Alternative Bonding Patents (Class 228/177)
  • Patent number: 10624245
    Abstract: According to various aspects, exemplary embodiments are disclosed of laser weldable brackets for attachment of heat sinks to EMI shields, such as a board level shield, etc. In an exemplary embodiment, an assembly generally includes an electromagnetic interference (EMI) shield, a heat sink, and a bracket laser weldable to the EMI shield for attachment of the heat sink to the EMI shield. In another exemplary embodiment, a method of attaching a heat sink to an EMI generally includes laser welding a bracket to the EMI shield whereby the bracket retains the heat sink in place relative to the EMI shield.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: April 14, 2020
    Assignee: Laird Technologies, Inc.
    Inventor: Yu Jen Wang
  • Publication number: 20150010270
    Abstract: An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 8, 2015
    Inventor: Hans-Herrmann Oppermann
  • Publication number: 20140277316
    Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a first portion and a second portion, wherein the first portion defines an exposed outer surface of the electrode and is electrically coupled to the second portion along a first interface, wherein the second portion is electrically coupled to the lead wire along a second interface different from the first interface via welding to couple the lead wire to the electrode, wherein an electrical signal may be transferred between the lead wire and exposed outer surface of the first portion via the second portion, and wherein the first portion is formed from a first material having a first composition, and the second portion is formed from a second material having a second composition different from the first composition.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Medtronic, Inc.
    Inventors: Xingfu Chen, Bernard Q. Li, Richard T. Stone, Dale F. Seeley, Alan Shi
  • Patent number: 8756785
    Abstract: A method of manufacturing a shaft of a surgical instrument including forming a proximal segment of the shaft to include one or more features for operably engaging the shaft to a first component of the surgical instrument, forming a distal segment of the shaft to include one or more features for operably engaging the shaft to a second component of the surgical instrument and forming an intermediate segment of the shaft. The proximal segment is welded to a proximal end of the intermediate segment; and the distal segment is welded to a distal end of the intermediate segment. The proximal and distal segments are welded to the intermediate segment such that the one or more features thereof are aligned in a pre-determined orientation relative to one another.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: June 24, 2014
    Assignee: Covidien LP
    Inventors: James D. Allen, IV, Kim V. Brandt, Monte S. Fry, Keir Hart, Daniel A. Joseph, Peter M. Mueller, Jeffrey R. Unger
  • Patent number: 8752753
    Abstract: A method of construction of a tungsten carbide/TSP insert for hard facing a wear surface comprises the steps of forming a tungsten carbide body (12) in a mold. After the molding step, a channel section slot (24) or pocket (24?) is created in the body before it has hardened substantially. The body is then heat-treated to harden it. A TSP body (32) is fitted in the slot/pocket (24/24?) so that it is a close sliding fit between the sides (18) of the slot, and is of the same depth as the slot. The TSP is (preferably) brazed into the slot. The insert has pips (30) on its edges (18) to facilitate welding to a substrate prior to a final brazing step.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 17, 2014
    Inventor: Mark Russell
  • Publication number: 20110228650
    Abstract: A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and a unit adhesion material layer that contains Sn, Sn alloy, Pb alloy or Bi alloy is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the unit adhesion material layer is sandwiched therebetween; and causing a light including the predetermined wavelength to enter the unit substrate to melt the unit adhesion material layer. The unit adhesion material layer melted by the light including the predetermined wavelength can ensure high alignment accuracy as well as higher bonding strength and less change with time.
    Type: Application
    Filed: October 6, 2010
    Publication date: September 22, 2011
    Applicants: TDK Corporation, Headway Technologies, Inc.
