Including Preheating Patents (Class 228/232)
  • Patent number: 9283593
    Abstract: An additive manufacturing process (110) wherein a powder (116) including a superalloy material and flux is selectively melted in layers with a laser beam (124) to form a superalloy component (126). The flux performs a cleaning function to react with contaminants to float them to the surface of the melt to form a slag. The flux also provides a shielding function, thereby eliminating the need for an inert cover gas. The powder may be a mixture of alloy and flux particles, or it may be formed of composite alloy/flux particles.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: March 15, 2016
    Assignee: Siemens Energy, Inc.
    Inventors: Gerald J. Bruck, Ahmed Kamel
  • Patent number: 8857699
    Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: October 14, 2014
    Assignee: Alfa Laval Corporate AB
    Inventors: Per Sjodin, Jens Rassmus
  • Publication number: 20140291301
    Abstract: A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 2, 2014
    Applicant: NTN CORPORATION
    Inventors: Masahiro Tosaji, Naoki Nakagawa
  • Patent number: 8809748
    Abstract: An apparatus and method for heating a pipe prior to performing a welding operation, an interpass welding operation, a hydrogen bake-out operation of a weld joint or for post heat-treating of a weld joint is provided. The heating apparatus can include at least one heating collar placed around a pipe or weld joint, and a controller unit for controlling the thermal heat energy transferred from the heating collar to the pipe or weld joint.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: August 19, 2014
    Inventor: Colin Regan
  • Publication number: 20140034716
    Abstract: A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 6, 2014
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi, Mario Lopez Ruiz
  • Publication number: 20130248585
    Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion.
    Type: Application
    Filed: March 23, 2012
    Publication date: September 26, 2013
    Inventors: Kurt Allen Rakozy, Jeffrey Michael Breznak, Andrew Batton Witney
  • Patent number: 8420226
    Abstract: A structural member comprising at least two aluminum alloy parts displaying different property balances, said at least two parts being welded and wherein one of said parts either is (i) selected from an aluminum alloy different from the other of said at least two parts and/or (ii) is selected from an initial temper different from the other of said at least two parts, and wherein at least one of said at least two parts has been pre-aged prior to being welded, and, wherein said structural member has undergone a post-welding thermal treatment conferring a final temper to each of said at least two parts. The parts are advantageously welded by friction stir welding. Another subject of the invention is a method for manufacturing a structural member.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: April 16, 2013
    Assignee: Constellium France
    Inventors: Jean-Christophe Ehrstrom, Henri Gérard
  • Publication number: 20120217287
    Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 30, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Rajneesh Kumar, Jae-Woong Nah, Eric D. Perfecto
  • Patent number: 8225984
    Abstract: A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: July 24, 2012
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: R. Jeffrey Ding
  • Patent number: 8127977
    Abstract: A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: March 6, 2012
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: R. Jeffrey Ding
  • Publication number: 20120043305
    Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Applicant: International Business Machines Corporation
    Inventors: Matthew S. Kelly, Kirit R. Shah, Thomas S. Truman
  • Patent number: 8013271
    Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: September 6, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Fukaya, Satoshi Yamaguchi
  • Patent number: 7980449
    Abstract: A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: July 19, 2011
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: R. Jeffrey Ding
  • Patent number: 7806311
    Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: October 5, 2010
    Assignee: National Taiwan University
    Inventor: Wei-Hsing Tuan
  • Publication number: 20100237049
    Abstract: A method of welding a component is provided. The component is welded using a preheating temperature of the component below 500° C. and above 400° C., wherein no material is added to an area to be welded.
    Type: Application
    Filed: June 25, 2008
    Publication date: September 23, 2010
    Inventor: Selim Mokadem
  • Patent number: 7591410
    Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: September 22, 2009
    Assignee: Electric Power Research Institute, Inc.
