Diverse Fillers Patents (Class 228/226)
  • Patent number: 6199742
    Abstract: A method of brazing together a lightweight metallic aerostructure sandwich panel having at least two spaced face sheets and an intermediate honeycomb core layer comprises: providing a tooling base having a determinable upper surface; assembling spaced upper and lower metal face sheets and an intermediate metal honeycomb core layer together with at least one layer of braze material upon the upper surface of the tooling base to provide an unbrazed aerostructure panel; positioning a layer of conformable working honeycomb core upon the upper face sheet; positioning apressure means upon the layer of conformable working honeycomb core to provide downward pressure upon the layer of conformable working honeycomb core and causing the conformable working honeycomb core to provide a uniform downward pressure over the upper face sheet of the unbrazed aerostructure panel; and subjecting the unbrazed aerostructure panel to a predetermined cycle of elevated temperature and time to permit the layer of braze material to
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: March 13, 2001
    Assignee: Rohr, Inc.
    Inventors: Steven A. Good, Peter D. Pallag
  • Patent number: 6095404
    Abstract: A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: August 1, 2000
    Assignee: Innova Electronics, Inc.
    Inventor: Charlie McAndrew
  • Patent number: 6073831
    Abstract: A method of manufacturing an ultrasonic generator adapted to ultrasonic sterilizers, for minimizing the heat input of a magnetostrictive element, comprises the steps of: forming, on a wave guide, melting layers constructed of joining materials such as Al--Si alloy and Sn--Ag alloy which melt within a temperature range of 575.about.590.degree. C. and 230.about.250.degree. C., respectively, and have tensile strength of 17.about.25 kg/mm.sup.2 and 10.about.15 kg/mm.sup.2, respectively; and joining the wave guide with the magnetostrictive element.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: June 13, 2000
    Assignee: Korea Institute of Machinery & Metals
    Inventors: Yang-Lae Lee, Pil-Woo Heo, Jae heyng Kim, Eui-su Lim
  • Patent number: 6053394
    Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.
    Type: Grant
    Filed: January 13, 1998
    Date of Patent: April 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Sudipta Kumar Ray, Gordon Jay Robbins
  • Patent number: 6027012
    Abstract: The present invention relates to a method for making metal frameworks for dental protheses:of the type comprising metallic cops, optionally coated with resin or ceramic material, designed to be anchored in the mouth directly onto the stump of the tooth or teeth to be restored, contiguous or independent,optionally coupled by also metal intermediate members;using for the embodiment of said cops directly on the master mould, generally of plaster, obtained from the patient maxilla or mandibular cast, i.e. without having to pass through a duplicate in refractory material, first a thin metal sheet forming operation on the stump model of the tooth to be restored and then wintering and/or melting operation of precious, semiprecious and non-precious metal powder, coating said metal sheet, through the effect of a suitable heat supply.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: February 22, 2000
    Inventors: Claude Bes, Claude Segura
  • Patent number: 6024275
    Abstract: A method of producing an array of interconnecting contacts for an integrated circuit package, such as a flip chip integrated circuit, and connecting the array of interconnecting contacts to the package utilizes a mold to form the array and attach the array to the package. The method may also be used to interconnect two integrated circuit die. The mold defines a desired shape and relative position for a plurality of interconnecting contacts which make up the array of interconnecting contacts. The array of interconnecting contacts are molded by filling the mold with a desired contact forming material such as solder paste. The mold containing the molded array of interconnecting contacts is positioned adjacent to the integrated circuit package such that each interconnecting contact is positioned adjacent to a corresponding contact pad of the integrated circuit package. And finally, the molded interconnecting contacts are attached to their corresponding contact pads of the integrated circuit package.
