Abstract: An additive manufacturing apparatus performs additive machining by controlling a machining head that includes a wire nozzle to feed a wire to a machining region on a surface of a base material, a beam source capable of emitting a beam to an end of the wire, and a gas nozzle placed such that the beam source is interposed between the gas nozzle and the wire nozzle, the gas nozzle directing a gas toward the machining region, and the additive manufacturing apparatus includes a machining-condition selection unit to obtain an angle that is formed between a direction in which the wire is fed and a travel direction of the machining head, when viewed in a direction in which the beam is emitted, and to select a machining condition for the additive machining on the basis of the angle.

Abstract: A system and methods for electrically starting an arc in a welding process are disclosed. The system and methods may reduce an electromagnetic interference (EMI) footprint during the arc start by reducing the average power spectral density output and broadening the frequency spectrum of the arc EMI footprint. In one embodiment, a welding system may include a welding torch and a welding power source electrically coupled to the welding torch via a weld cable configured to supply electrical energy to the welding torch. The welding power source may include pseudo-random noise (PRN) generator control logic circuitry configured to generate a dithered pulse waveform with a pseudo-randomly selected data sequence of binary values based on one or more baselines, and to apply the dithered pulse waveform to an oscillator during arc starting in a tungsten inert gas (TIG) welding process performed by the welding torch.

Abstract: A weld bead shaping apparatus including: a gouging torch for gouging an object to be shaped; a shape sensor for measuring a shape of the object; a slider apparatus and an articulated robot for driving the gouging torch and shape sensor; an image processing apparatus; and a robot controlling apparatus. The image processing apparatus includes: a shape data extracting unit extracting shape data of the object, from a measurement result obtained by the shape sensor; and a weld reinforcement shape extracting/removal depth calculating unit calculating a weld reinforcement shape of the weld bead from a difference between the shape data and a preset designated shape of the object, and calculating a removal depth by which gouging is performed, based on the weld reinforcement shape. The robot controlling apparatus controls the slider apparatus, the articulated robot, and the gouging torch based on the weld reinforcement shape and the removal depth.

Abstract: A weld head angle adjustment system includes a weld head, a base unit, and an angle adjustment mechanism. The weld head includes a welding torch and an arc voltage control assembly that is operatively connected to the welding torch and configured to move the welding torch. The angle adjustment mechanism is operatively connects the weld head to the base unit and is designed to change an angle between the welding torch and the base unit while ensuring that an orientation between the welding torch and the arc voltage control assembly remains fixed as the angle between the welding torch and the base unit is changed. In some embodiments, the angle adjustment mechanism includes a bolt that connects the weld head to the base unit. The angle adjustment mechanism is configured such that the angle between the welding torch and the base unit can be adjusted when the bolt is in a first state and the angle is fixed when the bolt is in a second state.

Abstract: A program controlled automatic soldering system is disclosed having a vision system, a first manipulator, and a second manipulator. The first manipulator is controlled by the vision system, and has a first gripper. The second manipulator is controlled by the vision system, and has a heater.

Abstract: A hand-held device shaped as a pencil used for dispensing solder wire onto a soldering point. Such device contains a roll of solder wire that can be gradually extracted through a hole on the tip by pressing a button in forward motion to extract the solder without touching it. The device can be held in one hand and the dispensing of the solder wire is performed by an internal servo-mechanism that controls the amount of solder and the speed at which it is dispensed. The extracted solder can be pulled back into the device in order to retrieve small portions of the already extracted solder by pressing the same or a different button in backward motion in order to maintain a desired amount of solder outside the device. The device can be electrically powered by “AA” size batteries, or by an external power supply.

Abstract: Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux; dispensing a thermosetting resin to at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon, to melt the bumps and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component to the substrate.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at periphery by applied pieces and may be insulated from one another by a vacuum.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Abstract: A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece on a headstock assembly and a tailstock assembly, which define a workpiece or weldment rotational axis extending therebetween. The tailstock assembly can be located at different positions within a workstation for accommodating different lengths of workpieces. Encoders are installed at the moving elements of the system for precisely tracking and providing output to the computer controller. Primary and secondary power/data distribution systems include cable and hose carriers for providing mobile power/data connections to the gantry and also to the robotic arc welders mounted thereon. The power/data distribution systems are elevated above a facility floor to avoid interfering with equipment, personnel and activities at floor level.

Abstract: A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.