    Inventors: Kent K. Coleman, David Wayne Gandy, Ramaswamy Viswanathan
  • Patent number: 7568609
    Abstract: A welding method forms a molten build-up portion on a base material that is any one of a single crystal material and a unidirectionally solidified crystal material. The method includes forming a plurality of build-up portions on the base material while maintaining a predetermined gap between adjacent build-up portions; and forming a build-up portion in each of the predetermined gaps.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: August 4, 2009
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Sachio Shimohata, Masahiko Mega, Kimihiro Kishi, Seiji Katayama
  • Publication number: 20090020593
    Abstract: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.
    Type: Application
    Filed: January 12, 2007
    Publication date: January 22, 2009
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Kazuo Kinoshita, Katsuitsu Nishida
  • Patent number: 7442445
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: October 28, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
  • Patent number: 7428979
    Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: September 30, 2008
    Assignee: Hispano Suiza
    Inventors: Bernard Glever, Erick Henry, José Chenot
  • Patent number: 7371988
    Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: May 13, 2008
    Assignee: Electric Power Research Institute, Inc.
    Inventors: Kent K. Coleman, David Wayne Gandy, Ramaswamy Viswanathan
  • Patent number: 7287312
    Abstract: A manufacturing method of a magnetic head device includes a preheating step of irradiating a laser beam to terminal pads of a magnetic head slider and to connection pads of a lead conductor member that is to be electrically connected to the magnetic head slider, a supply step of supplying conductive metal material for connecting the terminal pads and the connection pads during or after the preheating step, and a heating step of performing molten-metal connections between the terminal pads and the connection pads by irradiating a laser beam to the conductive metal material.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: October 30, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventor: Satoshi Yamaguchi
  • Patent number: 7265315
    Abstract: A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: September 4, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Atsushi Oohashi, Shoichiro Nishitani, Takahiro Yamada
  • Patent number: 7234627
    Abstract: A method of joining coiled sucker rod in the field. In its most basic form, the method includes a first step of placing abutting ends of sucker rod in face to face relation. A second step involves positioning a gas burner in proximity to the abutting ends of sucker rod and heating the abutting ends with a hydrocarbon gas flame while applying axial pressure to force the abutting ends together. A third step involves continuing heating and applying pressure until a weld is formed with a bulge formed above the weld which is at least one third of the diameter of the welded rod. A fourth step involves keeping the pressure constant until the weld cools.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: June 26, 2007
    Inventor: Karel Bostik
  • Patent number: 7047612
    Abstract: This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of an internal combustion engine are repaired by preheating the component to a first preheat temperature. The damaged area of the casting is then heated to a higher temperature using a torch and melted filler material is poured into the casting. The torch is used to maintain the temperature of the melted material for thirty seconds to two minutes. The temperature of the filler material is then cooled using compressed air.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: May 23, 2006
    Assignee: Caterpillar Inc.
    Inventors: Michael D. Bridges, Leonid Chuzhoy, Christopher A Kinney, Jose F. Leon Torres, Stephen E Post, Robert E. Sharp
  • Patent number: 6878172
    Abstract: Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder before the solder is applied. After the solder is applied, the performance of the packaged microelectronic component can be tested and any packaged microelectronic component that fails to meet minimum performance criteria can be rejected as defective. Such a process may help identify microelectronic components that may pass normal testing procedures, but fail during a subsequent solder reflow operation. One embodiment provides a system that includes a suitable heating apparatus and a solder plating apparatus, with the heating apparatus being adapted to heat and cool packaged microelectronic components before they are delivered to the solder plating apparatus.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: April 12, 2005
    Assignee: Micron Technology, Inc.
    Inventor: David G. Jensen
  • Patent number: 6838636
    Abstract: A method of welding two silicon workpieces (20, 22) together into one member without the formation of cracks along the weld. A first method passes current (34, 36) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. A second method passing current (34) through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: January 4, 2005
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6818078
    Abstract: The present invention is directed to a method of joining an amorphous material to a non-amorphous material including, forming a cast mechanical joint between the bulk solidifying amorphous alloy and the non-amorphous material.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: November 16, 2004
    Assignee: Liquidmetal Technologies
    Inventors: Choongnyun Paul Kim, Atakan Peker
  • Patent number: 6776327
    Abstract: A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: August 17, 2004
    Assignee: Palomar Technologies, Inc.
