sides is opened in a first part to be welded, two slits are formed in corresponding portions in a second part to be welded at positions corresponding to the hole, and a bridge portion that is made to protrude by plastic deforming a portion between the two slits is provided. A raised portion of the bridge portion of the second part to be welded is inserted into the hole of the first part to be welded, such that the two sides of the hole in the first part to be welded overlap with the two slits in the bridge portion of the second part to be welded, and the first part to be welded and the second part to be welded are welded together while the first part to be welded and the second part to be welded are engaged.
    Type: Application
    Filed: August 5, 2011
    Publication date: May 23, 2013
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenta Shima, Atsushi Kawakita, Tomohiko Sekiguchi
  • Publication number: 20130092675
    Abstract: A method for heating an entire spring, including regions adjacent to electrodes attached thereto, in a single electrical heating process includes (i) causing at least a pair of electrodes to make contact with the spring, and then (ii) electrically heating the spring by applying a voltage across the pair of electrodes. Each of the electrodes includes a first part having a first electric resistance value and a second part having a second electric resistance value that is higher than the first electric resistance value.
    Type: Application
    Filed: March 15, 2011
    Publication date: April 18, 2013
    Applicant: CHUO HATSUJO KABUSHIKI KAISHA
    Inventors: Yuichi Hirata, Hiroyuki Ogiso, Atsushi Fukatsu
  • Publication number: 20130082042
    Abstract: A welding jig and welding process for planar magnetic components are provided. The welding jig includes a fixed piece and an elastic piece. The fixed piece includes a base and a carrier. The base has an opening, bumps at the bottom of the opening and a pair of operation ends extending from the opening. The carrier is fixed on the base and located in the opening, and has multiple through holes. When the bumps are located respectively in the through holes, an accommodation interval is formed between adjacent pairs of the bumps for the placement of the planar magnetic components. The elastic piece is secured to the fixed piece, and when the planar magnetic components are placed in the accommodation intervals of the fixed piece, the elastic piece covers the planar magnetic components and the planar magnetic components abut against two side edges of the elastic piece.
    Type: Application
    Filed: March 12, 2012
    Publication date: April 4, 2013
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Chung-Kuang HSIEH, Lan GUO, Kao-Kuan FAN, Hui-Hua TENG
  • Publication number: 20130068756
    Abstract: In a method for heating a metal plate, the metal plate is placed between an lower contact element and an upper contact element. The contact elements are provided with heating units and integrated in mounts. At least one of the contact elements is shaped to suit a contour of the metal plate and made of a heat conducting material with a conductivity of at least 150 W/mK. The metal plate is heated between the contact elements to a temperature of 200° C. to 450° C. for a time period of less than 120 s in the presence of a contact pressure.
    Type: Application
    Filed: September 17, 2012
    Publication date: March 21, 2013
    Applicant: Benteler Automobiltechnik GmbH
    Inventor: Benteler Automobiltechnik GmbH
  • Patent number: 8389903
    Abstract: The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequently
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: March 5, 2013
    Assignee: picoDrill SA
    Inventor: Christian Schmidt
  • Publication number: 20120291557
    Abstract: A method is described for producing a pressure sensor assembly, the pressure sensor assembly having a sensor housing element having a pressure sensor and a base housing element, which have a continuous recess accommodating the pressure sensor and are welded to each other. It is provided that, after the welding, in the area of the welding connection, the recess of the base housing element and/or the sensor housing element is enlarged by material removal. A pressure sensor assembly is also described.
    Type: Application
    Filed: October 19, 2010
    Publication date: November 22, 2012
    Inventors: Markus Ledermann, Ralf Kaiser, Oliver Stoll, Bernhard Panhoelzl, Christian Roesser, Falk Rueth
  • Publication number: 20120273098
    Abstract: A method for producing a structural sheet metal component formed from an aluminum alloy for a motor vehicle includes providing an aluminum sheet blank in a state T4 or T5 or T6 or T7, heating the aluminum sheet blank to a heating temperature between 100° C. and 450° C., forming the aluminum sheet blank to a structural sheet metal component, and heat post-treatment of the formed structural sheet metal component.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 1, 2012
    Applicant: Benteler Automobiltechnik GmbH
    Inventors: Friedrich Bohner, Jochen Dörr, Jochem Grewe
  • Publication number: 20120248086
    Abstract: In a resistance welding method, by controlling the power amount from a melting start time onward, the weld quality may be stabilized efficiently, even when a disturbance is present, because of the correlation between the amount of power input from the melting start start time and a resulting nugget. The resistance welding method includes: pressing an electrode against a workpiece; inputting power to the workpiece through the electrode to subject the workpiece to Joule heating; detecting the melting start time, which is the time at which at least a portion of the faying portion of a workpiece starts to melt when subjected to Joule heating; calculating a first power amount input into the workpiece from the melting start time; and determining whether the first power amount has reached a first set value; and continuing the Joule heating until the first power amount reaches the first set value.
