Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

Abstract: A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

Abstract: A fluid cooled mold plate is disclosed. The fluid cooled mold plate has a front side, a rear side, and a perimeter that extends between its front and rear sides. A cooling chamber is formed within the mold plate. The cooling chamber has a front wall, a rear wall, and a perimeter wall that extends between the front and rear walls. An inlet fluid duct extends from a first side of the mold plate perimeter to a first end of the cooling chamber and an outlet fluid duct extends from a second side of the mold plate perimeter to a second end of the cooling chamber. The cooling chamber is occupied by a turbulence generating dispersion mesh that is secured between the front and rear walls the cooling chamber.

Abstract: A method of making a vacuum insulated refrigerator structure includes positioning a core of overlapping stacked sheets of fiberglass mat in an envelope of impermeable barrier material. The core is pressed into a predefined three dimensional shape by pressing first and second mold parts together. The core is evacuated, and the envelope is sealed to form a three dimensional core having an airtight envelope around the core. The three dimensional vacuum core is positioned between a wrapper and a liner, and the wrapper and the liner are interconnected to form a vacuum insulated refrigerator structure.

Abstract: A highly corrosion resistant and highly formable aluminum-alloy clad material, a method for producing the same, a heat exchanger using the same and a method for producing the same are shown. The present aluminum-alloy clad material has an aluminum alloy core material, an intermediate layer material clad on one surface of the core material and a brazing filler metal clad on the surface of the intermediate layer material that is not on the core material side, wherein a crystal grain size of the intermediate layer material before brazing heating is 60 ?m or more, and in a cross section of the core material in a rolling direction before brazing heating, when R1 (?m) represents the crystal grain size in a plate thickness direction, and R2 (?m) represents the crystal grain size in the rolling direction, R1/R2 is 0.30 or less.

Abstract: A highly corrosion resistant and highly formable cladded aluminum-alloy material, a method for producing the same, a heat exchanger using the same and a method for producing the same are shown. The present cladded aluminum-alloy material has an aluminum alloy core material, an intermediate layer material clad on one surface of the core material and a brazing filler metal clad on the intermediate layer material surface which is not at the core material side, wherein a crystal grain size of the intermediate layer material before brazing heating is 60 ?m or more, and in a cross section of the core material in a rolling direction before brazing heating, when R1 (?m) represents the crystal grain size in a plate thickness direction, and R2 (?m) represents the crystal grain size in the rolling direction, R1/R2 is 0.30 or less.

Abstract: One embodiment of the present invention is a unique method for brazing an assembly. Another embodiment is a unique method of heat treating an object. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for heat treating and/or brazing. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

Abstract: A billet includes a solid steel body and an alloy cladding. The cladding may include a square tube in which the body is inserted with an interface at which the cladding becomes bonded to the body when the billet is heated and rolled or otherwise worked into a ferrous product. At least one element composed of a mass of finely divided scavenging aluminum, titanium or magnesium, is placed in the tube adjacent the body and separate from the interface. The elements are advantageously compressed into briquettes which scavenge oxygen from residual air at the interface to prevent oxidation of the cladding at the interface. The tube may be closed to prevent gases outside the billet from penetrating to the interface. Alternatively, reliance may be placed on the briquettes to scavenge oxygen from the residual air and also from atmospheric air and furnace gases before they can penetrate to the interface.

Abstract: In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual components of the precious metal delivery system prior to and/or during their use. The method involves coating portions of the precious metal with an oxygen generating material prior to assembly of the component, and may comprise one or more heat treating steps of the component in an oxygen-containing atmosphere.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.

Abstract: A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.

Abstract: A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.

Abstract: A gettering system for a CAB furnace includes a nitrogen gas source to supply a nitrogen gas to a controlled atmosphere brazing (CAB) furnace and an active metal getter source disposed within the CAB furnace and being a sheet to remove oxygen and water vapor in the nitrogen gas, whereby heat exchangers are brazed during a controlled atmosphere brazing (CAB) process in the CAB furnace.

