Solder Form Patents (Class 228/56.3)
  • Patent number: 12021343
    Abstract: A method for joining a cable to a connector includes: providing an electrically conductive fusible conductor joining material which has a lower melting point than that of at least one inner conductor of the cable and/or at least one contact of the connector; bringing an end of the connector to an end of the cable such that at least one inner conductor of the cable and at least one contact of the connector are opposite one another and the fusible conductor joining material is present in between; and heating the cable and/or the connector from the outside such that the heat penetrates into an interior of the at least one heated cable or the connector so the fusible conductor joining material melts and electrically connects the at least one inner conductor of the cable and the contact of the connector to one another.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: June 25, 2024
    Assignee: Schott AG
    Inventor: Oliver Wolfgang Fritz
  • Patent number: 11951556
    Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 9, 2024
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Patent number: 11945052
    Abstract: The present invention provides a brazing material application method that can stably discharge a brazing material containing a fluoride-based flux over a long period of time. The brazing material application method of the present invention includes: a supply step of supplying a liquid brazing material containing a fluoride-based flux to a liquid chamber of a discharge apparatus that is configured to have the liquid chamber having a discharge channel, a plunger disposed in the liquid chamber movably forward and backward, and a drive device for moving the plunger forward and backward and to satisfy a predetermined relationship; and an application step of discharging the brazing material in the liquid chamber from the discharge channel by moving the plunger toward the discharge channel of the liquid chamber by the drive device, and applying the brazing material to a metal member.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: April 2, 2024
    Assignee: HARIMA CHEMICALS, INC.
    Inventors: Aoi Tazuru, Satoshi Moriya, Daigo Kiga, Tomoaki Akazawa
  • Patent number: 11932924
    Abstract: Provided herein are new aluminum alloy products and methods of making these alloys. The aluminum alloy products are age-hardenable, display high strength and formability, and allow for the use of recycled scrap. The aluminum alloys can serve as the core in a clad aluminum alloy product. The alloy products can be used in a variety of applications, including automotive, transportation, and electronics applications.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: March 19, 2024
    Assignee: NOVELIS, INC.
    Inventors: Aurèle Mariaux, Aude Celine Despois, Milan Felberbaum, Guillaume Florey
  • Patent number: 11923331
    Abstract: In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: March 5, 2024
    Inventors: Wei-Jhih Mao, Kuei-Sung Chang, Shang-Ying Tsai
  • Patent number: 11879476
    Abstract: A closed impeller includes an impeller body including a plurality of blade portions, and a shroud fitted on the impeller body. The shroud is press formed into a curved shape along end portions of the blade portions. The shroud includes a plurality of protrusions protruding from a surface facing the impeller body and extending, and curved, along the end portions of the plurality of blade portions. An amount of protrusion of each of the protrusions is less than a thickness of the shroud. A brazing material is provided at least on end portions of the protrusions.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: January 23, 2024
    Assignee: Daikin Industries, Ltd.
    Inventor: Tadashi Okada
  • Patent number: 11832386
    Abstract: A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventor: Deeder M. Aurongzeb
  • Patent number: 11824318
    Abstract: A busbar for electrically contacting an electrical conductor has two mutually opposing side walls and a bearing wall for the electrical conductor. The bearing wall extends between the side walls and transversely or substantially transversely to same, wherein the side walls and the bearing wall extend in an insertion direction and define a receiving space for receiving the electrical conductor. At least one electrically conductive projection is provided on one of the side walls and/or the bearing wall. The width of the projection is less than the width of the bearing wall.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: November 21, 2023
    Assignee: Weidmüller Interface GmbH & Co. KG
    Inventors: Andreas Rutz, Frank Hackemack, Karlo Stjepanovic, Jürgen Ziemke, Stefan Fischer, Marco Waldhoff, Jörg Münstermann
  • Patent number: 11798919
    Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: October 24, 2023
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Hsuanwei Mai, Zhanfeng Cao, Ke Wang, Haixu Li, Zhiwei Liang, Zhijun Lv
  • Patent number: 11791232
    Abstract: A packaging structure includes: a substrate provided with a through-cavity penetrating up and down, and a metal heat sink on a front surface of the substrate; a bonding chip mounting area and a first passive element mounting area on the front surface, and a flip chip mounting area, a second passive element mounting area and a pin lead mounting area are provided on a back surface of the substrate; a first sealing ring located at the periphery of the bonding chip mounting area and the first passive element mounting area; a first cover plate packaged on the first sealing ring; a second sealing ring located at the periphery of the flip chip mounting area and the second passive element mounting area with the pin lead mounting area being located at the periphery of the second sealing ring; and a second cover plate packaged on the second sealing ring.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: October 17, 2023
    Assignee: The 13th Research Institute of China Electronics Technology Group Corporation
    Inventors: Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang Duan, Dapeng Bi, Congge Lu
  • Patent number: 11772204
    Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: October 3, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shunsuke Koga, Tomoki Sasaki, Yoshie Tachibana, Shunsaku Yoshikawa
  • Patent number: 11638963
    Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: May 2, 2023
    Assignee: DTECH PRECISION INDUSTRIES CO., LTD.
