Abstract: A method of building an insulation system around a naked conductor section of a power cable. The insulation system includes an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer. The method includes: a) placing the naked conductor section in a mold, and b) molding an insulation system around the naked conductor section, wherein the molding of the insulation system involves injecting a first semiconducting compound into a first mold cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mold cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mold cavity to form an outer semiconducting layer around the insulation layer.

Abstract: Disclosed herein are technologies related to film-insert molding (FIM) with deposited light-generating sources, such as printed light-emitting diodes. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A coaxial connector assembly for interconnection with a coaxial cable with a solid outer conductor is provided with a monolithic connector body with a bore. A mating surface with a decreasing diameter toward a connector end is provided on an outer diameter of the connector body proximate the connector end. An overbody may be provided overmolded upon a cable end of the connector body. An interface end may be seated upon the mating surface, the interface end provided with a desired connection interface. The interface end may be permanently coupled to the mating surface by a molecular bond interconnection. In a method of interconnection, the interface end is coupled to the mating surface by application of radial ultrasonic welding.

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

Abstract: A combination scoop and mold press includes two generally cup-shaped half-mold members, which engage one another at mold member edges in mirror-image alignment to form a generally enclosed mold. The half-mold members of the scoop and mold press are carried on opposite ends of a unitary piece of injection molded polymeric material, which has a live hinge joint equidistantly spaced between the mold members. Either of the half-mold members may be utilized to scoop out an appropriate mass of bait dough having at least the volume of the closed mold. At least one of the half-mold members is equipped with a notch or slit through which the shank of a fish hook, or the line which is tied to the fish hook, may pass. Finger pressure is used to bring the mold half-members together, compressing the bait dough around the hook.

Abstract: A chewable animal toy having an edible core and a tearable outer shell molded around the edible core such that a portion of the edible core protrudes from the outer shell is provided. Further provided is a mold unit for making the chewable animal toy having a first mold half including a first mold cavity and a second mold half having a second mold cavity. The second mold half is engageable with the first mold half such that the first and second mold cavities cooperatively define an outer shell mold cavity. A first pocket is defined between the first and second mold halves that is adapted to receive a first protruding portion of the edible core. A first shut off defined within the first pocket is adapted to surround the first protruding portion of the edible core such that it is substantially isolated from the outer shell mold cavity.

Abstract: An insert molding apparatus includes a first mold and a second mold. The first mold has at least two cavity plates which cooperatively define at least one receiving groove therebetween. At least two connecting elements each have its one end positioned in one of the at least two cavity plates while the other end passing through the other cavity plate for movably connecting the at least two cavity plates with each other. At least one elastic element is compressibly disposed between and against the cavity plates in such a manner such that the at least two cavity plates are capable of contacting with each other or separating from each other. The second mold is engaged with the first mold for compelling one of the at least two cavity plates to move toward the other cavity plate so that the at least two cavity plates are in contact with each other.

Abstract: An injection-molding arrangement for molding a molded part is disclosed. In particular a grommet can be molded onto a cable. The arrangement has at least two injection-molding tools, which are arranged in a holding device offset in relation to each other along a longitudinal extent of a cable located in the injection-molding arrangement and enclose at least certain portions of the cable during the injection-molding operation. Furthermore, a method of molding on a molded part and use of the injection-molding arrangement for molding on a molded part is disclosed.

Abstract: A foaming die device is provided, in which can be directly placed a basic armrest unit having a shaft element and a connecting bracket rotatably secured to the shaft element. The foaming die device comprises a lower die, an upper die, and an auxiliary die element of split type to be incorporated in a working die area defined by the lower and upper dies. The auxiliary die element comprises two die pieces that can be mated together so as to be in a slidable engagement about one end portion of the shaft element. Hence, the mated two die pieces or auxiliary die element is slidable along the shaft element for its partial engagement in a through-hole of the basic armrest unit, whereupon all the basic armrest unit and auxiliary die element may be directly placed in the working die area of lower and upper dies and subjected to foaming process.

