Abstract: A method for the assembly and connection of bodies, massive parts or powder grains, of alloys comprising at least 50% of nickel, cobalt or iron, comprises a preliminary operation of deposition at the interface of the said bodies of a product of the type MBF.sub.x, x being equal to 3 or 4, M designating a radical of the type NH.sub.4 giving off when hot a gaseous component such as NH.sub.3 or a metallic element and a sequence of treatment of cleaning/activation by passage of the coated body at a temperature in excess of the temperature of sublimation of the said product.

Abstract: Disclosed is a vacuum-heat-insulated cooking utensil and a method of manufacturing the same. Inner and outer containers are prepared each having a tubular side wall and an end wall closing the end of the side wall. The inner container is positioned in the outer container with the respective bottoms being in contact with each other through a first brazing material, with the other ends of the side walls fitted to each other with a gap which constitutes a vacuum sealing section, and with an annular space being defined between the side walls. A second brazing material having a melting point higher than that of the first brazing material is positioned at the vacuum sealing section. An assembly of the containers and the brazing materials is placed in a vacuum furnace. The furnace is evacuated to evacuate the annular space. Temperature within the furnace is raised above the melting point of the second brazing material to melt the first and second brazing materials.

Abstract: A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250.degree. C., using a gold-tin eutectic solder which has a melting point of 280.degree. C., is disclosed. The process comprises heating the heatsink and solder past the solder melting point on a quick thermal response heating element, turning off the heating power, and introducing the chip into the liquid solder on the cool down cycle. By controlling the rate at which the heatsink solder and device cool down and the time span from introduction of the chip to solidification of the solder, the chip can be exposed to sufficient heat to provide a good thermal, electrical and physical bond while substantially enhancing the yield of electrically undamaged photodetector chips.

Abstract: The outer surface of a stainless steel utensil and one surface of an aluminum disk are cleaned and then separately heated at different temperatures. Thereafter, the disk is superimposed over the utensil and metallurgically bonded directly thereto by the application of pressure.

Abstract: A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device wire base prior to the coining, trimming, slotting and various other forming operations which transform the wire base into a finished contact device. The apparatus features a sequential arrangement of gripping devices which manipulate the gold ribbon for processing as stated above, a welding apparatus for combining the gold ribbon segment with the contact wire base, a cutting device for cutting the gold ribbon and apparatus for forming the finished electrical contact device. The product features a formed contact device including a wire support member and a contact material simultaneously formed and flattened, to provide a minimum amount of inlaid or coined gold for effecting desirable contact characteristics.

Abstract: The invention concerns a method of fabricating ceramic/metal or ceramic/ceramic composites. A porous surface region is produced on a ceramic material by sintering a granular substance onto the latter. Metal infiltrated into the porous region is then firmly mechanically bonded to the ceramic. Alternatively, the porous region provides a surface of large effective area to which another ceramic may be bonded chemically and mechanically.

Abstract: A method for bonding bodies made of metallic material is described herein, which method is characterized in that one ends of metallic bodies are butted against each other with a light mechanical load applied to the butted portion, and under such a loaded condition the proximity of said butted portion is subjected to a temperature cycle passing over a transformation point of said materials, whereby said metallic bodies may be pressure bonded while super-plastic phenomena are generated in said butted portion of said metallic bodies.