With Means To Cool Work Or Product Patents (Class 228/46)
  • Patent number: 10144983
    Abstract: A method of reheating a rail weld zone after rails were welded, a distance C between a reheating region P of a rail web portion 2 and a welding center Q is set to more than or equal to 0.2 times and less than or equal to three times a HAZ length Lh of the rail weld zone. A length B of the reheating region P may be more than or equal to 0.5 times and less than or equal to five times the HAZ length Lh of the rail weld zone. A height A of the reheating region P may be more than or equal to 0.2 times a height Hw of the rail web portion 2. A temperature Th reached in a reheating process at a center of the reheating region P may be higher than or equal to 400° C. and lower than or equal to 750° C.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: December 4, 2018
    Assignee: NIPPON STEEL AND SUMITOMO METAL CORPORATION
    Inventors: Kenichi Karimine, Masaharu Ueda, Katsuya Iwano, Hideo Tottori, Takeshi Yamamoto
  • Patent number: 9308852
    Abstract: A trailer and method of manufacturing a trailer are provided. The trailer has a storage vessel which may include hoppers and which is partially formed from a plurality of top wall segments having peaks. The peaks or other components may be angled relative to one another to provide improved aerodynamics. A jig is provided to facilitate the manufacturing process.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: April 12, 2016
    Assignee: MAC TRAILER MANUFACTURING, INC.
    Inventors: Scott A. Kibler, Denis Gosselin
  • Patent number: 9036354
    Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: May 19, 2015
    Assignee: Flextronics, AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi
  • Patent number: 9027823
    Abstract: A workpiece arrangement includes at least two join regions of at least one workpiece that are joined together by a material-to-material connection seam. The material-to-material connection seam covers only a portion of a first of the at least two join regions. A thermal insulation device is disposed in an area of the material-to-material connection seam and corresponds to the first of the at least two join regions.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: May 12, 2015
    Assignee: GSI Helmholtzzentrum fuer Schwerionenforschung GmbH
    Inventors: Tobias Engert, Ivan Kojouharov, Juergen Gerl
  • Publication number: 20150090768
    Abstract: An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.
    Type: Application
    Filed: April 24, 2013
    Publication date: April 2, 2015
    Inventors: Masami Kuroda, Jun Matsuda, Takayuki Suzuki
  • Publication number: 20150076214
    Abstract: A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.
    Type: Application
    Filed: February 28, 2012
    Publication date: March 19, 2015
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Seigo Kodama, Noriaki Iwaki, Shuichi Hirata, Masato Suzuki
  • Patent number: 8967450
    Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: March 3, 2015
    Assignee: Air Liquide Industrial U.S. LP
    Inventor: Tharron Scott Laymon
  • Patent number: 8864011
    Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: October 21, 2014
    Assignee: Ayumi Industry Co., Ltd.
    Inventor: Hideyuki Abe
  • Publication number: 20140131422
    Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.
    Type: Application
    Filed: January 21, 2014
    Publication date: May 15, 2014
    Applicant: Air Liquide Industrial U.S. LP
    Inventor: Tharron Scott LAYMON
  • Patent number: 8714432
    Abstract: An apparatus (10) for the production of brazed aluminum products on a continuous flow basis includes, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15,16) and a transportation element (25) for conveying (26) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying (26) and return (27) runs within the tunnel furnace.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: May 6, 2014
    Assignee: AFC-Holcroft
    Inventor: Malcolm Roger McQuirk
  • Publication number: 20140034716
    Abstract: A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 6, 2014
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi, Mario Lopez Ruiz
  • Patent number: 8501545
    Abstract: In a reflow process for connecting a semiconductor die and a package substrate, the temperature gradient and thus the thermally induced mechanical forces in a sensitive metallization system of the semiconductor die may be reduced during the cooling phase. To this end, one or more heating intervals may be introduced into the cooling phase, thereby efficiently reducing the temperature difference. In other cases, the central region may additionally be cooled by providing appropriate locally restricted mechanisms, such as a locally restricted gas flow and the like. Consequently, desired short overall process times may be obtain without contributing to increased yield losses when processing sophisticated metallization systems on the basis of a lead-free contact regime.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: August 6, 2013
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Michael Grillberger, Matthias Lehr, Rainer Giedigkeit
  • Publication number: 20130181037
    Abstract: A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 18, 2013
    Applicant: SHINKAWA LTD.