    Type: Grant
    Filed: June 16, 1998
    Date of Patent: February 15, 2000
    Assignee: National Semiconductor Corporation
    Inventor: Hem P. Takiar
  • Patent number: 5961032
    Abstract: A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: October 5, 1999
    Assignee: International Business Machines Corporation
    Inventors: James H. Covell, II, Shaji Farooq, Peter A. Gruber, Sudipta K. Ray
  • Patent number: 5806751
    Abstract: A method of repairing a metallic alloy article having a defect cavity greater than about 0.010 inches (2.5.times.10.sup.-4 m) in maximum width is disclosed. One aspect of the invention includes providing a first metallic filler material (10) in the defect cavity such that the first metallic filler material (10) substantially fills the cavity. The composition of the first metallic filler material (10) corresponds substantially to that of the metallic article. A second metallic filler material (12) is provided over the first metallic filler material (10). The second metallic filler material (12) includes between about 0 wt. % and about 40 wt. % metallic filler material of a composition corresponding substantially to the metallic article, and between about 100 wt. % and about 60 wt. % metallic filler material having the same basis as the composition of the metallic alloy article and including a melting point depressant in an amount substantially in excess of that in the metallic alloy article.
    Type: Grant
    Filed: October 17, 1996
    Date of Patent: September 15, 1998
    Assignee: United Technologies Corporation
    Inventors: Robert P. Schaefer, William F. Bender, Matthew J. Arnold
  • Patent number: 5803344
    Abstract: A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: September 8, 1998
    Assignee: Delco Electronics Corp.
    Inventors: Anthony John Stankavich, Dwadasi Hare Rama Sarma, Christine Ann Paszkiet, Marion Edmond Ellis
  • Patent number: 5771962
    Abstract: A heat exchanger assembly including at least one aluminum based tube having an internal surface and an external surface, an aluminum based lithium-magnesium composition cladding applied to either one of the internal surface and external surface of the tube, and at least one aluminum based component disposed adjacent the cladding, a modified aluminum brazing flux applied to a joint between the surface and one component. The modified aluminum brazing flux comprises cesium fluoride, lithium fluoride, or both. Preferably, the cladding further comprises cesium. To manufacture the heat exchanger assembly, the tube and component are joined together with flux applied in the area of the joint using a controlled atmosphere brazing (CAB) process.
    Type: Grant
    Filed: April 3, 1996
    Date of Patent: June 30, 1998
    Assignee: Ford Motor Company
    Inventors: Timothy Van Evans, Henry Mehraban, Matthew John Zaluzec, Gerry A. Grab
  • Patent number: 5720340
    Abstract: A laminated type heat exchanger includes a plurality of refrigerant passages which are formed by pairs of core plates. Each core plate comprises an outer covering layer, a core layer, and an inner covering layer. The outer covering layer is made of a brazing material of which electric potential is more negative than the core layer while the inner covering layer is made of a brazing material of which electric potential is equal to or more positive than the core layer. The refrigerant passages are formed by brazing only the adjacent two of the inner covering layer. The outer covering layer works as a sacrificial corrosive material with respect to the inner covering layer and the core layer. Leakage of refrigerant from the brazed portions of the core plates is prevented, whereby the corrosion resistance of the laminated type heat exchanger is improved.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: February 24, 1998
    Assignee: Denso Corporation
    Inventors: Toshio Ohara, Yasukazu Aikawa, Yoshiharu Kajikawa
  • Patent number: 5709338
    Abstract: A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.
    Type: Grant
    Filed: April 22, 1996
    Date of Patent: January 20, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Mitugu Shirai, Hideaki Sasaki, Takeshi Takahashi
  • Patent number: 5605283
    Abstract: Two rail sections are joined by a weld joint (5) between two rails (1,2) arranged one behind another in a lengthwise direction of a rail track (4) and a method for the production of this weld joint (5). The frontal ends (6,7) of the rails (1,2) which are facing each other are connected with one another by a filler material (8), which extends from the rail foot (32) to the rail head (30). The weld joint (5) is composed of a welding zone (22, 23, 24, 25) which connects the rail foot (32), the stem of the rail (31) and the rail head (30). The welding zones (22 to 25) are connected in a form-locking manner in the contact areas (33 to 36) immediately facing each other. Furthermore, the welding zone (22) of the rail head (30) consists of less than 15 neighbouring, molten beads (26) preferably situated one above another and approximately running parallel to each other.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: February 25, 1997
    Assignee: Fronius Schweissmaschinen KG. Austria
    Inventors: Robert Lahnsteiner, Julius Ehrlich
  • Patent number: 5544698
    Abstract: Microextruded tubes each having two side surfaces, front and trailing edge surfaces and two ends are provided for insertion into aligned slots in headers to complete a heat exchanger assembly. The tubes each include a first coating composition containing an adhesive binder vehicle, flux material and brazing alloy deposited on the side surfaces adjacent the ends of the tube. The first coating composition is structurally arranged and applied to engage the aligned slots in the headers upon the insertion of the ends of the tubes into the header. The side surfaces of the microextruded tube include a second surface coating containing an adhesive binder vehicle, flux material, zinc and silicon extending the length of side tube between the deposited first coatings. The front and trailing edge surfaces of the tube include a third surface coating composition containing adhesive binder vehicle, flux material and zinc. A method of manufacturing parallel flow-type heat exchangers is disclosed.
