Abstract: A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

Abstract: A connector for lined pipelines includes a tube having opposed male interface elements extending inwardly from respective ends of the tube. One or more circumferential permeable chokes project radially from each male interface element. The chokes minimise flow of oxidising fluid from the bore into the micro-annulus between the liner and the pipe while maximising flow of fluid from the micro-annulus into the bore in the event of catastrophic pressure drop in the bore. To maintain gaps between the tube ends and the pipe liners for fluid flow, shoulder formations extend circumferentially around the tube. The connector may be used in a joint arrangement where each liner includes a body, an end of lesser thickness and greater bore than the body that terminates short of an end of the pipe, an inner step between the body and the end, and an outer step between the end and the pipe.

Abstract: A method of post processing a laser peened component to remove a laser remelt layer is proposed. The post processing includes a series of steps including grit blasting, chemical etching and mechanical finishing the component. This will ensure that the mechanical property (i.e., damage tolerance) benefit of laser peening is restored to the surface of the component.

Abstract: A holder for a hair appliance with heatable elements that is comprised of a stand with two pockets. The heated portion of the appliance is inserted into the two pockets, each pocket receiving a heatable element of the appliance. The pockets are made of heat resistant material. The use of the dual-pockets keeps the heating elements of the appliance separated, which assists in cooling and helps extend the life of the appliance. The base includes a counterweight to balance the holder.

Abstract: A method for minimizing voids when soldering a printed circuit board being equipped with components, in particular with electrical and/or electronic components, includes oscillation of the printed circuit board while the solder situated between the components and the printed circuit board is being melted or after it has been melted. In this respect, the frequency of the oscillation changes between a starting frequency and a final frequency. Preferably, the oscillation is introduced in a direction of the printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop.

Abstract: A mandrel for manufacturing a vascular device for treating a vessel includes an elongate strand and a plurality of bulbs coupled to the elongate strand. The elongate strand may extend through each of the plurality of bulbs. The mandrel may include first and second elongate strands each including a plurality of bulbs. The first and second elongate strands may be separable at an intermediate portion coupling the first and second elongate strands. A vascular device manufactured utilizing the mandrel may be configured to treat a vessel.

Abstract: A field-customizable inflatable purge dam apparatus for welding includes first and/or second inflatable purge bladders. A bridge conduit extends between the purge bladders. First and second quick-disconnect couplers are provided for detachably connecting the bridge conduit to the first and second purge bladders, respectively. The quick-disconnect couplers allow the bridge conduit to be selectively attached to, and detached from, one or both of the first and second purge bladders. The purge dam apparatus can be field-customized by combining the bridge conduit with one or more different purge bladders. Alternatively, the purge bladders may be selectively combined with one or more different bridge conduits. In another aspect, one end of the bridge conduit may be detachably connected to a single inflatable purge bladder, and the other end of the bridge conduit may be adapted to connect to a purge gas source. Various purge dam apparatus sub-assemblies may also be provided.

Abstract: A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

Abstract: A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part, a connecting means and a sealing means. The connecting means is arranged in the first chamber region. The loaded pressure chamber is placed into a receiving region. The first housing element is pressed against the second housing element so that the pressure chamber is clamped with the aid of a working cylinder between the working cylinder and a holding frame. In the clamped state, a second gas pressure, which is higher than a first gas pressure in the first chamber region, is generated in the second chamber region. In this way, the first part, the second part and the connecting means are pressed against one another within the pressure chamber.

Abstract: A welding system has a baseplate and a plurality of welding components which are arranged on the baseplate.

Abstract: The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle (61, 81) comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.

Abstract: A purge plug for welding applications is provided that can be interchangeably used to seal tubing, pipes, or the like of various diameter or cross-sectional area. The purge plug has a central body with a male connector and a diffuser disposed on the end portions. The purge plug also includes one or more flexible seals annularly disposed around the central body. In some implementations, the diameter of the flexible seals is slightly larger than the diameter of the tubing or pipe. When the purge plug is inserted into the tubing or pipe, the resiliency of the seal allow the seal to expand mechanically and flex against the inner walls of the tubing, thus sealingly engage with the inner walls.

Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.

Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Abstract: A method for joining a plurality of single crystal members includes providing a bonding foil with a composition match with that of the members and with a bonding temperature within the gamma prime solution temperature range of the members, but below the melting temperature of the foil and below the incipient melting temperature of the members. The foil is disposed between and in contact with opposing members to be joined while heated to and held at the bonding temperature for at least 10 hours.

Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.

Abstract: A welding alignment and spacing article is provided for forming a welding gap between two structures to be welded together. The article includes a body having first and second surfaces that are spaced from each other at a selected spacing distance to define a region of selected body thickness. The body is formed from a non-metallic degradable body material in the region that can be wholly or partially degraded by exposure to a degrading agent to reduce the body thickness. The degradable body material is sufficiently incompressible to be useable as a spacer that maintains a specified welding gap distance between the two structures to be welded.

Abstract: A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers respectively covers the upper and lower metal layers respectively disposed on the upper and lower surfaces of the base. The lower metal layer has an electrical bonding portion and a strengthening bonding portion insulated with each other. The strengthening bonding portion enhances the bonding strength between the substrate and another substrate. The upper metal layer is electrically connected to the electrical bonding portion via the through hole. The lower covering layer exposes the electrical bonding portion and the strengthening bonding portion so as to be respectively connected with two bonding portions of the another substrate.

Abstract: Apparatus and method for purging atmospheric air from a chamber with a gas including means for generating a substantially non-turbulent, laminar flow front of the gas into the chamber with minimal turbulence to displace the atmospheric air in the chamber, the chamber having exhaust means associated therewith to permit the displaced atmospheric air to exit the chamber. The chamber is preferably a welding chamber and the gas is preferably argon.

Abstract: A receiving element which can be introduced into a borehole of at least one component includes a bolt presenting an outer surface that is approximately parallel and advantageously coaxial to a longitudinal axis of the bolt. The receiving element requires few materials and can therefore be produced at a low constructional cost while being provided with high dimensional stability and positioning accuracy. The bold includes an abrasion-resistant sintered material, and a metal tip provided on the front end of the shaft. The end part of the tip is engageable in a recess of the bolt, and there is a direct connection between the end part and the recess in the connection region on the front end of the bolt.

Abstract: The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device being characterized in that the above-mentioned cover is shaped in such a way that, on the above-mentioned end surface of the cylindrical body, the circular peripheral part of the above-mentioned cover exerts a compressive stress, after brazing, on substantially the whole contact area between the end surface of the cover and the end surface of the cylindrical body.

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract: A method of repairing an aperture and adjacent defect in a part which is started by removing one or more defects adjacent an aperture in a base material. The material is removed to create a weld seam that extends past an area of high stress concentration on the aperture. An insert of material containing a profile that corresponds to the profile of the base material removed adjacent the aperture and a combination top and runoff plate that encompasses the insert of material are provided. A backing plate is inserted underneath the combination top and runoff plate and insert such that there remains an air space between the backing plate and the combination plate which prevents the combination plate from becoming fused to the backing plate during a welding process. The insert is welded to the base material, and the backing plate is removed. Excess material is removed from the insert to obtain an aperture containing a profile essentially the same as the profile of the aperture prior to initiating the repair.

Abstract: This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements.

Abstract: The invention relates to a damping device (20), which in order to reduce vibrations occurring during the rotary friction welding of a first to at least one second component (12a, 12b) can be disposed on at least one of said components (12a, 12b), wherein the damping device (20) comprises a casing element (22), which is filled at least partially with a viscoelastic fluid (24) invention further relates to a welding system (10) and to a method for the rotary friction welding of a first to at least one second component (12a, 12b), and to a component (12), particularly for an aircraft engine.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.

Abstract: The invention relates to a method for welding two welding parts (1, 3) by means of a fillet weld (11), wherein a first welding part (1), with a bearing surface at least in an edge area of an edge that is to be welded by means of a fillet weld, is brought into contact with a bearing surface of a welding part (3) and the welding energy (5) is supplied in an energy supply area during the welding process, exclusive of a surface (7) of the first welding part facing away from the bearing surface, said energy supply area being located at a predetermined distance from the edge of the first welding part. The welding energy is supplied in a direction, whereby the direction component thereof points perpendicular to the course of the fillet weld that is to be produced in the direction of an inner area of the first welding part, forming a welding angle of less than 90° with the contact plane of the bearing surfaces of the first and second welding parts.

Abstract: A weld splatter containment device for use in rolling mills includes a lower cover and an upper cover, both controllable in approaching and moving away from a welding zone so as to substantially surround the welding zone when the lower and upper covers are situated in a position close to the welding zone. The lower cover is controlled in approaching and moving away from the welding zone along a first circular trajectory portion and the upper cover is controlled in approaching and moving away from the welding zone along a second circular trajectory portion.

