Solder Form Patents (Class 228/56.3)
  • Patent number: 10381223
    Abstract: A multilayer composite bonding material for transient liquid phase bonding a semiconductor device to a metal substrate includes thermal stress compensation layers sandwiched between a pair of bonding layers. The thermal stress compensation layers may include a core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness such that a graded stiffness extends across a thickness of the thermal stress compensation layers. The thermal stress compensation layers have a melting point above a sintering temperature and the bonding layers have a melting point below the sintering temperature. The graded stiffness across the thickness of the thermal stress compensation layers compensates for thermal contraction mismatch between the semiconductor device and the metal substrate during cooling from the sintering temperature to ambient temperature.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 13, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Patent number: 10304697
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: May 28, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10177079
    Abstract: A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: January 8, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hideo Nishikubo, Shunji Masumori, Takuya Harada, Tomohiro Ishii, Hidemichi Fujiwara
  • Patent number: 10150185
    Abstract: Produced is a metal ball which suppresses an emitted ? dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: December 11, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Patent number: 10121753
    Abstract: A solder pad includes a surface. A tin layer is arranged on the surface. At least one out of a bismuth layer, an antimony layer and a nickel layer is arranged on the tin layer.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: November 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Jens Oetjen, Stefan Macheiner
  • Patent number: 10046418
    Abstract: Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: August 14, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shunji Masumori, Toshiaki Asada, Hidemichi Fujiwara
  • Patent number: 9706662
    Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: July 11, 2017
    Assignee: RAYTHEON COMPANY
    Inventors: Tse E. Wong, Kenneth T. Teshiba, Shea Chen
  • Patent number: 9699910
    Abstract: A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: July 4, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shao-tzu Tang, Ying-Chou Tsai
  • Patent number: 9515444
    Abstract: A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 6, 2016
    Assignee: CommScope Technologies LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 9496458
    Abstract: A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 15, 2016
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, Michael Bergmann, Kevin Haberern, Kevin Schneider
  • Patent number: 9487846
    Abstract: An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1-15%, In: 2-16%, Sb: greater than 0% to at most 2%, optionally one or both of Ag: at most 2% and Cu: at most 1%, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01-0.15%, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: November 8, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Minoru Ueshima, Isamu Osawa
  • Patent number: 9394619
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Rajen S. Sidhu, Mukul P. Renavikar, Sandeep B. Sane
  • Patent number: 9327364
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: May 3, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • Patent number: 9218988
    Abstract: A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: December 22, 2015
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau
  • Patent number: 9214443
    Abstract: The present invention provides a eutectic solder structure for a chip including a substrate and a solder structure on the substrate. The solder structure includes an alternate lamination of a plurality of first metal layers and a plurality of second metal layers, wherein each second metal layer has a continuous region and a plurality of openings and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal layers. The eutectic solder structure for a chip also includes a chip on the solder structure, wherein the chip is bonded to the substrate by a eutectic reaction of the solder structure.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: December 15, 2015
    Assignee: Lextar Electronics Corporation
    Inventor: Yi-Jyun Chen
  • Patent number: 9198302
    Abstract: The present invention relates to a method of soldering an electronic component (3) to a substrate (1) with high accuracy using transient liquid phase soldering. The component (3) is exactly positioned above the substrate (1) with a handling tool, placed in the melted solder (2) and pressed against the substrate (1). The component (3) is then released and the solder (2) allowed solidifying. Due to the use of a solder (2) having a sufficiently high amount of a second metal or metal alloy of a higher melting point which only partly dissolves in the melted first metal or metal alloy of a lower melting point, a solid framework forms during the liquid phase soldering which inhibits a lateral movement of the placed component (3) during soldering. Since the positioning of the component (3) is made using exact reference features on the substrate (1), the whole soldering process results in a highly accurate lateral position of the soldered component.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: November 24, 2015
    Assignee: Koninklijke Philips N.V.
    Inventor: Gordon Patrick Rudolf Elger
  • Patent number: 9157135
    Abstract: The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0<x<m(m+n)), and wherein the element A is supersaturatedly dissolved in the room-temperature stable phase composed of the element B.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 13, 2015
    Assignee: Sanyo Special Steel Co., Ltd.
