Abstract: A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure including a plurality of micro heater groups, a chip-carrying structure for carrying a plurality of chips, and a plurality of soldering material groups disposed between the chip-carrying structure and the chip-detecting structure; placing the chip-carrying structure and the chip-detecting structure adjacent to each other, so that each of the soldering material groups simultaneously contact the chip-carrying structure and the chip-detecting structure; respectively curing the low-temperature soldering material groups by heating of the micro heater groups, so that the chips are electrically connected to the chip-detecting structure respectively through the low-temperature soldering material groups that have been cured; and then detecting the chips so as to divide the chips into a plurality of good chips and a plurality of bad chips.

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract: Apparatus and method are provided for an electric induction brazing process in an inert atmosphere using a substantially oxygen-free copper alloy filler or preform under an inert atmosphere within a brazing chamber minimally sized for containment of the brazed joint region and an induction coil. The inert atmosphere may be nitrogen gas supplied from a liquid nitrogen source. For brazing of an open-interior fitting around a hole in a tubular material a nesting area is provided around the hole for seating of the filler or preform and the fitting.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Abstract: A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.

Abstract: In a first step, friction stir welding is performed, while supplying a filler into a joining portion, in order to prevent the coarsening of crystal grains of metal materials in a subsequent fusion processing. Then, a fusion processing such as MIG welding is performed. The filler to be added to the joining portion includes a substance that does not chemically react with the metal materials and has a melting point higher than a melting point of the metal materials and a substance in which a misfit with the metal materials is within ±15%. As a result, the coarsening of crystal grains by the fusion processing is inhibited and the joint strength can be increased.

Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.

Abstract: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper alloy-ferrule assembly. The assembly is then furnace brazed to a metal fitting.

Abstract: According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.

Abstract: A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the temperature that is higher than the temperature of the device. The bond head is subsequently moved toward the device to bring a portion of the wire into contact with the bond pad. Ultrasonic energy is provided to an interface between the portion of the wire and the bond pad.

Abstract: A method to minimize the distortion, such as buckling, caused in the welding of thin plate by utilizing transient thermal tensioning to induce areas of residual tensile stress. Distortion of such welded plates after stiffeners are welded to the plates is due to large areas of unsupported residual compressive stress following the tensile stress that is induced along the weld lines by the welding of the stiffeners. Application of transient thermal tensioning by moving heat sources at the time of welding of the stiffeners induces areas of residual tensile stress that minimize the tendency of the plates to buckle. Multiple heat sources of variable intensity may be utilized, and multiple stiffeners may be welded to a single panel by the method. Minimization of distortion improves the function and appearance of the finished plates and minimizes post-welding repairs.

Abstract: A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.

Abstract: Reflow solder oven gas management system introduces an inert gas into and removes contaminated gas from a reflow oven tunnel (42) at predetermined points (6, 8) to influence the oven tunnel gas flow and to dilute and expel excess oxygen. The contaminated gas is ducted to a flux separation system (34) to be cleaned, for example remove flux vapors, and returned in part to the tunnel (42) for recirculation and with the remainder routed to end baffle boxes (54) for tunnel end pressurization and exhaust. The system has sufficient pressure to supply end baffle boxes (54) with clean gas to create a gas barrier to effectively seal off the tunnel ends from air infiltration or migration into the tunnel making the system insensitive to external pressure and/or temperature variations. The invention also includes alternative embodiments, low flow oxygen bleed valves (72) to maintain low oxygen content in the oven process tunnel.

Abstract: A method for attaching a workpiece, for example a semiconductor die, to a workpiece holder, for example a lead frame die support, comprises the steps of interposing an uncured adhesive between the semiconductor die and the die support and preheating the adhesive from an ambient temperature to a preheat temperature of between about 150° C. and about 160° C. over a period of about 1.5 seconds. Next, the preheat temperature is maintained for about 1.5 seconds, then the adhesive is further heated to a temperature of between about 190° C. and about 200° C. over a period of about 1.0 second. The inventive method quickly cures the adhesive to secure the die to the support with acceptably low levels of voiding. An apparatus which can be adapted to perform the inventive method is further described.

Abstract: A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.

Abstract: A multisheet structure is made using compression diffusion bonding according to the present invention using a CRES template to apply increased pressure in the areas designated for diffusion bonds (DB) to improve the bond quality and to reduce the processing time. The CRES template is patterned to correspond with the DB arrangement in the superplastically formed part. The forming press forces the template against the pack of SPF sheets to provide 300-1200 psi or more pressure along the bond lines to speed their formation.

