Abstract: In order to restrict a local concentration of an electric field in a conductor layer end portion of an insulating circuit board and increase a partial electric discharge starting voltage, thereby improving an insulating reliability of the insulating circuit board and a power semiconductor apparatus employing the same, the present invention provides a method of manufacturing a insulating circuit board comprising the step of applying a voltage between the circuit patterns of the insulating circuit board in an atmospheric or depressurized gas so as to allow the circuit board to discharge electricity, or irradiating a laser beam, thereby a projection shape of the end portion of the electrode conductor is melted and smoothened so as to restrict the concentration of the electric field.

Abstract: A stroke and pressure adjusting device is used for the soldering process of a soldering machine which has a driving device for driving a soldering device of the soldering machine to solder, and the driving device has a driving shaft on which the stroke and pressure adjusting device is attached. The stroke and pressure adjusting device comprises a thread sleeve mounted on the driving shaft of the driving device, a slider mounted on the thread sleeve, and a spring mounted between the slider and the driving device, wherein the distance between the thread sleeve and the driving device is adjustable so as to adjust the stroke of the driving device, the distance between the slider and the driving device is adjustable and the distance between the slider and the driving device is adjustable so as to adjust the elastic force generated by the spring, thereby adjusting the operating pressure of the driving device.

Abstract: A brazing composition for aluminum materials capable of functioning as a flux and a brazing material with a single component and providing a solid brazed joint exhibiting little local fusion. The brazing composition for aluminum materials which has the function of removing the oxide film on the surface of the aluminum material to be joined at a temperature lower than the melting point of the aluminum material and forming a eutectic aluminum alloy braze which fuses at such a low temperature by reaction with the aluminum materials, wherein the brazing composition comprises a first powder comprising at least one or more M—Si—F compounds comprising, in addition to at least Si and F, hydrogen or an alkaline metal or hydrates thereof or comprises this first powder as an component.

Abstract: An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

Abstract: Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

Abstract: Planishing or stress relief in a welded joint (34) is accomplished with a hammer (12) and a backing bar (26). The hammer is applied on a first side (1) to a first surface (31) of the structure (30). To indicate the proper position of the backing bar, a first magnet (20; 320) is associated with the hammer, and a magnetic sensor arrangement (24; 224; 300) is located on the other side (2) of the structure. In one embodiment, the sensor arrangement is a second magnet (24) which is held in place by the magnetic field (40) of the first magnet. In a second embodiment, the sensor includes a line array (262) of individual sensors, each associated with an indicator of a line array (264) of indicators. In a third embodiment, the sensor includes a line array (300) of two magnetic sensors, which are coupled to a differential indicator (324).

Abstract: A method of manufacturing a cooking utensil comprising a round container for the food, the container comprising a base, a plate of heat-conducting material and a cap enclosing the plate. A plate is inserted into the enclosing cap and leaves an annular flow space between it and a preformed collar on the cap. The assembly of the container base, the plate and the cap is centered between the ram and die of a press and intermetallically bonded by single or multiple impulse pressure, so as to form the convex curvature of the cap bottom and to mold the rim of the cap collar around the vessel. During impulse pressure, the plate is pressed by plastic deformation into the flow space, where it is intermetallically bonded to the cap bottom, the cap collar and the corresponding region of the container. Use is made of a plate having a base member which is circular in plan view and has at least three centering projections on its rim, around its circular periphery.

Abstract: A method of attaching a sintered friction material to a steel reinforcing cup. The sintered friction material is loosely placed in the steel reinforcing cup. An electrical induction heater surrounds the reinforcing cup and rapidly raises the temperature of the reinforcing cup to a predetermined temperature. When the predetermined temperature is reached, the reinforcing cup and sintered friction material are immediately moved to a press before the temperature of the bulk of the sintered friction material is significantly changed by thermal conduction of heat from the steel cup to the friction material. A single compressive force is applied to the sintered friction material and the steel reinforcing cup to compact the sintered friction material to a predetermined density and to form a metallurgical bond along the entire interface between the friction material and the reinforcing cup.