Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

Abstract: A method for depositing a metal-based coating on a particulate substrate, including: i) preparing a mixture comprising the particulate substrate, a powder comprising a coating metal oxide of one or more of Ti, Al, Zn, Sn, In, Sb, Ag, Co, V, Ni, Cr, Mn, Fe, Cu, Pt, Pd, Ta, Zr, Nb, Rh, Ru, Mo, Os, Re and W, a reducing agent powder of Al metal or Al alloy, and a powder of aluminium chloride; and ii) mixing and heating the mixture to form a coating on the particulate substrate, to produce a coated substrate product.

Abstract: Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.

Abstract: A method of joining a first metal workpiece substrate and a second metal workpiece substrate by way of reaction metallurgical joining involves passing a pulsating DC electrical current through the metal workpiece substrates and a reaction material disposed between confronting faying surfaces of the workpiece substrates. The electrical current comprises a plurality of current pulses that generally increase in applied current level.

Abstract: The present invention is an electrode material constituting a movable electrode of a thermal fuse, having a five-layer clad structure including a core material layer, an intermediate layer formed on the both sides of the core material layer, and a surface layer formed on the intermediate layer, wherein the core material layer includes Cu, the intermediate layer includes an Ag—Cu-based alloy, the surface layer includes an Ag—CuO-based oxide-dispersed strengthened alloy, and the ratio of the thickness of the intermediate layer to the thickness of the surface layer (intermediate layer/surface layer) is 0.2 or more and 1.0 or less. This electrode material can be manufactured by partially internally oxidizing a three-layer clad material in which plate materials made of an Ag—Cu-based alloy are clad-jointed to both sides of the plate material made of Cu.

Abstract: A method of forming a metal bonding layer includes forming first and second bonding metal layers on one surfaces of first and second bonding objects, respectively. The second bonding object is disposed on the first bonding object such that the first bonding metal layer and the second bonding metal layer face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first bonding metal layer and the second bonding metal layer includes an oxidation prevention layer formed on an upper surface thereof. The oxidation prevention layer is formed of a metal having an oxidation reactivity lower than an oxidation reactivity of the bonding metal layer on the upper surface which the oxidation prevention layer is disposed.

Abstract: A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.

Abstract: A method and apparatus for joining a first workpiece and a second workpiece. A layer of exothermic material is placed between the first workpiece and the second workpiece. A plurality of currents is applied to the layer of exothermic material in a plurality of locations and substantially at the same time such that an exothermic reaction occurs in the layer of exothermic material.

Abstract: A method of forming a metal bonding layer includes forming a first bonding metal layer and a second bonding metal layer on surfaces of first and second bonding target objects, respectively. The second bonding target object is disposed on the first bonding target object to allow the first and second bonding metal layers to face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first and second bonding metal layers includes a reaction delaying layer formed of a metal for delaying the reaction between the first and second bonding metal layers.

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: The present invention provides a process of initiating a self-propagating reaction with a coherent radiation source, which comprises mixing the chemical reactants, and contacting the chemical reactants by the coherent radiation, more specifically, the coherent radiation source may be a laser.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the elemental metal and/or precious metal. The invention is characterized in that the particles have a coating containing a reducing agent by means of which the organic metal compound and/or precious metal oxide is reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Abstract: Copper conductor members or other copper-base workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal strip between assembled facing joining surfaces. The members are pressed together against the reactive material and heated. The combined pressure and heat enable the reactive material to react with facing workpiece material, to liquefy and remove oxides or the like that might inhibit the formation of a welded interface. The liquid, containing original reactive metal and byproducts, is squeezed from the interface of the workpieces to enable the formation of a solid-state weld between them without melting of un-reacted workpiece copper material.

Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.

Abstract: A new anchoring mechanism for the mold-crucible set to the tube, to which the cable is to be welded is described, and the inclusion and use of some bushings which are inserted between the cable and the mold.

Abstract: Copper conductor members or other copper-base workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal strip between assembled facing joining surfaces. The members are pressed together against the reactive material and heated. The combined pressure and heat enable the reactive material to react with facing workpiece material, to liquefy and remove oxides or the like that might inhibit the formation of a welded interface. The liquid, containing original reactive metal and byproducts, is squeezed from the interface of the workpieces to enable the formation of a solid-state weld between them without melting of un-reacted workpiece copper material.

