Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.

Abstract: A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.

Abstract: A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.

Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.

Abstract: An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body.

Abstract: A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

Abstract: An assembly for clamping electrical components against a heat-dissipating surface of a heat sink may include the heat sink, one or more electrical components, two or more springs, and a fastener. Each of the springs may include a first surface, and a second surface opposite the first surface. The second surface of each of the springs may include an attachment region and two contact regions. The attachment region may be between the two contact regions. The second surface of one of the springs may overlap the first surface of another one of the springs. Each of the springs may be positioned to hold the electrical components against the heat dissipating surface of the heat sink. Each of the two contact regions of each of the springs may be positioned to hold the electronic components against the heat-dissipating surface. The fastener may couple the springs together in the attachment region of each of the springs and may further couple the springs to the heat sink.

Abstract: The present invention relates to a cooling module retentioner, which includes a fixing base and a flexible frame. The fixing base surrounds a heat-generating electronic component at a center and allows the placement of a cooling module therein, and a rising corner column is disposed at each of four corners thereof and each corner column has a snap hole; the flexible frame is composed of two M-like retention brackets whose bottom sides are mounted with a retention hook respectively for the corresponding snap hole, a lever is pivotally disposed at a lower center location thereof and pertains to a metal rod whose one end is integrally bent to form a protruded portion. The production process requires no mold so as to simplify the production process and reduce the production cost.

Abstract: A method of installing electrical cabling by securing an electrical cable clip to a structure using a fixing element that passes through the clip into the structure, subsequently inserting one or more electrical cables into a cable receiving channel defined by the clip and securing the electrical cables in that channel. The structure will typically be the wall of a building or the like and the fixing element is preferably a nail that is fired through the base portion of the electrical cable clip by means of a nail gun.

Abstract: A clip has an opposed jaw end, a bridged back end and defines a slot extending across the bridged back end. It is connected to an article, for example, another clip or a float, which has an enlarged spherical head extending longitudinally therefrom. The head of the post has a diameter which is slightly greater than the width of the slot so that the connected item has rotational freedom of movement by receipt of the spherical head through the slot.

Abstract: A heat sink assembly for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a heat sink (20) resting on the electronic component, and a fastener assembly (30) for securing the heat sink to the electronic component. The fastener assembly includes a hollow post (36) having a threaded hole (360) defined therein, a screw (32) threadedly engaged in the threaded hole, a coil spring (34) compressibly disposed between the heat sink and a top portion of the screw, and a latch (38) pivotably engaging with a bottom portion of the post. When the screw moves downwardly towards the printed circuit board, the latch is pushed by the screw to rotate and press the heat sink towards the printed circuit board, thus securing the heat sink to the electronic component.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A wristband and clasp for securing the wristband to a person is disclosed. The wristband includes at least one attachment aperture. The clasp includes a folding base having a first triangular section connected to a second triangular section and a hinge connecting the first and second triangular sections. The hinge defines a folding axis that enables the base to be folded so that the first triangular section is positioned adjacent to the second triangular section in an overlapping relationship. A securement aperture is formed in the first triangular section, and a post extends from the second triangular section to couple with the securement aperture when the base is folded along the folding axis. The post extends from the second triangular section through the attachment aperture of the wristband and couples to the securement aperture of the first triangular section so that the clasp is secured to the wristband.

Abstract: A mounting device for a heat sink (200) includes a pair of pivot members (10), two joining members (30), and two pairs of spring members (20). Each pivot member includes a clipping portion (11) for clasping the electric unit (300). The joining members pivotably connect with the pivot members. Each joining member includes a pressing portion (310) for resiliently abutting against the heat sink toward the electric unit. The spring members each includes two end catches (21), (22) secured with the joining member and a corresponding member and capable of providing resilient torsions to drive the clipping portions to engage with the electric unit when the clipping portions rotate to one position away from the electric unit.

Abstract: An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf springs in contact with the top plate, a leaf spring cradle that carries the leaf springs, with the cradle including upper projections that project through corresponding slots in the top plate, a pin inserted through openings in the upper projections, and a linear slide cam located on an upper surface of the top plate between the upper projections and further located below the pin. The cam operates in a first position to transfer a load the replaceable component to securely hold the replaceable component to the integrated circuit and a second position to allow placement of the replaceable component on the integrated circuit.

Abstract: A retention mechanism (6, 6′) for an LGA package assembly (1, 1′) consists of a spring clip (60, 60′) and a lever (62, 62′) both attached to a heat sink (5, 5′). The spring clip has a biasing strip (612, 612′) and a pair of opposite engaging legs (610, 610′). The lever includes an arcuate section (680, 680′) positioned beneath the biasing strip, whereby the lever is rotatable from a vertical position where the arcuate section is contained in a plane parallel with the biasing strip to a horizontal position where the arcuate section is contained in a plane perpendicular to the biasing strip and engages with the biasing strip. When the lever is rotated to the horizontal position, the biasing strip is biased upwardly to cause the engaging legs to abut against a bottom surface (22) of a PCB (2), whereby the components of the LGA package assembly are mechanically and electrically connected to one another.

Abstract: A heat sink assembly for use with an electronic IC chip (4) includes a socket (30), a heat sink (2), a pair of mounting clips (32) and a pair of retention modules (31). The heat sink abuts against the chip and has a plurality of cooling fins (21) extending upwardly from a base (20) and a pair of securing flanges (22) extending outwardly from the base. Each retention module defines a protrusion (313) on a first sidewall (311) and a latch (314) on a second sidewall (312). Each mounting clip forms a base member (320) defining two apertures (327) for receiving the protrusions. An arm (321) with a notch (325) defined on a free end thereof is formed at either lateral end of the base member for engaging with the latches. A retaining clip (322) extends downwardly and inwardly from the mounting clip for pressing against the securing flange.

Abstract: An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.

Abstract: An intubation device and a method of intubating a patient with an endotracheal tube is disclosed. The device comprises a housing and a flexible, tubular sheath having one end connected to the housing and a free end extending away from it. The sheath, which is adapted to fit within the endotracheal tube, also has a special light at the end of the sheath's free end for selectively providing illumination. In use, the sheath is inserted into the endotracheal tube until the light is at the end of the distal end of the tube. A clamp on the intubation device then clamps the endotracheal tube to the housing to prevent relative movement between the tube and the sheath. A tube stop is then slid along the sheath into abutting contact with the proximal end of the endotracheal tube to identify the location on the sheath corresponding to the proximal end of the tube. When the tube is properly positioned in the patient, the light will create a distinct glow visible to an observer in the area of the sternal notch.

Abstract: A clamp for gripping an elongate member comprises a mounting block having locating structures defining a desired position for the elongate member. Primary and secondary clamping yokes are each movable relative to the mounting block between a closed position, in which the clamping yoke engages an elongate member in the desired position, and an open position. A latch retains the primary clamping yoke in the closed position, and a force-transfer arm is effective between the primary clamping yoke and the secondary clamping yoke for retaining the secondary clamping yoke in its closed position when the primary clamping yoke is in its closed position.

Abstract: An improved bag shut-off clamp is disclosed. The clamp comprises curved resilient first and second legs connected by an integral hinge. The clamp includes means for holding the ends of the first and second legs together for engaging transversely a closable bag having a neck interposable intermediate the first and second legs at the neck thereof for closing the bag at the neck. The clamp includes means for biasly urging opposed surfaces of the first and second legs engaging the neck substantially continuously together along the length thereof. The clamp further includes means for manually engaging the legs in biased relation. The clamp further includes means for localizing pressure along the length of the neck engaged between the legs, thereby sealingly closing the bag at the neck.