Abstract: The invention relates to an ultrasonic welding and cutting device for use in the manufacture of a flat-cable. The flat cable includes a plurality of wire conductors which are arranged in parallel at a given interval with respect to each other and interposed between first and second insulator films. The device has a product flow line in an upstream to downstream direction. The device comprises a horn unit including a horn melter unit that imparts ultrasonic oscillations, and a horn cutter unit. The horn melter unit and the horn cutter unit are located sequentially from upstream to downstream at a predetermined distance along the product flow line. The device further includes an anvil unit including an anvil melter unit and at least one anvil blade unit.

Abstract: A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. These mechanics do not lose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: A thermo-compression bonding apparatus is for thermo-compressing a TCP and a substrate layer to connect electrode terminals. The thermo-compression bonding apparatus has a heating unit 1 for auxiliary heating a laminate which is heated by a compression bonding head whose temperature is kept at a predetermined temperature.

Abstract: The present invention provides schemes which are associated with wire bonding process or wire bonding machine to detect the bonding status of a bonding wire of a package including at least a semiconductor unit. The schemes are very useful to a BGA (Ball Grid Array) package or similar types of packages, and provide significant advantages particularly for a package in which the resistance (such as the resistance resulting from an adhesion layer and a layer of Cupric Oxide for promoting adhesion) between a semiconductor unit and its carrier is not low enough.

Abstract: Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Abstract: So as to perform high-precision position detection without performing pattern matching in the direction of rotation even when the object of detection involves a positional deviation in the direction of rotation, pattern matching between a reference image and a rotated image obtained by rotating this reference image is performed during registration, and then the difference between the measured value of the position obtained following rotation and the theoretical value of the position of the rotated image is retained as a calibration amount corresponding to the known angle of rotation. Upon detection, the measured value is detected by pattern matching between an image of the object of detection, which is detected by imaging the object of detection disposed in an attitude that includes a positional deviation in the direction of rotation, and a reference image; and this measured value is corrected by the calibration amount.

Abstract: Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.

Abstract: An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded series of support platforms linearly translatable with respect to the gantry and to one another in response to translation drive signals provided from a remote source to a separate translation motor for each platform. A head support assembly mounted to the last translatable platform in the series rotatably supports via a hollow elongated spindle an orbital bonding tool head rotatable with respect to the head support assembly in response to a rotational drive signals provided to a head rotation motor from a remote source.

Abstract: The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip.

Abstract: There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.

Abstract: A method for making an electrical connection between a first contact surface and a second contact surface. A contacting wire is arranged between the contact surfaces with the assistance of a wire-bonding device by contacting the contacting wire initially with the first contact surface and then with the second contact surface, and subsequently cutting off the contacting wire with the assistance of the wire-bonding device. Provision is made for contact metallization composed of the material of the contacting wire to be produced on the second contact surface using the wire-bonding device prior to contacting the first contact surface.

Abstract: The method of controlling a linear vibration welding apparatus, in accordance with the invention, may comprise the steps of: fastening a first workpiece portion in a fixed position; fastening a second workpiece portion to a reciprocating member; energizing a first single winding magnet with direct current power to create a magnetic field; sensing a location of the reciprocating member with respect to a zero point; and energizing a second magnet when the reciprocating member has crossed the zero point when moving towards the first magnet. The linear vibration welding apparatus in accordance with the invention may comprise: a frame; a flexure array; a first magnet assembly; a second magnet assembly; a digital controller; and direct current amplifiers for powering the magnet assemblies.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: An ultrasonic rotary horn has tapered input sections for the conversion of axial acoustic energy into radial acoustic energy. The preferred rotary horn includes a first half having a first radial weld section and a first axial input section for receiving a first axial acoustic energy. The rotary horn further includes a second half coupled to the first half. The second half has a second radial weld section and a second axial input section for receiving a second axial acoustic energy. Each half has a coned section defined by an inner tapered surface and an outer tapered surface such that the halves convert a portion of the first and second axial acoustic energy into radial acoustic energy. Each inner tapered surface forms an inner angle with respect to an axis of the horn and each outer tapered surface forms an outer angle with respect to the axis.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of inner leads aligned along a periphery of the die pad at intervals. The apparatus includes a heat block having an inner lead mounting portion for mounting the inner leads, a concave portion located inward of the inner lead mounting portion, and at least one supporting pad for mounting the semiconductor chip. Restoration of the lead frame at wire bonding portions is decreased at the time a lead frame forcing mold holding the lead frame to heat block is detached.

