Abstract: A semiconductor chip mounted on a substrate by solder columns connecting one side of the chip to the substrate, is removed from the substrate by cooling the unconnected side of the chip to embrittle the solder columns and then twisting the chip with small angle rotational motion to shear the columns at their midpoints. A mechanism for cooling and rotating the chip makes use of the cooling substance to minimize the contact of the substrate with the cooling substance.

Abstract: A butt welding and burr shearing machine for metal rod, e.g., reinforce steel has opposed relatively slidable clamping devices (8, 9), which has positioning clamp (10) and pivotable clamp lever to clamp the rod by lever action. One of the clamping devices mounts split type shear dies by the positioning clamp and the clamp lever respectively. In the cutting position of the shear dies 21, 22 the rod F2 is not clamped by the clamping device 10 on which the shear dies are mounted.By a series of simple operations the rods to be jointed are loaded sideways, clamped by rotating clamp lever, and pressure butt welded, and bulge formed by welding process is sheared off. The completed rod is removed sideways.

Abstract: A bonding head of the type having a bonding tool mounted in the bonding tool holder is provided with a pivotable wire clamp which is movable toward and away from the rear of the bonding tool. The wire clamp is pivotally movable to three distinct positions by a single solenoid. The wire clamp is opened and closed by a second solenoid. The solenoids are mounted on the pivot axis of the bonding tool holder in a manner which substantially prevents the shock force of actuation of the solenoid from being imparted into the bonding tool holder or the bonding tool during a bonding operation.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

Abstract: A rolled sheet metal tube having perforations therein with integrally formed associated protrusions. The protrusions alter the direction of the flow of fluid passing through the tube and ideally suit the tube for employment in mufflers for internal combustion engines. A tube mill incorporating a roll press as its first pass to perforate sheet metal strip as it is fed to the mill. The roll press comprises a die roll having circumferentially continuous slots extending therearound and a punch roll having spaced punches for entry into the slots of the die roll as sheet metal strip is drawn between the rolls. The punches form perforations in the strip as the strip is drawn between the rolls and in certain embodiments the slots and/or punches are configured to form protrusions in the strip simultaneously with the formation of the perforations.

Abstract: A crop shearing and joining method and apparatus includes a manually operable crop shearing assembly for producing clean linear edges at the ends of respective strips, sheets or the like, and a joining assembly for welding or otherwise securing the ends of two different strips or sheets together. Also, a strip aligning and clamping assembly comprising two independently operable clamping devices utilizes one of the clamping devices to provide an alignment stop for aligning the end of one strip relative to the welding torch or the like in the joining assembly and then uses that aligned strip end to facilitate alignment of the strip end to be joined therewith. Moreover, the clamping devices provide substantially full backing support of the aligned strip ends during the joining operation.

Abstract: A printed circuit board has a coating comprising a selected deformable material which is solder-compatible, and has a melting point below that of solder. Electrical and electronic components are then loaded in position on the board with their leads extending through holes in the board, and imbedded into or through the coating. The coating acts as a jig to steady or stabilize the components in position in the board so that the component leads may then be trimmed to finish length, and the components are then soldered in place. Alternatively the board may be placed in storage for future soldering operation. The coating is melted and displaced simultaneously with soldering. Preferred as coating material are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F. In a preferred embodiment of the invention compatible flux active agents are intermixed with the coating material.

Abstract: An apparatus for producing a structure in outer space from rolls of prepunched ribbon or sheet material that are transported from the earth to the apparatus located in outer space. The apparatus spins the space structure similar to a spider spinning a web utilizing the prepunched ribbon material. The prepunched ribbon material is fed through the apparatus and is shaped into a predetermined channel-shaped configuration. Trusses are punched out of the ribbon and are bent downwardly and attached to a track which normally is a previously laid sheet of material. The size of the overall space structure may be increased by merely attaching an additional roll of sheet material to the apparatus.

Abstract: Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support.

Abstract: An improvement in the process and apparatus for converting molten metal, especially steel, into a finished product by first converting the molten metal into thin layers which are superimposed on one another while hot and pressure welding the layers into a unitary body that is particularly adapted for hot or cold shaping into a final size and shape, with the advantage of accelerating the cooling of the molten metal and obtaining the improved grain structure and more nearly uniform distribution of alloying ingredients obtainable from rapid solidification of the molten steel to a solid, comprises forming several separate layers from a common heat of molten metal, simultaneously or successively pressure welding utilizing the layers into a unitary body in a single pressure welding station, in contrast to methods of and apparatus for producing a product from several layers requiring a separate casting unit for each separate layer or thickness and also requiring a pair of pressure rolls for each separate added layer

Abstract: The wire, ribbon, or the like, is repetitively bent back and forth until it breaks, the bending being, preferably, effected rapidly, for example by means of an electromagnet fed, for example, with line frequency alternating current. The wire is guided in a guide tool which deflects the wire transversely to its axis rapidly back and forth, thus effecting breaking within about one second of application of bending stresses. This is particularly useful to sever tiny wires, in the order of 100 .mu.m diameter, as connecting leads in semiconductor and thin film technology.