    Inventors: Koji SHIMAZAWA, Yoshihiro TSUCHIYA, Seiichi TAKAYAMA, Nobuyuki MORI, Yasuhiro ITO, Kosuke TANAKA, Osamu SHINDO, Ryuji FUJII, Takashi HONDA, Yoshitaka SASAKI
  • Publication number: 20110068152
    Abstract: Disclosed herein are iron-based alloys having a structure comprising fine-grained ferritic matrix and having a 60+ Rockwell C surface, wherein the ferrific matrix comprises <10 ?m Nb and W carbide precipitates. Also disclosed are methods of welding comprising forming a crack free hardbanding weld overlay coating with such an iron-based alloy. Also disclosed are methods of designing an alloy capable of forming a crack free hardbanding weld overlay, the methods comprising the step determining an amorphous forming epicenter composition, determining a variant composition having a predetermined change in constituent elements from the amorphous forming epicenter composition, and forming and analyzing an alloy having the variant composition.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 24, 2011
    Inventors: Justin Lee Cheney, John Hamilton Madok
  • Patent number: 7854364
    Abstract: The present invention resides in a golf club head having a high COR that is durable and has desirable acoustic qualities. The club head includes a body portion, a striking face and a crown forming a hollow cavity of at least 150 cc in volume. The crown is secured to the body portion, enclosing an upper opening. A surface veil may also be provided about a junction of the crown and body. The crown has a maximum thickness no greater than about 2 mm. The density of the crown is less than the density of the body portion. The golf club head has a maximum coefficient of restitution of at least 0.80.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: December 21, 2010
    Assignee: Taylor Made Golf Company, Inc.
    Inventors: Drew T. DeShiell, Kraig Alan Willett, Michael Scott Burnett, Benoit Vincent, Joseph Henry Hoffman
  • Publication number: 20100002987
    Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 7, 2010
    Applicant: HITACHI, LTD.
    Inventors: Shohei HATA, Naoki MATSUSHIMA, Toshiaki TAKAI, Yukio SAKIGAWA, Satoshi ARAI
  • Publication number: 20090288762
    Abstract: The invention relates to a method for welding a conductor to a conductive film, which is preferably intended for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.
    Type: Application
    Filed: January 24, 2006
    Publication date: November 26, 2009
    Inventor: Markus Wolfel
  • Publication number: 20090155623
    Abstract: Provided are precipitation hardened high strength nickel based alloy welds that yield improved properties and performance in joining high strength metals. The advantageous weldments include two or more segments of ferrous or non-ferrous components, and fusion welds, friction stir welds, electron beam welds, laser beam welds, or a combination thereof bonding adjacent segments of the components together, wherein the welds comprise a precipitation hardened nickel based alloy weld metal composition including greater than or equal to 1.4 wt % of combined aluminum and titanium based on the total weight of the nickel based alloy weld metal composition. Also provided are methods for forming the welds from the nickel based alloy weld compositions, wherein the precipitation hardening occurs in the as-welded condition. The nickel based welds do not require a separate heat treatment step after welding to produce advantageous strength properties.
    Type: Application
    Filed: December 16, 2008
    Publication date: June 18, 2009
    Inventors: Raghavan Ayer, Neeraj Srinivas Thirumalai, Hyun-Woo Jin, Daniel B. Lillig, Douglas Paul Fairchild, Steven Jeffrey Ford
  • Publication number: 20090098234
    Abstract: A screw is provided for an injection unit having an inner diameter surface and a raised outer diameter surface on the screw flights. Carbide inserts such as a carbide wire or a plurality of short carbide inserts are mounted to the outer diameter surface to reduce wear on both the screw flights and the inner surface of the extrusion barrel.
    Type: Application
    Filed: October 11, 2007
    Publication date: April 16, 2009
    Inventors: Josef Graetz, Frank Czerwinski
  • Publication number: 20090008430
    Abstract: Methods include providing substrate having substrate surface, forming metal-containing pad on substrate surface, and forming metal-containing protective shell enclosing metal-containing body on metal-containing pad. Methods may include forming sacrificial layer on metal-containing pad and including top surface and cavity, cavity having side wall extending between metal-containing pad and top surface; and forming metal-containing protective shell in cavity. Methods may also include providing first, second, third and fourth metal-containing pads on first, second, third and fourth substrate surfaces; forming first metal-containing protective shell on first or second metal-containing pad; forming second metal-containing protective shell on third or fourth metal-containing pad; heating first metal-containing protective shell to form solder-bond between first and second substrate surfaces; and heating second metal-containing protective shell to form solder-bond between third and fourth substrate surfaces.
    Type: Application
    Filed: July 6, 2007
    Publication date: January 8, 2009
    Applicant: Lucent Technologies Inc.
