Abstract: The present application discloses a semiconductor device. The semiconductor device includes a package structure including a first side and a second side opposite to the first side; an interposer structure positioned over the first side of the package structure; a first die positioned over the interposer structure; a second die positioned over the interposer structure; and a plurality of middle interconnectors positioned between the first side of the package structure and the first die and between the first side of the package structure and the second die. The plurality of middle interconnectors respectively includes a middle exterior layer positioned between the first side of the package structure and the interposer structure, a middle interior layer enclosed by the middle exterior layer, and a cavity enclosed by the interposer structure, the package structure, and the middle interior layer.

Abstract: The present application discloses a semiconductor device. The semiconductor device includes a package structure including a first side and a second side opposite to the first side; an interposer structure positioned over the first side of the package structure; a first die positioned over the interposer structure; a second die positioned over the interposer structure; and a plurality of middle interconnectors positioned between the first side of the package structure and the first die and between the first side of the package structure and the second die. The plurality of middle interconnectors respectively includes a middle exterior layer positioned between the first side of the package structure and the interposer structure, a middle interior layer enclosed by the middle exterior layer, and a cavity enclosed by the interposer structure, the package structure, and the middle interior layer.

Abstract: A method of joining a first piece of an automotive component that is made from a first material to a second piece of the automotive component that is made from a second material includes machining a fay surface onto each of the first and second pieces of the automotive component, cleaning the fay surfaces of each of the first and second pieces of the automotive component, placing a metal filler between the fay surfaces of the first and second pieces of the automotive component, holding the first and second pieces together with the metal filler positioned between the fay surfaces of the first and second pieces, and passing an electric current through the first piece, the metal filler and the second piece to melt the metal filler and weld the first piece to the second piece.

Abstract: A brazing material outer coat and a method for preparing the same, an in-situ synthetic metal-coated flux-cored silver brazing material and a method for preparing the same, a welding method and a joint body, wherein the in-situ synthetic metal-coated flux-cored silver brazing material comprises a flux core and a brazing material outer coat wrapping the flux core, the brazing material outer coat comprises, in percentage by weight: silver Ag 20.0˜36.0%, copper Cu 35.0˜45.0%, zinc Zn 27.0˜37.0%, tin Sn 1.0˜3.0%, phosphorus P 0.1%˜0.5%, nickel Ni 0.5˜2.0%, germanium Ge 0.1˜0.3%, and lithium Li 0.1˜0.3%, the flux core comprises, in percentage by weight: elemental boron micropowder 5.0˜10.0%, sodium borohydride 5.0˜10.0%, potassium fluoroborate 15.0˜30.0%, boric anhydride 25.0˜40.0%, sodium fluoride 10.0˜30.0%, sodium bifluoride 2.0˜4.0%, and copper sulfate 1.0˜5.0%.

Abstract: A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy having a bulk melting point of 420° C. or less; and an activating agent that decomposes and removes the coating material from the surface of the metal fine particles after the low melting point metal powder is melted, wherein a content of the metal fine particles containing the coating material is 0.5 mass % to 50 mass %, and a ratio ([inorganic compound/metal fine particles]×100 (mass %)) of the inorganic compound in the metal fine particles is 0.1 mass % to 50 mass %.

Abstract: According to the present invention, there is provided a wire aiming guide capable of further improving usability. The present invention provides a wire aiming guide (1) configured to guide a welding wire (W) and feed the welding wire from a tip side thereof while being attached to a welding torch including: a first guide member (2) and a second guide member (3) configured to guide the welding wire (W): and a connecting portion (5) rotatably connecting the first guide member (2) and the second guide member (3), wherein a direction of the welding wire (W) fed from a tip end side of the first guide member (2) is adjusted by bending the first guide member (2) with respect to the second guide member (3).

Abstract: A method for metallization during fabrication of an Integrated Circuit (IC). The IC includes a semiconductor wafer having a back surface and a front surface. The method includes etching a via hole through the semiconductor wafer. After this, a seed metal layer is deposited on the back surface of the semiconductor wafer. Thereafter, a photoresist layer is deposited on the back surface of the semiconductor wafer such that the via hole remains uncovered. After depositing the photoresist layer, a metal layer is formed along the walls of the via hole to electrically connect the back surface and the front surface of the semiconductor wafer. Finally, the photoresist layer is removed subsequent to forming the metal layer.

Abstract: A process of welding an article and a welded turbine blade are disclosed. The process includes fusion welding over a primary symmetry line determined from a center of gravity on a first side of the article or blade and fusion welding over the primary symmetry line determined from the center of gravity on a second side of the article or blade. The fusion treating includes multiple fusion treatments.

Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

Abstract: A method of identifying and selecting welding electrodes and welding output parameters on a welding power source is provided. The method includes identifying electrodes and/or electrode packaging with distinct colors and/or patterns which correspond to properties of the electrode. The method also may include employing distinguishable identifying markings on a power supply which correspond to the electrodes to be used to allow for easy setting of output parameters.

Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element (106) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.

Abstract: A brazing alloy is provided in the form of a wire, rod or preform, and is made of, in weight percent: 3-7.5% P, 0.1-1.9% Zn, 0-74.7% Ag, 0-80% Au, 0-10% Sn, 0-5% Ni, 0-3% each of Si, Mn, Li, and Ge, and the balance copper in an amount of at least 21.7%. In additional embodiments, Zn may be present in an amount of 0.6-1.9%. A method of torch brazing is also provided. The method includes forming the alloy into a wire or rod, placing the tip of the wire or rod in contact with a surface of a joint, heating the joint surface using a torch flame, and contacting the tip of the wire or rod to the heated joint surface to melt and flow the alloy onto the joint surface and into the joint under capillary action.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A solder feeder having a housing member with a proximal end and a distal end. A guide member fixed to an interior wall of the housing member and extending through and projecting from the housing member for receiving solder. A trigger, having in combination, a short portion having a plurality of teeth thereon and a long portion. The trigger pivotably attached to the housing member so that the short portion of the trigger extending through an opening in a wall of the housing member in alignment with and cooperating with a slot in a wall of the guide member and the long portion extending externally along a length of the housing member.

Abstract: The invention relates to a method for joining objects made of metal, plastic or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles.

Abstract: A flip chip package and a method of manufacturing the same are provided. The flip chip package include: a package substrate, a semiconductor chip and conductive hollow bumps. The semiconductor chip may be arranged over an upper surface of the package substrate. The conductive hollow bumps may be interposed between the semiconductor chip and the package substrate to electrically connect the semiconductor chip with the package substrate. Thus, a wide gap may be formed between the semiconductor chip and the package substrate by the thick conductive hollow bumps. As a result, a sufficient amount of the molding member may be supplied to each of the conductive hollow bumps to surround each of the conductive hollow bumps.

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract: A tuner structure soldering method for improving voltage difference, comprising the following steps: preparing the tuner structure, wherein the tuner structure comprises a frame and a communication connector with a fitting portion preinstalled on the frame; putting a tin ring around the fitting portion; melting the tin ring; permeating the melted tin ring into the gap between the through hole on the frame and the fitting portion of communication connector.

Abstract: An apparatus for applying a helical cladding bead to the interior surface of a pipe elbow has a rotor mounted to an elbow carriage so as to be rotatable about a primary axis. The elbow carriage is longitudinally movable parallel to the rotor's rotational axis. A radially-movable elbow collar is mounted to the rotor, and has means for mounting a first end of a pipe elbow. The second end of the elbow passes through a stationary frame with centering means for keeping the elbow's curved centerline tangential to the primary axis. A weld arm, extending from a weld arm carriage into the second end of the elbow, is sinuously configured so that it will not interfere with the elbow. The weld arm is rotatable about the primary axis in coordination with the rotor. A weld head is mounted at the extending end of the weld arm so as to remain spatially fixed regardless of rotation of the weld arm.

Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

Abstract: A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively.

Abstract: A component brazed to another, constraining component such as sleeve assembly brazed in a bore of a bit body. The braze joint includes particulate material in the gap between the components.

Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract: A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

Abstract: A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element.

Abstract: A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.

Abstract: A method for welding together two layers or workpieces within a multi-layer assembly in which laser light is directed through an outer layer of the assembly, allowing transmission of the laser light from its outer surface to at least within the vicinity of its inner surface substantially without any absorption of energy from the laser light. The laser light is directed towards a layer having an absorbent component, corresponding to a portion thereof, capable of absorbing laser light within a given wavelength range thereby creating a welded area between a surface of the layer having the absorbent component and a surface of a layer facing the layer having the absorbent component. The absorbent component can be provided either within the bulk of a layer or it can be provided as a separate surface layer on one or both surfaces of a layer.

Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A process of fabricating a stack capacitor includes the following steps. First of all, multiple energy storage units having respective first electrodes and second electrodes at opposite sides are provided. These energy storage units are then stacked to have the first electrodes contact with each other and the second electrodes contact with each other, wherein the energy storage units are initially positioned by a fastening member. Next, the first electrodes are bonded together via a first conductive layer and the second electrodes are bonded together via a second conductive layer, thereby fabricating the stack component.

Abstract: A method of aligning and duplicating alignment includes welding a washer over a larger opening in a hinge once in an aligned position relative to a vehicle door. The door is mounted into an alignment fixture and the hinges are installed over threaded studs extending from the door. The washer is placed onto the threaded stud and tightened against the hinge, covering the larger opening in the hinge. The larger opening in the hinge allows movement of the hinge relative to the door for alignment. The washer defines an opening with a smaller opening sized to provide relatively little clearance for the threaded stud, and thereby maintain alignment between the door and hinge. The washer is permanently attached by a welding operation to allow duplication of door hinge alignment during reassembly.