    Type: Grant
    Filed: March 30, 1994
    Date of Patent: August 13, 1996
    Assignee: Peerless of America, Incorporated
    Inventor: Roger Paulman
  • Patent number: 5305946
    Abstract: A weldment, such as the wall of a pressure vessel, is formed from segments, each of which includes a steel substrate, a protective layer of tantalum which is exposed to the interior of the vessel and an intervening layer of copper which lies between and is bonded to the substrate and the protective layer. The substrate and the two layers which form the cladding are explosively bonded together and the bonding procedure may leave the protective layer with small domes or embossments and pockets of trapped gas behind the embossments. The two segments are welded together edge-to-edge at their substrates, with their protective and intervening layers aligned. If one were to follow the traditional procedure, one would place a tantalum batten strip over the protective layers along the opposed edges so as to cover the edges, and then weld the batten strip to the protective layer along the edges of the strip.
    Type: Grant
    Filed: November 5, 1992
    Date of Patent: April 26, 1994
    Assignee: Nooter Corporation
    Inventor: Leroy W. Heilmann
  • Patent number: 5234153
    Abstract: A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 .mu.m. The wetting layer is preferably the intermetallic compound Ni.sub.3 Sn.sub.
    Type: Grant
    Filed: August 28, 1992
    Date of Patent: August 10, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Donlad D. Bacon, Avishay Katz, Chien-Hsun Lee, King L. Tai, Yiu-Man Wong
  • Patent number: 4911353
    Abstract: A method of making a solar energy collector where the absorber plate, selective surface, and protective outer skin of the collector are formed by spraying molten metal particles onto a substrate and building a coating of metal up to a desired thickness. This process allows greater flexibility in permitting a greater choice of materials and geometric shapes to be used for manufacturing the collector. The process may also be used to create the individual components of the collector, i.e., body, absorber plate, or selective surface as well as a storage tank.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: March 27, 1990
    Inventor: David Deakin
  • Patent number: 4901908
    Abstract: An aluminum material for brazing, comprising a core made of aluminum or an aluminum alloy, and a layer coated on the surface of the core. The layer is made of zinc or an alloy of zinc-and-aluminum and a brazing alloy having a melting point which is lower than that of the core by a predetermined value. The zinc or the alloy of zinc-and-aluminum and the brazing alloy have different melting points. Also disclosed are a method of manufacturing an aluminum material for brazing and a method of manufacturing an aluminum alloy heat exchanger by use of the Al material for brazing.
    Type: Grant
    Filed: September 6, 1988
    Date of Patent: February 20, 1990
    Assignee: Nippondenso Co., Ltd.
    Inventors: Kengi Negura, Ken Yamamoto, Shigeo Ito, Masahiro Shimoya
  • Patent number: 4896814
    Abstract: A method of welding in a groove (1) machined in a solid alloyed steel part, characterized in that bottom passes (2) are performed and then each wall (11, 13) of the groove (1) is faced with low alloy steel filler material, heat treatment is performed so as to eliminate the stresses in the zones (18, 19) of the part adjacent to the walls (11, 13) of the groove, and the empty space (20) between the two facing layers (15, 17) is filled with low alloy steel filler materials, said operation of facing the wall (11, 13) being performed by placing a carbon steel plate (4, 4', 2, 22') in the groove (1) at a certain distance from said wall (13, 11), by filling the space (12, 16) between the plate (4, 4', 22, 22') and the wall (11, 13) with layers (14, 14') of low alloy steel having a carbon content lying in the range 0.08% and 0.12%, and by getting rid of the steel plate (4, 4', 22, 22') and optionally a portion of the fill so as to leave only a layer (15, 17) on the wall (13, 11).