    Inventors: Nagesh R. Basavanhally, Raymond A. Cirelli, Avinoam Kornblit
  • Publication number: 20080274006
    Abstract: A submerged pot roll and other articles for use in galvanizing baths including a metallurgically bonded superalloy cladding layer on a steel core layer. The cladding layer improves the corrosion resistance and dross buildup of the article and improves service life while reducing costs.
    Type: Application
    Filed: May 1, 2007
    Publication date: November 6, 2008
    Inventors: Mark Bright, Vinod K. Sikka, James W. Hales, Ravi Menon, Ever J. Barbero, Xingbo Liu, Jing Xu
  • Publication number: 20080257939
    Abstract: A method is disclosed for brazing components in a structure using a gap setting surface and brazing foil as brazing filler between the parts in order to form uniform joints having optimal dimensions, shape and strength. The components are assembled in an unconstrained stack, and a controlled load is applied to the top of the stack. The stack is then heated to a temperature at which the brazing foil melts and reacts with the components to form the joints. The stack is cooled resulting in a brazed structure having the desired dimension.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 23, 2008
    Inventors: Edward Emaci, Kent Shue
  • Publication number: 20080217382
    Abstract: A method for joining together two or more ceramic and/or metal parts by providing a braze consisting of a mixture of copper oxide, silver, and ceramic particulate. The braze is placed upon the surfaces of the parts, which are then held together for sufficient time and at a sufficient temperature to cause the braze to form a bond between the parts. The addition of the ceramic particulate increases the viscosity of the braze, decreasing squeeze out, decreasing the formation of air pockets, decreases the formation of brittle phases by providing nucleation sites and increases the flexural strength of the joint.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 11, 2008
    Inventors: Jin Yong Kim, Kenneth Scott Weil, Jung-Pyung Choi
  • Publication number: 20080169336
    Abstract: A welding apparatus is disclosed. The welding apparatus includes a torch body comprising at least one core, a plurality of contact tips extending in a direction from the at least one core, and a plurality of gas supply tubes disposed proximate the plurality of contact tips, the plurality of gas supply tubes extending in a substantially similar direction as the plurality of contact tips.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 17, 2008
    Inventors: Lyle B. Spiegel, Edward Kenneth Ellis, William Harold Childs, Peter Robert Burke
  • Publication number: 20080107948
    Abstract: A metallic, rigidized foil support structure (11) supports a cell (14) of a solid oxide fuel cell (10). The support structure (11) includes a separator sheet (18), a support sheet (16) having perforations (26) configured to communicate a fluid, and a porous layer (20) positioned between the separator sheet (18) and the support sheet (16). The porous layer (20) provides support and reinforcement to the support structure (11) as well as an electrical connection between the support sheet (16) and the separator sheet (18). Fuel flows through the porous layer (20).
    Type: Application
    Filed: December 21, 2005
    Publication date: May 8, 2008
    Applicant: UNITED Technologies Corporation
    Inventor: Jean Yamanis
  • Publication number: 20080093421
    Abstract: A vehicle exhaust gas purification device has a multipart outer housing (10) including a tube (12) and end walls (14) that have been reshaped into funnels. The tube (12) and the end walls (14) are fitted into each other and brazed, soldered or welded to each other.
    Type: Application
    Filed: July 28, 2005
    Publication date: April 24, 2008
    Inventors: Erich Forster, Peter Kroner, Otto Steinhauser
  • Publication number: 20080090146
    Abstract: The present disclosure describes embodiments of bipolar plate electrode structures for use in an electrochemical battery assembly and a bipolar battery assembly utilizing the bipolar electrode plate structure as a fundamental building block. An exemplary bipolar electrode assembly can have an electrically isolated mechanical supporting plate sandwiched between two electrically conducting electrode substrate plates which are mechanically and electrically connected through holes in the supporting plate. Vapor and liquid tight sealing can be accomplished with an internal sealing ring placed in compression between and thermally bonded to the two conducting electrode substrates. The exposed metallic edges of the electrode supports and substrates can provide improved heat removal from the bipolar battery assembly. Associated construction methods are also described.
    Type: Application
    Filed: October 12, 2007
    Publication date: April 17, 2008
    Inventor: David Batson
  • Patent number: 6581820
    Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: June 24, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Sung Jung, Jong-Tae Kim, Guem-Young Youn, Chang-Dug Kim
  • Patent number: 6543672
    Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: April 8, 2003
    Assignee: TGK Co., Ltd.