Abstract: A HVOF process is used for applying brazing materials to repair surfaces of a substrate such as a turbine blade. The brazing material is applied in powdered form and is free of binders and adhesives. The brazing materials may be any one or more of a nickel based, cobalt based or ferrous based high temperature brazing material. Alloys of these elements may be used together with a temperature depressing melting point element such as boron or silicon.

Abstract: A first substrate is attached to a second substrate by providing solder structures that include a first portion adjacent the second substrate that has a first melting point, and a second portion adjacent the first substrate that has a second melting point that is lower than the first melting point. The solder structures then are heated to a first temperature that is at or above the second melting point but below the first melting point, to melt the second portions. Simultaneous with the heating of the solder structures to the first temperature, the first substrate is attached to the second substrate while the second portions are melted. Finally, the solder structures are heated to a second temperature that is above the first temperature, to alloy at least some of the first portions and the second portions.

Abstract: A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments include heating the wire bonding areas of the dies of a stacked die package with infrared radiation with an infrared lamp or gun directed towards the top surfaces of the dies before and during the wire bonding process, or heating the bonding pad area of the top surface of a substrate to which a flip-chip is to be mounted from above with infrared radiation from a lamp or gun to the desired temperature, then bonding the flip-chip to the substrate. The use of infrared radiant heating directed at the top surfaces of the dies and/or the substrate ensures that their respective bonding areas are heated to the proper temperature within the necessary time period, thereby enabling high-quality wire bonding or die bonding, and increasing yield.

Abstract: For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

Abstract: An apparatus and method for welding a superalloy article. The apparatus generally entails an enclosure adapted for containing a superalloy article, a polarity-reversing plasma transferred arc welder apparatus for welding a localized region of the article, an induction coil for heating the localized region, and elements for sensing and controlling the temperature of the localized region. The induction coil is placed in close proximity to the localized region of the article so that the temperature of the localized region is largely determined and quickly altered by the output of the coil. The polarity-reversing plasma transferred arc welding apparatus is operated at very low currents of not more than forty-five amps, so that the welding apparatus has only a secondary heating affect compared to the induction coil.

Abstract: An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom surface of a card immediately underlying the module. The method of removing and replacing a module on a card includes preheating the card and module prior to heating the contact sites to a solder reflow temperature and also preheating a card and a replacement module to an equilibrium temperature prior to increasing the temperature of the contact sites to the reflow temperature. The apparatus and method embodying the present invention effectively addresses the problem of providing a faster heating cycle, and a more even temperature distribution across the contact sites of the module and card.

Abstract: A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such a way that the metal oxide is at least partially reduced to metal at least on the solder side at the surface and in the subsurface region of the contact facing. The reduction can be carried out by heat treatment in reducing atmosphere. In the case of contact materials based on silver/iron oxide (AgFe.sub.2 O.sub.3 /Fe.sub.3 O.sub.4), in particular, the iron oxide may also be reduced to iron on the switching side since iron oxide is again formed after switching. Alternatively, contact facings may be provided with carbon as reducing agent on the solder side. In particular, the reduction may take place locally in this case.

Abstract: A technique is provided for manually performing a soldering operation on an article with a low-solids flux-containing solder to bond an object to the article with a reduced amount of flux residues. The technique is practiced by first manually applying heat to the article and to the object which is in contact therewith, such as by contacting the article and/or object with a heated tip of a soldering pencil, iron or gun. Once the object and article have been heated, a low-solids flux-containing solder is then applied so as to be reflowed upon contact with the heated article and the object in order to bond them together when the solder solidifies. Simultaneously, heated air (i,e., air heated above the ambient temperature) is directed at the article and the object towards the region where the solder is being applied to maintain any flux vapors, which were created upon heating of the solder, in their vaporous state.

Abstract: Heating apparatus specifically adapted for the heat treatment of turbine blades comprises two support parts (10, 11) which may be pivotally connected by a hinge (17), the support parts (10, 11) carrying heating elements (14, 15) and a slot (20) the provision of the slot (20) enabling the heating apparatus to be slid over the trailing edge of the turbine blade into position on the blade and subsequently closed by a closure member (24) which enables the rapid application of heating apparatus for heat treatment processes which has hitherto been a complicated and time consuming operation. The heating apparatus may incorporate thermocouples (27) and heat sinks.

Abstract: An apparatus for applying a soldering alloy to an element to be soldered including an open-channeled member having a receiving region for holding the element, a vacuum system connected to the member for creating a negative pressure through the open channel and at the receiving region sufficient to retain the element against the receiving region, a heating coil connected to the member for conducting heat to the element at a soldering temperature, and a gas distribution and heating system for providing heated gas to a soldering alloy at a temperature sufficient to melt and provide at least one soldering connection on the heated element. The invention also comprises a method for providing heat to an element to be soldered substantially by conduction and heat to a soldering alloy substantially by convection employing a heated gas all at temperatures sufficient to provide a soldered connection without damaging the element being soldered.

