Abstract: A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structured upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

Abstract: A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at least 500 kp/cm.sup.2 at a moderate temperature of approximately 150 to 200 degrees C. Components which have a structured or shaped upper side can be joined to substrates when they are inserted in common with a member of elastically deformable material, such as silicone rubber, into a receptacle chamber that is closed by a movable die which transmits the pressing power. The deformable member completely fills out the remaining interior of the receptacle chamber when the pressing power is reached.

Abstract: A compliant pad or work piece for use in bonding the inner leads of integrated circuit devices as a part of a tape automated bonding process. The work piece is constructed of a metallic base layer to which is affixed a compliant pad, a cap support and a cap positioned on said compliant pad surrounding a gas channel which is connected to a source of gas such as nitrogen. A ceramic heat distribution layer is positioned over said gas channel and acts to support the integrated circuit device to be bonded to an associated tape during the tape automated bonding process.

Abstract: A method for bonding which comprises the step of heating a bottom thermode to a temperature of approximately 150.degree. C. The bottom thermode is then pulse heated to approximately 350.degree. C. while a die and lead frame are disposed above the lower thermode. An upper thermode, which may remain unheated, is then lowered to cause contact between the lead frame and the contacts of the die. The lower thermode then returns to a temperature of approximately 150.degree. C. The pulse heating of the lower thermode lasts for approximately 1-3 seconds.

Abstract: In a process for bonding simultaneously a series of juxtaposed connecting terminals of an electric component to a connecting tag block, one tag per terminal, by the application of a bonding tool to the respectively superposed tags and terminals, the bonding tool is applied to the superposed tags and terminals through a sheet of ductile, heat conducting material. This sheet is made preferably in the form of a tape moving in synchronism with a tape carrying blocks of the tags. The two tapes are guided and driven in guide blocks placed each side of a work station carrying the components to be bonding. The tape of ductile material can serve as a protective strip for the tape equipped with the bonded components.

Abstract: A beam lead bonding apparatus for bonding simultaneously, a plurality of beam leads of varying thicknesses to bonding bumps of varying heights on an integrated circuit substrate subject to cracking when subjected to a predetermined bonding force. The substrate is supported on a base with beam leads in alignment with corresponding ones of the bonding bumps. A resilient pad is provided between the substrate and the base and compressed in response to unequal deflections of the substrate when a bonding element is moved in a direction towards the base to bond the beam leads to the bonding bumps. An alternate compliant pad is disclosed together with an alternate structure for distributing bonding energy throughout the bonding substrate and an alternate arrangement for preventing beam lead to substrate shorts.

Abstract: A process for improving the solderability of a layer of a silver frit burnt onto a glass pane and a current connecting element wherein a layer of enamel is disposed and the surface of soldering and the glass pane. According to the process the surface is treated with a fluorine containing etching agent prior to soldering. The fluorine containing etching agent may be an aqueous solution of an acid fluoride, such as ammonium hydrogen fluoride or alkali hydrogen fluoride.

Abstract: A non-impact form of thermocompression gang bonding of metal lead fingers to integrated circuit chip pads is disclosed. The method produces a plurality of simultaneously bonded chips using conventional heating means and totally avoids mechanical and thermal shock. The result is highly reliable bonding that results in exceptionally high bond strength.

Abstract: A tool for removing soldered IC packages comprises a block of heat-conducting material having a plurality of cylinder-shaped holes with parallel axes; a plurality of heat-conducting rods, each of which has one end that slides in a respective one of said holes; an insulator containing the block having a lid with another plurality of holes which are aligned with at least some of the rods in the block; and means for moving the rods that align with the holes in the lid partway through such holes by distances of unequal length so they can conduct heat from the block to respective I/O pins on the package that lie in multiple planes.

Abstract: A method for making spirally wound cells using a deformed metal strip mandrel with an electrode being forced therein by a compressing element fixedly retained by the mandrel to hold the electrode during winding. The electrode is electrically connected to the mandrel by the compressing force.

Abstract: A first metal surface of a first article of metal, such as the metalization layer on a silicon semiconductor device, is bonded to an opposing or second metal surface of a second article of metal, such as a "structured copper" strain buffer, using an improved method of thermo-compression diffusion bonding that involves temperature control independent of compressional force control, whereby a superior bond is obtained.