    Type: Application
    Filed: November 16, 2010
    Publication date: October 4, 2012
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Goro Watanabe, Yasuhiro Ishii, Yasumoto Sato, Tsunaji Kitayama, Hisaaki Takao, Takahiro Onda, Hideki Teshima, Keisuke Uchida
  • Publication number: 20120236458
    Abstract: A method for processing a metal film (1) embedded in a carrier (2) includes the step of heating the metal film (1) in such a way that the metal film (1) is transformed in a subregion into at least one insulator section (3). The metal film (1) is preferably locally heated by laser radiation (4). Also described is a component (10, 11, 12, 13) which is produced by the method and includes an electrostatic clamp, a drive mechanism which is adapted for moving a workpiece under the action of electrical fields, a resistor element or a display device, for example.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 20, 2012
    Applicant: Berliner Glas KGaA Herbert Kubatz GmbH & Co.
    Inventor: Jan INGWERSEN
  • Publication number: 20120239036
    Abstract: A method for joining two or more segments of a bone implant comprises the steps of placing a plurality of thin layers of an intermetallic material between first and second segments of the bone implant and applying a mechanical load to the plurality of layers. In a subsequent step, the plurality of layers are ignited by applying an external activation energy thereto, the ignition heating the plurality of layers to a reaction temperature and causing the segments to become affixed to one another after cooling.
    Type: Application
    Filed: September 15, 2011
    Publication date: September 20, 2012
    Inventors: Cyril Voisard, Robert Frigg, Goetz Thorwarth
  • Publication number: 20120228899
    Abstract: A sound-damped vehicle panel assembly, such as a dash panel, is attached to a structural member with one or more weld joints. The vehicle panel assembly may include a main panel member, a sound-damping patch, and a sound-damping adhesive layer arranged therebetween, where the patch covers at least a portion of an acoustically active region of the main panel member. The weld joints that attach the vehicle panel assembly to the structural member are preferably located at weld openings formed in the sound-damping patch and/or the sound-damping adhesive layer so that the weld joint can be formed without melting and vaporizing the adhesive during the welding operation, as such an operation would likely require additional ventilation equipment and could impact the quality of the weld joint.
    Type: Application
    Filed: March 10, 2011
    Publication date: September 13, 2012
    Applicants: SHILOH INDUSTRIES, INC, GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Jonathan E. Rich, Marcel R. Cannon, Terry A. Swartzell, Andrew W. White, Kenneth D. Schmid, James F. Keys, Jonathan W. Fisk, Stephen A. Fetsko, James J. Evangelista
  • Publication number: 20120217231
    Abstract: One example embodiment includes methods for making electron emitters. The electron emitter comprises a conductive member that defines a plurality of filament segments that are integral with each other. Each filament segment includes an intermediate portion and an interconnecting portion attached to an adjacent filament segment. The intermediate portions are substantially coplanar with each other and each intermediate portion includes a substantially planar electron emission surface.
    Type: Application
    Filed: May 7, 2012
    Publication date: August 30, 2012
    Applicant: VARIAN MEDICAL SYSTEMS, INC.
    Inventors: Paul D. Moore, Stephen G. Bandy, Clifford K. Nishimoto, David H. Humber, Gary F. Virshup
  • Publication number: 20120205361
    Abstract: When applying a current to a plated steel plate, plating often biases. In the present invention, when applying a current, the current is applied with a flux guiding member arranged in proximity to a side surface of the plated steel plate. The direction of the magnetic flux at the side surface of the plated steel plate is corrected, and the bias of the plating is efficiently suppressed.
    Type: Application
    Filed: February 6, 2012
    Publication date: August 16, 2012
    Applicant: ASTEER CO., LTD.