    Inventors: Hiroki Ikeda, Katsu Yanagimoto, Noriaki Matsubara
  • Publication number: 20150122874
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.
    Type: Application
    Filed: January 15, 2015
    Publication date: May 7, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko ABE, Koji WATANABE, Hideaki TAKAHASHI, Masahiko KANNO, Masaya ITO
  • Patent number: 8999519
    Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Nihon Superior Sha Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Patent number: 8991679
    Abstract: A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: March 31, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Masahiko Abe, Koji Watanabe, Hideaki Takahashi, Masahiko Kanno, Masaya Ito
  • Patent number: 8978959
    Abstract: A Ni—Fe-based alloy brazing filler material is provided comprising, in mass %, Fe: 21 to 40%; Cr: 10 to 30%; P: 7 to 11%; B: 0 to 5%; Si: 0 to 4.5%; V: 0 to 5%; Co: 0 to 5%; Mo: 0 to 5%; the balance being Ni and unavoidable impurities, wherein the mass ratio of Fe to P (Fe/P) is in a range of 2.6 to 5. The present invention provides a Ni—Fe-based alloy brazing filler material having a low melting temperature and a superior corrosion resistance and comprising raw materials that are relatively easily available, for use in manufacture of stainless-steel heat exchangers or the like.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: March 17, 2015
    Assignees: Sanyo Special Steel Co., Ltd., Tokyo Braze Co., Ltd.
    Inventors: Toshiyuki Sawada, Shingo Fukumoto, Kotaro Matsu
  • Patent number: 8970026
    Abstract: A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consists of a second solder compound. The outer section can be farther away from a center of the one external side of the substrate than the inner section. During a reflow process, the first and second solder compounds are configured to become completely molten when heated and the first solder compound solidifies at a higher temperature during cool down than the second solder compound.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: March 3, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: George R. Leal, Leo M. Higgins, III, Tim V. Pham
  • Patent number: 8950653
    Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Patent number: 8950652
    Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Publication number: 20150021330
    Abstract: A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Inventors: Kothandapani Ramesh, Lee Chee Kong
  • Patent number: 8925789
    Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: January 6, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt
  • Patent number: 8925793
    Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Siddharth Bhopte, Joe Albert Ojeda, Sr.
  • Publication number: 20140328039
    Abstract: In accordance with one or more aspects, a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate, placing a solder preform in the solder paste deposit, disposing a device on the solder preform and the solder paste deposit, and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects, the substrate is a printed circuit board and the device is an integrated circuit package.
    Type: Application
    Filed: September 25, 2012
    Publication date: November 6, 2014
    Inventors: Paul J. Koep, Michiel A. de Monchy, Ellen S. Tormey
  • Publication number: 20140319682
    Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 10, 2014
    Publication date: October 30, 2014
    Inventors: Rajen S. Sidhu, Wei Hu, Carl L. Deppisch, Martha A. Dudek
  • Publication number: 20140206149
    Abstract: Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed.
    Type: Application
    Filed: March 20, 2014
    Publication date: July 24, 2014
    Applicant: TriQuint Semiconductor, Inc.