Abstract: A first set of pre-tabbed solar cells are assembled in a predetermined array with at least part of each tab facing upward, each tab being fixed to a bonding pad on one cell and abutting a bonding pad on an adjacent cell. The cells are held in place with a first vacuum support. The array is then inverted onto a second vacuum support which holds the tabs firmly against the cell pads they abut. The cells are exposed to radiation to melt and reflow the solder pads for bonding the tab portions not already fixed to bonding pads to these pads.

Abstract: A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.

Abstract: A method for fixturing two or more workpieces in a desired positional relationship with respect to one another by utilizing a moldable and heat resistant work holding material to position and support the workpieces. The work holding material may subsequently be hardened to provide a permanent and reusable fixture.

Abstract: A brazing press for securing exterior claddings to bottoms of metallic receptacles, which includes a support structure and a reciprocable mandrel for exerting pressure against the former. The support structure holds a massive inductor block having a flat bottom and containing an inductor coil for respectively pressing and heating the flat portions of the workpieces, and an encompassing sleeve which is associated with an auxiliary inductor and exerts pressure on the peripheral curved portions of the cladding. Either the sleeve with its auxuliary inductor of the inductor block can be supported by said structure through resilient means which are calibrated, whereby auxiliary pressure is exerted on the peripheral curved portions independently from the one exerted on the flat central portion, when said mandrel is pushed against the inductor block.

Abstract: An improved method for thermo-compression diffusion bonding allows bonding of a compliant metallic member to a second metallic member which may have surface irregularities. Opposite surfaces of the compliant metallic member are contacted by a layer of compactible material and by the second metallic member, respectively, such that distribution of a loading force applied to this assembly conforms the compliant member to the irregularities in the surface contour of the second metallic member. Thus, a uniform substantially void-free diffusion bond between the two metallic members is achieved.

Abstract: A composite titanium or titanium alloy structure is made by diffusion bonding upper and lower face sheet components onto opposite sides of a honeycomb core component at an elevated temperature within a furnace under a high vacuum. The components are supported in the furnace upon a slip sheet carried by a glass pad which is, in turn, supported by a lower platen. The weight of an upper platen is transmitted through a slip sheet to the upper face sheet component. The upper face sheet component includes an internal passageway which is coupled to an inert gas supply to expand the passageway by superplastic forming. The upper wall surface of the passageway is restrained by the upper platen so that only the lower wall surface of the passageway is displaced and received in underlying recesses in the honeycomb core component. After expansion, the displaced wall surface is diffusion bonded to the honeycomb core component.

Abstract: The invention covers a method of and tools for producing structures from suitable materials which are sequentially formed superplastically and then diffusion bonded using forming dies that are flexible to conform to desired contours imparted to the mating dies, which can accommodate compound curvatures, and which utilize fluid pressures internal to the tool to force the dies to conform as well as to achieve forming and bonding. The tools consist of a forming die providing contoured cavities or recesses for shaping a superplastically formable component, a flexible die having a shape of the finished structure and cooperating with the forming die, a fluid container for pressure fluid to operate the flexible die, and a retaining structure that cooperates with the forming die to contain and direct the forming pressure in the desired manner.

Abstract: A method of bonding a laminated porous sheath to a cast strut includes the step of performing a compressible pad to have a plurality of closely spaced grooves on one surface thereon and a plurality of spaced apart lands on the opposite face thereof; locating a preformed porous laminate sheath over the outer surface of a cast strut and laser welding it thereto and thereafter assembling the preformed compressible pad to locate the plurality of grooves thereon in overlying relationship to a plurality of airflow openings in the porous laminated sheath and with ribs on either side of the grooves being located in juxtaposed relationship with the outer surface of the porous laminated sheath for uniformly distributing a load thereto; locating the preassembled casting, sheath and compressible pad within a contoured opening formed by a three piece pressure block fixture and applying a predetermined pressure to the assembled parts while subjecting them to a predetermined bond temperature while applying a vacuum.