Abstract: A building block for a ventilated wall includes an elongated center portion flanked by a pair of substantially parallel side walls oriented substantially perpendicularly to the center portion. The center portion has a first vertical wall and a second sloped wall, the second sloped wall extending between a relatively thicker bottom wall of the center portion and a relatively thinner top wall of the center portion. The first wall is co-planar with first edges of the side walls. A stacked arrangement of such blocks, where adjacent blocks are inverted and reversed, establishes front-to-back air passages that do not provide a sight line, and which prevent rain from passing through. A mold assembly for manufacturing the blocks is also disclosed.

Abstract: A foaming die device is provided, which has a closure element rotatably provided therein. The foaming die device allows a three-dimensional trim cover assembly with an opening defined therein to be placed therein and also allows a liquid foaming agent to be injected into an inside of so placed trim cover assembly for foaming operation. In operation, when the trim cover assembly is placed in foaming die device prior to the foaming operation, the closure element is able to be rotated toward and easily inserted in the opening to prevent leakage of the liquid foaming agent therethrough, whereas, when the trim cover assembly is taken out from the foaming die device subsequent to the foaming operation, the closure element is able to be rotated and easily removed from that opening.

Abstract: A semiconductor device with a sheet-like insulating substrate (101) integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads (103) in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures (703) at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material (704) to contact the pads. Metal-filled surface grooves (710) in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.

Abstract: A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mirror-finished surface at a tip end thereof is inserted into the ejector-pin-through-hole and positioned at a position where a surface of the tip end of the ejector pin coincides with an intermediate surface height of a satin-finished surface formed on an upper inner wall of the cavity of the first half. The IC structural body is then encapsulated with a molten resin, and the mirror-finished surface of the ejector pin and the satin-finished surface of the upper inner wall surface of the cavity are stamped on the semiconductor package in substantially the same plane.

Abstract: The invention concerns a formwork system (1) for forming a transition of reinforcement (8) between a concrete component and a further concrete component located adjacent thereto in a connecting direction (14), comprising two formwork elements (2, 3) and a central element (5), wherein the central element is disposed between the formwork elements in the region of one end of the formwork elements, and wherein elastic sealing lips (7) are disposed each between the formwork elements (2, 3) and the central element (5), which is characterized in that the formwork system comprises mounting positions (40–43) for spacers (6; 32–39), wherein one mounting position (41, 42) each is provided on the two outer sides, of the central element, facing the formwork elements, and one mounting position (40, 43) each is provided on the inner sides of the formwork elements opposite to these outer sides of the central element, several spacers can be mounted on top of each other at each mounting position, at least one spacer is mounted

Abstract: A hand-held void forming device, including a handle having two handle elements moveable relative to each other; and a void forming portion having two void forming elements moveable relative to each other, the void forming portion being operatively connected to the handle whereby movement of the handle elements relative to each other moves the void forming elements relative to each other.

Abstract: A system for manufacturing foamed plastics laminated panels at a high volume is disclosed. Press modules include a pair of opposed spaced open frame members with longitudinal raised sections attached to perpendicular supports. The open frame members move relative to one another, support respective panel outer skin layers; and recieve therebetween edge sealing members of a predetermined thickness. A spacing between the open frame members and a hinge is adjustable to move a first open frame member relative to a second frame member. Clamps retain the open frame members in a predetermined space relationship, and when actuated, forms a mould cavity defined by the outer skin layers and edge sealing members supported by the open frame members. An inlet introduces an a liquid foamable plastics material into the moulded cavity, and a delivery system delivers liquid reactants in predetermined proportions to a selected mould cavity formed in a selected press module.

Abstract: A structure of foaming die for forming a generally inverted-L-shaped headrest, which is designed to receive and enclose an incomplete headrest unit comprising a hollow trim cover assembly of a generally “inverted L” shape having a horizontal upper portion and a vertical head support portion, and at least one headrest stay extending vertically from the horizontal upper portion. This die structure includes die surface portions workable for receiving and enclosing a whole of the hollow trim cover assembly. A movable die element is movably provided so as to be movable toward and away from an operative position where the movable die element is normally set to receive a back cover surface region of such head support portion, thereby allowing the movable die element to be moved away from the operative position and thus allowing a resulting headrest to be removed from the die subsequent to a foaming process.