    Inventors: Shixi Louis Liu, Wenlong Ma, Frank Hin-Fai Chau, Barry Jia-Fu Lin
  • Patent number: 8783544
    Abstract: A brazing alloy is provided in the form of a wire, rod or preform, and is made of, in weight percent: 3-7.5% P, 0.1-1.9% Zn, 0-74.7% Ag, 0-80% Au, 0-10% Sn, 0-5% Ni, 0-3% each of Si, Mn, Li, and Ge, and the balance copper in an amount of at least 21.7%. In additional embodiments, Zn may be present in an amount of 0.6-1.9%. A method of torch brazing is also provided. The method includes forming the alloy into a wire or rod, placing the tip of the wire or rod in contact with a surface of a joint, heating the joint surface using a torch flame, and contacting the tip of the wire or rod to the heated joint surface to melt and flow the alloy onto the joint surface and into the joint under capillary action.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 22, 2014
    Inventor: Joseph W. Harris
  • Publication number: 20140199115
    Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 17, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
  • Publication number: 20140183733
    Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
    Type: Application
    Filed: November 18, 2013
    Publication date: July 3, 2014
    Applicant: DUKSAN HI-METAL CO., LTD
    Inventors: Yong Cheol CHU, Hyun Kyu LEE, Jung Ug KWAK, Seung Jin LEE, Sang Ho JEON, Yong Sik CHOI
  • Patent number: 8763880
    Abstract: A brazing sheet material including a core alloy layer bonded on at least one side with an aluminum brazing clad layer or layers forming a filler material of a 4000-series aluminum alloy. The core layer is made from an aluminum alloy having (in wt. %): Mg 1.0 to 3.0, Mn 0 to 1.8, Cu 0 to 0.8, Si 0 to 0.7, Fe 0 to 0.7, optionally one or more elements selected from the group (Zr, Cr, Hf, T), Zn 0 to 0.5, impurities and aluminum. The filler material forms a 4000-series aluminum alloy further including one or more wetting elements selected from Bi 0.03-0.5, Pb 0.03-0.5, Sb 0.03-0.5, Li 0.03-0.5, Se 0.03-0.5, Y 0.03-0.05, Th 0.03-0.05, wherein the sum of these elements being 0.5% or less.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: July 1, 2014
    Assignee: Aleris Rolled Products Germany GmbH
    Inventor: Adrianus Jacobus Wittebrood
  • Patent number: 8745858
    Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: June 10, 2014
    Assignee: JEONPTIK Laser GmbH
    Inventors: Dominic Schroeder, Matthias Schroeder
  • Patent number: 8740041
    Abstract: A brazing ring with integrated fluxing product and methods for production thereof is described. The brazing ring has a c-shaped body with a plurality of channels extending the thickness of the ring and disposed about the circumference thereof. The channels are separated by radially extending flanges with enlarged distal ends that extend into the channels. The enlarged ends at least partially enclose the channels to aid in retention of a fluxing product disposed in therein. The c-shape may enable flexure of the ring for installation on a pipe or fitting and a friction fit to maintain an installed position. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and compressing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicularly to its length to produce a plurality of the brazing rings.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: June 3, 2014
    Assignee: Flux Brazing Schweiss-Und Lotstoffe USA, LLC
    Inventors: Jasper G. J. Visser, Jacobus C. B. Kotzé
  • Publication number: 20140124925
    Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 8, 2014
    Inventors: Rajen S. Sidhu, Wei Hu, Carl L. Deppisch, Martha A. Dudek
  • Publication number: 20140117001
    Abstract: A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 4.7 and 10.9 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.
    Type: Application
    Filed: January 7, 2014
    Publication date: May 1, 2014
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventor: Bruce Edward Anderson
  • Patent number: 8696829
    Abstract: A brazing product includes a compacted solid and rigid material formed of a brazing flux and a filler metal as a mixture, which has mechanical strength sufficient to make it extrudable under a press with a flux mass proportion from 3 to 20%. The invention also provides a method for manufacturing a brazing product by mixing particles of filler metal and brazing powder in order to form metal particles coated with the flux, and compacting filler metal particles coated with the brazing flux.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: April 15, 2014
    Assignee: FP Soudage
    Inventors: Philippe Schmitt, Boris Bosi
  • Patent number: 8679591
    Abstract: An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu
  • Publication number: 20140076958
    Abstract: A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
    Type: Application
    Filed: February 6, 2012
    Publication date: March 20, 2014
    Applicant: ANDREW LLC
    Inventor: Kendrick Van Swearingen
  • Publication number: 20140044589
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Application
    Filed: December 12, 2012
    Publication date: February 13, 2014
    Applicants: HYUNDAI MOTOR COMPANY, HEESUNG MATERIAL LTD., KOREA AUTOGLASS CORPORATION, KIA MOTORS CORPORATION
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee
  • Publication number: 20140008417
    Abstract: A brazing ring with integrated fluxing product and methods for production thereof are described. The brazing ring has a generally circular body with a plurality of channels extending between opposing faces of the ring and disposed about the circumference thereof. The channels have a v-shaped profile. The body of the ring has a generally constant thickness between inner and outer surfaces. The v-shaped profile of the channels on the outer surface is thus mimicked in a plurality of v-shaped channels on the inner surface of the ring. The ring may be formed as a continuous ring or as a c-shape. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and disposing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicular to its length to produce a plurality of the brazing rings.