Abstract: An apparatus for and method of shaping interconnect leads which have been cut from an interconnect lead tape and have a semiconductor chip attached thereto. With a semiconductor chip attached to the interconnect leads of one section of an interconnect lead tape, and either during or after cutting of such leads from the remaining portion of the tape by means of a punch and matrix, a pressure differential is developed across the leads and chip to shape the leads to a desired and repeatable uniform configuration. While this pressure differential is applied, the free ends of the leads are held in one plane, such that the semiconductor chip is translated to a position which is spaced from the plane in which the free ends of the leads are held, thus bending the leads to conform to this change in position. This shaping can occur either before, during, or after the free ends of such interconnect leads are bonded to a lead frame.

Abstract: A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device wire base prior to the coining, trimming, slotting and various other forming operations which transform the wire base into a finished contact device. The apparatus features a sequential arrangement of gripping devices which manipulate the gold ribbon for processing as stated above, a welding apparatus for combining the gold ribbon segment with the contact wire base, a cutting device for cutting the gold ribbon and apparatus for forming the finished electrical contact device. The product features a formed contact device including a wire support member and a contact material simultaneously formed and flattened, to provide a minimum amount of inlaid or coined gold for effecting desirable contact characteristics.

Abstract: A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.

Abstract: Contact beads of noble metal are welded to a substrate of less corrosion-resistant metal in an apparatus in which one electrode formed with a receptacle is moved cyclically between a welding position adjacent another, stationary electrode and a remote feeding position. A gap between the electrodes receives the substrate, and blanks of contact bead material are fed into the laterally open receptacle through a stationary guide aligned with the receptacle in the feeding position of the movable electrode in a direction transverse to the direction of electrode movement.

Abstract: In a friction welding machine a shear tool is provided for shearing flash off the welded workpieces at the weld zone which tool is interposable between one workpiece holder and the flash only after the workpiece holder and the flash have been relatively moved apart. The workpiece holder and the weld zone are then relatively moved towards one another to force the shear tool and the weld zone to traverse relative to one another so that the flash is completely sheared off the weld zone.

Abstract: An apparatus for making a copper-aluminum transition joint characterized by utilizing a combination die and metal shears mounted between a pair of abrading brushes and wire feeding devices that are operable, respectively, to feed a copper wire and an aluminum wire into overlapping relationship between relatively movable die surfaces, after the wires have been abraded to remove oxidized portions thereof and to remove contaminants from the wires. The respective wire feeding devices cooperate with limit stops formed in the relatively movable dies to assure rapid, accurate positioning of the two wires over a punch in a double-action die that operates to form a cold welded transition joint between the wires when the dies are closed. The wire feed devices also selectively retract the sheared ends of the wires from the transition joint to facilitate rapid ejection of the joint from the die.

Abstract: Machine for cold butt welding of metal blanks, wherein one of the blank clamping devices mounts on its housing a carriage with blades for cutting off the ends of the blanks, adapted for possible displacement in the direction of the force upsetting the blanks to position these blades at such distances from the device housings that assure the upsetting of an amount of metal as needed for the welding. The machine is provided with guide members carrying blank clamping devices, single-endedly fixed, that is in a cantilever fashion, in a power drive housing installed on a bed of the machine and adapted for set turning in at least one vertical plane in relation of the upsetting force. The blanks may be in different relationships in space. The invention can be successfully employed in welding aluminum and copper blanks of any cross-sectional shapes: circular, square, rectangular, rhombic, etc.

Abstract: There is disclosed an electrical contact and a method and apparatus for making said electrical contact wherein the contact comprises at least one formed tine portion, a central retaining portion, and a tail portion. Secured to this tine portion is a precious metal contact material comprised of a first layer of a base material and a second layer of a precious metal.

Abstract: A method and apparatus for forming truss members which comprise oppositely disposed channel members and struts interconnected to one another by alternately extending apices wherein the apices are welded to the channel members. The method and apparatus provides for simultaneously forming channel members from a pair of endless strips and the strut members from an endless third strip, guiding the channels in a predetermined relation to one another with the third strip therebetween and thereafter welding the apices to the channel members.

Abstract: Bonding apparatus bonds inner leads on a film carrier to outer leads. Outer lead frame stock and the film carrier bearing the inner leads and dies are fed to the bonding site. A set of inner leads and the die thereto bonded is punched from the film carrier and moved to the bonding position in a manner such that the inner leads are aligned with the outer leads. A bonding tool effects the bond. Thereafter, the next set of outer leads and inner leads and die are advanced to the bonding site.