    Type: Grant
    Filed: July 28, 1988
    Date of Patent: January 30, 1990
    Assignee: Societe anonyme dite: ALSTHOM
    Inventors: Gilles Allain, Max Nougaret
  • Patent number: 4890783
    Abstract: A method for improving the reliability of a ceramic-metal joint by reducing the dynamic mismatch stresses and strains on the ceramic due to the mismatch in thermal expansions of the two materials. This is done by bonding with a metal layer the ceramic to metal to form a bonding interfacial region between the ceramic and metal; and radially grading the interface region the thermal conductivity, thermal expansion coefficient, or tensile strength of the metal layer. An article in the form of a laterally graded, metallic bonding disc for overcoming problems of dynamic mismatch stresses and strains is also disclosed and claimed.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: January 2, 1990
    Inventor: Chou H. Li
  • Patent number: 4881678
    Abstract: Welding is controlled from a control station (14) located at some distance from the welding zone. Before the start of a welding pass, the welding parameters are set by an operator, to whom the values to be given to the parameters as a function of the type of pass are supplied by a memory in which the information relating to the welding is stored. The welding operation is started, after the parameters have been checked as a function of the content of the memory. The welding operation is monitored continuously by the operator by means of a remote screen display of the welding zone. If appropriate, the operator changes some of the welding parameters according to the screen image of the welding zone. These changes are checked by comparison with the content of the memory.
    Type: Grant
    Filed: January 20, 1988
    Date of Patent: November 21, 1989
    Assignee: Framatome
    Inventor: Jean P. Gaudin
  • Patent number: 4852791
    Abstract: A method for producing corrosion resistance heat exchangers having a plurality of aluminum tubular elements and fin members, the method comprising immersing the tubular elements in a bath with passing an electric current so that the surfaces thereof are covered with zinc layers of 0.3 .mu.m or more in thickness; combining the zinc plated tubular elements with fin members covered with a brazing sheet so that a core is provisionally formed; painting the provisional core with a non-corrosive flux; and placing the provisional core in a furnace to braze the fin members to the tubular elements, and also to enable the zinc layers to diffuse over the surfaces of the tubular elements.
    Type: Grant
    Filed: June 2, 1988
    Date of Patent: August 1, 1989
    Assignee: Showa Aluminum Kabushiki Kaisha
    Inventors: Tatsuo Otsuka, Ichiro Iwai, Noboru Yamaguchi
  • Patent number: 4832252
    Abstract: A part and method for repairing a high velocity fluid flow machine part, for example a turbine blade comprises an insert which may be made from a piece of material the same as the turbine blade and prior to attachment to the blade has an edge region hardened by any suitable means, for example induction hardening, the insert then being secured to the blade by welding or brazing, the weld or braze material being of a relatively soft nature to provide a cushion between the insert and the blade so as to minimize the occurrence of stress corrosion cracking.
    Type: Grant
    Filed: December 16, 1987
    Date of Patent: May 23, 1989
    Assignee: Refurbished Turbine Components Limited
    Inventor: Michael J. Fraser
  • Patent number: 4817859
    Abstract: A component made of nodular cast iron is joined to a component made of steel by means of fusion welding, a Fe alloy containing 2 to 4% by weight of silicon and seeding materials for the purpose of globular carbon precipitation in the welding zone being used as filler. Advantageously, the nodular cast iron component is provided beforehand with a build-up welding with Si-alloyed filler or with an unalloyed filler now alloyed with such a Si-alloyed filler, whereupon the weld joining to the steel component can be carried out with conventional iron electrodes.Preferred Si-alloyed filler:C=0.01-0.12% by weight,Mn=0.2-1.5% by weight,Si=1-4% by weight,Al=0.005-0.1% by weight,Mo=0.2-0.7% by weight,Ce=0.0001-0.02% by weight,Mg=0.0001-0.01% by weight,Zr=0.01-0.7% by weight,S=0.006% by weight max.,P=0.01% by weight max.