    Inventors: Zeger Bok, John Brajkovich, Jay L. Smith, II
  • Publication number: 20040099714
    Abstract: Method for forming a weldment in a nickel based alloy substrate comprising subjecting the substrate prior to welding to a pre-heating step at an elevated temperature which is above ambient temperature and less than an aging temperature of the substrate.
    Type: Application
    Filed: November 26, 2002
    Publication date: May 27, 2004
    Inventors: Thaddeus J. Strusinski, Jeffry Killough, David Vargas Leal, Paul A. Wilson, Michael J. Butler, Daniel Salinas, M. Lee Blackwell
  • Patent number: 6726087
    Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: April 27, 2004
    Assignee: Seho Systemtechnik GmbH
    Inventors: Rolf Ludwig Diehm, Volker Liedke
  • Patent number: 6625886
    Abstract: In a manufacturing method of a heat exchanger including a core portion having a plurality of tubes and a plurality of radiation fins connected to surfaces of the tubes, and a tank portion communicating with the tubes, a preheating step, a brazing step, a gradual cooling step and a cooling step are performed in this order. In the preheating step, temperature of the tank portion having a large heat capacity is increased earlier than that of the core portion having a small heat capacity. Therefore, the temperature of the tank portion is rapidly increased, and the temperature of the core portion is obediently increased in accordance with the temperature increase of the tank portion.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: September 30, 2003
    Assignee: Denso Corporation
    Inventors: Syoji Iriyama, Koji Hirao, Hiroshi Ogawa, Takanori Takeda, Hiroshi Nishikawa, Satoshi Nohira
  • Patent number: 6583387
    Abstract: A heating apparatus and method for pre-weld heat treating, welding and post-weld heat treating a superalloy article in a single enclosure while avoiding oxidation of the article. The enclosure is preferably equipped with a one-way valve that permits the escape of gases, but otherwise seals the enclosure to prevent the ingress of air during welding and heat treatment as a result of thermal gradients induced when the article is inductively heated. To provide access to the article and a device used to weld the article, the enclosure is equipped with gloves by which the welding device and the article can be manipulated while a nonreactive atmosphere is fully maintained within the enclosure and the article is inductively heating.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: June 24, 2003
    Assignee: General Electric Company
    Inventors: Thomas J. Kelly, Keith B. Alexander, Rabon Hensley, Robert D. Lawrence, John H. Snyder
  • Patent number: 6583377
    Abstract: Two silicon workpieces (20, 22) welded together into one member without the formation of cracks along the weld. It may be formed by a first method in which current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second forming method, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: June 24, 2003
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Publication number: 20020179693
    Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.
    Type: Application
    Filed: May 24, 2002
    Publication date: December 5, 2002
    Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
  • Publication number: 20020148881
    Abstract: A novel process for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by directly melting dry solder powder over a bare-PCB 230 consequently forming relatively thick individual layers of solid solder over each soldering pad of said bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a dry solder powder pile 232 that is melted by localized heating.
