And Unclamping Patents (Class 228/213)
  • Patent number: 11559897
    Abstract: Systems and methods for AI assisted reconfigurable, fixtureless manufacturing is disclosed. The invention eliminates geometry-setting tools (hard points, pins and nets—traditionally known as 3-2-1 fixturing schemes) and to replace the physical geometry setting with virtual datums driven by learning AI algorithms. A first type of part and a second type of part may be located by a machine vision system and moved by material handling devices and robots to locations within an assembly area. The parts may be aligned with one another and the alignment may be checked by the machine vision system which is configured to locate datums, in the form of features, of the parts and compare such datums to stored virtual datums. The parts may be joined while being held by the material handling devices or robots to form a subassembly in a fixtureless fashion. The material handling devices are able to grasp a number of different types of parts so that a number of different types of subassemblies are capable of being assembled.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 24, 2023
    Inventor: George K. Ghanem
  • Patent number: 10088585
    Abstract: Coupling of geophysical sensor cable sections. At least some of the example embodiments are methods including coupling a first geophysical sensor cable section to a second geophysical sensor cable section. The coupling may be by: telescoping a first connector of the first geophysical sensor cable section into a second connector, the first connector comprising a male connector portion with external threads, and the second connector comprising a coupling ring with internal threads; abutting a first portion of a clam-shell gear against the coupling ring; closing the clam-shell gear such that a second portion of the clam-shell gear abuts the coupling ring, the clam-shell gear defining gear teeth on an outside diameter of the clam-shell gear; mating a pinion gear to the clam-shell gear; and turning the coupling ring relative to the male connector portion using of the pinion gear turning the clam-shell gear.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: October 2, 2018
    Assignee: PGS Geophysical AS
    Inventors: Matthew Eric Lyssy, Angela Dawn Riddick
  • Patent number: 9016551
    Abstract: The invention relates to a mounting device in an aircraft. In one aspect of the invention, a method is disclosed for assembling a metal securement member of the mounting device. In another aspect of the invention, a mounting device is disclosed. In another aspect of the invention, a method is disclosed for installing and using a mounting device in an aircraft.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: April 28, 2015
    Assignee: The Boeing Company
    Inventors: Brad L. Kirkwood, Paul S. Gregg, Gerry D. Miller, Jeff D. Will, David W. Evans
  • Publication number: 20150041524
    Abstract: A vacuum carrier can be employed to provide a partial vacuum on a back side surface of a substrate thereby holding the substrate flat against a rigid surface of the carrier throughout the duration of a bonding process. The magnitude of vacuum can be optimized to limit the warping of the substrate during and after bonding with another substrate, and to limit the mechanical stress induced in the solder balls during cooling. The vacuum carrier can include a base plate, a seal plate with at least one opening configured to accommodate at least one substrate, and vacuum seal elements configured to create a vacuum environment that pushes the substrate against the base plate when the vacuum carrier is under vacuum. The configuration of the vacuum carrier is chosen to avoid distortion of the substrate due to the vacuum seal elements, while allowing adjustment of the magnitude of the partial vacuum.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 12, 2015
    Applicant: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Sri M. Sri-Jayantha
  • Publication number: 20140331926
    Abstract: A mask assembly includes a mask frame having frame openings formed thereon, and a plurality of unit masks fixed to the mask frame. The respective unit masks extend in a first direction, and at least one of the plurality of unit masks includes at least one of a one sided projection projecting to one side thereof and another sided projection projecting to another side thereof, at both end portions of the unit mask, in a second direction that crosses the first direction.