Abstract: When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

Abstract: The top peaks of the outer fin are coated with slime-like flux. A sandwich unit is assembled from the outer fin and the tube plates by attaching the tube plates to the respective sides of the outer fin such that the surfaces of the tube plates having the butt bead faces formed thereon face inward. The butt bead faces on the respective tube plates on either side of the sandwich unit are coated with the slime-like flux. A plurality of sandwich units whose tube plates are coated with the flux are laminated and brazed, and the thus-formed assembly is heated in a heating furnace, to thereby braze together the tube plate pairs and the tube plates connected to the outer fin.

Abstract: So that the brazing of aluminium parts with the use of a flux can be made effectively without employment of a corrodible metallic muffle, furnace inner walls made of carbonaceous refractory sheets are utilized as a brazing space, and an inert atmosphere supplied into this space is protected from the air by furnace outer walls which are made of steel sheets to form a furnace shell and which are made hermetical against the air.

Abstract: A vacuum package (20) is fabricated by providing a package base (22) with a device (32) affixed to the interior of the package base (22), and a package lid (42). An activatable getter material (54) is deposited onto a preselected region of either the interior (48) of the package lid (42) or that portion of the package base (22) which does not have the device (32) affixed thereto. The deposited getter material (54) is deposited at a temperature such that it is activated during deposition. The vacuum package lid (42) is sealed to the vacuum package base (22). The steps of depositing and sealing are conducted in an evacuated vacuum chamber without exposing the interior to atmosphere.

Abstract: A method of brazing aluminium parts with a solder of a melting point of 500-630.degree. C. and a flux of a melting point of 550-500.degree. C., the brazing being made by successively heating them at a comparatively low temperature of 580-660.degree. C. under an inert gas atmosphere filled in an elongated muffle which is made of carbon, graphite or carbon fibre-reinforced carbon, wherein the muffle which contributes to keep the atmosphere at a high purity shall not be damaged by the flux liquidized with the heating of the parts, and wherein carbon of the muffle works to keep the atmosphere inert whereby the flux itself is also prevented from oxidation.

Abstract: A vacuum panel includes a jacket having a bottom that is formed into a "pan" shape. A top is welded to the flanges of the bottom to create a hermetic seal therebetween. A dense glass fiber mat fills the jacket. A getter is strategically located in the panel to absorb residual gases in the panel and maintain the vacuum life. To create the vacuum in the panel, the panel is heated to a specified temperature and time, and evacuated through an opening. The opening is sealed with a braze seal that is melted over the opening.

Abstract: The present invention relates to a method for mounting electronic devices on a substrate by using soldering with flux which contains materials capable of ion-exchanging or ion-catching so as to catch impurity ions which seep from a solder portions, and thereby it is not necessary to have a fusing step and a cleaning step in an plating process of the method.

Abstract: A process for wave soldering or reflow soldering comprises contacting substrates with a supply of molten solder containing from about 0.0001 to about 0.1% by weight of phosphorous in an atmosphere of diluent gas containing up to about 0.1% by volume oxygen. A reduced incidence of bridging and other soldering defects occurs.

Abstract: A first portion is set near or in contact with a second portion. The first and second portions are electrically connected by spraying fine metal particles particles of gold, nickel or copper in a carrier gas of helium, argon, hydrogen or nitrogen on the first and second portions to form a metal bump. Prior to spraying the fine metal particles to form the metal bump, hard particles of titanium, copper, hafnium, zirconium or vanadium may be sprayed on the first and second portions to remove contamination layers.