Abstract: An ultrasonic rotary horn has tapered input sections for the conversion of axial acoustic energy into radial acoustic energy. The preferred rotary horn includes a first half having a first radial weld section and a first axial input section for receiving a first axial acoustic energy. The rotary horn further includes a second half coupled to the first half. The second half has a second radial weld section and a second axial input section for receiving a second axial acoustic energy. Each half has a coned section defined by an inner tapered surface and an outer tapered surface such that the halves convert a portion of the first and second axial acoustic energy into radial acoustic energy. Each inner tapered surface forms an inner angle with respect to an axis of the horn and each outer tapered surface forms an outer angle with respect to the axis.

Abstract: Electric wires (20) and (21) are intersected with each other at right angles such that the electric wires (20) and (21) are inclined with respect to the vibration direction of ultrasonic vibration through 45°, intersected portions (C) of the electric wires (20) and (21) are set between a horn-side chip (11) and an anvil-side chip (12) in a pressurized state, and ultrasonic vibration is input to the intersected portions (C), thereby bonding the electric wires (20) and (21) to each other.

Abstract: A method and apparatus for producing a three-dimensional part from a plurality of planar layers using an ultrasonic welder. A sheet of planar material is placed on the partial part and ultrasonically welded, with the first sheet placed on a base. The sheet is cut to the shape of the partial part. The process of placing of the sheet materials on the partial, welding, and cutting of the two-dimensional contour layer is continued until part is complete. In a preferred embodiment, the three-dimensional part has layers of different material. The materials can be layers of incompatible materials for ultrasonic welding in which voids are created through interposed non-compatible materials for ultrasonic welding, to allow ultrasonic welding of compatible material layers spaced by a sheet of incompatible material.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bonding tool in the Z axis. A pair of arms form a wire clamp supported on the flexible support and are articulated by a link connected for moving one of the arms with respect to the other by an electrical drive having a coil. A wire cutter is connected to the bonding head and a pusher pushes the wire cutter toward the bonding tool before wire is to be cut after bonding.

Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.

Abstract: A golf club having an interior hosel that is disposed inward from a striking plate to allow for compliance of the striking plate during impact with a golf ball. The present invention also includes a method for producing the golf club in which the interior hosel is attached to a lateral extension of a face member. The lateral extension is connected to the striking plate. The striking plate is preferably composed of a forged titanium material.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A process for joining metals is provided, by which a core wire of a coated electric wire can be securely joined to a metal having a plated layer on the surface thereof. The process is to assemble a wiring module 1. The wiring module 1 has a metal piece 2, a coated electric wire 3 and so on. A plated layer 6 made of tin is formed on a surface of a matrix 5 of the metal piece 2. The coated electric wire 3 has a core wire 7. An ultrasonic welding is carried out after placing a part 7a of the core wire 7 on the plated layer 6 of the metal piece 2. The plated layer 6 is melted so as to join the part 7a of the core wire 7 to the matrix 5 and the core wire 7 is broken off separating the part 7a therefrom. Another ultrasonic welding is carried out after further placing another core wire 7 on the part 7a joined to the matrix 5, so that the core wire 7 of the coated electric wire 3 is joined to the metal piece 2 through the part 7a of the core wire 7.