    Type: Application
    Filed: June 18, 2002
    Publication date: October 17, 2002
    Inventor: Horacio Andres Trucco
  • Patent number: 6403914
    Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: June 11, 2002
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6384366
    Abstract: A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments include heating the wire bonding areas of the dies of a stacked die package with infrared radiation with an infrared lamp or gun directed towards the top surfaces of the dies before and during the wire bonding process, or heating the bonding pad area of the top surface of a substrate to which a flip-chip is to be mounted from above with infrared radiation from a lamp or gun to the desired temperature, then bonding the flip-chip to the substrate. The use of infrared radiant heating directed at the top surfaces of the dies and/or the substrate ensures that their respective bonding areas are heated to the proper temperature within the necessary time period, thereby enabling high-quality wire bonding or die bonding, and increasing yield.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: May 7, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Pak C. Wong
  • Patent number: 6333484
    Abstract: A process is provided for welding a nickel or cobalt based superalloy article to minimize cracking by preheating the entire weld area to a maximum ductility temperature range, maintaining such temperature during welding and solidification of the weld, raising the temperature for stress relief of the superalloy, then cooling at a rate effective to minimize gamma prime precipitation.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: December 25, 2001
    Assignee: Chromalloy Gas Turbine Corporation
    Inventors: Michael Foster, Kevin Updegrove
  • Patent number: 6310314
    Abstract: The description relates to a procedure for fastening a carbide tooth (1) at a saw blade (2), with a carbide tooth (1) fabricated according to the saw tooth geometry being held butt-jointed to the prepared front-side abutting surface (3) of the saw blade (2) and then being attached to the saw blade under addition of heat along the joint (10) between the saw blade (2) and the carbide tooth (1). To create favorable process conditions it is suggested that the carbide tooth (1) is welded to the saw blade (2) by means a focal spot (9) of a laser beam (7) extending over the whole joint length.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: October 30, 2001
    Assignee: Wintersteiger GmbH
    Inventors: Franz Nöbauer, Gerhard Liedl
  • Publication number: 20010027967
    Abstract: A soldering apparatus is provided with a holding section for mounting and holding a board to which reflow solder is previously applied and in which a mounted part is mounted on the reflow solder, a moving section for automatically moving a holding part between a heating position and a board mounted position, a first heater for heating a face having no mounted part of the board at a temperature lower than a solder melting point and a second heater for heating a connection range of the board and the mounted part at a temperature higher than the solder melting point. The soldering apparatus also has a timer for setting a heating time of the first heater and the second heater.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 11, 2001
    Applicant: NEC Corporation
    Inventor: Akira Noguchi
  • Patent number: 6297474
    Abstract: A heating apparatus and method for pre-weld heat treating, welding and post-weld heat treating a superalloy article in a single enclosure while avoiding oxidation of the article. The enclosure is preferably equipped with a one-way valve that permits the escape of gases, but otherwise seals the enclosure to prevent the ingress of air during welding and heat treatment as a result of thermal gradients induced when the article is inductively heated. To provide access to the article and a device used to weld the article, the enclosure is equipped with gloves by which the welding device and the article can be manipulated while a nonreactive atmosphere is fully maintained within the enclosure and the article is inductively heating.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: October 2, 2001
    Assignee: General Electric Company
    Inventors: Thomas J. Kelly, Keith B. Alexander, Rabon Hensley, Robert D. Lawrence, John H. Snyder
  • Patent number: 6284997
    Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a silicon plate (60) which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: September 4, 2001
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, Robert L. Davis, David B. Ackard, James W. Govorko
  • Patent number: 6241146
    Abstract: A process is provided for manufacturing a sensor arrangement for temperature measurement with a temperature-sensitive measuring resistance which has a thin, metal resistance layer electrically insulated toward the outside, and exposed contact surfaces on a ceramic substrate. The contact surfaces are connected electrically conducting and directly mechanically fast with high temperature-resistant conductor paths electrically insulated from one another on a ceramic carrier element. The measuring resistance is bonded and attached by application to and subsequent firing on a carrier element prepared prior to outfitting. A platinum-containing thick film conducting paste serves as a means for attachment and bonding. Contact surfaces for connecting a plug or cable are arranged at the end of the carrier element facing away from the measuring resistance.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: June 5, 2001
    Assignee: Herarus Electro-Nite International N.V.
