Abstract: In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: This patent application relates to methods and apparatus for temperature modification within a stack of microelectronic devices for mutual collective bonding of the microelectronic devices, and to related substrates and assemblies.

Abstract: An apparatus (10) for producing three-dimensional work pieces comprises a carrier (16), a powder application device (14) for applying a raw material powder onto the carrier (16), an irradiation device (18) selectively irradiating electromagnetic or particle radiation onto the raw material powder applied onto the carrier (16), and a control unit (38) which is adapted to control the operation of the powder application device (14) and the irradiation device (18) in dependence of the crystallization behavior of the raw material powder, in order to tailor the microstructure of a work piece made of said raw material powder by a additive layer construction method.

Abstract: An additive manufacturing process (110) wherein a powder (116) including a superalloy material and flux is selectively melted in layers with a laser beam (124) to form a superalloy component (126). The flux performs a cleaning function to react with contaminants to float them to the surface of the melt to form a slag. The flux also provides a shielding function, thereby eliminating the need for an inert cover gas. The powder may be a mixture of alloy and flux particles, or it may be formed of composite alloy/flux particles.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.

Abstract: An apparatus and method for heating a pipe prior to performing a welding operation, an interpass welding operation, a hydrogen bake-out operation of a weld joint or for post heat-treating of a weld joint is provided. The heating apparatus can include at least one heating collar placed around a pipe or weld joint, and a controller unit for controlling the thermal heat energy transferred from the heating collar to the pipe or weld joint.

Abstract: A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion.

Abstract: A structural member comprising at least two aluminum alloy parts displaying different property balances, said at least two parts being welded and wherein one of said parts either is (i) selected from an aluminum alloy different from the other of said at least two parts and/or (ii) is selected from an initial temper different from the other of said at least two parts, and wherein at least one of said at least two parts has been pre-aged prior to being welded, and, wherein said structural member has undergone a post-welding thermal treatment conferring a final temper to each of said at least two parts. The parts are advantageously welded by friction stir welding. Another subject of the invention is a method for manufacturing a structural member.

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract: A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Abstract: A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.

Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.

Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.

Abstract: A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: performing a multi-stage pre-oxidizing process on the copper sheet; placing the copper sheet on a ceramic substrate; and heating the copper sheet and the ceramic substrate to a joining temperature to join the copper sheet and the ceramic substrate together to enhance interface strength between the copper sheet and the ceramic substrate according to the multi-stage pre-oxidizing process. The multi-stage pre-oxidizing process includes a first stage of pre-oxidizing process and a second stage of pre-oxidizing process, and the first and second stages of pre-oxidizing processes are performed in atmospheres with different oxygen partial pressures and at different temperatures.

Abstract: A method of welding a component is provided. The component is welded using a preheating temperature of the component below 500° C. and above 400° C., wherein no material is added to an area to be welded.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: A welding method forms a molten build-up portion on a base material that is any one of a single crystal material and a unidirectionally solidified crystal material. The method includes forming a plurality of build-up portions on the base material while maintaining a predetermined gap between adjacent build-up portions; and forming a build-up portion in each of the predetermined gaps.

Abstract: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.

Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: A manufacturing method of a magnetic head device includes a preheating step of irradiating a laser beam to terminal pads of a magnetic head slider and to connection pads of a lead conductor member that is to be electrically connected to the magnetic head slider, a supply step of supplying conductive metal material for connecting the terminal pads and the connection pads during or after the preheating step, and a heating step of performing molten-metal connections between the terminal pads and the connection pads by irradiating a laser beam to the conductive metal material.

Abstract: A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.

Abstract: A method of joining coiled sucker rod in the field. In its most basic form, the method includes a first step of placing abutting ends of sucker rod in face to face relation. A second step involves positioning a gas burner in proximity to the abutting ends of sucker rod and heating the abutting ends with a hydrocarbon gas flame while applying axial pressure to force the abutting ends together. A third step involves continuing heating and applying pressure until a weld is formed with a bulge formed above the weld which is at least one third of the diameter of the welded rod. A fourth step involves keeping the pressure constant until the weld cools.

Abstract: This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of an internal combustion engine are repaired by preheating the component to a first preheat temperature. The damaged area of the casting is then heated to a higher temperature using a torch and melted filler material is poured into the casting. The torch is used to maintain the temperature of the melted material for thirty seconds to two minutes. The temperature of the filler material is then cooled using compressed air.

Abstract: Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder before the solder is applied. After the solder is applied, the performance of the packaged microelectronic component can be tested and any packaged microelectronic component that fails to meet minimum performance criteria can be rejected as defective. Such a process may help identify microelectronic components that may pass normal testing procedures, but fail during a subsequent solder reflow operation. One embodiment provides a system that includes a suitable heating apparatus and a solder plating apparatus, with the heating apparatus being adapted to heat and cool packaged microelectronic components before they are delivered to the solder plating apparatus.

Abstract: A method of welding two silicon workpieces (20, 22) together into one member without the formation of cracks along the weld. A first method passes current (34, 36) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. A second method passing current (34) through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: The present invention is directed to a method of joining an amorphous material to a non-amorphous material including, forming a cast mechanical joint between the bulk solidifying amorphous alloy and the non-amorphous material.

Abstract: A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.