    Inventor: Kouji SHIMOTSU
  • Publication number: 20120193236
    Abstract: A nanodevice is provided that includes a reservoir filled with a conductive fluid and a membrane separating the reservoir. The membrane includes an electrode layer having a tunneling junction formed therein. A nanopore is formed through the membrane, and the nanopore is formed through other layers of the membrane such that the nanopore is aligned with the tunneling junction of the electrode layer. When a voltage is applied to the electrode layer, a tunneling current is generated by a base in the tunneling junction to be measured as a signature for distinguishing the base. When an organic coating is formed on an inside surface of the tunneling junction, transient bonds are formed between the electrode layer and the base.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 2, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hongbo Peng, Stephen M. Rossnagel, Ajay K. Royyuru, Gustavo A. Stolovitky, Deqiang Wang
  • Patent number: 8148211
    Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 3, 2012
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Kelly J. Bruland, Brian W. Baird, Ho Wai Lo, Stephen N. Swaringen, Frank G. Evans
  • Patent number: 8097831
    Abstract: A method for welding two metal parts, in which: the metal parts are positioned against each other in a welding position, the parts being respectively in surface contact along their welding surfaces, at least one of the parts having at least one extra-thick zone along its welding surface; TIG welding is carried out on the welding surfaces (v) of the metal parts by means of a TIG welding torch, a method in which a penetrating welding flux is applied locally on said extra-thick zone of the metal part prior to the TIG welding step.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: January 17, 2012
    Assignee: SNECMA
    Inventors: Mathieu Gueguen, John Moreau, David Daniel Soullier
  • Publication number: 20120006803
    Abstract: A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 12, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gerald Keith Bartley, Darryl John Becker, Philip Raymond Germann, Andrew Benson Maki
  • Publication number: 20110297658
    Abstract: A method and system to weld or join workpieces employing a high intensity energy source to create a weld puddle and at least one resistive filler wire which is heated to at or near its melting temperature and deposited into the weld puddle.
    Type: Application
    Filed: August 17, 2011
    Publication date: December 8, 2011
    Applicant: LINCOLN GLOBAL, INC.
    Inventors: Steven R. Peters, Paul E. Denney, Terrance J. Wikberg, Michael D. Latessa
  • Publication number: 20110286878
    Abstract: An NdFeBGa magnet material has a composition that is represented by the genera formula NdyFe100-x-y-zBzGax, where x is between 1 and 3 inclusive, y is between 14 and 24 inclusive, and z is between 7 and 12 inclusive.
    Type: Application
    Filed: February 4, 2010
    Publication date: November 24, 2011
    Inventors: Hidefumi Kishimoto, Tetsuya Shoji, Noritsugu Sakuma
  • Publication number: 20110198333
    Abstract: A mold core includes a forming pin having a hollow interior and an end wall. A passage, preferably in the form of a hollow tube, extends into the hollow interior of the forming pin and has an end sealingly secured at a position spaced from the end wall of the forming pin. A poppet valve is disposed on the end wall of the forming pin. The poppet valve is responsive to air pressure within the passage to open and permit flow of air through the end wall of the forming pin to assist stripping of molded articles from the mold core. The poppet valve includes a valve element having an outer end at the end face of the forming pin and an inner end adjacent to the end of the passage. A spring preferably biases the valve element to a closed position. The spring preferably comprises a coil spring captured in compression between the valve element and the forming pin.
    Type: Application
    Filed: April 5, 2011
    Publication date: August 18, 2011
    Inventors: B. Jack Rote, Vance E. Reed, Richard E. Zorger
  • Publication number: 20110184310
    Abstract: The shape of a surgical instrument is changed during a surgical procedure by using a laser to heat a shape memory alloy or other shape memory material in the surgical instrument, thereby causing the instrument to assume a predetermined shape, while at the same time monitoring the heating site to prevent overheating.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Inventor: Joe Denton BROWN
  • Publication number: 20110158887
    Abstract: This invention relates to a two or three-stage apparatus and method of use to produce high purity silicon, such as for use in solar panels and/or photovoltaics. The device of this invention includes a melting apparatus with a delivery device, a holding apparatus with a tipping or transfer mechanism, and at least one solidification apparatus for receiving a molten feedstock. The optimized designs of individual apparatuses function efficiently in combination to produce high purity silicon.
    Type: Application
    Filed: August 21, 2009
    Publication date: June 30, 2011
    Applicant: AMG IdealCast Solar Corporation
    Inventors: Nathan G. Stoddard, James A. Cliber, Roger F. Clark, Bei Wu, Soham Dey, Douglas L. Stark
  • Publication number: 20100276408
    Abstract: Methods are provided for joining two panels by welding together a seam formed at a flange of each panel using a welding tractor adapted to travel along the seam to be welded. A welding tractor adapted for use in the methods is also provided, as is a welded panel product fabricated using the methods provided.
