Abstract: A method for slicing wafers from a workpiece using a sawing wire, wherein at least two wire guide rolls clamp a wire web, each wire guide roll having a multiplicity of grooves in its lateral surface, wherein at least one groove in which no wire is inserted during the wire sawing is present alongside a wire-guiding groove and, after wear on the wire-guiding grooves or after a defined number of sawing processes, the sawing wire is wound over into the previously unoccupied grooves that are not yet worn or used, respectively.

Abstract: A wire disposing assembly having a support, an axial traverser sub-assembly, a support arm, and a linear stage is provided. The support is configured to receive a plurality of turns of a wire, where the support is configured to rotate. The axial traverser sub-assembly is operatively coupled to the support. Further, a rate of motion of the axial traverser sub-assembly is coupled to a speed of rotation of the support. The support arm includes a resin unit configured to dispose resin on at least a portion of the wire, and a wire disposing device configured to guide a portion of the wire being disposed on a surface of the support. The linear stage is operatively coupled to the support arm.

Abstract: A coil forming apparatus for forming a continuous-pole coil having a plurality of single-pole coils includes a winding jig rotatable around a center swing axis. The winding jig includes: a holder rotatable around a center axis of rotation different from center swing axis; and a plurality of coil bobbins arranged around said holder and mounted for reciprocal movement between advanced and retracted positions relative to the holder. Each individual coil bobbin has a winding axes which can be aligned with the center swing axis by turning the winding jig around the center axis of rotation. The single-pole coils having little twist can be stably formed for any coil bobbin to thereby form the continuous-pole coil.