    Type: Application
    Filed: December 31, 2012
    Publication date: January 9, 2014
    Inventors: Jasper G. J. Visser, Jacobus C. B. Kotzé
  • Publication number: 20140008416
    Abstract: A brazing ring with integrated fluxing product and methods for production thereof is described. The brazing ring has a c-shaped body with a plurality of channels extending the thickness of the ring and disposed about the circumference thereof. The channels are separated by radially extending flanges with enlarged distal ends that extend into the channels. The enlarged ends at least partially enclose the channels to aid in retention of a fluxing product disposed in therein. The c-shape may enable flexure of the ring for installation on a pipe or fitting and a friction fit to maintain an installed position. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and compressing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicularly to its length to produce a plurality of the brazing rings.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 9, 2014
    Applicant: FLUX Brazing Schweiß-und Lötstoffe USA, LLCö
    Inventors: Jasper G. J. Visser, Jacobus C. B. Kotzé
  • Publication number: 20130313822
    Abstract: A brazing ring is provided and includes ring material including an aluminum-zinc-silicon alloy having a first melting point and flux material contained within the ring material having a second melting point, which is substantially lower than the first melting point, the ring material being formed such that the flux material is exposed outwardly to a heat source and such that, upon heating, flux material melts before the ring material.
    Type: Application
    Filed: February 6, 2012
    Publication date: November 28, 2013
    Applicant: CARRIER CORPORATION
    Inventors: Jeffrey L. Jones, Luis Felipe Avila, Loren D. Hoffman, Jason Michael Thomas, Eric Konkle, Timothy Andrecheck
  • Publication number: 20130276856
    Abstract: A junction box for a solar panel comprises a housing, a lid, a first connector and a second connector. The housing comprises sidewalls and a top wall defining an interior space. The first coupling comprises a first contact element and the second coupling comprises a second contact element. Said contact elements penetrate at least one of the sidewalls, so that the contact elements provide an electrical contact from external contact elements to internal contact elements, such as solder tails. Internal contact elements are arranged at least partially in said interior space. The top wall comprises an opening extending only partially in said top wall. Said opening is located such in the top wall that access to said solder tails in a substantially perpendicular direction to the surface of a solar panel for connecting the solder tail to the solar panel is provided.
    Type: Application
    Filed: June 11, 2013
    Publication date: October 24, 2013
    Inventors: Brian Wade MILLS, Robert D. STREET, Danny Cam Toan LU, Yacov ELGAR, Ian Worthington WEATHERLEY, Dustin Delmar Reede CARVER, Jeffrey S. SULLIVAN, Ian McKay PRATT
  • Patent number: 8550327
    Abstract: A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: October 8, 2013
    Assignee: Intel Corporation
    Inventors: Carl L. Deppisch, Rajasekaran Swaminathan
  • Patent number: 8459529
    Abstract: A production method of composite silver nanoparticle including the steps of: arranging at least an alcohol solvent selected from alcohols with a carbon number of 1 to 12 composed of methanol, ethanol, propanol, buthanol, pentanol, hexanol, heptanol, octhanol, nonanol, decanol, undecanol and dodecanol; preparing an alcohol solution by mixing a silver salt into the alcohol solvent added more excessively than the mol number of the silver salt so as to become an excess alcohol solution; heating the excess alcohol solution in a reaction chamber at a generation temperature PT generating an aldehyde for a generation time; forming a silver core through reducing of the silver salt by the alcohol solvent and/or the aldehyde; and forming a composite silver nanoparticle having an organic coating layer originated from the alcohol solvent around the silver core.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: June 11, 2013
    Assignee: Applied Nanoparticle Laboratory Corporation
    Inventor: Teruo Komatsu
  • Patent number: 8418910
    Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: April 16, 2013
    Assignee: Fujitsu Limited
    Inventors: Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa, Masayuki Kitajima
  • Patent number: 8413878
    Abstract: A system and method for manufacturing welded structures comprises components to be welded, a welding additive material which, before the welding, has a shaped profile and the shaped profile is disposed between components to be welded and conforms with at least one of the components to be welded. At least one heat source is used in the method to weld the components, producing a weld seam on at least one side of one of the components.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: April 9, 2013
    Assignee: Airbus Deutschland GmbH
    Inventors: Jens Hackius, Rainer Kocik