Abstract: A method of metalworking a substrate (10) previously strengthened in a gas heat treatment to form precipitates throughout an entire volume of the substrate (10), where the precipitates have an active chemical element incorporated during the gas heat treatment. The method includes: melting a portion of the substrate (10) during a full penetration metalworking process to form a molten portion (12); generating a metalworking atmosphere (22) having a supply of an active chemical element in a gas state during the metalworking process; exposing the molten portion (12) to the metalworking atmosphere (22); and cooling the molten portion (12) while maintaining exposure to the metalworking atmosphere (22) to form a solidified portion (36) comprising precipitates comprising the active chemical element, where the precipitates are present throughout an entire volume of the solidified portion (36), and thereby re-strengthen the entire volume of the solidified portion (36).

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: A process produces a connecting structure between two superconductors, in particular magnesium diboride superconductors embodied as a superconducting core wire surrounded by normally conducting metal. A substance which reduces the melting point of magnesium is admixed to a substance mixture including magnesium and boron, and the exposed ends of the core wires are brought into contact with the substance mixture, which is caused to react in situ at a reaction temperature corresponding to the lower melting point to give magnesium diboride.

Abstract: A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a second step, electrical connections are formed from connection portions already present in the application surfaces of the two circuit parts. The connections formed extend across the bonding interface, and are compatible with a high reliability and a high level of integration of the circuit.

Abstract: An exothermic reaction mixture for joining metallic components includes at least one transition metal oxide and, as fuel, a mixture of aluminium and calcium suicide, wherein the molar ratio of aluminium to calcium suicide is from 16:1 to 0.25:1. Methods of preparing the exothermic reaction mixtures and for using them in welding applications are also described.

Abstract: A weld ignition system includes a wireless receiver that wirelessly receives a weld ignition activation signal. The weld ignition system further includes igniter that ignites a weld ignition material in response to the wireless receiver wirelessly receiving the weld ignition activation signal. The ignited weld ignition material initiates exothermic based welding of a weld material.

Abstract: A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other.

Abstract: A reactive foil is used to assemble the components of rock bit cutters and to affix cutting elements to rock bit bodies. A small pulse of localized energy ignites the foil in a fraction of a second to deliver the necessary amount of heat energy to flow solder or braze and form a strong, true metallic joint. The reaction in the foil may be activated using optical, electrical, or thermal sources.

Abstract: An assembly is disclosed for exothermic welding comprising a mold which is formed of a material which withstands exothermic welding temperatures and includes a weld cavity therein for positioning at least two members which are to be exothermically welded together, and an ignition cavity communicating with the weld cavity. The mold is capable of accommodating any one of several exothermic welding procedures which may involve either a flint igniter or the use of an electrical igniter which is readily accommodated by the mold in the performance of several of the procedures. The electrical igniter is formed of a pair of flat, longitudinally extending conductor strips with a sheet of insulation laminated therebetween, a filament adjacent one end of the strips, and one or more positioning tabs adjacent one end of the strips. A cartridge is also provided which contains the weld metal and the electrical igniter and which may be positioned in the ignition cavity of the mold.

Abstract: Fluidizable potassium fluorozincate which is very suitable for dry fluxing applications can be prepared from a diluted potassium base selected from the group consisting of KOH, KHCO3 and K2CO3, ZnO and HF. The cumulative volume of the particles has an X10 value of equal to or greater than 1.5 microns, preferably, equal to or greater than 2 microns. It is very suitable for pneumatic transport for aluminum brazing.

Abstract: A method for joining components to be used in an electrical generator. First and second components are provided. The first and second components are preheated and a reactive bonding material is disposed between and in contact with the first and second components. The reactive bonding material includes a first material, which is a brazing material, and a second material that is capable of melting the first material upon an initiation of an exothermic reaction in the second material. An exothermic reaction is initiated in the second material to effect a release of thermal energy from the second material to melt the first material. Upon a cooling and solidification of the first material, the first material creates a bond between a first surface of the first component and a second surface of the second component to join the first and second components together.