Abstract: A gasket and mandrel assembly, including a gasket having an annular main body portion with an anchor flange and a pipe sealing portion. The gasket is foldable between a folded position in which the pipe sealing portion is disposed substantially within the main body portion and an unfolded position in which the pipe sealing portion extends outwardly of the main body portion along its longitudinal axis. A pair of mandrels are respectively fitted on opposite sides of the folded gasket to enclose most of the gasket for casting the gasket within a wall in a concrete structure. At least one of the mandrels includes an annular outer surface aligned parallel or substantially parallel with the longitudinal axis of the gasket.

Abstract: In order to prevent the formation of flash and air bubbles on a gasket used to seal a filter element when the filter element is mounted in a housing to filter a fluid, a molding apparatus comprises first and second mold components cooperating to define a mold cavity positioned around the filter media formed by their respective mold surfaces and adapted to receive an expandable material forming the sealing gasket. The mold cavity includes a substantially semi-spherical ridge portion having an apex. The ridge portion of the mold cavity is formed by both the first and second mold components abutting each other at the apex of the ridge portion of the mold cavity along a mold line oriented at an angle to a central axis of symmetry of the mold apparatus. Moreover, mold surfaces of the mold components have upwardly sloping ramp surfaces for preventing trapped air bubbles.

Abstract: A foaming die for forming an armrest, which includes a pair of core die elements in addition to comprising upper and lower dies in which a trim cover assembly with a frame provided there is to be placed for foaming process. Both of the upper and lower dies have, formed therein, recessed die surfaces including local support regions in which the two core die elements can be temporarily secured together and supported against dislocation. Both two core die elements are so designed that they may respectively be attached on two lateral sides of the trim cover assembly and connected with the frame. Hence, the frame in the trim cover assembly can be positively retained in the upper and lower dies against rotation and dislocation.

Abstract: An apparatus in which a pair of hollow molding portions 53 and 54 for molding in which a terminal connecting portion with a terminal fitting 20 crimped onto a conductor 11 at a tip portion of a sheathed wire 10 is accommodated and set are provided inside a mold 50 made up by an upper mold 51 and a lower mold 52, a molding resin 30 in a molten state being injected and poured into the molding portions 53 and 54 to cover and mold the terminal connecting portion so as to provide waterproofing, the terminal connecting portion subjected to covering and molding being released from the mold so as to be removed outside the mold. A casting surface of the molding portion 53 of the upper mold 51 is provided with a gradient or a curvature for facilitating the release of the terminal connecting portion subjected to covering and molding from the mold, whereby the terminal connecting portion subjected to covering and molding remains in the molding portion 54 of the lower mold 52 during mold releasing.

Abstract: Connector terminals 13 connected to ends of respective electric wires 12 are inserted into an electric wire insertion section 11b formed in a housing body 11 of a waterproof connector 10. The connector terminals 13 are attached to respective terminal attachment sections 11a. The connector comprises a plug 14 which is molded on the outer peripheral surfaces of the electric wires 12 situated in the electric wire insertion section 11b and which is removably fitted into the electric wire insertion section 11b with a slight gap between the inner peripheral surface of the electric wire insertion section 11b and the plug 14; and a resiliently-deformable annular sealing body 15 which is retained in a retention groove formed along an outer peripheral surface of the plug 14 and which is brought into intimate contact with the inner peripheral surface of the electric wire insertion section 11b.

Abstract: A method of making a prototype golf club grip includes the steps of providing a two-piece mold having a main chamber and a pair of blind bores extending from opposed ends of the main chamber, providing a mandril having an intermediate section and opposite ends, placing the mandril in the two-piece mold with its intermediate section in the main chamber thereof and its opposite ends in the blind bores of the two-piece mold, pouring polymeric material such as epoxy into the main chamber of the two-piece mold, curing the polymeric material to form a grip blank on the intermediate section of the mandril, removing the mandril and the grip blank from the two-piece mold, and machining the grip blank to form a desired shape and features thereon to complete the prototype golf club grip.