    Inventor: SHINKAWA LTD.
  • Patent number: 8459527
    Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: June 11, 2013
    Assignee: Indutech Canada LP
    Inventor: Derek J. Wolstenholme
  • Patent number: 8459528
    Abstract: The assembly is intended for application to manufacturing of tubes, bottles, boxes. Characterized by improved quality of the weld and low reject percentage. It has a mandrel (1), on which there is a head (3) and a tube body (2), put over in a typical manner, as well as a cooling element, coaxial with the mandrel (1), and a nozzle D, coaxial with the mandrel. Said nozzle contains two parts—internal 7 and external (8)—which form channel (9) for feeding heating gas HG. The assembly consists of only one work station. The cooling element is also forming element OFE and consists of cooling metal ring 4, located in forming metal ring (6). There is heat-insulating ring (5) between the latter and the cooling metal ring (4). In the position of heating, said heat-insulating ring (5) is positioned around the end of the tube body (2). The heat-insulating ring (5) is of solid-state material or gas of low thermal conduction.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: June 11, 2013
    Inventor: Miroslav Ivanov Hinkov
  • Publication number: 20130119112
    Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 16, 2013
    Applicant: DENSO CORPORATION
    Inventor: DENSO CORPORATION
  • Patent number: 8381962
    Abstract: A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: February 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah, Kazushige Toriyama
  • Patent number: 8353443
    Abstract: A device for cooling a rail weld zone according to the invention includes a first cooler cooling a head portion of the rail weld zone, a second cooler cooling a rail web portion of the rail weld zone, and a control section controlling the first and second coolers. The first cooler includes a first temperature detecting section that detects the temperature of the head portion, and a first ejection section that ejects a first cooling fluid to the head portion. The second cooler includes a second temperature detecting section that detects the temperature of the rail web portion, and a second ejection section that ejects a second cooling fluid to the rail web portion. The control section individually changes the kinds, the flow rates, and the flow velocities of the first and second cooling fluids while cooling the head portion and the rail web portion.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: January 15, 2013
    Assignee: Nippon Steel Corporation
    Inventors: Seiji Sugiyama, Mitsugu Kajiwara, Kenichi Karimine
  • Patent number: 8328076
    Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: December 11, 2012
    Assignee: Indutech Canada Ltd.
    Inventor: Derek J. Wolstenholme
  • Patent number: 8286853
    Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: October 16, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Naoki Akiyama, Masahiko Sugiyama, Michikazu Nakamura
  • Publication number: 20120248598
    Abstract: An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (?m) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 ?m and 125 ?m.
    Type: Application
    Filed: March 19, 2012
    Publication date: October 4, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Kuniaki Sueoka
  • Patent number: 8274161
    Abstract: A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a loading station and ending up at an unloading station after various melting and vacuuming of chip/substrate components has been stepwise indexed through those various chambers to the final joining thereof.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: September 25, 2012
    Assignee: SemiGear Inc
    Inventors: Jian Zhang, Chunghsin Lee
  • Patent number: 8252678
    Abstract: A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers.
    Type: Grant
    Filed: December 31, 2010
    Date of Patent: August 28, 2012
    Assignee: SemiGear, Inc
    Inventor: Jian Zhang
  • Patent number: 8210417
    Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: July 3, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Naoki Akiyama, Masahiko Sugiyama, Hajime Furuya
  • Publication number: 20120088362
    Abstract: A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.
    Type: Application
    Filed: October 8, 2010
    Publication date: April 12, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Cheng-Chung Lin, Ying-Jui Huang, Chung-Shi Liu
  • Publication number: 20120061452
    Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 15, 2012
    Inventor: Derek J. Wolstenholme
  • Publication number: 20110244632
    Abstract: In a reflow process for connecting a semiconductor die and a package substrate, the temperature gradient and thus the thermally induced mechanical forces in a sensitive metallization system of the semiconductor die may be reduced during the cooling phase. To this end, one or more heating intervals may be introduced into the cooling phase, thereby efficiently reducing the temperature difference. In other cases, the central region may additionally be cooled by providing appropriate locally restricted mechanisms, such as a locally restricted gas flow and the like. Consequently, desired short overall process times may be obtain without contributing to increased yield losses when processing sophisticated metallization systems on the basis of a lead-free contact regime.