    Type: Application
    Filed: April 29, 2009
    Publication date: November 4, 2010
    Applicant: John Bean Technologies Corporation
    Inventors: Larry D. Martin, Brian E. Lone, James P. Gast
  • Publication number: 20100276409
    Abstract: The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequently
    Type: Application
    Filed: November 9, 2008
    Publication date: November 4, 2010
    Inventor: Christian Schmidt
  • Publication number: 20100266094
    Abstract: A dual-cooled nuclear fuel rod and a method of manufacturing the same are provided. The nuclear fuel rod includes an outer cladding tube having a circular cross section, an inner cladding tube having an outer diameter smaller than an inner diameter of the outer cladding tube, and a length longer than the outer cladding tube, and located in parallel in the outer cladding tube, a pellet charged in a space between the outer and inner cladding tubes and generating energy by nuclear fission, and first and second end plugs coupling opposite ends of the outer cladding tube to stepped outer joints formed on outer circumferences of first ends thereof and coupling opposite ends of the inner cladding tube to stepped inner joints formed on inner circumferences of the first ends thereof.
    Type: Application
    Filed: September 14, 2009
    Publication date: October 21, 2010
    Applicants: Korea Atomic Energy Researsh Institute, Korea Hydro and Nuclear Power Co., Ltd.
    Inventors: Hyung-Kyu Kim, Jong-Hun Kim, Dae-Ho Kim, Kun-Woo Song, Kyung-Ho Yoon, Young-Ho Lee, Jae-Yong Kim, Kang-Hee Lee
  • Publication number: 20100223789
    Abstract: A method for repairing a rotor of a turbine includes providing a rotor having a groove portion defined by a circumferential portion of the rotor. The circumferential portion of the rotor is removed to create an opening to provide access to the groove such that the opening, immediately adjacent the groove, is narrower than the groove. A guide block may be extended into a receiving slot separating a first protruding surface from a second protruding surface of the rotor such that a weld area slot of the guide block extends over at least a portion of the opening. The opening may be welded adjacent the guide block to close at least a portion of the opening.
    Type: Application
    Filed: December 17, 2009
    Publication date: September 9, 2010
    Applicant: MECHANICAL DYNAMICS AND ANALYSIS, LLC
    Inventors: James Harvey COFFEY, Andrew Otto RUEHS
  • Publication number: 20100193492
    Abstract: Disclosed is an apparatus for altering the temperature of a liquid, comprising: a pipe having a first end for receiving a liquid and a second end for discharging the liquid; and a thermal element for altering the temperature of the liquid, wherein the thermal element is located in the pipe such that the volume available for the liquid within the pipe is in the range 0 to 20% of the pipe volume.
    Type: Application
    Filed: March 14, 2008
    Publication date: August 5, 2010
    Inventor: Michael Karl William Hughes
  • Patent number: 7755003
    Abstract: A temperature control method for a heat process on a resist film on a substrate includes first and second steps. The first step includes measuring a stepped response waveform of measured temperatures of a substrate at measurement points while changing stepwise each target temperature, then using this result to compose a pulsed response waveform with respect to a change of a pulsed target temperature, then using this result to compose a triangular response waveform with respect to a change of a triangular target temperature, and then using this result to acquire a matrix as relation information showing a relation between the target temperatures and temperatures of the substrate at measurement points.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: July 13, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Jun Ookura, Eiichi Sekimoto, Hisakazu Nakayama
  • Publication number: 20100151695
    Abstract: A substrate processing apparatus includes a chamber capable of being evacuated, a substrate stage adapted to mount a substrate, a heating unit adapted to be set above the substrate mounting surface of the substrate stage, face the substrate mounted on at least the substrate mounting surface, and heat the substrate by radiant heat without being in contact with the substrate, a shutter adapted to be retractably inserted in the space between the heating unit and the substrate mounted on the substrate mounting surface, and a shutter driving unit adapted to extend/retract the shutter into/from the space. The substrate is mounted on the substrate stage to face the heating unit, the substrate is annealed by heating the substrate by radiant heat from the heating unit, and the shutter is extended into the space between the heating unit and the substrate stage.
    Type: Application
    Filed: December 14, 2009
    Publication date: June 17, 2010
    Applicants: CANON ANELVA CORPORATION, CANON ANELVA ENGINEERING CORPORATION
    Inventors: Nobuyuki Masaki, Yuichi Sasuga, Masami Shibagaki, Hiroshi Doi
  • Publication number: 20100147820
    Abstract: A device is provided comprising at least one cantilever comprising at least one tip and at least one heating element. Methods for making and using such a device are also provided.
    Type: Application
    Filed: May 13, 2009
    Publication date: June 17, 2010
    Inventors: Joseph S. FRAGALA, Albert K. HENNING, Raymond Roger SHILE