Abstract: A holder comprising a rigid base bar having a pin end and a stabilizing end; a rigid stabilizing bar having a base end and an opposite end, with the base end of the rigid stabilizing bar being rigidly attached to the stabilizing end of the rigid base bar, and extending perpendicular to the rigid base bar; two nails being each having a head end and a pointed end, with the head end of the each nail being rigidly attached to separate points along the rigid stabilizing bar, and with the pointed end of the each nail being extended perpendicular to the rigid stabilizing bar and parallel with the rigid base bar and toward the perpendicular direction of the rigid base bar; and the rigid base bar having a bore through it in a direction parallel with the length of the rigid stabilizing bar.

Abstract: The bellows (6) of a filter cartridge is inserted into an injection-molding die (3) and provided with the plastic frame (24) by an injection-molding process. The surfaces of the die (3) that lie opposite one another are provided, at least at their edge surfaces (15), with sawtooth-like profiles (1, 2; 30, 31). The sawtooth-like profiles engage with one another and hold the individual folds (22, 23; 35, 36) of the bellows (6) in a defined position relative to one another. The bellows (6) is held by the profiles (1, 2; 30, 31) at its face edges (19) over a narrow region (18), and pressed together, forming a seal, for the injection-molding process.

Abstract: An apparatus and method for shaping and molding material having two sidewalls, two end walls, a bottom and at least one partition. The two sidewalls have grooves spaced at predetermined intervals on an inside surface for receiving a partition and a bottom ledge for retaining the bottom. The inside surface has a plurality of openings sized for receiving holding members and may have a variety of shapes. The bottom is shaped to mate with the shape of the inside surface of the sidewalls. The two end walls include locking mechanisms for holding the various components of the apparatus together.

Abstract: A placement ring assembly has inside and outside mandrels releasably fastened together to secure and align a pipe connector gasket therebetween. A permanent magnet of a magnet assembly is inserted through co-aligned openings in the mandrels and is magnetically attracted to an inner-core of a casting assembly. When the cast member is set, a mechanical release is rotated to release the magnetic attraction between the permanent magnet and the mold core. One of the mandrels may be provided with shock absorbing knockout pads while the other mandrel has openings aligned with the knockout pads to enable the knockout pads to be struck with a hammer to separate the mandrels. Rubber cushioning members absorb the shock of the impacts, protecting the mandrel from permanent damage. One-piece hole formers may likewise be provided with a magnetic assembly having a mechanic release as well as knock-out pads.

Abstract: A hole former assembly used to form a reusable hole former assembly used during the construction of a manhole base. The hole former assembly of the present invention aligns the center of the formed hole in the concrete manhole base sidewall with the center of an inlet or outlet opening of a canal bed liner embedded in the base of the manhole. The hole former assembly is suitable for use in either wet casting or dry casting the base of the manhole with the inlet and/or outlet of the invert embedded in a sidewall of the base of the manhole. Several of the component parts of the hole former assembly of the present invention may be molded as a single unit and thereafter separated, thereby reducing certain manufacturing costs of the component parts.

Abstract: A device and method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The device is formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.

Abstract: In the surface of a lower die 104 in a resin sealing mold, a region where an external leads 18 of a lead frame 12 and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region 22. The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region 24. The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.

Abstract: A placement ring assembly has inside and outside mandrels releasably fastened together to secure and align a pipe connector gasket therebetween. A permanent magnet of a magnet assembly is inserted through co-aligned openings in the mandrels and is magnetically attracted to an inner-core of a casting assembly. When the cast member is set, a mechanical release is rotated to release the magnetic attraction between the permanent magnet and the mold core. One of the mandrels may be provided with shock absorbing knockout pads while the other mandrel has openings aligned with the knockout pads to enable the knockout pads to be struck with a hammer to separate the mandrels. Rubber cushioning members absorb the shock of the impacts, protecting the mandrel from permanent damage. One-piece hole formers may likewise be provided with a magnetic assembly having a mechanic release as well as knock-out pads.