Abstract: The present invention relates to an assembly method by reactive brazing of a first metallic element such as an end cover plate of a vacuum cartridge with a second element such as the cylindrical body of said cartridge, said second element comprising an ion-covalent oxide at least at the surface by means of an alloy called added alloy designed to constitute a liquid brazing alloy designed to wet the two respectively metallic and ion-covalent oxide surfaces to be assembled of the above-mentioned two elements, said brazing alloy containing titanium and said metallic element containing nickel.

Abstract: Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: This invention relates to a thermite welding process for joining sections of a railway line in situ, the process including the preliminary step of mounting a suitable welding mould about the aligned sections of railway line to be welded together and sealing the mould to prevent run out; mounting a vibration means on the railway line at a suitable distance from the mould and operating it at a suitable frequency; heating the sections of railway line to a desired temperature; igniting an ignitor means and allowing it to drop into the mould to react with molten steel in the mould and fill a weld area about and between the sections of railway line in the mould; and when solidified, to vibrate the railway line for a further period of time until stress relieving of the cast weld area has occurred.

Abstract: Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to form the desired solder. In-situ composite solder alloys formed by the disclosed method provide greater solder joint strength and fatigue resistance.

Abstract: A gas turbine airfoil is disclosed. The gas turbine airfoil includes a root section, a separate extension section attached to the root section, and a joint disposed between the root section and the extension section, the joint including at least one of a mechanical interlock and a metallurgical bond.

Abstract: A method of inhibiting a formation of palladium-nickel-tin (Pd—Ni—Sn) intermetallic in solder joints is described as follows. Firstly, a solder alloy is provided. Then, at least one of a trace of copper and a trace of zinc is doped into the solder alloy. Afterward, the solder alloy is disposed on the Pd-bearing surface finish, such as a Pd/Ni bi-layer or a Au/Pd/Ni tri-layer. Next, the solder alloy is soldered with the surface finish as solder joints. During the soldering, the Cu and Zn will incorporate into the soldering reaction, forming copper-palladium-nickel-tin intermetallic and zinc-palladium-nickel-tin intermetallic, replacing the Pd—Ni—Sn respectively. Consequently, the addition of Cu and/or Zn into solders will inhibit the undesirable Pd—Ni—Sn intermetallic to form in the solder joints.

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: One embodiment of the invention includes first particles comprising an intermetallic compound comprising titanium and aluminum; second particles comprising aluminum; and third particles comprising titanium.

Abstract: This invention is directed to a process for joining materials comprising providing an assembly comprising at least one material layer; at least one metal heat source; and at least one solder layer, each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere; and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.

Abstract: A solid weld-metal-producing material is formed by agglomerating weld metal material powder. An igniter may be integrally formed in or on the agglomerated weld metal material. In addition to typical components of a weld metal material mixture, such as a reductant metal and a transition metal oxide, the agglomerated weld metal mixture may include a binder material, such as sodium silicate. In addition to functioning as a binder to help hold the agglomerated weld metal material together, the binder material may aid in the exothermic reaction that occurs when the weld metal material is ignited. The agglomerated weld metal material may be made by mixing together a reductant metal powder, a transition metal oxide powder, and possibly a binder solution. A slurry of the components may be pressed together, for example, using a die and a ram, and then may be dried.

Abstract: A process and apparatus for the reactive multilayer joining of components utilizing a print screen metallization technique to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.

Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

Abstract: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.

Abstract: A reactive foil is used to join rock bit components such as leg sections, hardfacing, and cutter elements to the rolling cone earth-boring bit body. A small pulse of localized energy ignites the foil in a fraction of second to deliver the necessary amount of heat energy to reflow solder or braze and form a strong, true metallic joint. The reaction in the foil may be activated using optical, electrical, or thermal sources.

Abstract: This invention is directed to a process for joining materials comprising providing an assembly comprising at least one material layer; at least one metal heat source; and at least one solder layer, each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere; and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.

Abstract: A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joining surface of the supporting member. A second metal film is formed on a joining surface of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixture have distinct advantages over the prior art. These advantages include a higher filler metal yield, an increased tensile strength, and a higher quality corrosion resistant weld. These advantages are accomplished by a process wherein a reactant mixture is provided which has a reducing agent, a metallic compound, and at least two filler metals that at least in part do not chemically react with the metallic compound, one of which is aluminum. The metallic compound subsequently forms, with the reducing agent, having a high heat of formation which provides an exothermic reaction with sufficient heat to melt the filler metals.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Abstract: The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.