    Inventors: Karlheinz Wienand, Stefan Dietmann, Margit Sander
  • Patent number: 6223975
    Abstract: A method and apparatus for the temperature regulation of components such as semiconductor circuits, printed circuit boards and the like. The components are conveyed on carriers through an inlet slot into a temperature regulating housing provided with temperature regulating members and are convey out through an outlet slot opposite the inlet slot. In the housing, the carriers are loaded on a magazine provided with adjacently arranged holders. After the first holder is loaded in the starting position, the magazine is displaced progressively in one direction into successive positions in which the remaining holders of the magazine are loaded one after the other. Once all the holders are loaded, the magazine is filled and in an end position. Thereupon the magazine is displaced back to its starting position in a fast reverse run in the opposite direction.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: May 1, 2001
    Assignee: SEHO Systemtechnik GmbH
    Inventors: Johann Alfred Blohmann, Rolf Diehm, Rudolf Ullrich
  • Patent number: 6213385
    Abstract: A method of manufacturing a clad product in which a metallic substrate material is extruded and a cladding material is then brought into intimate contact with the heated extrudate before the extrudate has had an opportunity to cool to room temperature. The cladding material is compressed against the heated extrudate, thereby bonding the cladding material to the substrate material and forming the clad extruded metallic product. The clad extruded metallic product is then cooled to room temperature.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: April 10, 2001
    Assignee: Brazeway, Inc.
    Inventors: Matthew M. Guzowski, Henry McCarbery
  • Patent number: 6160237
    Abstract: The invention is directed to a friction welding process for mounting blades of a rotor for a flow machine. A plurality of oblong welding surfaces are provided at a circumferential surface of a carrier and are respectively welded to a welding surface of a blade. The welding temperature is generated by pressing the welding surfaces together and by an oscillating relative motion between the blade and the carrier in the welding plane. At least the blade or the carrier is additionally heated to a temperature lying below the welding temperature in the region of the welding surface.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: December 12, 2000
    Assignee: MTU Motoren-und Turbinen-Union Muenchen GmbH
    Inventors: Dieter Schneefeld, Hans Wilhelm, Dietmar Helm, Erich Thaler
  • Patent number: 6124568
    Abstract: A heating apparatus and method for welding a superalloy article. The apparatus and method of this invention provide for pre-weld and post-weld heat treatments to be performed on an article within the same enclosure in which the welding operation is performed. The apparatus accurately controls the temperature of the component to be welded throughout the temperature treatment profiles with the use of means for welding the article, means for heating the article, and means for sensing the article temperature. The apparatus also works in conjunction with a memory storage device that stores appropriate pre-weld and post-weld heat treatment temperature profiles and a welding temperature profile for the article.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: September 26, 2000
    Assignee: General Electric Company
    Inventors: Thomas F. Broderick, Richard R. Worthing, Jr., Lawrence J. Roedl, John M. Powers, Warren D. Grossklaus, Jr.
  • Patent number: 6036083
    Abstract: The forming oil degreasing step and flux coating step are reversed as part of a basic fluxed heat exchanger brazing process. This allows the fluxed parts to be thermally degreased concurrently with the braze oven workpiece preheat process, eliminating a separate degrease step and apparatus entirely. Surprisingly, and contrary to all teaching as to electrostatic dry power coating, powdered flux was found to electrostatically bond to an oily surface as well as, or even better than, an oil free surface.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: March 14, 2000
    Assignee: General Motors Corporation
    Inventors: Yang Luo, Hartley F. Hutchins
  • Patent number: 6024276
    Abstract: The method provides a diffusion-bonding of dual-phase stainless steel material having excellent strength and corrosion. The method includes: cold-working a material to be bonded so as to enhance the proof stress; inserting into the bonding portion an insert material; applying pressure thereto while performing shielding by mixed nitrogen/argon gas; heating the restricted bonding portion; cooling at a restricted rate; so as to form a bonded portion having the ferritic phase percentage of 30-70% by volume.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: February 15, 2000
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Hiroyuki Hirata, Yuuichi Komizo, Yasuto Fukada, Masakatsu Ueda