    Inventor: Ting-Jui Wang
  • Patent number: 11614289
    Abstract: An aluminum heat exchanger includes first and second plates with inner and outer surfaces, which are joined by brazing and define at least one fluid flow passage. The first and second plates each comprise a core layer of aluminum or an aluminum alloy having a melting temperature greater than an aluminum brazing temperature. The first plate also includes a first outer clad layer defining the outer surface of the first plate. The first outer clad layer is solderable to a metal layer of an object to be cooled and includes nickel or copper. A second outer clad layer is located between the first outer clad layer and the core layer and is roll bonded to at least the second outer clad layer. A manufacturing method includes brazing first and second plates, where the layers of the first plate are roll bonded and the first plate is optionally formed before brazing.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 28, 2023
    Assignee: DANA CANADA CORPORATION
    Inventors: Doug Vanderwees, Meinrad K. A. Machler
  • Patent number: 11584043
    Abstract: An ultrasonic device comprising a chamber (10) provided with an inlet bore (11), which receives a melted pressurized polymer, an outlet bore (12) and a sonotrode housing bore (13) through which a distal portion (21) of an ultrasonic head (20) is inserted into the chamber, wherein the distal portion is separated from the rest of the ultrasonic head by a first nodal plane (PN1) wherein there is a first surface (S1) in contact with a complementary surface of a ring seal (30) that closes the chamber, and wherein the ultrasonic head includes a second nodal plane (PN2) away from and parallel to the first nodal plane (PN1) coinciding with or adjacent to a second surface (S2) wherein an anchoring device (40) presses the ultrasonic head against the ring seal ensuring a tight closure.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: February 21, 2023
    Assignee: Fundacio Eurecat
    Inventors: German Anibal Perez LLanos, Jose Antonio Marfil Romero, Maria Eugenia Rodriguez Sierra, Maria del Carmen Verge Estefania, Encarnacion Escudero Martinez, Francisco Javier Planta Torralba
  • Patent number: 11559837
    Abstract: A powder production method includes providing an elongated workpiece and repeatedly contacting an outer surface of the elongated workpiece with a reciprocating cutter according to a predetermined at least one frequency to produce a powder. The powder includes a plurality of particles, wherein at least 95% of the produced particles have a diameter or maximum dimension ranging from about 10 ?m to about 200 ?m. A system for producing powders having a plurality of particles including a cutter and at least one controller is also provided herein.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: January 24, 2023
    Assignee: Metal Powder Works, LLC
    Inventors: John E. Barnes, Christopher B. Aldridge
  • Patent number: 11549323
    Abstract: The present disclosure provides methods for bonding a first downhole tool to a borehole tubular, which include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The methods may also include rupturing the shells of the solder particles to release the liquid metal cores. The methods may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: January 10, 2023
    Assignee: Halliburton Energy Services, Inc.
    Inventors: William Cecil Pearl, Jr., Sam Lewis, Lonnie Helms, Frank Acosta
  • Patent number: 11545800
    Abstract: A method for joining a first cable to a second cable that each include at least one electrically conductive inner conductor, an outer sheath which at least partially surrounds the at least one inner conductor, and an insulation material which is arranged at least partially between the at least one inner conductor and the outer sheath. The method includes: bringing an end of each cable together such that at least one inner conductor of the cables are opposite one another and a fusible conductor joining material having a lower melting point than the at least one inner conductor is present in between; and heating at least one of the cables from the outside such that the heat penetrates into an interior of the at least one heated cable so the fusible conductor joining material melts and electrically connects the at least one inner conductor of the cables to one another.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: January 3, 2023
    Assignee: Schott AG
    Inventor: Oliver Wolfgang Fritz
  • Patent number: 11515287
    Abstract: The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: November 29, 2022
    Assignee: LASERSSEL CO., LTD.