Abstract: A device for making or undoing welds between a component with several galvanic connections and a support is particularly suited for surface mounting. In order to direct a stream of hot gas or infrared radiation accurately onto the connections of the component and corresponding weld surfaces, a mask is provided which has openings that exactly match the configuration of the weld surface. Preferably, in the case of hot-air operation, a light source is arranged behind the mask in such a way that the predetermined pattern is reproduced exactly on the substrate in the form of points of light for positioning purposes. In one embodiment, the mask comprises two pairs of horizontally adjustable shields, the two pairs of shields being arranged at an angle of 90 degrees, the shields being made of a material of low thermal conductivity.

Abstract: An apparatus and method is disclosed for making additional solder joints on a printed wiring assembly which includes a printed wiring board and components soldered previously thereto. Additional components, along with additional solder to be reflowed to form new solder joints, are placed on the assembly. A titanium shield is placed over the board to cover the already completed solder joints which are not to undergo reflow, and the assembly is passed through an oven producing both infrared and convection heating. The convection heating of the oven is set to warm the entire printed wiring assembly to a temperature which remains below the reflow temperature of the solder used to attach the preexisting components. The infrared heating of the oven is applied to the board, but is prevented from heating previously completed solder joints by the shield.

Abstract: Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this invention. The outer laminate, reactive-metal layer, and superconductive alloy layer are removed to form exposed sections of the parent metal layer. The tapes are positioned so that the exposed sections are in contact. Metallurgical bonding, for example by spot welding, forms bridges between the parent-metal layers. The joined exposed sections are heated in a protective atmosphere, and in the presence of excess reactive metal to form a continuous layer of the superconductive alloy on the bridge and the exposed areas that is continuous with the superconductive alloy layer on the superconducting tape.

Abstract: The following steps are performed for joining workpieces of metal or ceramic to each other by boundary surface diffusion at the junction location. After laying together the surfaces at which the workpieces are to be joined together, a layer is applied to the outer edge of the joint location consisting of a material compatible with the material of the parts to be joined and mechanically stable under high static pressure. The layer is fixed and sealed. Thereafter the workpieces are diffusion welded by hot isostatic pressing (HIP). A layer meeting the requirements of this process can be applied by plasma spraying onto the region of the seam at the outer edge of the junction location.

Abstract: A method for producing a metallic interface suitable for overlaying consists of exposing the area of an alloy combination to be overlayed to a temperature above its lower critical until an element reduced zone arises. This element reduced zone more easily accepts element diffusion that takes place during overlaying. Accordingly, an improved interface, one that is more ductile and less prone to cracking, is produced.

Abstract: The method for bonding a wire of this invention comprises the steps of: positioning a metal ball or a wire on a material (to be bonded); applying a pressing force on the metal ball or the wire against the material (to be bonded) and deforming it; inducing eddy currents in the wire to generate heat energy, whereby elements of the wire and the material (to be bonded) are mutually diffused by means of the heat energy and the pressing force, and bonding is completed. The wire bonding apparatus of this invention comprises: a capillary tip having a through-hole which opens onto a end thereof and through which a wire is passed, the capillary tip pressing the wire against a material to be bonded by the end of the tip (flat face); an electromagnetic coil provided around the end of the capillary tip to surround the through-hole; and a power source for supplying a high-frequency current to the electromagnetic coil.

Abstract: An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air heating to achieve solder reflow at throughput speeds and soldering quality not heretofore achievable.

Abstract: A fairing and a fairing assembly for towed underwater cables is provided, having two different embodiments of fairings. In the first embodiment, each fairing has a flexible nose portion and a substantially rigid tail portion having separable halves, with the connection between the nose portion and the tail portion being by way of a flange at each side at the rear of the nose portion fitting into a channel at the front of each of the half pieces of the tail portion, and with the channel being interrupted by a shear block which is accommodated by a discontinuity in the nose portion flanges. A special arrangement is made having half-length nose portions, and using a flexible link between at least certain ones of adjacent fairings, where the half-length nose portion accommodates a ring secured to the periphery of the cable.

Abstract: A process for manufacturing a glazing unit by jointing a metallized margin of a sheet of glass to an intervening spacer strip following a course along the peripheral margin of the unit, the joint between the sheet and the strip along at least a section of such course being formed by applying molten solder into the corner angle between the sheet and the strip to form a solder bead along the section, the joint being progressively traversed by at least one flame so that at each moment during its progress along the joint such flame acts on such solder metal before it has completely solidified whereby the final bead is formed by solidification of solder metal from the molten condition in which it is left by such flame and apparatus for carrying out such process.