    Type: Application
    Filed: October 21, 2013
    Publication date: November 13, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventor: YONG HWAN KIM
  • Publication number: 20140263587
    Abstract: Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: US Synthetic Corporation
    Inventors: Timothy N. Sexton, John Corradini
  • Publication number: 20130299563
    Abstract: Weld stress compensation system and method comprising: 1) a primary tube/rod clamp; 2) a secondary tube/rod clamp for selectively and accurately, angularly positioning the secondary tube relative to the primary tube. The secondary clamp is transferable while a secondary tube/rod is clamped therein to: 3) a saddle cutting fixture to produce a concave, relieved portion in the end of the secondary tube/rod with flanking flanges that fit precisely over the primary tube at the join intersection; 4) a miter-cut fixture for miter cutting of tube/rod ends to fit flat surfaces or conversely-cut tubes/rods for angular joins; and 5) a welding fixture for precise angular positioning of a miter cut tube/rod to a deck, wall, or stair plate. The primary clamp includes an adjustable pressure pad that applies pressure to the side of the primary tube opposite the secondary tube weld join line thereby preventing warping due to weld stresses.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 14, 2013
    Inventor: Timothy M. Uecker
  • Publication number: 20130270232
    Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 17, 2013
    Applicants: TDK Corporation, SAE Magnetics (H.K.) Ltd., ROHM CO., LTD.
    Inventors: Koji SHIMAZAWA, Osamu Shindo, Yoshihiro Tsuchiya, Yasuhiro Ito, Kenji Sakai
  • Patent number: 8474680
    Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: July 2, 2013
    Assignee: Invensas Corporation
    Inventors: Thomas M. Kampschreur, Joep Stokkermans, Arjan F. Bakker, Piet C. J. Van Rens, Arnoldus J. C. B. De Vet, Piet Van Der Meer
  • Patent number: 8360304
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: January 29, 2013
    Assignee: Kulicke and Soffa Industries Inc.
    Inventors: Sung Sig Kang, Hing Kuong Wong, Samuel Capistrano, III, Abdul Shukor Mohd Salleh, Wun Man Oranna Yauw
  • Publication number: 20120282445
    Abstract: A mask stick including a main body part having a pattern formed therein, one or more side clamping parts extending from a side of the main body part, and a slant clamping part disposed adjacent an outermost one of the one or more side clamping parts, wherein an angle (?) between the slant clamping part and the outermost side clamping parts is greater than 0° and less than 90° (0°<?<90°).
    Type: Application
    Filed: November 23, 2011
    Publication date: November 8, 2012
    Inventor: Yong-Hwan KIM
  • Publication number: 20110049221
    Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.
    Type: Application
    Filed: September 1, 2009
    Publication date: March 3, 2011
    Applicant: International Business Machines Corporation
    Inventors: Pascal P. Blais, Paul F. Fortier, Kang-Wook Lee, Jae-Woong Nah, Soojae Park, Robert L. Toutant, Alain A. Warren
  • Patent number: 7841505
    Abstract: A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arms with respect to a process to be performed, a clamping section in each clamp arm, the clamping section having concave portions facing the interval between the clamp arms, the concave portions being configured to contact the bonding wire when the clamp arms are brought close together, and at least one abrasion prevention member in each clamping section, the abrasion prevention members being configured to prevent abrasion during contact with the bonding wire.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: November 30, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Soo Lee, Ki-Taik Oh, Jung-Hyeon Kim
  • Patent number: 7802714
    Abstract: A machine for butt welding of pipes can be used in different branches of industry and construction when welding of tubular parts having different configurations and purposes. The machine increases the accuracy of pipe alignment during clamping and reduces frictional losses by using a special mechanism for aligning and clamping the pipes being welded. The improvement makes it possible to improve the quality of welded joints, labor productivity and reliability of machine operation.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: September 28, 2010
    Assignee: E.O. Paton Electric Welding Institute of the National Academy of Sciences of Ukraine
    Inventors: Sergey I. Kuchuk-Yatsenko, Vladimir S. Kachinsky, Boris A. Galyan, Nikolay I. Koval, Alexander P. Miroshnichenko, Vadim Y. Ignatenko, Andrey N. Levchuk
  • Publication number: 20100213246
    Abstract: A weld cylinder having a single piston arrangement is provided. The cylinder has a movable retract piston assembly with the piston arranged within the retract piston assembly. The piston supports a rod that is movable between home, intermediate, work, and advanced work positions. The rod moves rapidly from the home position to the intermediate position however, the rod moves more slowly from the intermediate position to the work position to reduce the impact force. A cushion chamber slowly exhausts through a pre-orifice and a hole in the cushion valve while an isolator is in an open position. Once the cushion valve opens in response to a retract-forward pressure on the cushion valve, the cushion chamber exhausts rapidly so that weld force increases rapidly to minimize increases in cycle time. Advance of a retract piston assembly is also cushioned. A weld-forward port is no longer provided on a cylinder barrel.