    Inventors: Byung Rock Kim, Wan Ki Cho, Jae Joon Choi
  • Patent number: 11408690
    Abstract: A method for producing an aluminum alloy clad material having a core material and a sacrificial anode material clad on at least one surface of the core material, wherein the core material comprises an aluminum alloy comprising 0.050 to 1.5 mass % (referred to as “%” below) Si, 0.050 to 2.0% Fe and 0.50 to 2.00% Mn; the sacrificial anode material includes an aluminum alloy containing 0.50 to 8.00% Zn, 0.05 to 1.50% Si and 0.050 to 2.00% Fe; the grain size of the sacrificial anode material is 60 ?m or more; and a ratio R1/R2 is 0.30 or less, wherein R1 (?m) is a grain size in a thickness direction and R2 (?m) is a grain size in a rolling direction in a cross section of the core material along the rolling direction; a production method thereof; and a heat exchanger using the clad.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 9, 2022
    Assignee: UACJ CORPORATION
    Inventors: Makoto Ando, Atsushi Fukumoto, Akio Niikura
  • Patent number: 11272645
    Abstract: An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: March 8, 2022
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 10903186
    Abstract: An assembly that includes a first substrate, a second substrate, and a pair of bonding layers disposed between and bonded to the first and second substrates. The assembly further includes a solder layer disposed between the pair of bonding layers such that the solder layer is isolated from contacting the first substrate and the second substrate. The solder layer has a low melting temperature relative to a high melting temperature of the bonding layers. A coating is disposed over at least the pair of bonding layers and the solder layer such that the coating encapsulates the solder layer between the pair of bonding layers. The solder layer melts into a liquid form when the assembly operates at a temperature above the low melting temperature of the solder layer and the coating maintains the liquid form of the solder layer between the pair of bonding layers.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: January 26, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Naoya Take
  • Patent number: 10751840
    Abstract: A multilayer composite bonding material with a plurality of thermal stress compensation layers is provided. The plurality of thermal stress compensation layers include a metal core layer, a pair of particle layers extending across the metal core layer such that the metal core layer is sandwiched between the pair of particle layers, and a pair of metal outer layers extending across the pair of particle layers such that the pair of particle layers are sandwiched between the pair of metal outer layers. A pair of low melting point (LMP) bonding layers extend across the pair of metal outer layers. The metal core layer, the pair of particle layers, and the pair of metal outer layers each have a melting point above a transient liquid phase (TLP) sintering temperature, and the pair of LMP bonding layers each have a melting point below the TLP sintering temperature.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 25, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan M. Dede
  • Patent number: 10636722
    Abstract: A reliability cover that is disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package is disclosed. The integrated circuit package is mountable to a printed circuit board via a plurality of solder balls. The reliability cover is configured to reduce a difference in a coefficient of thermal expansion between the integrated circuit package and the printed circuit board, and between the Si die and a substrate of the integrated circuit package by a threshold value.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: April 28, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill, Weng-Hong Teh
  • Patent number: 10381223
    Abstract: A multilayer composite bonding material for transient liquid phase bonding a semiconductor device to a metal substrate includes thermal stress compensation layers sandwiched between a pair of bonding layers. The thermal stress compensation layers may include a core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness such that a graded stiffness extends across a thickness of the thermal stress compensation layers. The thermal stress compensation layers have a melting point above a sintering temperature and the bonding layers have a melting point below the sintering temperature. The graded stiffness across the thickness of the thermal stress compensation layers compensates for thermal contraction mismatch between the semiconductor device and the metal substrate during cooling from the sintering temperature to ambient temperature.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 13, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Patent number: 10304697
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: May 28, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10177079
    Abstract: A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: January 8, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hideo Nishikubo, Shunji Masumori, Takuya Harada, Tomohiro Ishii, Hidemichi Fujiwara
  • Patent number: 10150185
    Abstract: Produced is a metal ball which suppresses an emitted ? dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: December 11, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Patent number: 10121753
    Abstract: A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged on the tin layer.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: November 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Jens Oetjen, Stefan Macheiner
  • Patent number: 10046418