    Inventors: Hisatoshi Hirota, Shiniji Saeki, Kouji Habu
  • Patent number: 6543673
    Abstract: A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: April 8, 2003
    Assignee: Seagate Technology LLC
    Inventors: Michael Henry Lennard, William Leon Rugg
  • Patent number: 6354484
    Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: March 12, 2002
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Masami Sakuraba, Masami Kimura, Masaya Takahara, Junji Nakamura
  • Patent number: 6299056
    Abstract: There is provided an LED that can prevent the dissolution and separation of electrodes due to etching in the manufacturing stage and has a high light emission efficiency even when horizontally mounted as well as a method for manufacturing the LED. In a light-emitting diode 100 which is cut from a wafer by dicing and in which a positive electrode 4 and a negative electrode 3 are formed parallel to a pn junction plane 20, the positive electrode 4 provided by a p-side ohmic contact metal layer 41 formed on a surface of a p-type semiconductor layer (p-type GaN layer 2) and a p-side electrode metal layer 42 made of an alloy including gold and nickel, while the negative electrode 3 is provided by an n-side ohmic contact metal layer 31 formed on a surface of an n-type semiconductor layer 1 and an n-side electrode metal layer 32 made of an alloy including gold and nickel. The side surface 7 of a light-emitting diode chip that is brought in contact with a dicing blade is etched by an acid solution.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: October 9, 2001
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kiyohisa Oota
  • Patent number: 6295709
    Abstract: A PCB assembly which allows economical and reliable rework. The PCB assembly contains a soldermask and a trace with a portion of the trace exposed by a soldermask relief When one needs to rework the PCB assembly, one bonds a rework wire, using conventional intermetalic bonding materials, to the portion of the trace exposed by the soldermask relief There is no need to bond a rework wire to a component. Further, there is no need to scrape a off the soldermask and possibly damage the traces and/or vias. The bonds are high reliability bonds, and the labor required to perform such bonds are minimal.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: October 2, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Dean A. Klein
  • Patent number: 6160237
    Abstract: The invention is directed to a friction welding process for mounting blades of a rotor for a flow machine. A plurality of oblong welding surfaces are provided at a circumferential surface of a carrier and are respectively welded to a welding surface of a blade. The welding temperature is generated by pressing the welding surfaces together and by an oscillating relative motion between the blade and the carrier in the welding plane. At least the blade or the carrier is additionally heated to a temperature lying below the welding temperature in the region of the welding surface.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: December 12, 2000
    Assignee: MTU Motoren-und Turbinen-Union Muenchen GmbH
    Inventors: Dieter Schneefeld, Hans Wilhelm, Dietmar Helm, Erich Thaler
  • Patent number: 6142358
    Abstract: Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.
    Type: Grant
    Filed: May 31, 1997
    Date of Patent: November 7, 2000
    Assignee: The Regents of the University of California
    Inventors: Michael B. Cohn, Roger T. Howe
  • Patent number: 6138889
    Abstract: There is described a device for welding motor-vehicle bodies, comprising a welding station provided with welding programmable robots, to which the floor panels of the bodies to be welded are fed along a vertical direction by a lifting device. The component elements of the sides of the body to be welded are brought to the assembling position by means of two locating gates, provided with self-propelled lower carriages, which are movable on rails between a working position, at the two sides of the floor panel of the body to be welded, and a waiting position, in which they may receive the component elements of the body sides. The elements of the rear part of the body are carried by a third locating frame arranged transversally between the two guiding rails of the side locating gates.
    Type: Grant
    Filed: February 1, 1999
    Date of Patent: October 31, 2000
    Assignee: Comau S.p.A.
    Inventors: Giancarlo Campani, Bernd Konigsbrugge
  • Patent number: 6092714
    Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: July 25, 2000
    Assignee: MCMS, Inc.
