Abstract: A magnetic nanofluid that includes magnetic transition metal ferrite nanoparticles, ferroelectric nanoparticles, and a carrier fluid, and a method of changing the temperature of an object (e.g., heating or cooling) using the magnetic nanofluid. The magnetic transition metal ferrite nanoparticles and ferroelectric nanoparticles can be present as a composite comprising both types of nanoparticles. The use of the magnetic nanofluid is associated with an increase in the Nusselt number in the presence of a magnetic field.

Abstract: A magnetic nanofluid that includes magnetic transition metal ferrite nanoparticles, ferroelectric nanoparticles, and a carrier fluid, and a method of changing the temperature of an object (e.g., heating or cooling) using the magnetic nanofluid. The magnetic transition metal ferrite nanoparticles and ferroelectric nanoparticles can be present as a composite comprising both types of nanoparticles. The use of the magnetic nanofluid is associated with an increase in the Nusselt number in the presence of a magnetic field.

Abstract: A magnetic nanofluid that includes magnetic transition metal ferrite nanoparticles, ferroelectric nanoparticles, and a carrier fluid, and a method of changing the temperature of an object (e.g., heating or cooling) using the magnetic nanofluid. The magnetic transition metal ferrite nanoparticles and ferroelectric nanoparticles can be present as a composite comprising both types of nanoparticles. The use of the magnetic nanofluid is associated with an increase in the Nusselt number in the presence of a magnetic field.

Abstract: Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure.

Abstract: An insulating heat-radiating coating composition including a coating layer-forming component including a main resin; and an insulating heat-radiating filler, which not only is capable of exhibiting excellent heat-radiating performance due to excellent thermal conductivity and heat radiation but also forms an insulating heat-radiating coating layer having a heat-insulating property. In addition, an insulating heat-radiating coating layer formed using the insulating heat-radiating coating composition has excellent adhesiveness to a surface to be coated, thereby remarkably preventing the peeling of an insulating heat-radiating coating layer during use and maintaining the durability of the insulating heat-radiating coating layer against physical and chemical stimuli such as external heat, organic solvents, moisture, and impact after formation of the insulating heat-radiating coating layer.

Abstract: A composite phase change material, including 65 to 80 parts of a phase change material and 20 to 35 parts of a binder by weight. The binder includes an acrylate monomer having a molecular weight of 50 to 300, an acrylate polymer having a molecular weight of 500 to 2000, and an initiator. The initiator in the composite phase change material can generate free radicals under the condition of ultraviolet light irradiation to initiate polymerization reactions between components of the composite phase change material, so that the composite phase change material is cured, thereby greatly accelerating a cure speed of the composite phase change material.

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

Abstract: To provide a working fluid for heat cycle having a low global warming potential, which can replace R410A, a composition for a heat cycle system comprising it, and a heat cycle system employing the composition. A working fluid for heat cycle, which comprises trifluoroethylene and 2,3,3,3-tetrafluoropropene, wherein the total proportion of trifluoroethylene and 2,3,3,3-tetrafluoropropene based on the entire amount of the working fluid is from 70 to 100 mass %, and the proportion of trifluoroethylene based on the total amount of trifluoroethylene and 2,3,3,3-tetrafluoropropene is from 35 to 95 mass %, a composition for a heat cycle system comprising the working fluid for heat cycle, and a heat cycle system employing the composition.

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Abstract: Carbon fiber reinforced steel matrix composites have carbon fiber impregnated in the steel matrix and chemically bonded to the steel. Chemical bonding is shown by the presence of a unique amorphous carbon layer at the carbon fiber/steel interface, and by canting of steel crystal edges adjacent to the interface. Methods for forming carbon fiber reinforce steel composites include sintering steel nanoparticles around a reinforcing carbon fiber structure, thereby chemically bonding a sintered steel matrix to the carbon fiber. This unique bonding likely contributes to enhanced strength of the composite, in comparison to metal matrix composites formed by other methods.

Abstract: Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: A polymer composite formed from an epoxy based polymer and an amino-graphene. The epoxy based polymer forms a polymer matrix and the amino graphene is dispersed throughout the polymer matrix. Further, a graphene is functionalized with 3,5-dinitrophenyl groups to form functionalized graphene and one or more amine functional groups form Meisenheimer complexes with the functionalized graphene to form the amino-graphene. An associated method of making the polymer composite is also provided.