    Type: Application
    Filed: August 11, 2005
    Publication date: August 26, 2010
    Applicant: DOBEN LIMITED
    Inventor: Peter Tenzer
  • Patent number: 7752742
    Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 13, 2010
    Assignee: Flir Systems, Inc.
    Inventors: Paul Schweikert, William J. Parrish, Andrew Sharpe, Vu L. Nguyen, Marco Scussat
  • Patent number: 7578425
    Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: August 25, 2009
    Assignee: NXP B.V.
    Inventors: Thomas Markus Kampschreur, Joep Stokkermans, Arjan Franklin Bakker, Piet Christiaan Jozef Van Rens, Arnoldus Jacobus Cornelis Bernardus De Vet, Piet Van Der Meer
  • Publication number: 20090127315
    Abstract: An apparatus for manufacturing a semiconductor device is provided. The apparatus has a bonding head, a stage, and a system for appropriately setting the amount of a descending movement of the bonding head. The bonding head incorporates a heater. A camera is capable of capturing an image of a gap between the bonding head and the stage under the condition that the bonding head holds a first bonding object and the stage has a second bonding object mounted thereon and before the first and second bonding objects come in contact with each other. A controller calculates the amount of the descending movement of the bonding head based on the image captured by the camera, and causes the bonding head to descend based on the calculated amount of the descending movement.
    Type: Application
    Filed: October 22, 2008
    Publication date: May 21, 2009
    Inventor: Takanori OKITA
  • Patent number: 7510109
    Abstract: An apparatus and method for randomly interchanging up to four pairs of side framing gates at a framing station of a vehicle assembly line while maintaining a predetermined build cycle time interval of the assembly line. The system employs first and second carousels positioned on opposite sides of the assembly line upstream of the framing station and third and fourth carousels positioned on opposite sides of the production line downstream of the framing station.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: March 31, 2009
    Assignee: Comau Pico, Inc.
    Inventors: Velibor Kilibarda, Leonard A. Zanger
  • Patent number: 7195144
    Abstract: On production of a component, two primary pieces must often be fixed together to give one piece. In order to achieve the above, it is important that the two primary pieces are oriented in a particular manner during the fixing process, which provides some difficulties. According to the invention, a plug body is fixed to the component by a mounting, whereby the position of the plug body relative to the component remains unchanged during a fixing process.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: March 27, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Gerd Maussner, Gerd Neber, Michael Ott
  • Patent number: 7051918
    Abstract: A method utilizing a stabilizing jig structure for positioning and supporting the assembly of an elongate structural beam and a beam-end mounting component during weld attachment of that mounting component to an end of the beam. This method includes the steps of (a) applying, through a positionally shiftable first biasing element, a first yieldable biasing force which urges the beam-end mounting component relatively toward the associated beam end, and (b) applying, through a positionally shiftable second biasing element, a second yieldable biasing force which urges the beam-end mounting component relatively toward the first biasing element.