    Inventor: William J. Casey
  • Patent number: 6045029
    Abstract: An earth-boring bit has a bit body, at least one cantilevered bearing shaft, including a base and a cylindrical journal bearing surface extending inwardly and downwardly from the bit body, and at least one cutter mounted for rotation on the cylindrical journal bearing surface of the bearing shaft. A seal assembly is disposed between the cylindrical journal bearing surface and the cutter proximally to the base of the cantilevered bearing shaft. The seal assembly includes at least one rigid seal ring having a seal face in contact with a second seal face. At least one of the seal faces is at least partially formed of a super-hard material having wear-resistance greater than, and a coefficient of sliding friction less than, that of the rigid seal ring material.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: April 4, 2000
    Assignee: Baker Hughes Incorporated
    Inventor: Danny Eugene Scott
  • Patent number: 5957366
    Abstract: A helical weld servo controller for controlling the diameter of helically formed welded pipes adjusts the auxiliary hold down wheel position and the helix angle based on information provided by transducers regarding outgoing pipe diameter and by a laser vision device which generates weld gap and offset information.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: September 28, 1999
    Assignee: Ameron International Corporation
    Inventor: Ralph S. Friedrich
  • Patent number: 5950906
    Abstract: A method of reversibly brazing surfaces together. An interface is affixed to each surface. The interfaces can be affixed by processes such as mechanical joining, welding, or brazing. The two interfaces are then brazed together using a brazing process that does not defeat the surface to interface joint. Interfaces of materials such as Ni-200 can be affixed to metallic surfaces by welding or by brazing with a first braze alloy. The Ni-200 interfaces can then be brazed together using a second braze alloy. The second braze alloy can be chosen so that it minimally alters the properties of the interfaces to allow multiple braze, heat and disassemble, rebraze cycles.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: September 14, 1999
    Assignee: Sandia Corporation
    Inventors: Jim D. Pierce, John J. Stephens, Charles A. Walker
  • Patent number: 5634585
    Abstract: A method for aligning and bonding spaced components, such as a baseplate and a faceplate of a field emission display, is provided. The method includes: providing an optical alignment tool suitable for flip chip bonding; calibrating the tool to simulate a desired spacing in the assembled components; aligning the components using the calibrated tool; bringing the aligned components towards one another using the calibrated tool; and then bonding the components together with the desired spacing therebetween. The method of the invention can be practiced with an aligner bonder tool calibrated to eliminate a parallax error. A spacer element placed between the bondheads of the tool can be used to simulate the desired spacing during calibration. Alternately the spacing during calibration can be simulated by measuring with a caliper or other instrument.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: June 3, 1997
    Assignee: Micron Display Technology, Inc.
    Inventor: Darryl Stansbury
  • Patent number: 5632437
    Abstract: A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: May 27, 1997
    Assignee: LSI Logic Corporation
    Inventors: Sutee Vongfuangfoo, Mirek Boruta, Galen Kirkpatrick
  • Patent number: 5551623
    Abstract: Process for welding two blade parts (9, 10) by a means such as a linear friction welding machine, in which a collar or flange (15) of material to be sacrificed is placed between the contact surfaces (16) or around the latter in order to increase the heat produced by the friction at the leading and trailing edges of the blade. As a result of this arrangement it is possible to start with two blade parts (9, 10) having the dimensions of the finished product, possibly with the exception of the area around the contact surfaces, so that the final machining is very significantly reduced.
    Type: Grant
    Filed: February 17, 1995
    Date of Patent: September 3, 1996
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "SNECMA"
    Inventors: Andre C. F. Collot, Jean-Pierre Ferte, Roger Jolly
  • Patent number: 5411199
    Abstract: A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).
    Type: Grant
    Filed: March 7, 1994
    Date of Patent: May 2, 1995
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Suppelsa, Robert F. Darveaux, Thomas A. Goodwin, Julio Abdala, Henry F. Liebman
  • Patent number: 5400952
    Abstract: There is provided by the present invention method and apparatus for damping vibrations or other unwanted motions of a brush seal, the apparatus including a damper having a plurality of individual plates that are bonded directly to the inlet rows of bristles of the seal. Methods for producing a damped brush seal in accord with the present invention contemplate brazing damping plates to the bristles, absorbing a melting point suppressor into the surface of the damping plates and then heating the damping plates until the treated surface melts and bonds with the bristles, or sintering a braze alloy to the bristles such that the braze alloy functions as a damping plate.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: March 28, 1995
    Assignee: General Electric Company
    Inventors: Rolf R. Hetico, Stephen M. Bishop, Larry W. Plemmons, Eugene W. Kreimer
  • Patent number: 5330095
    Abstract: A constant velocity universal joint designed as a fixed or plunging joint permits the use of balls with a larger diameter, with the selectable shaft diameter not being adversely affected by using such balls with a larger diameter. The objective is achieved in that, in a first operation, the inner joint part is assembled with the cage while being pivoted at an angle of up to 90.degree. and that, subsequently, in a second operation, the inner joint part is welded to an associated shaft.