Abstract: A method of making a composite diffusion bonded structure, comprising a honeycomb panel portion made up of a honeycomb core sandwiched between two face sheets, and a load carrying structural member bonded thereto. The honeycomb core, face sheets and structural member are preassembled in a vacuum furnace so as to permit exposure of the surfaces which are to be diffusion bonded. A vacuum is drawn and the assembly is heated to near diffusion bonding temperature with the bonding surfaces still exposed to the vacuum environment. Thereafter, the bonding surfaces are brought into contact with very moderate pressure, and are maintained at a temperature and pressure sufficient for diffusion bonding. The assembly is then cooled, with the result being a substantially unitary diffusion bonded structure.

Abstract: A method of and apparatus for bonding together a first and a second workpiece, which are bondable by applying energy thereto while they are urged together at a bonding site. First, the workpieces are urged together by moving into engagement with the first workpiece, and then slightly deforming, a rigid, self-supporting, deformable planar member. The deformation is not only effective to urge the workpieces together, but also forms a capillary space between the member and the first workpiece. Then, the energy is passed to the bonding site. If the energy should produce, molten components at the site, they are attracted into the capillary space to prevent them from creeping up the workpieces and from undesirably building up at the bond site. Multiple pairs of workpieces may be simultaneously bonded by overlying all of the bonding sites with the member and by deforming it by the application of a force at a point generally central to all of the bonding sites.

Abstract: Compliant bonding of successive beam-lead semiconductor devices to successive metallic patterns on substrates is accomplished with a bonding apparatus that uses an indexable compliant member. A bonding head of the apparatus is provided with a single movable tip which disengages from the compliant member during indexing of the member. The movable tip engages with a portion of the compliant member that is suspended between two drive sprockets when it is desired to perform a bonding operation. The engagement of the tip with the compliant member produces tension in the member. The tension results in a precise and flat configuration within the engaged portion of the member. The flat configuration enhances accurate alignment of workpieces to the compliant member.A toggle linkage is described as a desirable system for moving the bonding tip with respect to the head.

Abstract: In a thermocompressive soldering process, a conductive overlay of a material such as gold is applied to a contact finger of a circuit board.In carrying out this process, the overlay is initially carried on an adhesively coated strip such as a polyimide tape. To transfer the overlay to the contact finger, it is aligned with the contact finger and temporarily attached to the circuit board. A heat conductive resilient sheet is then interposed between the circuit board and a thermode. The thermode is adjusted to engage the contact finger with a predetermined force. The force is resiliently distributed by the interposed sheet. Heat is then applied from the thermode through the resilient sheet to liquefy a solder coating on the overlay and to bond the overlay to the contact finger upon resolidification of the solder. The applied force is sustained during the application of head and during a subsequent cooling period during which the solder resolidifies.

Abstract: In making electronic components, it is often necessary to bond a lead frame to an insulating substrate. In carrying out the bonding, it is desirable to provide compensation to prevent cracking of the substrate. At the same time it is also desirable to prevent relative motion between the substrate and lateral guides for accurately positioning the substrate with respect to a bonding tip. The prevention of such motion reduces the likelihood of damage to the guides. To these ends, the substrate is positioned on a supporting pedestal and on the first ends of a plurality of elongated members or rods slidable through the pedestal and having second ends mounted to spring elements. In so positioning the substrate, it is located between lateral guides which are fixed to the pedestal. Prior to bonding, the surface of the pedestal is urged flush with the surfaces of the first ends of the rods. Then, during bonding the pedestal is moved with the guides and the substrate.

Abstract: Methods of producing consistently uniform and high strength solid-phase (preferably thermocompression) bonds between two mating members and, in particular, between multiple micro-size lead-frame-fabricated electrical ribbon leads and thin film terminals formed on glass or ceramic circuit substrates, for example, through the utilization of at least one, but preferably two or more, interposed and specially contoured compliant contacts per lead.

Abstract: Bonding machines have transparent elements on their bonding axes. Magnified optical means are positioned to view bonding tips and integrated-circuit chips simultaneously through the transparent elements thereby facilitating alignment of the chips to the tips. In one embodiment a bonding tip is transparent and a transparent compliant bonding member is utilized in conjunction with the tip to produce compliant bonds. Another embodiment utilizes a transparent tip in a "hard tip" type of bonding operation. A third embodiment utilizes a transparent tray closely positionable to the bonding tip. After alignment of the tip to one of the chips is achieved the tray is removed and bonding proceeds on an accurately positioned substrate.