Abstract: Force sensing apparatus is provided for sensing deflection of a transducer (8) in an ultrasonic welding machine. The apparatus includes a body member (2), a transducer holder (1) and a force sensor (4). The transducer holder (1) is adapted to hold an ultrasonic transducer (8) and the transducer holder (1) is fixed to the body member (2). The force sensor (4) is located between adjacent surfaces (11, 12) of the body member (2) and the transducer holder (1) to sense a force applied between the surfaces (11, 12).

Abstract: A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A method of bonding a bonding element to a metal bonding pad, comprising the following steps. A semiconductor structure having an exposed metal bonding pad within a passivation layer opening is provided. The bonding pad has an upper surface. A bonding element is positioned to contact the bonding pad upper surface. A bonding solution is applied within the passivation layer opening, covering the bonding pad and a portion of the bonding element. The structure is annealed by heating said bonding element to selectively solidify the bonding solution proximate said contact of said bonding element to said bonding pad, bonding the bonding element to the bonding pad.

Abstract: A battery apparatus includes an anode terminal and a cathode terminal at least one of which includes a conductive extension extending through and contacting insulative housing material. The extension includes at least one outer rough surface characterized by a plurality of surface nodules at least a majority of which are at least 5 microns in height and have a maximum linear cross dimension of at least 20 microns and which contact and bond with the enveloping electrically insulative housing material. The battery apparatus can include a plurality of bicells. A method of forming a battery apparatus includes brushing an outer surface of at least one of an anode terminal material or a cathode terminal material effective to roughen the outer surface from what it was prior to the brushing. The anode and cathode assembly are enveloped in a housing comprising electrically insulative material with at least the one terminal material projecting therefrom.

Abstract: Method for welding two end portions (6, 8) of a coil (not shown) onto two electric contact pads or bumps (24, 26) of an integrated circuit (2) or an electronic unit of small dimensions. This welding method is characterised in that, prior to the actual welding step, a preliminary step is provided consisting in removing at least partially the insulating sheath from the electric wire (10) at least at the locations of the two end portions (6, 8) provided for the welding onto said electric contact pads or bumps (24, 26). The insulating sheath is removed locally by means of heat application, in particular using a heating press (58) working at a sufficiently high temperature to melt or sublimate the insulating sheath. The welding step is achieved at a much lower temperature than the temperature of the preliminary step, which allows the heat and mechanical stress to be reduced for the integrated circuit (2) and the bumps (24, 26) during welding of the ends (6, 8) onto said bumps.

Abstract: The invention concerns a method for the constant maintenance of the mean gap width between a sonotrode of an ultrasonic system and a tool of an ultrasonic cutting device, designed as a counter surface, for cutting and/or welding of various types of materials such as, for example, synthetic foils, textile fabrics containing synthetic substances, by means of a cutting tool, using an adjusting device.

Abstract: A wire fixing jig for arranging and fixing covered wires when intersection portions thereof are welded. The jig has a jig body on which the covered wires are arranged, supporting portions for supporting the covered wires are formed around the intersection portions to be welded. These portions are located at a predetermined pitch from a corresponding one of the intersection portions, at both sides in the longitudinal direction thereof and for ensuring a space that allows a core part of each of the intersection portions, which are pressurized when welded, to spread out, and through holes through which welding device is inserted when the intersection portions of the covered wires are welded to each other.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: A flip chip bonding method including steps of applying a pressure and a heat and applying an ultrasonic wave in a plurality of directions or along a circular locus for connecting solder bumps, which are formed on one or both of a connecting pad of a semiconductor element or a connecting pad of a wiring board, whereby flip chip bonding is performed without using flux, a drop of yield and deterioration of reliability are improved.