Abstract: A removable anchor positioning insert for forming a recess in a face of a concrete structure and for the simultaneous positioning of an anchor within the recess. The insert includes a resilient body having an upper surface connected to an arcuate lower surface by front and rear surfaces. An anchor placement channel extends within the body intermediate the upper face and the lower surface and includes a channel apex connecting first and second receiving bores. The first and second receiving bores extend in a downward direction from the channel apex toward the lower surface and include front and rear outlets opening adjacent the front and rear surfaces. A slot extends downwardly from the placement channel to the lower surface. The first and second receiving bores include engagement surfaces for engaging outer surfaces of first and second legs of the anchor. The first and second legs of the anchor extend downwardly from an anchor apex.

Abstract: A multi-part mold assembly, which may be incorporated in a kit assembly along with other structural components, to form a lipstick product which is either formed from a plurality of unused remnants of previously used lipstick products or a "customized" lipstick made up of a newly blended color or alternatively, a lipstick having at least two separately colored longitudinal halves. In one embodiment, the mold assembly is specifically structured to form a whole or complete lipstick product whether from the left-over portions or remnants of several lipsticks or from a one or more colors to arrive at a "customized" lip color, for example by mixing a main or base shade with another color in order to darken or lighten the main shade.

Abstract: A mold for joining conductors such as stranded cable to each other and to other elements such as a ground rod is formed of two or more parts. The mold formed by the parts includes a weld chamber. Exothermic welding material in a crucible above forms molten metal which drops into the weld chamber through a tap hole. The mold includes sleeving passages extending upwardly at an angle from horizontal to exit the mold well above the level of molten metal forming the weld. The sleeving passages extending upwardly at an angle from the weld chamber, or as a V with two symmetrical passages, are preferably larger than normal passages and accordingly will accommodate a wide variety of cable sizes without interference with or abrasion of the sleeving passages. This enables one mold to accommodate more sizes, avoids the use of packing, adapter sleeves or shims, and maintains the weld chamber well vented.

Abstract: In order to prevent the formation of flash on a gasket used to seal a filter element when the filter element is mounted in a housing to filter a fluid, such as air for an internal combustion engine, a molding method and apparatus utilizes a pair of mold components which abut along a mold line and define a cavity for forming the gasket. As the expandable material expands to fill the cavity and form the gasket, a portion of the material adjacent the mold line is received in an annular groove in one of the mold components so that flash is not formed at the mold line. One of the mold components also has an upwardly sloping ramp surface so that air and gas move along the ramp surface as the material expands and does not become trapped in the cavity, thus avoiding defects and blemishes in the gasket due to trapped air bubbles.

Abstract: A system of plastic pipes which are anchored vertically in place along a shoreline by a concrete form that will position the pipes with a specific distance between pipes. Once the pipes are positioned, a concrete cap will be poured to permanently secure the pipes, after which the concrete form can be removed and moved to a new location.

Abstract: A web for trusses, trusses with at least one chord including a cast slab and also chords for a slab in a cast member, manufactured from bar, wire or strip material, which like diagonals in a lattice girder are inclined in relation to the longitudinal direction of the chord, fastened to the chords or to the chord and slab, respectively.

Abstract: The apparatus includes an upper die, a replaceable first core member fixed to the cavity of the upper die by a screw, a titanium face plate for golf club head attached to the first core member and having notches and cuts for binding of molten alloy, a bottom die, and a second core member fixed to the cavity of the bottom die by a screw and having a projecting block raised from the top side corresponding to the sweat spot of the golf club head to be made for forming a hollow structure in the golf club head at the back of the sweat spot.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: An apparatus for making an encapsulated shelf assembly includes a mold defining a mold cavity. A shelf panel and a shelf support bracket extend partially into the mold cavity. The shelf support bracket is spaced from the sides of the mold by the head of a post on one side and a nut on the other side. The post head and nut are partially encapsulated by a moldable material injected into the mold cavity. The nut and post head are removable from the mold cavity with the encapsulated shelf assembly.

Abstract: A mold assembly for forming a panel assembly having a gasket on one surface for use as a flush-mounted panel or window in vehicles, buildings, or other structures includes a mold cavity defined in a facing surface of one mold section and a pressure pad on the second mold section, the pressure pad being urged against the surface of a sheet-like panel at a position opposite the mold cavity with the panel being held against a support surface adjacent the mold cavity when the mold sections are closed. Preferably, the pressure pad is a heat insulative pad which is urged against the panel surface by a resilient member preferably formed from urethane. The support surface and mold cavity are preferably raised above and offset from adjacent portions of the first mold section, and the size of the raised area of the support surface and mold cavity preferably corresponds in size to the area of the pressure pad.

Abstract: There is disclosed a mold for molding a box-shaped product which is open at one side face thereof, and has a resilient insert extending into an interior of the product through a side face of the product opposite to the opening. The insert has a convex portion formed on one surface thereof. A mold cavity is defined by a pair of metal mold halves and a pair of slide cores. The mold halves form an outer shape of the product, and the slide cores form an inner shape of the product. One of the slide cores has a recess for receiving the convex portion of the insert. In the molding, after a resin is cured, the other slide core is retracted before the metal mold halves are opened apart from each other, and then the one slide core with the recess is retracted.

Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.

Abstract: A loudspeaker cone assembly having a generally conical cone body and an annular flexible suspension rim. In making the cone assembly, a cone body having an outer free edge is placed within a female mold having an annular channel configured to form the suspension rim with the free outer edge of the cone exposed to the channel. A predetermined quantity of liquid plastic foam is deposited into the channel which is then substantially closed by a male die so as to seal off the cone body adjacent its outer free edge. The foam is then expanded and cured so that the resulting annular rim is integrally impregnated into the free outer edge of the cone body and forms high density closed-cell outer skin surfaces on opposite sides of a low density closed-cell inner core to provide a suspension rim having improved flexibility, strength and durability. A color coating may be applied to selective exposed surface areas of the suspension rim.

Abstract: A mold for forming coreless armatures having an upper mold and a lower mold. The lower mold has a mold cavity for receiving a shaft capable of supporting windings of a coreless armature. An elastic ring plate is placed between the upper and lower molds and is adapted for being compressed therebetween. The elastic ring plate is further adapted to contact terminal ends of the windings as they extend outside of the mold cavity, and to seal said mold cavity with the terminal ends extending therefrom.

Abstract: A resin frame such as a gasket or seal is injection-molded around the peripheral edges of a glass sheet which are positioned in a mold cavity which is defined between upper and lower molds that are brought together. Portions of the glass sheet which are spaced from the peripheral edges toward the geometric center of the glass sheet are gripped by a pair of resilient seal members mounted on the molds, respectively. A pair of protective walls is mounted on the molds, respectively, and held against surfaces of the resilient seal members which are closer to the mold cavity. The protective walls have respective distal ends spaced by a distance ranging from 0.01 mm to 0.1 mm from surfaces of the glass sheet when the molds are brought together.

Abstract: A mold arrangement for molding an optodevice onto an optical fibre ribbon. The mould includes several plates which are intended for insertion between the movable top plate and the stationary bottom plate, or counterpressure plate, of a transfer molding press, and includes an inlet channel, primary and secondary runners, and an optodevice molding cavity which is defined by two of the plates, the mould plates, when the mould is closed, and through which the fibre ribbon extends. Each of the mould plates is provided with respective front and back exchangeable jaws. One jaw of the front jaws is provided in the jaw dividing plane with V-grooves which correspond in number to the number of fibers in the fibre ribbon and in which the optical fibers from which a protective covering material has been stripped are positioned so that their centers lie in the jaw dividing plane. That side of the other jaw which lies proximal to the fibers is provided with a recess in which a pad of soft resilient material is mounted.

Abstract: Encapsulation molding equipment includes individual loading bars each having an elongated support surface which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having plural rows of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Converging gate passages and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle to the cavities. Support of the cavity inserts independent of the loading bars and resilient mounting of the loading bars is disclosed. The mold is completed by an upper mold member which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts.

Abstract: Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.