Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Abstract: The disclosure relates to a reversible, electrically controllable light transmission (RECLT) film, article of manufacture composition, process and product produced by the process, comprising a conductive narrow composition distribution polyvinylidene fluoride copolymer in combination with an electrolyte and an RECLT material. The narrow composition distribution polyvinylidene fluoride copolymer has low solubility, high thermal stability and strength, and very high optical clarity. The polyvinylidene fluoride copolymer comprises a nonporous or porous copolymer of vinylidene fluoride preferably with either hexafluoropropylene or tetrafluoroethylene or chlorotrifluoroethylene, or vinyl acetate, or combinations thereof. The RECLT material includes organic or inorganic compounds known in the art. Typical RECLT materials include electrochromic materials, reversible metal electrodeposition materials, liquid crystal materials and dispersed particle materials.

Abstract: A ferroelectric Pb5Ge3O11 (PGO) thin film is provided with a metal organic vapor deposition (MOCVD) process and RTP (Rapid Thermal Process) annealing techniques. The PGO film is substantially crystallization with c-axis orientation at temperature between 450 and 650° C. The PGO film has an average grain size of about 0.5 microns, with a deviation in grain size uniformity of less than 10%. Good ferroelectric properties are obtained for a 150 nm thick film with Ir electrodes. The films also show fatigue-free characteristics: no fatigue was observed up to 1×109 switching cycles. The leakage currents increase with increasing applied voltage, and are about 3.6×10−7 A/cm2 at 100 kV/cm. The dielectric constant shows a behavior similar to most ferroelectric materials, with a maximum dielectric constant of about 45. These high quality MOCVD Pb5Ge3O11 films can be used for high density single transistor ferroelectric memory applications because of the homogeneity of the PGO film grain size.

Abstract: A conductive paste is provided which can prevent the generation of wrinkles on electrode films after drying and which can be used for forming a highly reliable ceramic electronic element having superior appearance. The conductive paste contains a conductive component such as silver or copper and an organic vehicle. The organic vehicle contains an organic binder, a first solvent dissolving the organic binder and a second solvent substantially not dissolving the organic binder, wherein the boiling point of the first solvent is higher than that of the second solvent or is higher than the temperature at the end of distillation thereof by about 20° C. or more, and the content of the second solvent is about 30 to 70 wt % of the organic vehicle.

Abstract: Composition and process for making same in which the composition includes support particles having at least one catalytically active metal or precursor thereof distributed therein in a layer below the surface of the particle. The layer is located between an inner and an outer region of the support particle, and each of the inner and outer regions has a lower concentration of the metal or precursor thereof than the layer.

Abstract: A method of doping vanadium pentoxide with silver comprising the steps of: providing vanadium pentoxide gel providing stable colloidal silver and combining the vanadium pentoxide gel and the colloidal silver at room temperature for a period sufficient for vanadium (+5) to be electrochemically reduced to vanadium (+4) and for silver to be oxidized (+1).

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecules; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: A fine metal particle-dispersion solution and a method for the solution are disclosed which enables to form a transparent conductive film having an uniform distribution of at least two kinds of metals and is produced by mixing an aqueous solution (A) of at lest one metal salt, the metal comprising one or more metals selected from the group consisting of Au, Pt, Ir, Pd, Ag, Rh, Ru, Os, Re and Cu and an aqueous solution (B) including citrate ion and ferrous ion under an atmosphere having substantially no oxygen to produce fine metal particles. A multi-layers conductive film having a low reflectivity, a low resistance and an excellent durability is available by using the dispersion solution of the present invention comprising Ag—Pd fine particles.

Abstract: A resistive paste composition comprising 5 to 75% by weight of ruthenium(Ru) metal or ruthemium oxide particles having a specific surface area of 5 to 30 m2/g, 5 to 75% by weight of silver(Ag) metal or its compound particles having an average particle size of 0.1 to 3 &mgr;m and a maximum particle size of 8 &mgr;m or less, 5 to 40% by weight of a glass frit having a softening point of 400 to 550° C. and 5 to 45% by weight of an organic binder can be coated by a conventional screen-printing or dipping method on a substrate and then calcined at a low temperature of about 500 to 600° C. to form an electrically heat-generating thick film layer having good stability, uniformity and heat-up characteristics.

Abstract: The function of a functional material is enhanced by kneading a metallic powder, a metallic compound, or a functional mineral powder with a far-IR-radiating ceramic composition into a shape suitable for the application. A shaped article of a function-enhanced ceramic is obtained by kneading a powder of a far-IR-radiating material comprising a ceramic composition containing 52.5-70 wt % SiO2 and 20-47 wt % Al2O3 in an amount of 30 wt % or more and a metallic powder, a metallic compound, or a functional mineral powder; shaping and drying the mixture; and firing.

Abstract: A substitutional electroless gold plating solution for applying electroless gold plating to the surface of nickel. Tetraethylenepentamine as a straight chain alkylamine, hydrazine 1-hydrate as a reducing agent of nickel or a nickel alloy, and gold potassium cyanide as a gold source are blended into the electroless gold plating solution. It becomes possible to minimize the drop of shear strength of a solder member such as a solder ball resulting from a heat history even when a thin film-like gold plating layer is directly formed on the surface of nickel or a nickel alloy.

Abstract: To provide a conductive paste that exhibits a high thermal conductivity (a low thermal resistance) after adhesion and hardening and that enables an adhesive layer to be formed thin and to provide an electronic part that has an excellent radiating capability and that enables the thickness of films to be reduced. A conductive paste containing conductive particles, a hardenable resin, and a solvent has mixed therein fine spherical conductive particles such as Ag particles, the particle size is on the order of 0.05 to 1 &mgr;m, smaller than the first conductive particles. This conductive paste is used to mount an electronic part such as a semiconductor chip in producing a semiconductor package.

Abstract: There is provided a conductive paste comprising a conductive component, a glass frit, and a vehicle, wherein the glass frit comprises a glass and at least one of alumina (Al2O3), silica (SiO2), titania (TiO2) and zirconia (ZrO2). The conductive paste is capable of being baked at a low temperature with sufficient coloring, and is suitable for forming a circuit on a glass substrate, the glass circuit substrate suitable for application in a defogging glass for an automobile window formed therewith.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: The present invention provides a formulation for forming an electronically conducting polymer. The formulation contains an electron acceptor comprising a dopant anion and a metal cation selected from Ag+, Fe3+, Cu2+ or combinations thereof. The preferred electron acceptor is a silver salt, preferably selected from AgNO3, AgClO4 and AgNO2. The formulation also contains between 2 and 100 moles of a polymerizable component per mole of the electron acceptor, the polymerizable component being selected from pyrrole, aniline, their oligomers, or combinations thereof. In addition, the formulation includes an aqueous solvent selected from acetonitrile, acetone, and combinations thereof, the aqueous solvent having up to 30 volume percent water.

Abstract: A conductive paste comprising conductive powder and low-melting glass frit, wherein the low-melting glass frit constituting the conductive paste crystallizes crystals during firing to increase the resistivity of the conductive paste.

Abstract: The present invention relates to an electroactivated material comprising fibers and a binder and additionally having an electrocatalytic agent in the form of particles comprising a precious metal oxide or in the form of particles comprising a support and a coating based on such an oxide. The electroactivated material can be used especially as cathode component of an electrolysis cell and in particular of a cell for the electrolysis of aqueous sodium chloride solutions. The present invention also relates to a composite material comprising the said material and to processes for the preparation of each of the two materials.