    Type: Grant
    Filed: September 22, 1987
    Date of Patent: April 4, 1989
    Assignee: BBC Brown Boveri AG
    Inventors: Georg Breitenmoser, Guy Faber
  • Patent number: 4807800
    Abstract: A method for manufacturing thin-walled hollow bodies comprising concentric layers forming thin-walled structural parts of chemical installations subjected to stress at high temperatures, thereby replacing non-layered pipes of single-metal materials. Due to the methods of manufacture, structural parts of these single-metal materials have disadvantages because the single materials of which they are built cannot simultaneously satisfy the demands of corrosion resistance, high-temperature stability and resistance of scaling. According to the new method, for example, thin-walled pipes of concentric, non-corrosive, high-temperature stable, and non-scaling material layers are intended to be produced. For the non-corrosive inner layer, for example, a conventional thin-walled pipe is used.
    Type: Grant
    Filed: December 15, 1987
    Date of Patent: February 28, 1989
    Assignee: Man Gutehoffnungshuette, GmbH
    Inventor: Karl Million
  • Patent number: 4759490
    Abstract: A soldering method using a solder paste composed of solder alloy powder and soldering flux comprising rosin, thixotropic agent, activator, organic solvent and azobis compound such as 1,1'-azobis (cyclohexane-1-carbonitrile) as a free radical generator. The 1,1'-azobis (cyclohexane-1-carbonitrile) generates free radicals of cychlohexane-1-carbonitrile when heated in soldering, and the generated free radicals urge the activator to liberate hydrogen halide which enhances a removing effect of oxide film over a metal surface to be soldered. The azobis compound contributes to diminish the amount of activator and, consequently, hydrogen halide in the flux. The viscosity of the solder paste does not vary for a long time, which results in allowing the solder paste have a long shelf life. Since generation of the free radical is not decreased even though a soldering temperature decreased, which results in increasing solderability for low temperature soldering.
    Type: Grant
    Filed: October 16, 1987
    Date of Patent: July 26, 1988
    Assignee: Fujitsu Limited
    Inventor: Masayuki Ochiai
  • Patent number: 4739917
    Abstract: A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.
    Type: Grant
    Filed: January 12, 1987
    Date of Patent: April 26, 1988
    Assignee: Ford Motor Company
    Inventor: Jay D. Baker
  • Patent number: 4702406
    Abstract: A method of forming a stable welded joint between low alloy steels and austenitic stainless alloy steels which is characterized by increased resistance to chemical corrosion and mechanical stress and which has a greatly extended service lifetime. The method comprises forming a deposit of a low alloy steel containing niobium onto a portion of low alloy steel to be welded; heating the deposit to a first temperature at which all carbides present therein have dissolved; quenching the deposit and forming a solid solution of the elements of the dissolved carbides; and reheating the deposit for a time period and at a second temperature sufficient to form niobium carbides therein containing substantially all of the carbon present in the deposit. The austenitic stainless steel portion is welded to the deposit using a substantially nonferrous nickel-based alloy as the weld filler material, thereby joining the low alloy steel portion to the austenitic stainless steel portion.
    Type: Grant
    Filed: October 16, 1986
    Date of Patent: October 27, 1987
    Assignee: Carolina Power & Light Company
    Inventors: Dennis Sullivan, Richard J. Bloch
  • Patent number: 4624402
    Abstract: Stress corrosion cracking 36 at a welded pipe joint 14 in service in a nuclear reactor can be controlled by the location of a overlay weld 18 over the primary weld 16, which extends axially along the pipe on either side of the primary weld 16. The overlay weld 18 is comprised of a plurality of circumferentially and continuously applied weld beads 35, 37 which extend substantially to a minimum distance necessary to produced a favorable residual stress pattern. This distance has been estimated to be the square root of the product of the radius of the pipe times the thickness of the pipe on either side of the primary weld 16.
    Type: Grant
    Filed: January 18, 1983
    Date of Patent: November 25, 1986
    Assignee: Nutech, Inc.
    Inventors: David Pitcairn, Peter Riccardella
  • Patent number: 4605154
    Abstract: This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.