Abstract: Method for forming a weldment in a nickel based alloy substrate comprising subjecting the substrate prior to welding to a pre-heating step at an elevated temperature which is above ambient temperature and less than an aging temperature of the substrate.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: In a manufacturing method of a heat exchanger including a core portion having a plurality of tubes and a plurality of radiation fins connected to surfaces of the tubes, and a tank portion communicating with the tubes, a preheating step, a brazing step, a gradual cooling step and a cooling step are performed in this order. In the preheating step, temperature of the tank portion having a large heat capacity is increased earlier than that of the core portion having a small heat capacity. Therefore, the temperature of the tank portion is rapidly increased, and the temperature of the core portion is obediently increased in accordance with the temperature increase of the tank portion.

Abstract: Two silicon workpieces (20, 22) welded together into one member without the formation of cracks along the weld. It may be formed by a first method in which current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second forming method, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: A heating apparatus and method for pre-weld heat treating, welding and post-weld heat treating a superalloy article in a single enclosure while avoiding oxidation of the article. The enclosure is preferably equipped with a one-way valve that permits the escape of gases, but otherwise seals the enclosure to prevent the ingress of air during welding and heat treatment as a result of thermal gradients induced when the article is inductively heated. To provide access to the article and a device used to weld the article, the enclosure is equipped with gloves by which the welding device and the article can be manipulated while a nonreactive atmosphere is fully maintained within the enclosure and the article is inductively heating.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.

Abstract: A novel process for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by directly melting dry solder powder over a bare-PCB 230 consequently forming relatively thick individual layers of solid solder over each soldering pad of said bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a dry solder powder pile 232 that is melted by localized heating.

Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments include heating the wire bonding areas of the dies of a stacked die package with infrared radiation with an infrared lamp or gun directed towards the top surfaces of the dies before and during the wire bonding process, or heating the bonding pad area of the top surface of a substrate to which a flip-chip is to be mounted from above with infrared radiation from a lamp or gun to the desired temperature, then bonding the flip-chip to the substrate. The use of infrared radiant heating directed at the top surfaces of the dies and/or the substrate ensures that their respective bonding areas are heated to the proper temperature within the necessary time period, thereby enabling high-quality wire bonding or die bonding, and increasing yield.

Abstract: A process is provided for welding a nickel or cobalt based superalloy article to minimize cracking by preheating the entire weld area to a maximum ductility temperature range, maintaining such temperature during welding and solidification of the weld, raising the temperature for stress relief of the superalloy, then cooling at a rate effective to minimize gamma prime precipitation.

Abstract: The description relates to a procedure for fastening a carbide tooth (1) at a saw blade (2), with a carbide tooth (1) fabricated according to the saw tooth geometry being held butt-jointed to the prepared front-side abutting surface (3) of the saw blade (2) and then being attached to the saw blade under addition of heat along the joint (10) between the saw blade (2) and the carbide tooth (1). To create favorable process conditions it is suggested that the carbide tooth (1) is welded to the saw blade (2) by means a focal spot (9) of a laser beam (7) extending over the whole joint length.

Abstract: A soldering apparatus is provided with a holding section for mounting and holding a board to which reflow solder is previously applied and in which a mounted part is mounted on the reflow solder, a moving section for automatically moving a holding part between a heating position and a board mounted position, a first heater for heating a face having no mounted part of the board at a temperature lower than a solder melting point and a second heater for heating a connection range of the board and the mounted part at a temperature higher than the solder melting point. The soldering apparatus also has a timer for setting a heating time of the first heater and the second heater.

Abstract: A heating apparatus and method for pre-weld heat treating, welding and post-weld heat treating a superalloy article in a single enclosure while avoiding oxidation of the article. The enclosure is preferably equipped with a one-way valve that permits the escape of gases, but otherwise seals the enclosure to prevent the ingress of air during welding and heat treatment as a result of thermal gradients induced when the article is inductively heated. To provide access to the article and a device used to weld the article, the enclosure is equipped with gloves by which the welding device and the article can be manipulated while a nonreactive atmosphere is fully maintained within the enclosure and the article is inductively heating.

Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a silicon plate (60) which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: A process is provided for manufacturing a sensor arrangement for temperature measurement with a temperature-sensitive measuring resistance which has a thin, metal resistance layer electrically insulated toward the outside, and exposed contact surfaces on a ceramic substrate. The contact surfaces are connected electrically conducting and directly mechanically fast with high temperature-resistant conductor paths electrically insulated from one another on a ceramic carrier element. The measuring resistance is bonded and attached by application to and subsequent firing on a carrier element prepared prior to outfitting. A platinum-containing thick film conducting paste serves as a means for attachment and bonding. Contact surfaces for connecting a plug or cable are arranged at the end of the carrier element facing away from the measuring resistance.

Abstract: A method and apparatus for the temperature regulation of components such as semiconductor circuits, printed circuit boards and the like. The components are conveyed on carriers through an inlet slot into a temperature regulating housing provided with temperature regulating members and are convey out through an outlet slot opposite the inlet slot. In the housing, the carriers are loaded on a magazine provided with adjacently arranged holders. After the first holder is loaded in the starting position, the magazine is displaced progressively in one direction into successive positions in which the remaining holders of the magazine are loaded one after the other. Once all the holders are loaded, the magazine is filled and in an end position. Thereupon the magazine is displaced back to its starting position in a fast reverse run in the opposite direction.

Abstract: A method of manufacturing a clad product in which a metallic substrate material is extruded and a cladding material is then brought into intimate contact with the heated extrudate before the extrudate has had an opportunity to cool to room temperature. The cladding material is compressed against the heated extrudate, thereby bonding the cladding material to the substrate material and forming the clad extruded metallic product. The clad extruded metallic product is then cooled to room temperature.