    Type: Application
    Filed: December 8, 2010
    Publication date: October 6, 2011
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Michael Grillberger, Matthias Lehr, Rainer Giedigkeit
  • Patent number: 8011563
    Abstract: A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: September 6, 2011
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Evan G. Colgan, Peter A. Gruber, Gareth G. Hougham, John P. Karidis
  • Publication number: 20110198388
    Abstract: A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers,
    Type: Application
    Filed: December 31, 2010
    Publication date: August 18, 2011
    Applicant: Semigear Inc
    Inventor: Jian Zhang
  • Publication number: 20110127311
    Abstract: A system and method for friction stir welding of small diameter tubing, wherein the small diameter tubing is held in a correct position with a grasp sufficient to perform FSW when the tubing is comprised of high melting temperature materials, wherein the small diameter tubing can be rotated by the positioning and holding system while a FSW tool is held stationary, or vice versa, wherein internal mandrels are also described which can fit inside the smaller dimensions of the small diameter tubing and expand to provide a counter force to prevent deformation of the tubing when forces are applied by the FSW tool, wherein new FSW tool geometries are also described which enable the FSW tool to direct more heat on a tool/workpiece interface to counteract a lack of contact between the FSW shoulder and the workpiece because of tube curvature, and wherein the FSW tool is positioned on a small diameter tube by trailing the joint to provide desirable heating at the joint/workpiece interface and surface finishing.
    Type: Application
    Filed: November 2, 2010
    Publication date: June 2, 2011
    Inventors: Jeremy Peterson, John Hall, Russell J. Steel, Jonathan Babb, Matt Collier, Scott M. Packer
  • Publication number: 20110049220
    Abstract: The assembly is intended for application to manufacturing of tubes, bottles, boxes. Characterized by improved quality of the weld and low reject percentage. It has a mandrel (1), on which there is a head (3) and a tube body (2), put over in a typical manner, as well as a cooling element, coaxial with the mandrel (1), and a nozzle D, coaxial with the mandrel. Said nozzle contains two parts—internal 7 and external (8)—which form channel (9) for feeding heating gas HG. The assembly consists of only one work station. The cooling element is also forming element OFE and consists of cooling metal ring 4, located in forming metal ring (6). There is heat-insulating ring (5) between the latter and the cooling metal ring (4). In the position of heating, said heat-insulating ring (5) is positioned around the end of the tube body (2). The heat-insulating ring (5) is of solid-state material or gas of low thermal conduction.
    Type: Application
    Filed: April 24, 2009
    Publication date: March 3, 2011
    Inventor: Miroslav Ivanov Hinkov
  • Patent number: 7878386
    Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: February 1, 2011
    Assignee: Pink GmbH Thermosysteme
    Inventor: Stefan Weber
  • Patent number: 7766211
    Abstract: A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.
    Type: Grant
    Filed: May 1, 2008
    Date of Patent: August 3, 2010
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Ka Shing Kenny Kwan, Gang Ou, Yong Wang, Man Chan
  • Publication number: 20100170934
    Abstract: Residual tensile stresses can be mitigated through methods and systems provided by the present invention. Such a method can include securing a metal member (10) to a substrate and at least partially surrounding a portion of the metal member (10) with a cooling fluid (18). As a result, the cooled portion of the metal member (10) contracts a predetermined amount. Once cooled, the metal member may be fixed, preferably welded, to another metal member in a constrained relationship. As the portion of the metal member is returned to its original temperature, expansion of the metal member acts to mitigate residual tensile stresses in the metal assembly. Tensile stress in restrained members, cambering, and structural deformation can be readily controlled in an assembled structure.
    Type: Application
    Filed: March 19, 2010
    Publication date: July 8, 2010
    Inventors: William A. Komlos, Lawrence D. Reaveley
  • Patent number: 7708183
    Abstract: A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: May 4, 2010
    Assignee: Illinois Tool Works Inc.
    Inventor: Jonathan M. Dautenhahn
  • Publication number: 20100001040
    Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.