    Type: Grant
    Filed: January 28, 1985
    Date of Patent: August 12, 1986
    Assignee: Johnstone Railway Supply Mfg., Co. Inc.
    Inventor: Wayne A. Rhodes
  • Patent number: 4510171
    Abstract: A plasma arc spray overlay of cladding metals is used over joints between clad metal pieces to provide a continuous cladding metal surface. The technique permits applying an overlay of a high melting point cladding metal to a cladding metal surface without excessive heating of the backing metal.
    Type: Grant
    Filed: June 1, 1984
    Date of Patent: April 9, 1985
    Assignee: Monsanto Company
    Inventor: Oliver W. Siebert
  • Patent number: 4459062
    Abstract: A plasma arc spray overlay of cladding metals is used over joints between clad metal pieces to provide a continuous cladding metal surface. The technique permits applying an overlay of a high melting point cladding metal to a cladding metal surface without excessive heating of the backing metal.
    Type: Grant
    Filed: September 11, 1981
    Date of Patent: July 10, 1984
    Assignee: Monsanto Company
    Inventor: Oliver W. Siebert
  • Patent number: 4426031
    Abstract: An ink jet tip assembly in which the individual jets are comprised of a piezoelectric cylinder having a longitudinally through bore, a glass ink nozzle disposed in the cylinder bore and a low melting temperature alloy interposed between the bore and the nozzle for anchoring the nozzle to the piezoelectric cylinder. The method of assembly for the individual jet tip assemblies comprises inserting the glass ink nozzle into the cylinder bore which contains the anchoring alloy in a molten form. A method of checking for flaws in the cylinder comprises fluxing the cylinder bore for allowing flux to pass through any cylinder pinholes or cracks. Upon introducing solder for coating the interior cylinder wall, some solder will appear as shining spots or areas on the cylinder exterior wall.
    Type: Grant
    Filed: August 26, 1981
    Date of Patent: January 17, 1984
    Assignee: Gould Inc.
    Inventor: Laszlo Halasz
  • Patent number: 4346280
    Abstract: A method comprises feeding two or more, if necessary, alloying materials and simultaneously changing the ratio thereof. The ratio of the alloying materials is changed at the moment of transition from one section to the other one having different composition, the ratio being changed to such extent that the length of the transition portion is as small as possible. The time of transition is determined depending on the weld pool volume, rate of surfacing, cross section of the layer being built up, amount of the alloying elements both the required and the real one. Determining the time of transition for carrying out the method of the invention is disclosed in term of a preferred embodiment. An apparatus for carrying out the method of the invention is characterized in that it includes an adder-differentiator link, a voltage limiter, a switching device and an aperiodical link. The aperiodical link is a simulator of the weld pool.
    Type: Grant
    Filed: July 1, 1980
    Date of Patent: August 24, 1982
    Inventors: Sergei V. Gulakov, Boris I. Nosovsky, Leonid K. Leschinsky, Ksenofont K. Stepnov, Anatoly E. Rudnev
  • Patent number: 4277013
    Abstract: A method for braze-assembling metal components having low softening temperatures is provided, whereby selective cooling of specific regions of stabilized dimensions with the aid of heat sinks prevents softening of the metal components at and proximal to the specific regions of stabilized dimensions.
    Type: Grant
    Filed: August 17, 1979
    Date of Patent: July 7, 1981
    Assignee: Owens-Illinois, Inc.
    Inventor: Louis Spanoudis
  • Patent number: 4256518
    Abstract: A box tool joint member of generally tubular configuration is adapted for securement by welding to one end of a steel tube to form a drill pipe. The box tool joint member comprises a body having a cylindrical outer periphery, an internally threaded socket at one end of the body, and a weld neck of smaller outer diameter than the body adjacent to the other end of the body. A tapered transition piece connecting the neck with the adjacent end of the body provides an elevator shoulder. A correlative pin tool joint member is welded to the opposite end of the tube to complete the drill pipe.The box tool joint member has an annular band of hard facing over the outer periphery of the transition piece and extending down over the adjacent part of the weld neck and up around the adjacent part of the body. The hard facing is corrosion resistant and has a smooth finished surface. Underneath the hard facing and extending beyond both ends of the hard facing is an annular butter layer of non-hardenable steel.