Abstract: A wire bonding technique applied to wafer bump and wafer level chip size package structure and the method of manufacturing thereof comprising under no repassivation layer and without an under bump metallurgy layer, direct forming metal bump on a metal pad of a wafer surface, ball bump, method being employed to form metal bump, and wire bonding of ultrasonic vibration being used to join a suitable metal wire on the metal pad, next pulling off the metal wire and leaving the metal bump, the height of the metal bump is controlled by the parameters of the type, diameter and wire bonding of the metal wire; planarizing the metal bump of all wire bonding to an appropriate height using metallurgical tools; implanting solder bump by means of implant ball or solder printing technology on the metal bump, and an under bump metallurgy layer being formed on the top face of the metal block by means of metal deposition method in case an unfavorable intermetallic compound is formed between the metal (used for the metal bump) a

Abstract: Ultrasonic welding apparatus is used for making roof flashing units. The roof flashing unites typically include a generally flat aluminum plate and a cylindrical aluminum element joined to the generally flat plate. Two ultrasonic welders are used to make the roof flashing unit, including a horizontally disposed ultrasonic welder for the cylindrical element and a horizontally disposed ultrasonic welder for joining the cylindrical unit to the generally flat plate.

Abstract: A machine for automatically making ultrasonic bonds between metallic conductors using a metal bonding wire precisely positions the tip of an ultrasonic bonding tool relative to a workpiece with a positioning mechanism which includes a first, upper tool support platform rollably supported by a support structure and translatable in a first direction with respect to the support structure by a first remotely operable drive motor, at least a second tool support platform rollably supported by the first tool support platform and translatable with respect thereto in a second direction by a second drive motor, and preferably, a third, end tool support platform rollably supported by the second tool support platform and translatable with respect thereto by a third drive motor.

Abstract: An integrated suspension for a slider in a magnetic record system has a simplified structure relatively easy to manufacture. This new integrated suspension is assembled from separate pieces including a load beam a flexure and a mount plate. The flexure includes a flexible member and a conductive lead integrally formed thereon. Since the flexible member is of super-thin type, the flexion of the flexure is minimized by the support using a platform support in an ultrasonic bonding of its conductive lead with a bonding pad of the slider. Besides, to minimize the deflection, an ultrasonic bonding is executed in close order of distance to support portion. Furthermore, a tab extending from the tip of the load beam is used so as not to affect the flexure regarded as a fine piece.

Abstract: A micro-optical component comprises an optical element for interacting with an optical beam and a mounting structure for attaching the optical element to an optical bench. This optical element is solid phase welded to the mounting structure. Solid phase welding has advantages in that it can be performed at lower temperatures than most soldering, even some eutectic soldering. Solid-phase welding, however, is much more robust during subsequent temperature cycling. This is especially important when the optical components undergo subsequent high temperature cycling.

Abstract: A magnetic head includes a metal plate having a conductive pattern, and a slider having a head element and a connecting terminal electrically connected to the head element, and fixed on the metal plate. The connecting terminal and the conductive pattern are connected by ultrasonically bonding a ball bump thereto. The ball bump has on its surface a projecting portion extending in the direction that links the connecting terminal and the conductive pattern. A bonding capillary for use in the ultrasonic bonding includes a tip section having a through hole for passing a wire therethrough. The tip section also has a recessed portion centered on the through hole, and a groove that reaches the outer surface of the tip section across the center of the recessed portion.

Abstract: A hermetically sealed electrical package having wires entering at the base and being embedded vertically in its walls for connecting to the leads of a component assembly within the package. The wires protrude vertically from the walls, serving as pins for electrical connection of the leads inside the package. The component assembly is secured to an inner side of the package by an adhesive. A cover is affixed to the upper edges of the walls by an ultrasonic weld so as to create a hermetic seal.

Abstract: A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.

Abstract: A method of manufacturing an electronic component includes bonding an electronic component via a bump to electrically and mechanically connect the electronic component to a base member and bonding a cap member to the base member in such a manner that the cap member covers the electronic component element. High temperature aging is performed after bonding the electronic component to the base member via the bump.