    Type: Grant
    Filed: July 31, 2005
    Date of Patent: May 30, 2006
    Inventor: Robert J. Simmons
  • Patent number: 6863210
    Abstract: In a method for assembling a plurality of component individual parts in stages to form a complex composite component, in order to achieve as high an accuracy as possible of the finished component, the individual parts are positioned relative to one another and fixed during the staged assembly process, such that there may be no need for any reclamping of the intermediate component between the individual assembly stages. For this purpose, a clamping frame is used, which is first equipped with some clamping elements, into which is introduced a first set of component individual elements which are assembled together with one another to form an intermediate component. In the second step, the clamping frame is equipped with further clamping elements, into which the component individual elements corresponding to them are introduced, and, in a further assembly step, these further component individual elements are assembled together with the intermediate component to form the finished component.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: March 8, 2005
    Assignee: DaimlerChrysler AG
    Inventors: Juergen Becker, Rainer Class, Hans-Guenther Ziegler
  • Patent number: 6829824
    Abstract: A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: December 14, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl
  • Patent number: 6612479
    Abstract: A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: September 2, 2003
    Assignee: Ford Global Technologies, LLC
    Inventors: Oludele Olusegun Popoola, Daniel Edward Wilkosz, Larry Van Reatherford, Jan Birger Skogsmo, Robert Koehl, Ronald P. Cooper, Arnon Wexler
  • Publication number: 20030066867
    Abstract: A metalworking support system has an elongate c-channel support member and a magnet in the channel acting as anchoring device for attaching the support member to a weldable element, such as an automobile body. A pry tool inserts into an orifice in the support member and is used as a lever for removing the support member from the weldable element. The support system provides support to the weldable element and acts as a heat sink to reduce warping from the welding or other operations.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 10, 2003
    Inventors: Justin Lindahl, James H. Sladek
  • Patent number: 6534194
    Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: March 18, 2003
    Assignee: Johns Hopkins University
    Inventors: Timothy P. Weihs, Michael Reiss
  • Patent number: 6518535
    Abstract: This invention relates to an apparatus and a method for manufacturing a member which makes a part of a car body of an automobile or the like by mash-seam welding a plurality of blanks. Standby areas (B) are provided at both right and left sides of an welding area (A) to/from which a seam welding machine (130) moves forward/backward, and a lapping device (100) for overlapping respective end portions of blanks (W1)(W2) and a temporary clamping device (80) for temporarily clamping the blanks (W1)(W2) are disposed on two transfer tables (70) which are sent from the standby areas (B) to the welding area (A) by turns. When the blanks (W1)(W2) with these end portions overlapped one another and temporarily clamped are sent to the welding area (A) by the transfer table (70), the blanks (W1)(W2) are permanently clamped by a permanent clamping device (180) and thereafter, subjected to a mash-seam welding by upper/lower electrode rollers (142)(148) of the seam welding machine 130.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: February 11, 2003
    Assignee: Kikuchi Co., Ltd.
    Inventors: Masataka Yoneya, Masayuki Inoue, Shunji Yamaguchi, Yoshihiro Yamashita
  • Patent number: 6467675
    Abstract: A front floor panel (31) and a first small component such as a second cross member (35) to be assembled to a surface thereof, with the first small component at the bottom side are positioned and set into a locator jig (29) at a part setting station (S), a moving stage (27) is moved to a welding station (T), and the front floor panel (31) and first small component are welded. A handling robot (55) reverses the front floor panel 31 front-to-rear, the moving stage (27) is caused to retreat to the part setting station (S), and a second small component such as a front floor reinforcement (41) to be assembled to the rear surface of the front floor panel (31) is positioned in locator jig (29), the moving stage (27) being moved to the welding stage and the reversed front floor panel (31) being positioned in a locator jig (29), after which the front floor panel (31) and second small component are welded together.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: October 22, 2002
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Hiromi Ozaku, Kousuke Yoshikawa
  • Publication number: 20020074382
    Abstract: An apparatus and method for positioning and soldering together multiple stained glass sections is disclosed.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 20, 2002
    Inventor: Ephrem Gelfman
  • Patent number: 6405918
    Abstract: Brazing or soldering of pieces of low wettable materials (1, 3), such as single crystal silicon, is accomplished by sandwiching the brazing material (5) between the pieces and sealing the edges of the brazing material with a tape (11) wrapped about the periphery of the brazing material, mechanically placing that tape in compression and maintaining that compression while heating (21) the sandwiched assembly to the brazing temperature of the brazing material. The tape possesses the characteristic of being non-wettable by the brazing material in the molten state and, hence, is impermeable to that melt. The tape may comprise a fibrous porous ceramic material.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: June 18, 2002
    Assignee: TRW Inc.