Abstract: A working fluid for heat cycle, a composition for a heat cycle system containing the working fluid, and a heat cycle system employing the composition are provided. The working fluid has a low global warming potential and can replace R410A. The working fluid contains trifluoroethylene, 2,3,3,3-tetrafluoropropene, and optionally a hydrofluoroolefin other than trifluoroethylene and 2,3,3,3-tetrafluoropropene. The total proportion of trifluoroethylene and 2,3,3,3-tetrafluoropropene based on the entire amount of the working fluid is from 70 to 100 mass %.

Abstract: The semiconductor apparatus includes: a thermal source TS including a semiconductor device generating heat in an operating state; a thermal diffusion unit thermally connected to the thermal source TS, the thermal diffusion unit including space in a direction opposite to the thermal source; a plurality of air-cooling fin units disposed in the space of the thermal diffusion unit, one end of the plurality of fin unit is connected to the thermal diffusion unit; and a base unit connected to the thermal diffusion unit, wherein the plurality of air-cooling fin units is connected to the base unit through a plurality of thermal contact units CP1, CP2, CP3, . . . , CPn. Provide is an air-cooling type semiconductor apparatus, power module, and power supply, each having high heat dissipation performance and realizing light weight.

Abstract: An additive composition for a hydraulic fluid, or a heat transfer fluid, comprises one or more phosphate esters derived from the esterification of phosphoric acid and one or more monomer glycols containing up to 18 carbon atoms, or combinations thereof. In addition, the additive composition may comprise one or more corrosion inhibitors selected from the group consisting of dicarboxylic acids, alkanolamines or combinations thereof; one or more antioxidants including selected from the group consisting of one or more organosulfur compounds, one or inorganic oxyanion salts or combinations thereof; and, one or more surfactants.

Abstract: A method of heat treatment of a non-metallic or metallic item is provided. The method includes at least one step A) of heat transfer between the item and a heat transfer fluid A? including a fluid medium and nanoparticles. The heat transfer fluid has a heat transfer coefficient above the heat transfer coefficient of water. The method also includes at least one step B) of heat transfer between the item and a heat transfer fluid B? including a fluid medium and nanoparticles. The heat transfer fluid B? has a heat transfer coefficient different from the heat transfer coefficient of A? and above the heat transfer coefficient of water. The heat transfer fluids A? and B? are different.

Abstract: A polymer composition comprising a polymer matrix within which a plurality of flake-shaped mineral particles and mineral whiskers are distributed is provided. The polymer composition exhibits an in-plane thermal conductivity of about 0.2 W/m-K or more as determined in accordance with ASTM E 1461-13.

Abstract: A method of heat treatment of a non-metallic or metallic item is provided. The method includes at least one step of heat transfer between the item and a heat transfer fluid A?. The heat transfer fluid A? includes a fluid medium and nanoparticles having a lateral size between 26 and 50 ?m. The heat transfer fluid has a heat transfer coefficient below the heat transfer coefficient of water.

Abstract: A working fluid for heat cycle, a composition for a heat cycle system containing the working fluid, and a heat cycle system employing the composition are provided. The working fluid has a low global warming potential and can replace R410A. The working fluid contains trifluoroethylene, 2,3,3,3-tetrafluoropropene, and optionally a hydrofluoroolefin other than trifluoroethylene and 2,3,3,3-tetrafluoropropene. The total proportion of trifluoroethylene and 2,3,3,3-tetrafluoropropene based on the entire amount of the working fluid is from 70 to 100 mass %.

Abstract: A polyether polymer composition containing 50 parts by weight or more of a filler per 100 parts by weight of a polyether polymer composed of 10 to 200 oxirane monomer units is provided. The present invention can provide a polyether polymer composition that is capable of appropriately showing various properties of the filler such as high heat conductivity and high electrical conductivity and that also has excellent long-term stability.

Abstract: One object of the invention is to improve the affinity between the silicone resin and the thermally conductive filler to facilitate mixing thereof. Another object of the invention is to suppress a viscosity increase of a silicone resin composition containing a high level of loading of thermally conductive filler, and to provide a cured product having a higher thermal conductivity. According to the invention, a thermally conductive silicone composition is provided, which comprises (A) an organopolysiloxane having two or more alkenyl groups each bonded to a silicon atom per molecule; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms each bonded to a silicon atom per molecule in such an amount that the molar ratio of the hydrogen atoms each bonded to a silicon atom in component (B) to the alkenyl groups in component (A) is within the range of from 0.

Abstract: The present invention is a glass-fiber-reinforced polyamide resin composition which contains a crystalline aliphatic polyamide resin (A), an amorphous polyamide resin (B), an acrylic resin (C), mica (D), glass fiber (E) and carbon black (F) in a ratio by mass of (10 to 40):(2 to 20):(1 to 10):(2 to 25):(20 to 50):(0.1 to 5), respectively and further contains a copper compound (G) in a rate of 0.005 to 1.0 part by mass when a total amount of the ingredients (A) to (F) is taken as 100 parts by mass.