    Type: Grant
    Filed: August 12, 1993
    Date of Patent: July 19, 1994
    Assignee: GKN Automotive AG
    Inventors: Werner Krude, Peter Harz
  • Patent number: 5299727
    Abstract: The invention relates to a method for manufacture of an optoelectronic coupling element having a multi-part housing, in which a first housing section is designed as a plug and a second housing section as the receptacle receiving said plug, and where at least one optoelectronic element each is mounted on a contact strip in said first and second housing sections. The method in accordance with the invention is characterized in that the first and second housing sections are initially shaped around one contact strip segment each, in that in a further process step the optoelectronic elements are mounted in cutouts in the interiors of the plug and the receptacle, and in that the plug and the receptacle are joined together after manufacture of the electrical connections of the optoelectronic elements with their respective contact strips.
    Type: Grant
    Filed: April 9, 1993
    Date of Patent: April 5, 1994
    Assignee: Temic Telefunken microelectronic GmbH
    Inventor: Albin Kofler
  • Patent number: 5297719
    Abstract: A method of producing inner parts of a tripod joint followed by a tubular shaft has one end of the tubular shaft deformed in a non-chip-forming way. The deforming increases the wall thickness. Radial arms are connected to the thickened region of the tubular shaft end, preferably by friction welding.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: March 29, 1994
    Assignee: GKN Automotive AG
    Inventor: Rolf Cremerius
  • Patent number: 5230461
    Abstract: Apparatus is described for transporting sections of pipe and connecting them together for laying pipe above ground or in a trench. The apparatus includes a wheeled frame (e.g., a trailer), rotary support for supporting one end of a first pipe section, and an alignment mechanism for supporting the other end of the first pipe section and the leading end of a second pipe section. The first pipe section can be rotated relative to the second pipe section to either connect or disconnect the pipe sections. In another embodiment, apparatus is provided for supporting pipe sections which are to be welded together.
    Type: Grant
    Filed: September 8, 1992
    Date of Patent: July 27, 1993
    Inventor: Robert Scheuerman
  • Patent number: 5180095
    Abstract: Machinery for welding helical-seam pipe from metal strip. It includes a strip feed, a strip shaper, a seam welder, a pipe output, and a downstream pipe sectioner. The pipe sectioner has a cutter that moves back and forth axially, trimming sections of different lengths from the pipe as it rotates around its axis and leaves the machinery. The machinery also has controls that determine the welding gap between the section of the strip and the beginning of the pipe and how rapidly the pipe cutter moves along the pipe. How rapidly (v) the pipe cutter (47) moves along the pipe is controlled by three detectors. One detector (60 determines how rapidly (v.sub.b) the strip is traveling. Another detector (62) determines the strip-infeed angle (.alpha.) between the section (9) of strip and the axis of the pipe. A third detector, a camera (53), determines the axial deviation of the incision (54) over an angle (.beta.) to the pipe cutter at the circumference of the pipe.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: January 19, 1993
    Assignee: Hoesch Maschinenfabrik Deutschland AG
    Inventor: Heinz-Dietmar Orth
  • Patent number: 5100047
    Abstract: A spacing ring for placement between a radially inwardly facing annular surface on a first member and a radially outwardly facing annular surface on a second member to maintain the first and second members in predetermined radially spaced relationship. The ring consists of a plurality of matted metal threads formed into an annular configuration. The ring has a radially inwardly facing surface to surroundingly engage the radially outwardly facing annular surface on the second member and a radially outwardly facing surface to be surroundingly engaged by the inwardly facing annular surface of the first member with the radially inwardly facing annular surface on the first member and the radially outwardly facing annular surface on the second member in axially overlapping relationship. The invention also contemplates a method of forming the spacing ring. The wool material is wrapped around an annular surface on a core bar.