    Inventors: Rex C. Claridge, Christopher M. Adams, Annetta J. Luevano, Loren E. Record
  • Publication number: 20010017313
    Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 30, 2001
    Applicant: International Business Machines Corporation
    Inventors: Allen Thomas Mays, Kris Allan Slesinger, Michael Camillo Weller
  • Patent number: 6244494
    Abstract: An apparatus and method for leveling the clamping surface to obtain proper heat sink for narrow strips in a coil end joiner which includes a coil material support table and a retaining plate which is positioned against the upper surface of the coil material to be joined by, for example, one or more air cylinders. A weld clamp leveler is also provided which is adjustable to provide a preselected offset between the coil material support table and the retaining plate in a forward portion of the coil material support table. The weld clamp leveler is preferably used when relatively narrow coil material is being joined to preclude tilting of the retaining plate relative to the coil material support table and the coil material being joined and is preferably adjusted to provide approximately the same offset between the coil end support table and the retaining plate as the thickness of the coil material being joined.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: June 12, 2001
    Assignee: Iron Bay, Inc.
    Inventor: Steve Shaffer
  • Patent number: 6193142
    Abstract: An assembling apparatus assembling a body side of an automotive vehicle, comprises: a moving body provided in a transfer line; a clamp member provided on the moving body for fixing and positioning a body side outer in an upright position in such a manner that a roof rail end of the body side outer is an upper portion and the side sill end of the body side outer is a lower portion; and a welding robot disposed in a side of the transfer line, the welding robot assembling the body side by welding the body side outer positioned by the clamp member.
    Type: Grant
    Filed: December 24, 1997
    Date of Patent: February 27, 2001
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Teruo Segawa, Kaoru Okuyama, Setsuo Nakamura, Yukihide Ueda, Shoichi Takahashi, Jun Matsubara
  • Patent number: 6095405
    Abstract: Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: August 1, 2000
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Choul-su Kim, Woo-sik Kim, Byung-woo Woo, Masaharu Tsukue
  • Patent number: 6036080
    Abstract: A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: March 14, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kuniyuki Takahashi, Minoru Torihata, Kazumasa Kimura, Tatsunari Mii
  • Patent number: 5992726
    Abstract: Apparatus and method for setting welding run-off tabs in a coil end joiner which includes a support table having a U-channel therein, the U-channel having an opening through a base portion thereof, a left hold down clamp and a right hold down clamp positioned to either side of the U-channel over the support table, a first angled member having an actuator which provides horizontal movement of the first angled member, the first angled member extending upwardly through the opening in the base portion of the U-channel and contacting a corresponding second angled member such that horizontal movement of the first angled member results in vertical movement of the top surface of the second angled member which is parallel to the top surface of the support table. A rear welding run-off tab holder member having a U-channel therein is positioned over the second angled member and includes a rear welding run-off tab clamp which is positioned at a rear end thereof.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: November 30, 1999
    Assignee: Iron Bay
    Inventor: Steve Shaffer
  • Patent number: 5871137
    Abstract: Method and apparatus for reliable splices to be made in hard-rolled copper and alloy tapes without buckling or overlap and with splices that are stronger than the tape metal, itself. The invention permits an operator to load a second reel of tape in position such that when a first reel is exhausted, the system will automatically butt splice the tail end of the first tape to the front end of the second tape without the presence of the operator.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: February 16, 1999
    Inventors: Sigmund Ege, Arne Ramsland
  • Patent number: 5848747
    Abstract: A welding line system has a transfer robot dispose closely to and between a workpiece loading line for loading preliminarily welded four-wheeled buggy frames and a workpiece unloading line for unloading fully welded four-wheeled buggy frames. The welding line system also has a main welding station including a plurality of welding sections disposed around the transfer robot and having respective workpiece holders. The workpiece holders are arranged such that the preliminarily welded frames supported thereby have respective longitudinal axes whose hypothetical extensions cross each other in the vicinity of the transfer robot. The transfer robot transfers preliminarily welded frames successively delivered along the workpiece loading line successively to the workpiece holders, and receives fully welded frames successively from the workpiece holders and discharges them to the workpiece unloading line.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: December 15, 1998
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Yasuhiro Nishi
  • Patent number: 5590450
    Abstract: Method and apparatus for the sizing of annular objects by cutting through an arcuate portion of the object to be sized; separating and straightening the cut ends of the object; placing sizing stock coated with solder into temporary adherence with a holder and then placing the stock, while held in the holder, between the cut ends; followed by heating the holder and the stock to release the sizing stock from the holder and cause solder paste to adhere the stock to the annular object between its cut ends.