Abstract: The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

Abstract: A vacuum pump is first driven to start evacuation from the interior of a furnace. At the time when the furnace pressure reaches 8.times.10.sup.-5 Torr, a heater is driven to start elevating the furnace temperature. Then, at the time when the furnace temperature reaches 565.degree. C. that corresponds to the solidus line temperature for a brazing filler metal of Al - 10% Si alloy containing Mg of 0.6 wt. %, a motor is driven to close a shutter, thereby vacuum brazing aluminum with evacuation control under a high-vacuum level. By controlling the evacuation after reaching a high-vacuum level, the amount of water vapor in the furnace becomes sufficiently small and Mg vapor is highly densified, which permits brazing of satisfactory quality even with a brazing filler metal containing Mg of 1.2 wt. % or less, in combination with use of such a brazing filler metal as having the Mg.sub.2 Si particle size fined to be 5 .mu.m as a typical value through soaking and the thickness of a surface oxide film thinned to be 80 .

Abstract: A vacuum-insulated, double-walled metal structure comprises inner and outer shells made of a metal and seamed together to form a double-walled structure with a space between them, the space being exhausted of air. At least one of the inner and outer shells is provided with at least one activated foil of a metal selected from the group consisting of copper, titanium and zirconium. The inner shell may be wound with an activated titanium or zirconium foil, and covered by another metal foil selected from the group consisting of copper, aluminum, titanium and zirconium, except for a part of its bottom. The metal foil wound on the metal structure is activated by preliminarily exhausting air from the space so that a pressure therein becomes reduced to a low vacuum of the order of 10.sup.-2 Torr, and then heating the double-walled structure at not less than about 400.degree. C.

Abstract: The present invention provides a method for brazing a metal object to a ceramic surface defining a recess for receiving the metal object where the space between the metal object and the ceramic surface defining the recess inhibits the establishment of the oxygen depleted environment necessary to establish a reliable braze joint. The present invention includes the use of a material having a high affinity for oxygen that is positioned adjacent to the space between the metal object and the ceramic surface defining the recess and serves to pull or draw oxygen from the space to establish the oxygen depleted environment required to produce a reliable braze joint.

Abstract: An improved heating cycle for brazing an assembly of clad aluminum sheet components having a hypoeutectic aluminum-silicon braze alloy cladding comprises a dwell at a temperature slightly above the eutectic melting point and effective to partially melt the cladding. The dwell is accompanied by vaporization of residual magnesium from the clad alloy to getter oxygen from about the assembly and enhanced disruption of oxide film on the cladding surface, which film would otherwise interfere with capillary flow of the braze alloy into joints. The eutectic temperature dwell provides a more uniform flow of braze alloy into seams and thereby produces a strong, leak-free joint in the brazed structure.

Abstract: Processes and composition for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strotium, barium and antimony. The solder may be used with or without flux.

Abstract: An improved practice for the vacuum brazing of aluminum alloy workpieces in a multi-chamber braze furnace is disclosed. When magnesium-containing aluminum alloys are brazed in a furnace having a braze chamber and adjacent exit chamber, there may be advantage in providing thermal barriers between a load of hot brazed workpieces and the furnace walls of the exit chamber.

Abstract: A method of vacuum brazing large assemblies in an enclosed evacuated furnace with brazing material containing a gettering agent in the area of the joints to be formed, including sensing the temperature of the assembly to be brazed adjacent the joints on the exterior surface of the assembly, and shifting an additional quantity of gettering agent from a cool zone into a hot zone in the furnace as the surface temperature of the assembly approaches the brazing temperature. A furnace adapted to carry out this method is also disclosed.

Abstract: A method of producing an object of fiber reinforced metal material, in which method a plurality of fibers or fiber bundles of a material of high strength are arranged at spaced positions, and a matrix material, preferably metal or metal alloy, is brought to closely surround each fiber or fiber bundle and is formed to a shape corresponding to the desired shape of the object. Earlier attempts to produce objects of fiber reinforced metal material have encountered problem regarding the arrangement of the fibers in a uniform pattern and in obtaining a predetermined volume fraction of the fibers in the completed object.