Abstract: In accordance with particular embodiments, a method for packaging electronic devices includes melting solder for a solder jet. The method additionally includes depositing the melted solder from the solder jet in a pattern on a first substrate of a first component of an electronic device. The pattern comprises a plurality of individual dots of melted solder. The method also includes aligning a second substrate of a second component of the electronic device with the pattern deposited on the first substrate of the electronic device. The method further includes re-melting the solder deposited in the pattern on the first substrate. The method additionally includes, while the solder is re-melting, compressing the first and second substrates.

Abstract: This invention relates to a method for axial positioning of a first pipe with respect to a second pipe for the welding of said pipes at their ends thereof of which the faces have been previously machined and define a joint plane, according to which a plurality of jacks are distributed around the first and second pipes, and said jacks are connected to a central processing and control unit. According to the invention, the movement of each of the jacks is controlled with respect to said external surface of the first and/or second pipe so as to align and center the internal end surfaces of the first and second pipes. The invention also relates to an associated device.

Abstract: The present invention relates to a welding device suitable for joining by welding a first and a second part at a weld joint, said parts defining a joint face between said parts, the device comprising: a traveling support mean (2) for moving the device along the weld joint; at least one welding means (4) cooperating with said traveling support means (2) so as to be kept at a distance from said weld joint; means for automatic motion control of the traveling support mean (2) in particular.

Abstract: A method for producing tubes for use in a heat exchanger that includes providing first and second metallic strips on a rolling mill train with predetermined breaking points using a device, deforming the strips to form the a tube, separating individual tubes from the tube at the predetermined breaking points, sensing positions of the predetermined breaking points in the strips using a sensing element which the strips pass through, transmitting signals relating to sensed positions of the predetermined breaking points of the strips to a computer, comparing the positions of the predetermined breaking points in the first and the second strips using the computer on the basis of the signals transmitted, and sending signals to the device using the computer which lead to the alignment of the positions of the predetermined breaking points in the first and the second strips.

Abstract: Adjustable, elongate, beam-offset jig structure for assisting, under manual, or appropriate computer, control, in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder may be provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established.

Abstract: Equipment for carrying out a method for manufacturing a power capacitor including at least one capacitor element. The equipment includes a solder pot. A solder head includes a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically). A press unit fixes the capacitor elements. The solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.

Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.

Abstract: The electronic component mounting line includes computing unit for calculating a print position of solder paste printed on board-side electrodes, electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to a displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.

Abstract: An improved apparatus for positioning and aligning a patterned surface of a semiconductor structure directly opposite to solder filled patterned mold cavities of a mold structure includes a pattern based alignment too including means for identifying a mold training pattern image and a semiconductor training pattern image on a training mold structure and a training semiconductor structure, respectively, means for training the alignment tool with the training pattern images, means for storing the alignment tool trained position, means for identifying a mold pattern image and a semiconductor pattern image on the mold structure and the semiconductor structure matching the mold training pattern image and the semiconductor training pattern image, respectively, and means for aligning the identified mold pattern image with the semiconductor pattern image

Abstract: A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.

Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.

Abstract: The position of a workpiece delivered into a welding station by a feed mechanism is detected by CCD cameras of position detectors, and a positioning error of the workpiece with respect to a reference position is determined on the basis of the detected position. After training data for welding robots is corrected on the basis of the determined positioning error, scan heads on distal ends of the welding robots are inserted into the workpiece. After the scan heads have been inserted to predetermined positions in the workpiece, only the scan heads are actuated to weld the workpiece at a plurality of locations thereof with a laser beam.

Abstract: A method for preparing and assembling a planar reinforcement for a concrete element according to a pre-determined design plan, wherein a full-sized plan including the position and type of each element in the reinforcent to be achieved is mapped onto a working surface (30) having two reference directions, a suitable reinforcement element is positioned in each of a plurality of crossing points. The method is characterised in that one or both of the mapping and assembling operations are performed by a tool attached to the carriage of a robot (10), said carriage (10) having at least two degrees of freedom parallel to the reference directions. The method further comprises storing all the design plan data in a storage area of the robot, and using the robot to move the carriage (10) automatically in accordance with said data.

Abstract: A remote controlled welding and cutting carriage, with an automated positioning arm, to facilitate welding and cutting of flat and curved surfaces including plate and pipe without the use of track, band or similar carriage positioning or guidance mechanisms. Multiple motor driven precision ground magnetic wheel sets align and propel the carriage across a surface. Precision maintenance of magnetic wheel position is facilitated by use of spring steel axles which resist distortion from impacts. A separate magnetic wheel set alignment adjustment is provided to correct magnetic wheel set positioning. The system of motor driven magnetic wheel sets permits the carriage, or carriages, to transport cutting and welding materials required for welding and cutting around the complete circumference of a pipe or other surface regardless of orientation or slope.

Abstract: An apparatus for repairing curved grinding surfaces in bowl mill coal pulverizers by welding hardfacing material onto the grinding ring surface. The inventive apparatus includes novel guide structure imparting an arcuate motion to the welding torch as it traverses the grinding surface. In a preferred form a welding torch is pivotally mounted about an axis at or near the center of curvature of the grinding surface, pivoted along the circumference of the curved grinding surface to effect welding repairs. The pivotal positioning and motion of the welding torch assures a constant distance and angle relative to the grinding surface, and thus a strong, primary, non-overlapping weld bond across the entire width of the ring. In a preferred form the apparatus employs dual, independently adjustable, simultaneously indexed torch heads.

Abstract: The present invention discloses a wire bonder that does not require bonding tool replacement to be performed by an experienced worker, is not bothersome and can be completed in an extremely short time, while also enabling time management of the degree of wear of the bonding tool and so forth to be performed reliably, so as to realize improved work efficiency and yield, as well as being able to demonstrate various other effects. In addition, the present invention also discloses a bonding arm and bonding tool that contribute to the achieving of these effects. The above effects are obtained by adding a tool replacement device that removes a used bonding tool (capillary) installed in a bonding arm and installs a new bonding tool. In addition, the above effects are obtained with respect to the bonding arm and bonding tool by forming a tapered surface that guides their mutual insertion.

Abstract: Soldering condition information such as the position and angle of a soldering iron, amount of solder supplied and heating time is stored beforehand, for each grouping of parts, in a part classification table (26) for soldering purposes. Parts to be mounted on a board are stored, in correspondence with the board ID, on a floppy disk of a floppy disk device (24). When the board ID is entered, the parts to be mounted on the board are displayed on a display unit (23). The operator reads out the part classification table (26) for soldering purposes and designates soldering correction information that corresponds to the part groups to which the parts belong. As a result, a teach-data table (27) in which soldering condition information has been stored in correspondence with the parts is created. Soldering is executed automatically in accordance with the teach-data table (27).

Abstract: A die bonding apparatus includes a device for making a coarse surface in a region where an identifier is to be applied to a lead frame; an application device for applying the identifier to the coarse surface region, a dividing device for dividing a wafer into chips, a test device for testing the wafer which has not been divided into chips yet in positions corresponding to the prospective chips, a storage device for storing information about positions of the chips on the wafer and the test results, a die bonding device picking out the chips from the wafer for die-bonding them to the lead frame having the identifier, a reading device for reading the identifier of the lead frame to which the chips are to be die-bonded, an information processing device for adding information which the identifier contains to the test results and position information about each of the chips to make test information, and an output device for outputting the test information.

Abstract: An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that of an elongated rectangular cross-section bar having at the lower end thereof a tapered, smaller cross-section tip. The tip includes a flattened front toe section for applying ultrasonic energy to wire and a bonding pad, and an upawardly angled oblique lower face rearward of the toe section. A wire guide hole through the tip that has a longitudinal axis that slopes upward at a steeper angle than the oblique lower face has an exit opening in the lower oblique face, just rearward of the front toe section. The guide hole has an enlarged opening in the rear face of the tip. An elongated straight shallow groove formed in a side wall of the tip extends obliquely downwards from the rear face to front face of the tip.

Abstract: A process and apparatus for leak-proof sealing of a metallic capsule closed by a stopper and joining the capsule to a metal cable by arc welding, wherein a capacitor is charged, the capsule with a striking tip at one end or the stopper with an ignition point and the cable are clamped at their ends, connected to the terminals of the capacitor, moved together and welded together by discharging of the capacitor with the formation of an arc.

Abstract: The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

Abstract: A computer controlled flow solder machine is controlled by a computer, operating in conjunction with two other computers, to control the operation of the machine and to control and monitor the process parameters for each circuit board processed through the flow solder machine. The flow solder machine is made up of a conveyer system, a flux system, a preheat system, and a solder pot system.

Abstract: An automatic build-up welding machine for repair of workpieces such as track rollers. The machine requires no operator in charge during the welding operation. The apparatus comprises a device including a pair of guides, and a switch box connected adjustably in position to a welding torch, the switch box housing therein a pair of limit switches for reversing motion of the torch and a swing lever positioned between the limit switches. The apparatus controls the travel of the torch by varying half-cycles of the reciprocable travel thereof.

Abstract: An electronic circuit board rework and repair system having a carriage manually movable to successive station positions and having a table thereon movable along mutually orthogonal axes for positioning of a circuit board clamped to the table. At a first station, a circuit board is loaded onto the table, and a microscope can be swung into position for inspection of the loaded board. At a second station, an intended component or circuit board site can be aligned by way of a visual image of the component and site, and the table locked in position. At a third station, the selected component or circuit board site is automatically in alignment with a programmable heater for selected heating of the component contacts and removal of the component by a pickup probe associated with the heater. The system is calibrated such that there is alignment between a visually established position at the second station and that component position under the heater at the third station.

Abstract: Method for reflow soldering respectively desoldering of circuit boards by using infrared radiation from radiator groups in a furnace. The circuit boards are introduced into the furnace on a timed belt or work piece carrier and maintained motionless during the prewarming, soldering respectively desoldering and cooling down phase. For prewarming for a first given time the radiator groups are operated with reduced operating current. For reflow soldering respectively desoldering the operating current of the radiator groups is switched for a second given time to a maaximum given stage and subsequently turned off completely. The soldered respectively desoldered circuit boards are cooled in a laminar air stream from ventilators for drawing off the solder vapors; the ventilators are initially operated with reduced number of rpms until the solder solidifies and then at the maximum number of rpms. Subsequently, the circuit boards are moved out of the furnace.

Abstract: A tool positioning system comprises a discontinuity detection means, such as an eddy current system, for detecting a discontinuity within a workpiece resulting from a joint between a first piece of material relative to a second piece of material, the discontinuity being detected from the back side of the second piece of material. The discontinuity is detected at a plurality of points by translating an eddy current probe over the back side of the second piece of material, the individual points thereafter being utilized to compute line elements that define the joint between the first and second pieces of material in a continuous fashion over the surface of the second piece of material. Thereafter a tool, such as a laser welding tool, is guided along the computed position along the backside of the second piece of material such that the first and second pieces of material are welded together along the joint.

Abstract: To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

Abstract: An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel longitudinally extending rails mounted on the top portion on opposing sides of said central cavity; a flux tank mounted in said central cavity approximate said first end to hold a liquid flux for flux-coating electronic component leads; a heated pot mounted in said central cavity approximate said second end to hold a hot molten solder bath for tinning the electronic component leads; a powered, wheeled electronic-component transport adapted to ride on said rails to carry electronic components from said first end over the flux tank to the second end over said solder pot and back again; two powered cam means mounted in said transport, rotatable to a high transport position and a low processing position, said c

Abstract: In a method of building an automobile body separate upper and lower body modules (50, 78) are formed, incorporating the roof area and the floor area of the automobile respectively, precision mating locations (62) on the body modules are used first as reference for fitting interior parts and equipment to the respective modules and then for fitting the modules together. An assembly line for carrying out the method has respective sets of stations for forming operations on upper and lower body modules, a mating station (30) at which the two modules are brought together and a joining station (32) where they are, for example, welded. The leading station (20, 22) in each set determines a master body point (64, 82) on a module presented to it, and forms the mating locations (62) on the module with reference to the master body point.

Abstract: A control system for a movable robot, having a movable member which is linearly movable on and articulated about a base and having an articulated arm with a work element, executes a prestored continuous path program for moving the work element through a continuous path by simultaneous coordinated linear and articulation displacements of the movable member and arm in all degrees of freedom. These simultaneous coordinated displacements are produced by interpolating in advance the position of the movable member at a teaching point and by loading the interpolated position of the movable member into an interpolation calculation of the arm position.

Abstract: An automatic welding apparatus for forming a circular bead along a circumference of a first workpiece at its junction with a second workpiece in order to weld the former to the latter, comprising a turntable, clamp members for clamping the second workpiece to the turntable, a torch holder for holding a welding torch in an adjusted position, a torch positioner which is engageable with the first workpiece, for maintaining a constant relative positional relationship between the welding torch and the first workpiece, a positioner guide mechanism for supporting and guiding the torch positioner to a desired position in a plane extending in parallel relationship with respect to a surface plane of the turntable, and the torch holder being restricted from rotating.

Abstract: The invention relates to a machine for automatically welding and/or cutting the junction point between a main pipe and a secondary branch pipe placed thereon. This machine comprises a positioning support on which the main pipe is placed. The positioning support comprises two servomotors which drive the main pipe in rotation about the longitudinal axis of the pipe and about a second horizontal axis perpendicular to said longitudinal axis. The machine comprises a travelling gantry crane which bears three carriages movable by three servomotors along three axes rectangular with each other, one of which is vertical. One of the carriages bears a welding or cutting head.