    Type: Grant
    Filed: August 2, 1995
    Date of Patent: January 7, 1997
    Inventor: Michael A. March
  • Patent number: 5495980
    Abstract: A method and apparatus for the lining of rounded arcuate chamber areas is disclosed. One edge of a flexible, rectangular sheet of lining material is attached to the substrate wall of the chamber by welding. The opposite end from the now attached side is compressed laterally to bow the sheet into contact with the wall. Keeper welds or attachments are made, trapping the compressive force. The installers are now free to complete the seam welds around the periphery of the sheet. In the preferred embodiment, the sheet is made of a high nickel alloy (HNA) and the arcuate chamber is a desulfurization duct or absorber tower. Successive sheets are overlapped approximately one inch on the sides and top/bottom.
    Type: Grant
    Filed: October 12, 1994
    Date of Patent: March 5, 1996
    Inventor: Steve Reynolds
  • Patent number: 5476208
    Abstract: Method for forming welded joints on superconducting foils to form long lengths of foil for use in superconducting magnet tapes including fixturing for controlling the accurate positioning of sheared foils and control of the overlap to be welded.
    Type: Grant
    Filed: November 8, 1993
    Date of Patent: December 19, 1995
    Assignee: General Electric Company
    Inventors: Neil G. Fiddes, Christopher G. King, Anthony Mantone, Frank D. Shaffer
  • Patent number: 5415331
    Abstract: The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128.
    Type: Grant
    Filed: July 8, 1994
    Date of Patent: May 16, 1995
    Assignee: National Semiconductor Corporation
    Inventor: Peng-Cheng Lin
  • Patent number: 5282566
    Abstract: A process for the manufacture of a lift arm assembly for a work vehicle includes a plurality of closely controlled process steps. The lift arm assembly is a large fabrication which, when assembled to the vehicle, interconnects with several other components and work implements. In order to properly connect with these other components, the various holes, throughbores, and connecting surfaces must be machined within close tolerances. The subject process provides the controls for holding the tolerances within specified and acceptable ranges. The lift arm assembly produced by the subject process is used for lifting and manipulating a bucket or other type of work implement.
    Type: Grant
    Filed: December 14, 1992
    Date of Patent: February 1, 1994
    Assignee: Caterpillar Inc.