Abstract: An object-to-be-soldered (92) is accommodated in a sealable chamber (17). An internal pressure (P) of the chamber (17) is raised to a normal pressure (Po) or higher by feeding a reducing gas to the chamber (17). A soldering of a semiconductor element (12) with respect to a circuit board (11) is carried out in the pressurized state. The pressurized state indicating a set pressure (P1) (for example, 0.13 MPa) is maintained in a solder melting period (t3 to t7) until the molten solder (33) is solidified (t7) after the solder (33) starts melting (t3). Accordingly, voids are inhibited from being generated in the solder after being solidified.

Abstract: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

Abstract: The present application provides a latent ink-jet ink formulation suitable as solder mask. The composition generally comprises: (a) at least one compound capable of self cross-linking (USM); (b) at least one phenolic resin; (c) at least one solvent; (d) at least one mineral filler; (e) at least one polyol; and (f) at least one photoinitiator.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A select solder machine configured to solder a circuit board using a solder material. The select solder machine includes a solder head movable with respect to the circuit board. The solder head is configured to position the solder material with respect to the circuit board to solder the circuit board. The select solder machine further includes a support member configured to support the circuit board in a position adjacent the solder head, and a heating member configured to heat the circuit board. The heating member is located above the circuit board.

Abstract: The present invention generally comprises a method and apparatus for bonding a cylindrical sputtering target to a backing tube. The cylindrical sputtering target may be disposed over the outside surface of the backing tube and melted bonding material may be vacuum pulled through the gap formed between the sputtering target and the backing tube. By vacuum pulling the melted bonding material through the gap, the amount of air bubbles or pockets present within the bonding material between the sputtering target and the backing tube may be reduced.

Abstract: A volatile soldering aid for solder bonding surfaces. A thermally decomposable solid that is suspended in a carrier or dissolved in a solvent is incorporated in a solder assembly having two surfaces separated by a solder preform. The solvent or carrier is subsequently evaporated, and the assembly is heated to decompose the solid and produce a reducing gas. The assembly is then further heated to melt the solder preform. A vacuum may be introduced to remove the gas prior to melting of the solder preform. The solder preform in the assembly may be a monolithic preform or it may be a powder. The solder preform may be provided as a thin film deposited on one or both of the surfaces to be joined. Upon heating, the volatile soldering aid is converted to vapor without forming a liquid phase at the melting point of the solder.

Abstract: One embodiment of a welding apparatus includes a stationary welding device that defines a stationary weld zone, and a support that moves a weld member through the stationary weld zone.

Abstract: A welding apparatus is disclosed. The welding apparatus includes a torch body comprising at least one core, a plurality of contact tips extending in a direction from the at least one core, and a plurality of gas supply tubes disposed proximate the plurality of contact tips, the plurality of gas supply tubes extending in a substantially similar direction as the plurality of contact tips.

Abstract: An ultrasound welding device for welding metallic conductors for producing a junction point includes two welding surfaces, which are located on opposite sides, and two lateral delimiting surfaces, which extend transverse to the working surfaces and which, together, define a compression space. In order to eliminate longitudinal movement of the conductors during welding, at least one of the lateral delimitation surfaces is additionally structured next to the structured welding surfaces.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.

Abstract: A sandwich material comprising two metal plates affixed to and separated by a fibrous core, is characterised in that the core comprises a three-dimensional porous network comprising metal fibres, wherein substantially all of the fibres are inclined at an acute angle to the plates. The sandwich material is lightweight, thin and handles like a monolithic sheet. It displays high beam stiffness and is easy to weld. It as therefore particularly useful in the manufacture of aircraft and vehicle parts.

Abstract: A multi-functional welding platform is disclosed. The multi-functional welding platform has a box body at a base thereof. The rear side thereof is installed with a power input end, a power regulator, a high voltage discharging plate, a power output end, etc. A lower side of the platform is installed with an air inlet space. A rear side of the space has a fan. A plurality of air inlet holes are distributed on the platform and filtering material is placed therein. Other than providing the general device for welding, harmful gas or metal smoke enters into the air inlet holes on the platform and then is filtered and then exhausted from the fan so that the operators will not breath harmful gas.

