Abstract: A brazing method for a dynamoelectric machine is provided, and includes the steps of providing a first dynamoelectric machine part and a second dynamoelectric machine part, where a first portion of the first dynamoelectric machine part is configured to fit inside a second portion of the second dynamoelectric machine part. A step of preplacing a non-self-fluxing braze alloy on the first portion or the second portion. A step of thermally treating the first portion or the second portion, to create a temperature differential and size differential between the first portion and the second portion. A step of inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined to the second portion by brazing in air, without the use of a flux, vacuum or inert atmosphere.

Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

Abstract: In a method of welding of metal plates in a solid phase, wherein the metal plates are combined to form a package, and welded together by heating and deforming the package by contacting with two rotating cylinders, the improvement includes: providing a damping lining between the metal plates; placing the package between two cylinders such that the metal plate with the smallest yield value under welding temperature faces the cylinder with smaller diameter, heating and deforming the package in vacuum, such that during a first stage the temperature reaches 0.4-0.5 of melting temperature of a metal plate with the smallest yield value, during a second stage the package is heated by a high frequency which heats the damping lining up to 0.92-0.95 of its melting temperature, wherein angular velocities of the rotating cylinders and their radiuses are selected in accordance with a formula.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

Abstract: This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of an internal combustion engine are repaired by preheating the component to a first preheat temperature. The damaged area of the casting is then heated to a higher temperature using a torch and melted filler material is poured into the casting. The torch is used to maintain the temperature of the melted material for thirty seconds to two minutes. The temperature of the filler material is then cooled using compressed air.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g., die, chip scale package), or on electrodes of a mating component (e.g., PCB, MCM substrate). The bumps include an adhesive matrix material and dendritic metal particles. The adhesive matrix material is in a semi cured condition having adhesive qualities for bonding, but with a structural rigidity for supporting the dendritic particles to enable penetration of oxide layers on the electrodes. The semi cured adhesive bumps permit the bumps to be cured without the necessity of externally generated compressive forces.

Abstract: A method of bonding a first thin crystalline metal to a second thin metal ch as metallic glass is disclosed. Initially, the metallic glass is coated with a thin thermal barrier layer. Next, the first metal is heated to a temperature sufficient for diffusion bonding. Finally, the metallic glass is maintained at ambient temperature as the metallic glass is diffusion bonded to the crystalline metal. The thermal barrier layer prevents the metallic glass from reaching a phase transition temperature during the diffusion bonding. Consequently, a composite product having a base layer of crystalline metal and an outer layer of metallic glass is produced. Preferably, the diffusion bonding is produced by evacuated roll-bonding and the coating is attached to the metallic glass by electroplating. A plurality of metallic glass layers and crystalline metal layers can be bonded together to produce a sandwiched composite product.

Abstract: A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250.degree. C., using a gold-tin eutectic solder which has a melting point of 280.degree. C., is disclosed. The process comprises heating the heatsink and solder past the solder melting point on a quick thermal response heating element, turning off the heating power, and introducing the chip into the liquid solder on the cool down cycle. By controlling the rate at which the heatsink solder and device cool down and the time span from introduction of the chip to solidification of the solder, the chip can be exposed to sufficient heat to provide a good thermal, electrical and physical bond while substantially enhancing the yield of electrically undamaged photodetector chips.

Abstract: A soldering device having a guide body for receiving and delivering a filler metal to form a weldment. The guide body has an end portion which is positioned in the path of the heat from the burner to preheat the filler metal therein. The temperature of the filler metal in the end portion is sensed by a thermocouple and delivered to a memory unit for comparison with a preset temperature for operating a device for feeding the filler metal to the end portion. A cooling area upstream from the end portion having collant circulating therethrough is also controlled from the memory unit. A screen movable between the burner and the end portion to control the flow of heat to the latter is also controlled by the memory unit. The temperature of the burner flame and of the workpiece can also be sensed to assure proper working conditions upon delivery of the filler metal. Additionally, the burner and the feed of a reducing gas can be automatically terminated while changing workpieces.

Abstract: The invention relates to an improved method of automatic or semi-automatic welding with gas, or brazing, effected by using a coil of fillet wire brought to the welding point by continuously passing through the center of a gas flame, (oxy-acetylene, oxygen-propane for example) which melts the wire and heats the work part, said improvement comprising the application of an electrical voltage between a member mounted on the forward-movement path of the fillet wire and the work part under treatment, so as to cause the passage therein of a heating current.The electrical voltage is preferably applied either between the welding torch nozzle or the forward-movement rollers and the part treated.

Abstract: Apparatus for affixing surface enlarging, transversally corrugated metal strips to elongate metal basic profiles which are advanced in the direction of their longitudinal axes whilst simultaneously being joined by a joining compound to the wave crests on one side of the corrugated metal strips. The apparatus provides a furnace for heating the basic profile to a temperature which exceeds the melting point of the joining compound, a device for advancing the metal strip longitudinally externally of the path of the basic profile while applying the joining compound to the crests and solidifying a suitable portion of the compound at respective crests by conducting heat away from the compound through the strip to material.