    Type: Grant
    Filed: June 18, 1979
    Date of Patent: March 17, 1981
    Assignee: Smith International, Inc.
    Inventors: Jimmie B. Bolton, Sam T. Crews
  • Patent number: 4234119
    Abstract: A groove is provided on the side of a metallic structure opposite to the side thereof which is exposed to a corrosive atmosphere, and the groove is subjected to build-up welding while cooling with a liquid coolant, whereby any stress corrosion cracking which otherwise occurs on the side of the structure to be exposed to the corrosive atmosphere can be prevented. Especially, this method of manufacture is appropriate for the repair welding of a butt-welded pipe of austenite type stainless steel, and it is effective to perfectly prevent the stress corrosion cracking of the pipe prone to be caused by reactor water during use in a nuclear reactor.
    Type: Grant
    Filed: August 14, 1978
    Date of Patent: November 18, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Isao Masaoka, Katsuyuki Imai
  • Patent number: 4186864
    Abstract: When a welded joint is produced for joining metal components by applying a plurality of layers of deposited metal, the plurality of layers of deposited metal are provided in a groove of a weld preparation formed between the metal components to be joined in such a manner that each layer of deposited metal has a small thickness and a large width crosswise of the groove and the layers are arranged to be superposed one over another. During this process, a coarse metal structure formed when each underlying layer of deposited metal is provided is completely tempered and transformed into a fine metal structure by the heat generated when each overlying layer of deposited metal is provided. Thus the welded joint produced by this method shows an excellent performance in service.
    Type: Grant
    Filed: October 14, 1977
    Date of Patent: February 5, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Ishimaru, Hiroshi Kobayashi, Junji Tamura
  • Patent number: 4142664
    Abstract: A method of butt welding titanium-clad steel plates whereby the steel portions of the abutting plates are first welded together, then the portions of the steel plates adjacent to the titanium portions are metallized with a refractory metal coating, which coating is compatible both with the steel layer and with the titanium portions, then titanium is cast into the space between the titanium plates by a known method to complete a butt weld between the titanium clad steel plates, having continuous titanium and steel segments.
    Type: Grant
    Filed: September 21, 1977
    Date of Patent: March 6, 1979
    Assignee: Titanium Fabrication Corporation
    Inventor: Norman G. Feige
  • Patent number: 3986255
    Abstract: Gold alloy bumps are built up upon conductive pads formed upon electronic chips. The bumps are thereafter aligned with conductive portions of a generally larger substrate to which the chips are to be electrically connected. The bumps are produced by either vacuum evaporating or plating metallic layers over the conductive chip pad areas wherein certain layers within the bumps are formed of magnetic metals such as cobalt or nickel cobalt alloys. Metallic layers of gold and alloying metal are evaporated or plated over the deposited magnetic metals to complete the formation of the bumps. The chips are thereafter subjected to a sufficient amount of heat to cause the bumps to flow, thereby to form a reliable electrical connection between the chips and the substrate. The magnetic materials formed within the bumps result in ease of transporting and manipulating the chips for further processing by means of magnetic plates or other pickup devices.
    Type: Grant
    Filed: November 29, 1974
    Date of Patent: October 19, 1976
    Assignee: Itek Corporation
    Inventor: Robert P. Mandal
  • Patent number: 3958743
    Abstract: In conducting the butt welding of a coated steel produced by applying a diffusion coating with aluminum or chromium on the surface of a chromium-molybdenum steel as the base metal, adoption of a process comprising welding the diffusion-coating side of said coated steel with a ferritic high chrome steel to begin with, next welding it with a molybdenum steel or chromium-molybdenum steel selected on the bases of the content of chromium and the content of molybdenum in the base metal, and lastly welding it with the same material as the base metal, varieties of such drawbacks as would ordinarily arise from the weld zone can be avoided.
    Type: Grant
    Filed: July 7, 1975
    Date of Patent: May 25, 1976
    Assignee: Japan Gasoline Co., Ltd.
    Inventors: Kunio Ishii, Masao Izumiyama, Keikichi Maeda