Brazing Or Soldering Patents (Class 228/262.45)
  • Patent number: 8083121
    Abstract: In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: December 27, 2011
    Assignee: Panasonic Corporation
    Inventors: Tadashi Maeda, Tadahiko Sakai
  • Publication number: 20110101619
    Abstract: A MCrAlY alloy, methods to produce a MCrAlY layer and a honeycomb seal are provided. The MCrAlY alloy includes chromium, aluminum, yttrium and iron and optionally titanium, hafnium or silicon. The honeycomb seal includes a substrate, honeycomb cells and a protective coating on side walls of the honeycomb cells or a diffusion area inside side walls of the honeycomb cells, the protective coating or the diffusion area including the MCrAlY alloy.
    Type: Application
    Filed: January 23, 2009
    Publication date: May 5, 2011
    Inventors: David Fairbourn, Paul Mathew Walker
  • Publication number: 20110020666
    Abstract: In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material.
    Type: Application
    Filed: April 21, 2009
    Publication date: January 27, 2011
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Taisei Wakisaka, Tokuji Okumura, Takanori Suzuki
  • Patent number: 7506793
    Abstract: A process for repairing a turbine component of a turbomachine, as well as a sintered preform used in the process and a high gamma-prime nickel-base superalloy component repaired thereby. The sintered preform contains a sintered mixture of powders of a cobalt-base braze alloy and a cobalt-base wear-resistant alloy. The braze alloy constitutes at least about 10 up to about 35 weight percent of the sintered preform and contains a melting point depressant such as boron. The preform is formed by mixing powders of the braze and wear-resistant alloys to form a powder mixture, and then sintering the powder mixture. To use the preform, a surface portion of the turbine component is removed to expose a subsurface portion, followed by diffusion bonding of the preform to the subsurface portion to form a wear-resistant repair material containing the braze alloy dispersed in a matrix of the wear-resistant alloy.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: March 24, 2009
    Assignee: General Electric Company
    Inventor: Sujith Sathian
  • Patent number: 7442445
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: October 28, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
  • Publication number: 20080222887
    Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.
    Type: Application
    Filed: March 15, 2007
    Publication date: September 18, 2008
    Inventors: John Chow, Huan Chen, Chih-Min Lin
  • Patent number: 7326892
    Abstract: A process for heating a powder material by microwave radiation so that heating of the powder material is selective and sufficient to cause complete melting of the particles. The process entails providing a mass of powder comprising a quantity of filler particles of a metallic composition, and subjecting the mass to microwave radiation so that the filler particles within the mass couple with the microwave radiation and are completely melted. According to one aspect, the mass further contains at least one constituent that is more highly susceptible to microwave radiation than the filler particles, and the filler particles are melted as a result of heating by microwave radiation and thermal contact with the at least one constituent. According to another aspect, the powder mass is thermally pretreated to induce an irreversible increase in its dielectric loss factor prior to melting by microwave irradiation.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: February 5, 2008
    Assignee: General Electric Company
    Inventors: Laurent Cretegny, David Edwin Budinger, Vasile Bogdan Neculaes, Holly Sue Shulman, Morgana Lynn Fall, Shawn Michael Allan
  • Patent number: 7261784
    Abstract: The method of the invention enables a coating to be made on at least one face to be protected of a metal substrate and/or article in order to improve its performance in terms of resistance to wear by friction, in particular at high temperature. The method comprises the following steps: providing a flexible sheet derived from at least one plate obtained by the technique of casting a strip by silkscreen printing from a viscous material made of a binder and a metal powder of a superalloy; cutting said flexible sheet to the dimensions of said face to be protected of a metal substrate and/or article in order to constitute a preform; placing said preform on said face to be protected of a metal substrate and/or article; and raising the assembly to a temperature enabling a coating to be formed by establishing a bond between said preform and said face to be protected.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: August 28, 2007
    Assignee: Snecma Moteurs
    Inventor: Claude Mons
  • Publication number: 20020185524
    Abstract: An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element.
    Type: Application
    Filed: May 30, 2001
    Publication date: December 12, 2002
    Applicant: Gerneral Electric Company with cover sheet
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay