Metal To Nonmetal Patents (Class 228/903)
  • Patent number: 10165798
    Abstract: An electric heating wire winding device and a method for manufacturing an electric heating wire element are provided by the present application. The electric heating wire winding device includes a connection assembly, a delivering assembly and a wire winding assembly. The wire winding assembly includes a first clamping component, a second clamping component, a first rotating component, a second rotating component, a first power device, a second power device and a third clamping component. When the electronic wire with the first preset length connected to the free end of the electric heating wire rotates together with the liquid guiding rope and they are moved in an axial direction of the liquid guiding rope away from the first clamping component, the electric heating wire is winded around the liquid guiding rope. The method for manufacturing an electric heating wire element according to the present application improves the working efficiency.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: January 1, 2019
    Assignee: HUIZHOU KIMREE TECHNOLOGY CO., LTD. SHENZHEN BRANCH
    Inventor: Zhiyong Xiang
  • Patent number: 10029162
    Abstract: A ball bat includes a barrel in which one or more stiffening elements or damping elements, or both, are located. The stiffening or damping elements may be positioned at a variety of locations, and may have a variety of configurations, for selectively reducing the barrel's performance without appreciably increasing the bat's moment of inertia.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: July 24, 2018
    Assignee: EASTON DIAMOND SPORTS, LLC
    Inventors: Dewey Chauvin, William B. Giannetti, Hsing-Yen Chuang, Ian Montgomery
  • Patent number: 9925435
    Abstract: A golf club (2) comprising a shaft (20), a head and a damping device (1, 100). The damping device (1, 100) includes an anchor element (3, 103) and a damping element (4, 104) interconnected by a rigid rod (5, 105). The anchor element (3, 103) is anchored within the lower section of the shaft (20) that has a substantially constant diameter such that the damping element (4, 104) is in contact with an internal surface of the shaft (20) to dampen vibrations therein.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: March 27, 2018
    Assignee: PRO-CORE TECHNOLOGIES LIMITED
    Inventor: David Raymond Hicks
  • Patent number: 9793636
    Abstract: The object of the present invention is an insulating body (1) for a pluggable connector (10) intended to be connected to a junction block (100), said insulating body (1) comprising a housing (2) for conductive parts (11, 12) comprising a connection terminal (11) for a conductive wire intended to be connected to the pluggable connector (10), said housing (2) comprising a support portion (6) for the connection terminal (11) and being arranged to open on a side wall (3) of the insulating body (1) via an aperture (4) arranged on said side wall (3), the insulating body (1) comprising wedging means (7), said wedging means (7) being disposed in whole or in part within a portion of the housing (2) situated facing the support portion (6) of the housing (2).
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: October 17, 2017
    Assignee: ABB SCHWEIZ AG
    Inventors: Philippe France, Romain Villard
  • Patent number: 8899470
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: December 2, 2014
    Assignee: Corning Incorporated
    Inventors: David M. Lineman, Wenchao Wang, Randy D. Ziegenhagen
  • Patent number: 8590770
    Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is a binary alloy consisting in atomic percentages, of 60% to 66% silicon and 34 to 40% nickel. A brazing composition as defined above is also provided. A paste, suspension of braze alloy comprising a powder of the brazing composition and an organic binder is provided. In addition, a joint and assembly obtained with the foregoing method is provided.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: November 26, 2013
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Valérie Chaumat, Jean-François Henne
  • Patent number: 7435377
    Abstract: A weldable ultrahard insert can include an ultrahard working layer and a weldable metal layer metallically bonded with the working layer. The ultrahard working layer can be any ultrahard material such as PCD, PCBN, metal carbide, ceramic, diamond, or the like. The weldable ultrahard inserts can be formed by charging a reaction vessel with ultrahard materials, including precursors thereof, and placing a weldable metal layer in the reaction vessel with an optional intermediate layer. The assembly can be subjected to a pressure and a temperature sufficient to metallically bond the weldable metal layer to the ultrahard material. The weldable layer is formed as part of the insert in situ which facilitates subsequent welding of the insert to a tool substrate without risking damage to the ultrahard material.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: October 14, 2008
    Assignee: ADICO, Asia Polydiamond Company, Ltd.
    Inventors: Hyun Sam Cho, Kyung Ryul Han, Tim Valentine
  • Patent number: 7043822
    Abstract: A method of manufacturing a commutator of a rotary electric machine includes a step of forming a first unitary material having nail portions, a step of forming a second unitary material for the commutator segments, a step of fixing the first unitary material and the second unitary material together to form a pre-commutator unit so that the nails extend radially outward from the periphery of the pre-commutator unit, a step of inserting the pre-commutator unit between a pair of dies so that the dies hold the nails without a gap, and a step of charging liquid resinous material into the inside of the dies to mold the pre-commutator unit.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: May 16, 2006
    Assignee: Denso Corporation
    Inventors: Masayuki Kobayashi, Eiji Iwanari
  • Patent number: 6698242
    Abstract: In the method according to the invention cold or unheated hardened glass and/or glass-ceramic parts are bonded together with a metallic ductile joining material, preferably silver, copper, aluminum or an alloy of those metals, to form a brittle article. The parts to be joined in an initial unheated state are placed with the metallic ductile joining material between them in a high frequency alternating field with frequencies preferably from 100 to 500 kHz. Then the joining material is inductively heated locally to melt it by means of the alternating field and the parts are pressed together to form a sufficiently strong bond between the parts.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: March 2, 2004
    Assignee: Schott Glas
    Inventors: Wolfram Beier, Ulrike Beer, Roland Schnabel, Evelin Weiss, Stefan Hubert, Patrik Schober, Rainer Liebald
  • Patent number: 6634082
    Abstract: A method for making a carbon commutator assembly by forming an annular carbon cylinder of a conductive carbon composition and metalizing an inner surface of the carbon cylinder by bonding a first layer of metallic material to the inner surface of the carbon cylinder. A metallic substrate is soldered to the metalized inner surface of the carbon cylinder and an insulator hub is disposed in a position supporting the metallic substrate and carbon cylinder. The carbon cylinder and substrate are then segmented by forming radial interstices through the carbon cylinder and the metallic substrate thus forming a carbon/metal commutator array comprising electrically isolated carbon/metal commutator sectors.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: October 21, 2003
    Inventors: William E. Ziegler, William A. Bauer
  • Patent number: 6582548
    Abstract: A method for bonding an oxide-containing member to an aluminum surface, includes the steps of: providing a substrate, wherein a portion of a surface of the substrate has aluminum thereon; positioning an oxide-containing member on the aluminum surface of the substrate; and bonding the oxide-containing member to the aluminum surface by pressing the oxide-containing member against the aluminum surface while simultaneously heating the interface between the oxide-containing member and the aluminum surface. The interface between the oxide-containing member and the aluminum surface is heated with a laser.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: June 24, 2003
    Assignee: TriQuint Technology Holding Co.
    Inventors: Mindaugas Fernand Dautartas, Frank Stephen Walters
  • Patent number: 6410161
    Abstract: A metal-ceramic joint assembly in which a brazing alloy is situated between metallic and ceramic members. The metallic member is either an aluminum-containing stainless steel, a high chromium-content ferritic stainless steel or an iron nickel alloy with a corrosion protection coating. The brazing alloy, in turn, is either an Au-based or Ni-based alloy with a brazing temperature in the range of 9500 to 1200° C.
    Type: Grant
    Filed: April 15, 1999
    Date of Patent: June 25, 2002
    Assignee: FuelCell Energy, Inc.
    Inventor: Jian Li
  • Patent number: 6399019
    Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: June 4, 2002
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Masami Sakuraba, Masami Kimura, Masaya Takahara, Junji Nakamura
  • Patent number: 6354484
    Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: March 12, 2002
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Masami Sakuraba, Masami Kimura, Masaya Takahara, Junji Nakamura
  • Patent number: 6347982
    Abstract: A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: February 19, 2002
    Assignee: Speedfam-Ipec Corporation
    Inventor: Paul Holzapfel
  • Publication number: 20010044999
    Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.
    Type: Application
    Filed: March 9, 2001
    Publication date: November 29, 2001
    Applicant: CoorsTek, Inc.
    Inventors: Marcus A. Ritland, Dennis W. Readey, Richard N. Kleiner, Jack D. Sibold, Kyle Knudson, Steven Landin, Paul Thoen
  • Patent number: 6319617
    Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: November 20, 2001
    Assignee: Agere Systems Gaurdian Corp.
    Inventors: Sungho Jin, Guenther Wilhelm Kammlott, Hareesh Mavoori, Ainissa G Ramirez
  • Patent number: 6315843
    Abstract: A method of manufacturing a sliding component comprising a main body made of a non-carburized heat-hardened steel and a member adapted to form at least one sliding face of sliding faces of the sliding component and heat-joined to the main body, in which the steel-made main body is heat-hardened before heat-joining to the member and the heat-joining between the main body made of the heat-hardened steel and the member is conducted at a lower temperature than the temperature at which the heat-hardened main body has been heat-hardened. The sliding component is superior in hardness and abrasion resistance and is readily manufactured at a reduced cost.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: November 13, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Matsuura, Akira Yamakawa
  • Patent number: 6306516
    Abstract: The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: October 23, 2001
    Assignee: Agere Systems Guardian Corp.
    Inventors: Sungho Jin, Hareesh Mavoori, Ainissa G Ramirez
  • Patent number: 6247221
    Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal. Methods for joining infiltrated ends are also provided.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: June 19, 2001
    Assignee: Coors Tek, Inc.
    Inventors: Marcus A. Ritland, Dennis W. Readey, Richard N. Kleiner, Jack D. Sibold, Kyle Knudson, Steven Landin, Paul Thoen
  • Patent number: 6197435
    Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.
    Type: Grant
    Filed: October 20, 1998
    Date of Patent: March 6, 2001
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshihiko Tsujimura, Miyuki Nakamura, Yasuhito Fushii
  • Patent number: 6020076
    Abstract: A joined ceramic structure including a ceramic member and a metallic joining member joined to each other through a joining layer made of a brazing material wherein a metallic member is buried in the ceramic member in the state that a metal-exposed portion is formed through partial exposure of the metallic member from such a joining surface of the ceramic member as contacting said joining layer, and the ceramic member and the metal-exposed portion are also joined to the joining layer along the joining surface of the ceramic member.
    Type: Grant
    Filed: February 2, 1996
    Date of Patent: February 1, 2000
    Assignee: NGK Insulators, Ltd.
    Inventors: Tomoyuki Fujii, Ryusuke Ushikoshi
  • Patent number: 6000243
    Abstract: A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plastic, or alloys, etc., which have a moderate melting point with a gradual softening point curve, involves the application of an active vacuum source to evacuate interstices between the substrates while at the same time providing a positive force to hold the parts to be bonded in contact. This enables increasing the temperature of the bonding process to ensure that the softening point has been reached and small void areas are filled and come in contact with the opposing substrate. The process is most effective where at least one of the two plates or substrates contain channels or grooves that can be used to apply vacuum between the plates or substrates during the thermal bonding cycle.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: December 14, 1999
    Assignee: The Regents of the University of California
    Inventors: James C. Davidson, Joseph W. Balch
  • Patent number: 5942185
    Abstract: Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provided are electronic products prepared using this lead-free solder. The lead-free solder has a solder composition including 3-5% Zn and 10-23% Bi, the balance being Sn. Preferably, the solder composition is a composition (Sn, Zn, Bi) surrounded by lines connecting A and B, B and C and C and A, where A is (85, 5, 10 ), B is (72, 5, 23) and C is (76, 3, 21), of a ternary diagram having pure Sn, pure Zn and pure Bi at the vertices of an equilateral triangle. Through use of this solder, it is possible to solder parts, etc. on conventionally employed organic substrates at reflow temperatures equivalent to those for conventional Pb--Sn eutectic solders. The solder does not damage the environment, can be stably supplied and is low in cost.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: August 24, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuya Nakatsuka, Tasao Soga, Hanae Shimokawa, Kenichi Yamamoto, Masahide Harada, Yuuji Ochiai, Tsuneaki Kamei
  • Patent number: 5900097
    Abstract: There is provided a method of fabricating a laminated composite material and laminated composite materials fabricated thereby wherein the method includes the initial step of forming a pre-laminate by overlaying a first layer characterized by a first thermal expansion coefficient and a first ductility parameter with a second layer characterized by a second thermal expansion coefficient and a second ductility parameter. The pre-laminate is heated to a temperature at which the first ductility parameter becomes substantially equivalent in value to the second ductility parameter. The first and second layers of the heated prelaminate are then pressed together, preferably by use of a rolling mill technique, with sufficient compression force to cause the layers to adhere one to the other, thus forming a core laminate. Preferably, the core laminate is divided, either by cutting or folding, into a plurality of divided laminate members.
    Type: Grant
    Filed: October 30, 1996
    Date of Patent: May 4, 1999
    Inventor: Dennis P. Brown
  • Patent number: 5882784
    Abstract: A metal-film laminate including a metal plate and a biaxially oriented polyester-group film laminated on the metal plate. The orientation degree of the film is controlled such that, when the thickness of the film is represented by T and the mean orientation degree of the film in the area from the metal-plate side surface to a position of T/2 in the thickness direction of the film is represented by X, the orientation degree of the film in the area from the metal-plate side surface to the position of T/2 is in the range of X.+-.0.5X and an orientation degree of the film at the non-metal-plate side surface is not less than 2X. When the metal-film laminate is processed by drawing etc., an excellent drawing property and an excellent impact resistance of an obtained metal-film laminated product can be achieved.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: March 16, 1999
    Assignee: Toray Industries, Inc.
    Inventors: Takashi Sumiya, Iwao Tanaka, Kunio Shibatsuji, Hirokazu Kurome, Seiya Sugiura, Wataru Ooe
  • Patent number: 5831309
    Abstract: Semifinished products designed as composite bodies for electronic or opto-electronic semiconductor components are known. The composite bodies are made of a disk-shaped, transparent quartz glass substrate and a wafer made of a semiconductor material. The directly bonded surfaces of the quartz glass substrate and wafer are polished before being mutually bonded. In order to create a semifinished product that resists temperatures above 900.degree. C., such as those used to produce semiconductor circuits in industrially feasible times, without raising fears of a substantial reduction of the adhesive forces, chipping of the wafers away from each other or an undesirable deformation of the composite body, the substrate quartz glass is a synthetic quartz glass with at least 10.sup.14.0 poise viscosity at 950.degree. C. which does not fall below 10.sup.12 poise at 1050.degree. C.
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: November 3, 1998
    Assignee: Heraeus Quarzglas GmbH
    Inventors: Wolfgang Englisch, Reinhold Uebbing
  • Patent number: 5700373
    Abstract: A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantially fill the void space. The ceramic filter is cooled to form a filter having a ceramic-metal composite portion. The present invention also provides a filter having an infiltrated metal seal.
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: December 23, 1997
    Assignee: Coors Ceramics Company
    Inventors: Marcus A. Ritland, Dennis W. Readey, Richard N. Kleiner, Jack D. Sibold
  • Patent number: 5534103
    Abstract: Proposed is a method for bonding of a ceramic body and a metallic body at a relatively low temperature not to cause substantial deformation or material degradation of the ceramic and metallic materials. The surface of the ceramic body is first irradiated with laser beams in vacuum so that the inorganic non-volatile constituent of the ceramic material, e.g. silicon when the ceramic is silicon nitride, is isolated on the surface of the ceramic body forming a layer. Thereafter, the metallic body is brought into contact with and pressed in vacuum against the thus laser beam-irradiated area of the ceramic body under an adequate pressing force and at an elevated but relatively low temperature which is, for example, not higher than 0.5Tm .degree.C., Tm .degree.C. being the melting point of the metallic material, so that the ceramic and metallic bodies are firmly bonded together.
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: July 9, 1996
    Assignee: Japan as represented by Director General of Agency of Industrial Science and Technology
    Inventors: Tetsuo Yano, Toshihiko Ooie, Masafumi Yoneda, Akihiro Utsumi, Munehide Katsumura, Jun Matsuda
  • Patent number: 5465898
    Abstract: A process is provided where a ceramic metal substrate is produced by attaching metal foils on either side a ceramic layer to form metal layers and for producing a through connection by placing metal in an opening to form a bridge so that the metal layers are electrically connected together by direct bonding, and a metal body is inserted into the opening to almost fill it, while a surface of the metal body is provided with a layer with chemical compound of metal and reactive gas.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: November 14, 1995
    Inventors: Jurgen Schulz-Harder, Peter H. Maier
  • Patent number: 5294241
    Abstract: A method for making a seal between a sealing glass and titanium by forming a nitride layer on the titanium and then sealing the glass to the nitrided titanium. The formation of the nitride layer can be accomplished by the steps of placing the titanium in a substantially oxygen-free atmosphere comprising a major amount of an inert gas and a minor amount of nitrogen and heating the titanium in that atmosphere to a temperature of at least 300.degree. C. The method allows for the formation of the nitride layer and the glass seal in a single operation. The method works well in the manufacture of feedthroughs with conventional processing equipment.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: March 15, 1994
    Assignee: Medtronic, Inc.
    Inventors: William J. Taylor, Joseph F. Lessar, Weiss J. Douglas, Charles N. Wilson
  • Patent number: 5262347
    Abstract: A method of bonding together two dissimilar planar bodies, one of which is a semiconductor. A film of palladium is deposited on one of the bodies. The two bodies are pressed together with moderate force with the palladium in between. The palladium chemically reacts with the semiconductor and, at least in the case of GaAs, dissolves the surface oxide and forms a crystalline palladium/semiconductor product topotaxial with the semiconductor.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: November 16, 1993
    Assignee: Bell Communications Research, Inc.
    Inventor: Timothy D. Sands
  • Patent number: 5178319
    Abstract: Elements such as glass spheres (11) and optical fibers (30') are permanently bonded to aluminum surfaces (13) of substrates (12) by applying pressure along with energy to the interface of the element and the aluminum. For example, a glass sphere is bonded by pressing it against aluminum while heating the aluminum. As an alternative to heating, acoustic energy can be applied to the sphere along with the pressure. Glass optical fibers can be bonded to aluminum surfaces in the same manner.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: January 12, 1993
    Assignee: AT&T Bell Laboratories
    Inventor: Alexander Coucoulas
  • Patent number: 5143275
    Abstract: An improved method for repairing a damaged portion of a glass layer of glass-lined equipment. In the method, a metallic fiber-containing sheet made of a metallic fiber-containing web, a metallic woven fabric sheet or a metallic nonwoven fabric sheet is disposed on the metal substrate of the damaged portion exposed by grinding, and the metallic sheet is welded partially to the metal substrate underlying the glass layer by a resistance or spot weld. After solidification of the repairing agent, e.g., of a sol-gel solution containing a metallic alkoxide which has been applied onto the partially welded sheet(s) and the sol-gel solution impregnated therein, the reapiring glass layer is formed integrally together with the sheet(s) by heating the damaged portion at a temperature from about 300.degree. to about 350.degree. to avoid the occurence of cracks on the glass layer surrounding the damaged portion.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: September 1, 1992
    Assignee: Shinko Pantec Co., Ltd.
    Inventors: Tatsuo Hara, Akihiko Hogetsu, Shigeo Uegaki
  • Patent number: 5106434
    Abstract: In heat-connections between metal and ceramic, martensite stainless steel or martensite heat-resistant steel which can be hardened by quenching in a gas or vacuum after having been heated beyond the quench hardening temperature thereof are used as metal. The heat connection is by brazing or shrinkage fit at 800.degree. C. or more. Stress strain caused by a difference in thermal expansion coefficient between the two can be reduced. Further, since the metal can be connected to the ceramic while hardening the metal, man-hours can be reduced markedly.
    Type: Grant
    Filed: April 16, 1991
    Date of Patent: April 21, 1992
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Noboru Ishida, Masaya Ito, Mitsuyoshi Kawamura
  • Patent number: 5074941
    Abstract: Metal-ceramic interfaces of enhanced strength are produced by positioning bodies of ceramic oxides and transition element metals or alloys containing such in abutting relationship, and heating in air at a temperature ranging from 500.degree. C. to just below the melting point of the metal of the metal body to join said bodies and then subsequently heat treating said joined bodies in a reducing atmosphere at a temperature in the range of 300.degree. C. to 1200.degree. C. to form intermetallic compound layer at the interface.
    Type: Grant
    Filed: December 10, 1990
    Date of Patent: December 24, 1991
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Stephen L. Sass, Rishi Raj, Fuh-Sheng Shieu
  • Patent number: 5066547
    Abstract: In heat-connection between metal and ceramic, martensite stainless steel or martensite heat-resistant steel which can be hardened a gas or vacuum after having been heated beyond the quenching temperature thereof are used as metal. The heat connection is brazing or shrinkage fit at 800.degree. C. or more. Stress strain caused by a difference in thermal expansion coefficient between the two can be reduced. Further, since the metal can be connected to ceramic while hardening the metal, man-hour can be reduced markedly.
    Type: Grant
    Filed: July 24, 1989
    Date of Patent: November 19, 1991
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Noboru Ishida, Masaya Ito, Mitsuyoshi Kawamura
  • Patent number: 5058799
    Abstract: A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and a layer of electrically conductive material. The metallized ceramic substrate is made by a process which includes an acid etchant step that increases the actual surface area of the treated surface of the ceramic workpiece without undermining the integrity of the ceramic surface while at the same time selectively attacking vitreous binder phase present between substrate grains and creating even deeper penetration at the relatively higher energy triple joint junctures. In this manner, metal anchor sites that enhance adhesion are provided. During subsequent high temperature firing these anchors hold the resulting composite together as a chemical bond is formed in addition to a mechanical bond or interlock.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: October 22, 1991
    Inventor: Kalman F. Zsamboky
  • Patent number: 5054683
    Abstract: A method is set forth of bonding together two bodies (1, 2), according to which a first body (1) is provided with a flat surface (5) and the second body (2) is provided with a silicon oxide layer (4) with a flat surface (6), after which a connecting layer (7) containing boron is provided on at least one of the two flat surfaces. Subsequently, the two bodies (1, 2) are pressed together at elevated temperature, so that a borosilicate glass layer is formed. According to the invention, a layer of practically pure boron is used by way of connecting layer (7). Among the advantages of this is that the composition of the borosilicate glass layer is exclusively determined by the previously chosen layer thicknesses.
    Type: Grant
    Filed: August 29, 1990
    Date of Patent: October 8, 1991
    Assignee: U.S. Philips Corporation
    Inventors: Jan Haisma, Gijsbertus Spierings, Joseph G. Van Lierop, Hendrik F. Van Den Berg
  • Patent number: 5046242
    Abstract: A cochlear prosthetic package having a cup-shaped titanium case with a ceramic plate; a plurality of hermetically-sealed feedthroughs are formed in the plate by sintering the plate with hollow metallic tubes located in plate holes and then sealing at least one end of each tube. An electrode cable connector is provided which allows removal and replacement of a case even in the presence of body fluids. A telemetry coil is contained in a metallic tube which extends out of the case; the coil-containing tube has its two ends hermetically-sealed to the case by ceramic insulating bushings.
    Type: Grant
    Filed: May 11, 1989
    Date of Patent: September 10, 1991
    Assignee: Commonwealth of Australia
    Inventor: Janusz Kuzma
  • Patent number: 5007575
    Abstract: The invention relates to a device for producing essentially cone-shaped flat bodies, whose surface area consists of n attached segments, (preferably 4, 6, 8), each composed of a number of attached glass pieces connected to one another, particularly Tiffany-style lampshades, whereby the boundary lines of adjoining segments lie in a common plane or a straight line, having a base body or form cone for placing glass pieces to be soldered, a bottom plate placed at the form cone and a rod, that is positioned in the middle of the bottom plate and form cone.
    Type: Grant
    Filed: May 24, 1989
    Date of Patent: April 16, 1991
    Inventor: Peter Degenhardt
  • Patent number: 4962879
    Abstract: A method for bubble-free bonding of silicon wafers to silicon wafers or silicon wafers to quartz wafers either outside or inside a Clean Room. The method includes the steps of positioning wafers in closely spaced-apart and parallel relationship to each other in a rack or the like with mirror-polished surfaces of the wafers facing each other, cleansing the mirror-polished surfaces with a hydrophilization cleansing solution, flushing the cleansing solution from the mirror-polished surfaces of the wafers with deionized water, drying the wafers in a spin-dryer, and moving the wafers together so that contact occurs between opposing mirror-polished surfaces of the wafers and bonding occurs. The bonded wafers are then placed into a wafer shipping and storing container for improved wafer storage performance.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: October 16, 1990
    Assignee: Duke University
    Inventors: Ulrich M. Goesele, Volker Lehmann
  • Patent number: 4902358
    Abstract: A method for forming extremely strong ceramic-to-metal joints is provided which is particularly applicable to the formation of components for internal combustion engines. The present method simultaneously brazes a ceramic to a metal and creates a normallized microstructure and desired mechanical in the metal in a single heating step. The ceramic is metallized, a suitable alloy is applied, and the ceramic-alloy-metal composite is first heated to about 160.degree. F. to 1750.degree. F. for about one hour and then gas quenched in nitrogen or argon, or a gas with similar heat transfer capabilities.
    Type: Grant
    Filed: November 16, 1988
    Date of Patent: February 20, 1990
    Assignee: Cummins Engine Company, Inc.
    Inventors: Buel D. Napier, George W. Wolter, Renita G. King
  • Patent number: 4883215
    Abstract: A method for bubble-free bonding of silicon wafers to silicon wafers or silicon wafers to quartz wafers either outside or inside a Clean Room. The method includes the steps of positioning wafers in closely spaced-apart and parallel relationship to each other in a rack or the like with mirror-polished surfaces of the wafers facing each other, cleansing the mirror-polished surfaces with a hydrophilization cleansing solution, flushing the cleansing solution from the mirror-polished surfaces of the wafers with deionized water, drying the wafers in a spin-dryer, and moving the wafers together so that contact occurs between opposing mirror-polished surfaces of the wafers and bonding occurs.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: November 28, 1989
    Assignee: Duke University
    Inventors: Ulrich M. Goesele, Reinhard J. Stengl
  • Patent number: 4762269
    Abstract: Silicon carbon molded parts, whether made of silicon carbide sintered together in the absence of pressure or hot pressed silicon carbide are bonded together at close fitting surfaces by applying a layer not thicker than 1 .mu.m on polished surfaces to be joined, containing at least one carbide and/or silicide forming element from the group Ag, Al, Au, B, Be, Co, Cr, Cu, Fe, Mg, Mn, Mo, Nb, Ni, Pd, Pt, Ta, Ti, V, W and Zr. The surfaces to be joined are than fitted together and heated in an inert or reducing atomosphere at a pressure between 10.sup.-1 and 10.sup.-5 Pa at temperatures in the range 800.degree. to 2200.degree. C. while under a pressure applied which is between 1 and 100 MPa. In particular, the heat treatment range from 1550.degree. C. to 1750.degree. C. under a pressure of 15 to 45 MPa applied pressure in argon at a pressure of from 10.sup.3 to 10.sup.5 Pa argon, for 30 to 60 minutes. Preferably a thin layer is vapor-deposited or sputtered.
    Type: Grant
    Filed: May 23, 1986
    Date of Patent: August 9, 1988
    Assignee: Kernforschungsanlage Julich GmbH
    Inventors: Erno Gyarmati, Aristides Naoumidis
  • Patent number: 4693409
    Abstract: A laminated body comprising a ceramic member and a metal member, and a method of forming the laminated body are described. The laminated body is characterized in that the ceramic member contains in its surface portion a bonding agent and the metal member is directly bonded to the surface of the ceramic member. The method of forming the laminated body is characterized in that a bonding agent-containing layer is first formed in the surface of the ceramic member and then the bonding agent-containing layer is heated while being contacted with the metal member.
    Type: Grant
    Filed: February 4, 1985
    Date of Patent: September 15, 1987
    Assignee: Tokyo Shibarua Denki Kabushiki Kaisha
    Inventors: Nobuyuki Mizunoya, Hajime Kohama, Yasuyuki Sugiura
  • Patent number: 4690793
    Abstract: The nuclear fusion reactor of the present invention presents a new vacuum vessel for enclosing plasma particles where a reactor wall exposed to the above plasma particles has a piled structure. A plurality of heat-resisting ceramic tiles are metallurgically bonded to a metal-base body having a cooling means through a brazing material. The ceramic tiles are preferably composed of sintered silicon carbide of high density and containing a little beryllium oxide between the boundaries of crystal grains.
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: September 1, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Hisanori Okamura, Kunio Miyazaki, Hirosi Akiyama, Shinichi Itoh, Tomio Yasuda, Kousuke Nakamura, Yukio Okoshi, Mutuo Kamoshita, Akio Chiba
  • Patent number: 4631099
    Abstract: A method for the adhesion of oxide type ceramics and copper or a copper alloy is provided by this invention, which method comprises placing the oxide type ceramics and the copper or copper alloy in mutual contact, heating them in an oxidative atmosphere thereby effecting adhesion thereof, and rapidly cooling the resultant composite of adhesion. The adhesive strength of the composite of adhesion so produced is about 40% higher than the adhesive strength of a similar composite of adhesion obtained by the conventional method involving gradual cooling.
    Type: Grant
    Filed: January 4, 1985
    Date of Patent: December 23, 1986
    Assignee: Agency of Industrial Science & Technology
    Inventors: Yoshihiro Ebata, Saburo Kose, Ryozo Hayami
  • Patent number: 4610934
    Abstract: A silicon carbide-to-metal joint includes a thin layer of metal adherent to the ceramic material, a compliant layer of metal overlying the thin metal layer and a brazing alloy in contact with the metal to which the ceramic material is joined.A method for preparing a silicon carbide surface for joining by metallic brazing to a metal includes the steps of applying a thin layer of metal adherent to the ceramic surface followed by application of a compliant layer of metal.Also described is an easily brazable silicon carbide article which includes a silicon carbide substrate, a thin electrically conductive adherent metal layer overlying the substrate and a compliant metal layer overlying the thin metal layer.
    Type: Grant
    Filed: January 17, 1985
    Date of Patent: September 9, 1986
    Assignee: Kennecott Corporation
    Inventors: Wolfgang D. G. Boecker, Laurence N. Hailey
  • Patent number: 4608166
    Abstract: A filter suitable for press fitting into an assembly for inline filtration is disclosed. The filter includes a base, filtration material supported on the base, and a metal collar surrounding at least a portion of the base with a portion of the metal collar embedded in the base. The leading edge of the collar and anchor tabs on the distal end of the collar are embedded in the base and thus secure the collar to the base. The collar also has a rounded entry corner which provides a smooth entry into the press fit hole when the filter is pressed into place.
    Type: Grant
    Filed: April 1, 1985
    Date of Patent: August 26, 1986
    Assignee: Filtertek, Inc.
    Inventor: Thomas A. Cain