    Type: Application
    Filed: September 16, 2009
    Publication date: January 7, 2010
    Applicant: Wen-Chih Liao
    Inventor: Wen-Chih LIAO
  • Patent number: 7581961
    Abstract: Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: September 1, 2009
    Assignee: Fujikura Ltd.
    Inventors: Tomonari Ohtsuki, Katsuya Yamagami
  • Publication number: 20090173771
    Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).
    Type: Application
    Filed: April 27, 2007
    Publication date: July 9, 2009
    Inventor: Stefan Weber
  • Publication number: 20090166397
    Abstract: A BGA package module desoldering apparatus for detaching a chip module from a circuit board is disclosed to include a heat source for heating the chip module, and radiators each having a tank and a refrigerant received in the tank for attaching to the circuit devices of the circuit board around the chip module to be detached to shield the circuit devices against the heat energy from the heat source and to lower the temperature of the circuit devices during heating of the chip module by the heat source.
    Type: Application
    Filed: October 23, 2008
    Publication date: July 2, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventor: Liang MENG
  • Publication number: 20090159648
    Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.
    Type: Application
    Filed: March 3, 2009
    Publication date: June 25, 2009
    Inventor: Wen-Chih LIAO
  • Publication number: 20090020593
    Abstract: In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.
    Type: Application
    Filed: January 12, 2007
    Publication date: January 22, 2009
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Kazuo Kinoshita, Katsuitsu Nishida
  • Publication number: 20080237300
    Abstract: A method and apparatus for soldering interconnectors to photovoltaic cells that, after soldering, prevents bending of the photovoltaic cells due to heat warping caused by heat contraction of the lead wires. The interconnectors are positioned at predetermined positions on the photovoltaic cell, the interconnectors and the photovoltaic cells are held tightly together, and the solder is melted as the photovoltaic cells are heated, after which the photovoltaic cells are sequentially cooled in the long direction of the interconnectors with cold blasts from the end of the photovoltaic cells in the long direction of the interconnector.
    Type: Application
    Filed: March 3, 2008
    Publication date: October 2, 2008
    Inventors: Manabu Katayama, Hikaru Ichimura
  • Publication number: 20080179378
    Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 31, 2008
    Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
  • Patent number: 7392925
    Abstract: A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling apparatus of each tweezer member includes a pair of heat dissipating tubes that travel in an associated tweezer member, with distal ends thereof in fluid communication with an associated soldering head, and with a proximal end of one thereof fluidly communicating with a fluid source. A crossover tube fluidly communicates the proximal end of one tube of one tweezer member with the proximal end of one tube of the other tweezer member.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: July 1, 2008
    Inventor: Richard N. Arnoth
  • Publication number: 20080061116
    Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.
    Type: Application
    Filed: October 29, 2004
    Publication date: March 13, 2008
    Applicant: REHM ANLAGENBAU GmbH
    Inventor: Hans Bell
  • Patent number: 7156279
    Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: January 2, 2007
    Assignee: Visteon Global Technologie, Inc.
    Inventors: Lakhi N. Goenke, Charles Frederick Schweitzer, Jason Bullock, legal representative, Shona Bullock, legal representative, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Lawrence Lernel Bullock, deceased
  • Patent number: 7150387
    Abstract: An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Atsushi Yamaguchi, Masato Hirano, Yoshinori Sakai
  • Patent number: 7014092
    Abstract: The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer because of the cooling is removed through direct contact with a post-forming bumps heating device, or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: March 21, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama
  • Patent number: 6910614
    Abstract: A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for closing an end of the cylindrical wall. A workpiece handling system is mounted on the pressure vessel door for supporting a metallic workpiece to be heat treated or brazed. The workpiece handling system includes apparatus for rotating the workpiece during a processing cycle. A vacuum system is connectable to the workpiece for creating a subatmospheric pressure inside the workpiece during a brazing cycle.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: June 28, 2005
    Assignee: IPSEN International, Inc.
    Inventors: Wayne Mitten, Leonard Ohrin, William McVeigh
  • Patent number: 6827249
    Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: December 7, 2004
    Assignee: Newport Corporation
    Inventors: R. Scott Enochs, Travis Ernst