    Abstract: Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: August 14, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shunji Masumori, Toshiaki Asada, Hidemichi Fujiwara
  • Patent number: 9706662
    Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: July 11, 2017
    Assignee: RAYTHEON COMPANY
    Inventors: Tse E. Wong, Kenneth T. Teshiba, Shea Chen
  • Patent number: 9699910
    Abstract: A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: July 4, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shao-tzu Tang, Ying-Chou Tsai
  • Patent number: 9515444
    Abstract: A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 6, 2016
    Assignee: CommScope Technologies LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 9496458
    Abstract: A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 15, 2016
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, Michael Bergmann, Kevin Haberern, Kevin Schneider
  • Patent number: 9487846
    Abstract: An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1-15%, In: 2-16%, Sb: greater than 0% to at most 2%, optionally one or both of Ag: at most 2% and Cu: at most 1%, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01-0.15%, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: November 8, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Minoru Ueshima, Isamu Osawa
  • Patent number: 9394619
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Rajen S. Sidhu, Mukul P. Renavikar, Sandeep B. Sane
  • Patent number: 9327364
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: May 3, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • Patent number: 9218988
    Abstract: A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: December 22, 2015
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau
  • Patent number: 9214443
    Abstract: The present invention provides a eutectic solder structure for a chip including a substrate and a solder structure on the substrate. The solder structure includes an alternate lamination of a plurality of first metal layers and a plurality of second metal layers, wherein each second metal layer has a continuous region and a plurality of openings and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal layers. The eutectic solder structure for a chip also includes a chip on the solder structure, wherein the chip is bonded to the substrate by a eutectic reaction of the solder structure.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: December 15, 2015
    Assignee: Lextar Electronics Corporation
    Inventor: Yi-Jyun Chen
  • Patent number: 9198302
    Abstract: The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: November 24, 2015
    Assignee: Koninklijke Philips N.V.
    Inventor: Gordon Patrick Rudolf Elger
  • Patent number: 9157135
    Abstract: The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0<x<m(m+n)), and wherein the element A is supersaturatedly dissolved in the room-temperature stable phase composed of the element B.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 13, 2015
    Assignee: Sanyo Special Steel Co., Ltd.
    Inventors: Hiroki Ikeda, Katsu Yanagimoto, Noriaki Matsubara
  • Publication number: 20150122874
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Application
    Filed: January 15, 2015
    Publication date: May 7, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko ABE, Koji WATANABE, Hideaki TAKAHASHI, Masahiko KANNO, Masaya ITO
  • Patent number: 8999519
    Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Nihon Superior Sha Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Patent number: 8991679
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: March 31, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • Patent number: 8978959
    Abstract: A Ni—Fe-based alloy brazing filler material is provided comprising, in mass %, Fe: 21 to 40%; Cr: 10 to 30%; P: 7 to 11%; B: 0 to 5%; Si: 0 to 4.5%; V: 0 to 5%; Co: 0 to 5%; Mo: 0 to 5%; the balance being Ni and unavoidable impurities, wherein the mass ratio of Fe to P (Fe/P) is in a range of 2.6 to 5. The present invention provides a Ni—Fe-based alloy brazing filler material having a low melting temperature and a superior corrosion resistance and comprising raw materials that are relatively easily available, for use in manufacture of stainless-steel heat exchangers or the like.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: March 17, 2015
    Assignees: Sanyo Special Steel Co., Ltd., Tokyo Braze Co., Ltd.
    Inventors: Toshiyuki Sawada, Shingo Fukumoto, Kotaro Matsu
  • Patent number: 8970026
    Abstract: A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consists of a second solder compound. The outer section can be farther away from a center of the one external side of the substrate than the inner section. During a reflow process, the first and second solder compounds are configured to become completely molten when heated and the first solder compound solidifies at a higher temperature during cool down than the second solder compound.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: March 3, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: George R. Leal, Leo M. Higgins, III, Tim V. Pham
  • Patent number: 8950653
    Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Patent number: 8950652
    Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Publication number: 20150021330
    Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Inventors: Kothandapani Ramesh, Lee Chee Kong
  • Patent number: 8925789
    Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: January 6, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Patent number: 8925793
    Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Siddharth Bhopte, Joe Albert Ojeda, Sr.