Abstract: A laser is used to melt portions of first and adjacent workpieces to form a weld. As the laser melts the workpieces, a powdered metal is injected into the molten metal pool. The powdered metal improves the strength of the weld by providing additional weld volume to bridge any preexisting gaps between the workpieces. The molten metal is then cooled to form a weld between the workpieces. For welding galvanized steel or metals with coatings or alloy materials having a lower vaporizing temperature, a powdered metal is used that reacts with the lower temperature metal to form an alloy that avoids vaporization during welding, thereby reducing weld porosity and weld spatter.

Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: A microjoint interconnect structure comprising a dense array of metallic studs of precisely controllable height tipped with a joining metallurgy. The array is produced on a device chip that is to be attached to a carrier, or to a carrier along with other devices, some of which may be selected to have similar interconnect structures so as to form all together an assembled carrier that functions as a complete computing, communications or networking system.

Abstract: System, apparatus, and method for making composite articles. Jewelry items such as finger rings, bracelets, earrings, body jewelry, and the like, are examples of such articles. Medical, dental, and industrial devices or components are other examples. Method of manufacturing an article including a substrate comprising a first material and an inlay comprising a second material includes the steps of preheating the substrate; contacting a depression in a surface of the substrate with the second material; heating the second material at a point contact with the substrate causing it to liquify and flow into the depression; and moving the point of contact along the along the depression in the surface of the substrate while continuously feeding the second material and heating the second material at the point contact with the substrate to cause it to substantially fill the depression.

Abstract: Dispensing apparatus is provided for dispensing items. The dispensing apparatus includes a dispensing outlet and an item holder having item holding areas and being movably disposed to position the item holding areas one at a time in sequence over the dispensing outlet so that when one of the item holding areas is positioned over the dispensing outlet, the other item holding areas are not disposed over the dispensing outlet. The dispensing apparatus further includes a blocker disposed over the item holder opposite the dispensing outlet, the blocker blocking access to the dispensing outlet from directly above the item holder when the item holder positions one of the item holding areas over the dispensing outlet.

Abstract: Apparatus for directing and feeding wire (W) such as for a welder includes first and second, generally planar, guide plates (108) which are slid in a direction parallel to the movement path of the wire (W) into a slit (74) of a mount (68) and a slot (64) of an adapter element (44). A driven roll (20) penetrates an opening (112) in the first guide plate (108). A pressure roll (82) is pivotably mounted to mount (68) between a drive position where it penetrates an opening (112) in the second guide plate (108) and sandwiches wire (W) against the driven roll (20) and a disengaged position. The pressure roll (82) is removably held in the drive position by abutment of a washer (104) with the bracket (84) to which pressure roll (82) is rotatably mounted. The washer (104) is slideable upon a shaft (98) and biased toward the bracket (84) by a spring (106), with the shaft (98) being pivotably mounted to a connecting block (24) between a latched and unlatched position.

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract: A method of diffusion brazing parts made of a superalloy A uses a single-component brazing powder prepared by measuring a quantity of a superalloy powder having a composition identical to the superalloy A and a quantity of a boron and/or silicon flux powder in a proportion of between 0.1% and 40% by weight of the superalloy powder, mixing the powders and placing them with balls made of superalloy A in a container also made of superalloy A, closing the container and keeping its contents in a controlled atmosphere, placing the container in a grinder and operating the grinder to keep the container moving for a period ranging from 30 seconds to 500 hours in order to encrust the flux onto the surface of the grains of the superalloy powder.

Abstract: A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is elimina

Abstract: An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.

Abstract: A punching pin of a soldering apparatus cuts out a solder piece from a solder plate onto a feeder pin, and the feeder pin presses the solder piece against a predetermined junction of a conductive wiring pattern incorporated in a printed circuit board; then, an electric circuit component is mounted on the printed circuit board, and is strongly soldered to the conductive wiring pattern, because the punching pin and the feeder pin supply a fixed amount of solder to the predetermined junction.

Abstract: A solder dispenser which includes a body portion having a sleeve thereon with a moveable shuttle extending through the sleeve. A solder holder bracket is retained on the moveable shuttle for retaining a spool of solder on the solder dispsenser. A solder gripper is carried on the body for gripping solder upon moving the shuttle to extend a length of solder from the solder spool. The solder gripper acts as a one-way cam which retains the solder as it is being extending from the spool but also allows solder to pass therethrough once it is extended from the spool. A trigger assembly is used to displace the shuttle and thereby extend a length of solder. The trigger assembly allows for dispensing a selected or desired length of solder from the spool.