    Type: Grant
    Filed: January 23, 1991
    Date of Patent: March 31, 1992
    Inventors: Yukihiro Nakagawa, Alan L. Brittingham
  • Patent number: 5094384
    Abstract: A soldering tip is provided with a sensor to sense soldering tip temperature during a soldering cycle. The sensor is embedded in the soldering tip and positioned immediately adjacent to the tip's working surface. The sensor location provides rapid response to changing conditions at the tip's working surface. A microprocessor, responsive to the sensor, is provided to process the tip temperature data to control the power delivered to the heater which provides heat to the soldering tip. A visual and/or audio display also can be coupled to the processor. The microprocessor can be coupled to a further processor having long-term memory so that the collected data may be subsequently retrieve and displayed.
    Type: Grant
    Filed: August 16, 1991
    Date of Patent: March 10, 1992
    Assignee: Cooper Industries, Inc.
    Inventor: Paul L. Urban
  • Patent number: 5083697
    Abstract: A method for joining a first metal surface to a second metal surface employs metallized particles or protuberances disposed between said surfaces. The metallized particles include a core particulate composed of a material having a hardness greater than that of the metals to be bonded. By compressing the metal surfaces together in a generally normal or perpendicular direction, one or both of the metal surfaces is compressed into a metal region formed around the particulate core. In this way, very high local regions of stress are created which cause the metal to elastoplastically deform, enhancing the ability to form diffusion bonds. Alternatively, temporary electrical or other junctions may be formed by bringing the surfaces together under less rigorous conditions and/or using metals which are incapable of forming diffusion bonds.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: January 28, 1992
    Inventor: Louis Difrancesco
  • Patent number: 5076485
    Abstract: Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles so that each bonded particle is between and in contact with a pad and a lead. Preferably the particles are solid spheres 1.0 mils in diameter. The spheres may be applied by covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of vehicle and spheres.
    Type: Grant
    Filed: December 20, 1990
    Date of Patent: December 31, 1991
    Assignee: Microelectronics and Computer Technology Corporation
    Inventor: Colin A. MacKay
  • Patent number: 5074456
    Abstract: An electrode assembly for a plasma reactor, such as a plasma etch or plasma-enhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof. The electrode plate is composed of a substantially pure material which is compatible with a particular reaction being performed in the reactor, while the support frame is composed of a material having desirable thermal, electrical, and structural characteristics. The support frame is bonded to the electrode plate using a bonding layer, usually a ductile metallic bonding layer, which provides effective thermal and electrical coupling while permitting a degree of thermal expansion mismatch between the support frame and the electrode plate.
    Type: Grant
    Filed: September 18, 1990
    Date of Patent: December 24, 1991
    Assignee: LAM Research Corporation
    Inventors: Raymond L. Degner, Eric H. Lenz
  • Patent number: 5070775
    Abstract: An improved removable cooking surface assembly for the upper movable heated platen of a two-sided cooking device includes a cooking surface device having a planar rigid heat-conducting metal platen with threaded studs bonded to its upper surface, the studs being aligned with bores in an upper movable heat platen, the heat-conducting plate being coated on its lower surface with a layer of non-stick synthetic coating. The coated platen is removably connected with a heated platen and extends in contiguous relation across the lower surface of the heated platen for uniform heat transfer from the heated platen to the coated platen and the food product being cooked. Following cooking of the food product, the upper platen is raised, and the food product remains on the lower grill surface because the coating of the upper surface prevents the product from sticking to the non-stick coating over the heated platen.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: December 10, 1991
    Assignee: Bottomline Management, Inc.
    Inventor: John Blake
  • Patent number: RE41266
    Abstract: An electrode assembly for a plasma reactor, such as a plasma etch or plasma-enhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof. The electrode plate is composed of a substantially pure material which is compatible with a particular reaction being performed in the reactor, while the support frame is composed of a material having desirable thermal, electrical, and structural characteristics. The support frame is bonded to the electrode plate using a bonding layer, usually a ductile metallic bonding layer, which provides effective thermal and electrical coupling while permitting a degree of thermal expansion mismatch between the support frame and the electrode plate.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: April 27, 2010
    Assignee: Lam Research Corporation
    Inventors: Raymond L. Degner, Eric H. Lenz