    Inventors: Bryan G. Lammers, Gilles Didier
  • Patent number: 5257715
    Abstract: The metallic portion of a multiple wrap brake band for use in automatic transmissions of motor vehicles is obtained by deforming a circular metallic blank at right angles to its plane into a cup-shaped preform. The bottom wall of the preform is separated from the annular wall and the annular wall is thinned, calibrated, cut, slotted and provided with actuating elements as well as slitted in the circumferential direction to form several neighboring wraps of the multiple wrap brake band. A prefabricated split ring-shaped brake lining is bonded to the internal surface of the annular wall prior to the formation of wraps.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: November 2, 1993
    Assignee: Luk Lamellen und Kupplungsbau GmbH
    Inventors: Johann Jackel, Heinz Molt
  • Patent number: 5234155
    Abstract: In a wire bonding method and apparatus for connecting first and second bonding points by a wire, a wire clamper, that is made up of an immovable member and a movable member which is driven by a linear motor, is used. The linear motor is actuated so that the clamper first acts in a direction of clamping, then the power to the linear motor is switched off or the linear motor is actuated so that the clamper acts in a direction of releasing, and then the linear motor is actuated in the direction that the clamper clamps the wire, thus moving the movable member.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: August 10, 1993
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kuniyuki Takahashi, Minoru Torihata
  • Patent number: 5167362
    Abstract: To splice two metal tapes by means of a solder wire that is thicker than the tapes themselves, their terminal edges are positioned upon one electrode, a spacing shim is inserted upon one of the tapes, another electrode is lowered onto the shim, the wire is inserted into the channel formed by the tape and shim edges and the electrodes, the shim is withdrawn to lower the upper electrode down upon the solder, and the latter is then fused.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: December 1, 1992
    Assignee: Kloften and Kloften (U.S.A.), Inc.
    Inventor: Sigmund Ege
  • Patent number: 5147085
    Abstract: The machine is provided with a set of two pairs of die halves 60, 62 (FIG. 7) mounted in a framework on hydraulically actuated piston and cylinder assemblies. The die halves 60 and 62 of each pair are relatively radially reciprocable to grip or release a workpiece 102, 104 and the two pairs of die halves are relatively axially reciprocable to effect cold pressure welding together of end portions of the workpieces 102, 104. Adjoining end faces of the die halves are formed with nose portions 100 having inner anvil edges for effecting welding flash removal from the workpieces.
    Type: Grant
    Filed: October 5, 1990
    Date of Patent: September 15, 1992
    Assignee: BWE Limited
    Inventors: Daniel J. Hawkes, Leslie J. Webb, Douglas E. Anderson
  • Patent number: 5125559
    Abstract: Means and method are presented for butt-splicing two metal tapes by confining molten solder between two carbon electrodes while the tape edges are moved together.
    Type: Grant
    Filed: March 13, 1991
    Date of Patent: June 30, 1992
    Assignee: Kloften and Kloften (USA) Inc.
    Inventor: Sigmund Ege
  • Patent number: 5071057
    Abstract: Method and apparatus for making a roof of a water-steam cooled cyclonic separator. The fixture locates, supports, and restrains portions of the roof during welding operations. By continuing that restraint through a stress relief step, the method and apparatus address the problem of distortion that otherwise would occur during welding. The method and fixture provide good access to the roof during the welding operations and, in particular, allow for faster welding and welds of higher quality by maximizing the availability of "down hand" welding techniques. The fixture is a universal fixture, designed to accommodate roofs of varying geometries.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: December 10, 1991
    Assignee: Foster Wheeler Energy Corporation
    Inventor: John Q. Murphy
  • Patent number: 5002219
    Abstract: A clamping method and apparatus for applying the necessary pressure to an sembly of metal parts during diffusion bonding and/or superplastic forming of the parts. Basically, the apparatus comprises a pair of opposed generally L-shaped frames having a cavity therebetween for holding the assembly of parts and associated shaping tooling. The frames are pivotable about a hinge connecting first ends, with a mechanism at the opposite ends for moving the frames together in a clamping manner or apart to allow access to the cavity. The tooling within the cavity typically includes a pressure vessel having a housing containing ceramic forming members having an internal volume within which metal parts to be shaped and/or bonded are placed. The parts are subjected to heat and pressure during processing. This apparatus and method are particularly suitable for manufacturing elongated metal products having a generally box-like cross section.
    Type: Grant
    Filed: July 6, 1990
    Date of Patent: March 26, 1991
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Gilbert C. Cadwell