Abstract: A capillary threading tool is used to thread bond wire through the capillary tool of a wire bond machine. The capillary threading tool includes a handle that is grasped to manipulate a body portion into a gap between the upper end of the capillary tube and the lower end of a guide tube that is positioned above the capillary tube. The body portion includes a guide surface that is placed in contact with the wire bond machine, and a vertical slot extending from the guide surface that terminates in a closed end having an inclined surface. The length of the slot is selected to position the lower edge of the inclined surface above the end of the capillary tube so the bond wire can be threaded into the capillary tube simply by forcing the end of the wire on the inclined surface.

Abstract: A soldering pliers construction 10 including a pair of pivoted handle members 20, 21 having anvil members 30, 40 provided on their outboard ends. Each of the anvil members 30, 40 are provided with at least one pair of complementary lateral grooves 32, 42 which are dimensioned to receive the abutted ends of two lengths of wire 100, 100′ which are to be joined together by a soldered connection. One of the anvil members 30 is provided with a heating element 34 for heating the butted wires 100, 100′ and the other anvil member 40 is provided with an aperture 45 that is dimensioned to receive a stick of soldering material 200 that will be melted upon contact with the heated wires 100, 100′.

Abstract: A soldering station system for transporting, utilizing, and storing the unique tools required for soldering electrical wiring assemblies, printed circuit boards, and other small electronic sub-assemblies is provided. The soldering station system includes a tool case with a bottom portion, a plurality of side portions, and a top portion, a tool pallet assembly which is coupled to an interior surface of the tool case, the tool pallet has a plurality of interior recesses, and a plurality of tools adapted for working on electronic assemblies and positioned in the interior recesses of the tool pallet assembly.

Abstract: A method of continuous rolling comprises the steps of: forming a continuous billet 20 by joining a rear end of preceding billet 21 with a front end of succeeding billet 21 by flash-butt welding 3; removing burr on welded portions of the continuous billets 20; then rolling the continuous billet 20 in a rolling mill line 6; wherein locally cold portions produced by clamping at welding are reheated after removing the burr using a travelling induction-heating unit 5 running at a speed synchronously with a running speed of the continuous billet 20, which travelling induction-heating unit 5 is provided with induction-heating coils arranged at the same distance with that of the locally cold portions.

Abstract: A plurality of materials are rolled in an upstream stand. While the transfer speed of a succeeding material and the front end position thereof are detected, the transfer speed and the rear end position of a preceding material are detected by a measuring roll. The transfer speed of the succeeding material is controlled by adjusting at least the drive speed of the pinch rolls so that the front end of the succeeding material contacts the rear end of the preceding material at a specified position in a travelling welder. The rear end of the preceding material is joined with the front end of the succeeding material by flash-butt welding using the travelling welder to form a continuous material while letting the travelling welder move at a speed synchronous with the transfer speed of the continuous material. The welded portion on the continuous material is ground and/or cut to remove burr therefrom. After removing the burr, the continuous material is continuously rolled by a down-stream stand.

Abstract: In a process for joining two metallic workpieces together, the pieces are butted together to form a butt joint and are joined to one another in the region of the butt joint. During this operation, the workpieces are subjected to a magnetic attraction force at one side, and. can be subjected to holddown pressure on the opposite side.

Abstract: A method for continuous rolling includes flash-butt welding to form a continuous billet by joining a rear end of a preceding billet with a front end of a succeeding billet, removing burrs from a welded portion of the joined part, and continuously rolling the joined continuous billet in a rolling mill group. The flash-butt welding step includes the use of two travelling welders arranged in series and spaced at a distance along the direction of movement of the continuous billet corresponding to the length of the billet being welded. The travelling welders synchronously move with the continuous billet, and separately and simultaneously weld the continuous billet to another billet by flash-butt welding so as to extend the length of the continuous billet.

Abstract: There is provided a rolled plate joining apparatus equipped with a truck that can travel reversibly in the rolling direction, tailing end pinch rolls that are mounted on the truck and can be moved vertically with the tailing end of a preceding rolled plate pinched horizontally, leading end pinch rolls that are mounted on the truck and can pinch horizontally the leading end of a succeeding rolled plate, machining apparatuses for cutting one surface of the tailing end of the preceding rolled plate and the other surface of the leading end of the succeeding rolled plate, and a pressure welding apparatus for compressing the preceding rolled plate and the succeeding rolled plate with the machined surfaces of the preceding rolled plate and the succeeding rolled plate overlapped to reduce them approximately to the thickness of the rolled plates, including a tailing end centering apparatus placed between the tailing end pinch rolls and the pressure welding apparatus for pressing the opposite width ends of the tailing