Abstract: Apparatus for making a spiral muffler includes a mandrel for spirally winding a metal strip while maintaining a predetermined spaced relationship between the wound portions, with the strip being welded to a pair of side plates as it is wound.

Abstract: A magnetic seam tracking device designed to orientate the feed or forward motion of a soldering tool along the edges of metal sheets disposed head against head and to be submitted to the soldering operaion. The device comprises a carriage or truck B capable of retaining the soldering tool A, said carriage or truck being provided with track-chains (30), the articulated elements whereof have permanent magnets (40-42) which co-operate with metal sheets (D1) and (D2) to be soldered.

Abstract: A welding machine holds a plurality of metal objects in abutting engagement, moves those abutting metal objects relative to a welding torch, and provides an angular disposition of that welding torch relative to the junction between the abutting portions of those abutting metal objects which foster the formation of a smooth and uniform weld at that junction. The welding torch is mounted on a support which can move as the abutting metal objects are moved relative to the welding torch; and that support can be moved to cause that welding torch to closely "track" the junction between the abutting portions of those abutting metal objects, and also to provide whatever angular disposition of that welding torch relative to that junction which is needed to foster the formation of a smooth and uniform weld at that junction.

Abstract: Apparatus for controlling the operation of a pivoted member. A pivoted arm such as provided in an apparatus for bonding leads in electronic components is controlled by means of a torque motor during bonding and non-bonding intervals to provide control of forces exerted by the pivoted member during the bonding interval and forces exerted on the pivoted member during non-bonding intervals. Motion cams to complement the operation of the torque motor may also be utilized.

Abstract: An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.