Abstract: A method of brazing aluminum parts in an inert gas atmosphere is disclosed. The brazed filler metal is controlled to contain a ternary alloy of aluminum-silicon-magnesium and the base aluminum parts are controlled to contain a binary alloy of aluminum-magnesium. Magnesium in the base metal is controlled to 0.4-1.2% and in the filler metal it is controlled to 0.2-0.6%; in the filler metal only, silicon is controlled to 7-12%. The assembled base metal parts and filler metal are subjected to differential heating rates, one rate being limited to at least 50.degree. C./minute when the metal parts reach temperatures in the range of 400.degree.-550.degree. C., and a conventional rate when outside said temperature zone. As a result, three physical parameters are caused to occur simultaneously: initiation of porosity in oxide film on the metal parts, transport of magnesium to the oxide interface and reaction with the oxide, and initial melting of the filler metal as well as wettings of the oxide by the filler metal.

Abstract: A method of fluxless brazing of aluminum parts is disclosed. Gaseous species, such as O.sub.2 and H.sub.2 O, which inhibit wetting are controlled by rapid heating (at least 100.degree. C./min) through a critical temperature range (such as 400.degree.-590.degree. C.) during heat-up to brazing temperatures. The formation of porosity through the oxide film and the collection of a promoter and wetting agent at the interface with the oxide film will thus occur simultaneously precluding disruption of wetting action by gaseous O.sub.2 or H.sub.2 O. Wicking of the wetting agent through the film porosity in the critical temperature range will then take place because of the limited time available for the reaction of gaseous O.sub.2 and H.sub.2 O with the film to form a duplex oxide. Heating may be carried out in a vacuum of 10.sup.-3 Torr or less or in an inert atmosphere with pulsed heating, provided the critical heating rate is observed in said critical temperature range.

Abstract: This invention concerns getters for controlled atmosphere and vacuum processes, and in particular, for processes carried out in an atmosphere having a very low oxygen content. The invention has been particularly developed for the vacuum brazing of parts, such as gas turbine components, but has a wide variety of other applications, including argon purged retort brazing and diffusion bonding.

Abstract: A method of high temperature assembly of similar or different metallic, nonmetallic or partially metallic components without any direct contact with a cleaning flux, by means of an added metal or alloy with a melting point below that of the most fusible component, characterized in that the components to be assembled and the added metal or alloy are brought to a temperature at least equal to that required to melt the added metal or alloy, in a chamber from which air is substantially evacuated and which contains one or more halogens in the free or combined state, at least a fraction of these free or combined halogens being or passing into the gaseous state for at least part of the heating time.

Abstract: A method including the step of applying braze alloy in sheet-like form to a part made of a brazeable parent metal. Pressure is exerted to place the braze alloy in intimately contacting relation to the part. For a predetermined period of time, while the exerted pressure is maintained, heat is applied at a temperature value which is just below the melting point of the braze alloy. Diffusion bonding occurs and, in accordance with an optional practice of the invention, a catalyst may be introduced which at a temperature below the applied temperature liquifies and speeds up the diffusion process.

Abstract: A heat exchanger core includes a communicating set of metallic tubular elements, preferably aluminum, for carrying a primary fluid and a matrix of rounded metallic elements. The matrix elements are metallurgically bonded to one another and to the tubular elements. This arrangement of the matrix creates a multiplicity of communicating interstices which serve as passageways for the secondary fluid. The surface of the rounded elements constitutes the major area exposed to the secondary fluid flow. The rounded elements are metallurgically bonded by preferably a brazing technique. Relatively small particles of low melting temperature alloy, preferably aluminum, are dispersed throughout a stacked arrangement of relatively larger rounded elements, preferably of aluminum of a higher melting temperature. In one brazing method, an assembly of tubes, large rounded elements and smaller particles are brazed in a vacuum brazing oven. At the temperature of the oven, the smaller particles melt but the larger elements do not.

Abstract: A method for bonding bodies made of metallic materials is described herein, which method is characterized in that said metallic bodies are pressure bonded to each other by making use of super-plastic phenomena which are generated by subjecting the bonding portions of the metallic bodies to be bonded to a heating and cooling temperature cycle under the state where a bonding insert material that can form a reducible atmosphere upon bonding is sandwiched between the bonding surfaces of the metallic bodies to be bonded.