Abstract: A surfactant suitable for use as an additive in the heat transfer liquid of a heating and/or cooling system, wherein the surfactant comprises a coconut-derived surfactant, the preferred coconut-derived surfactant being a non-ionic, coco-glucoside. The surfactant can be used as an additive in a heat transfer fluid of a wet central heating system or a chiller circuit at a concentration of between 800 ppm and 1500 ppm, but preferably 1200 ppm, as this has surprisingly been found to yield an optimum reduction in the surface tension of the heat transfer fluid, whilst not significantly or appreciably increasing the specific heat capacity of the heat transfer fluid.

Abstract: Systems and methods for lightning strike materials are disclosed. The material may include a carbon fiber tow. Carbon nanotubes may be grown on carbon fibers within the carbon fiber tow. The carbon nanotubes may cause the carbon fibers to separate, decreasing a carbon tow fiber volume fraction of the tow. The growth of the carbon nanotubes may be controlled to select a tow fiber volume fraction of the tow. The lightning strike material may transmit electricity to decrease damage to the composite structure in case of a lightning strike.

Abstract: The present application relates to a method for preparing a carbon carrier-metal nanoparticle composite and a carbon carrier-metal nanoparticle composite prepared thereby, and has an advantage in that it is possible to improve dispersibility and supporting ratio of metal nanoparticles with respect to a carbon carrier by efficiently supporting metal nanoparticles having a uniform size of several nanometers on evenly dispersed carbon carriers.

Abstract: A composition for a heat cycle system and a heat cycle system employing the composition are provided. The composition has favorable lubricating properties and contains a working fluid for heat cycle and a refrigerant oil. The working fluid has a low global warming potential and can replace R410A. The working fluid contains an unsaturated fluorinated hydrocarbon compound having a specific structure. The refrigerant oil has a breakdown voltage of at least 25 kV, a hydroxyl value of at most 0.1 mgKOH/g, and a kinematic viscosity at 40° C. of from 5 to 200 mm2/s and a kinematic viscosity at 100° C. of from 2 to 30 mm2/s.

Abstract: A composition for a heat cycle system having favorable lubricating properties is provided. A heat cycle system employing the composition is also provided. The composition contains a working fluid for heat cycle, which has a low global warming potential and can replace R410A. The working fluid contains an unsaturated fluorinated hydrocarbon compound having a specific structure and a refrigerant oil having a breakdown voltage of at least 25 kV, a hydroxy value of at most 0.1 mgKOH/g, and a minimum temperature on the high temperature side of the phase separation temperature from the working fluid of at least 35° C. and a maximum temperature on the low temperature side of at most ?60° C.

Abstract: A composition for a heat cycle system and a heat cycle system employing the composition are provided. The composition has favorable lubricating properties and contains a working fluid for heat cycle and a refrigerant oil. The working fluid contains an unsaturated fluorinated hydrocarbon compound having a specific structure. The working fluid has a low global warming potential and can replace R410A. The refrigerant oil has a breakdown voltage of at least 25 kV, a hydroxyl value of at most 0.1 mgKOH/g, and an aniline point of at least ?100° C. and at most 0° C.

Abstract: A working fluid for heat cycle, a composition for a heat cycle system containing the working fluid, and a heat cycle system employing the composition are provided. The working fluid has a low global warming potential and can replace R410A. The working fluid contains trifluoroethylene and 2,3,3,3-tetrafluoropropene. The total proportion of trifluoroethylene and 2,3,3,3-tetrafluoropropene based on the entire amount of the working fluid is from 70 to 100 mass %. The proportion of trifluoroethylene based on the total amount of trifluoroethylene and 2,3,3,3-tetrafluoropropene is from 35 to 95 mass %.

Abstract: A composition for a heat cycle system having less influence over the ozone layer, a low global warming potential, and excellent stability and durability is provided. A heat cycle system using the composition is also provided. The composition contains a working fluid and a phosphoric acid ester. The working fluid contains trifluoroethylene and difluoromethane. An interaction distance (Ra) between the working fluid and the phosphoric acid ester as determined from the Hansen solubility parameters is at most 15.

Abstract: A helmet and/or helmet liner including at least one compartment, chamber, bladder, or internal sipe. The at least one compartment, chamber, bladder or internal sipe includes a media with at least one magnetorheological liquid for use to absorb shock or change sliding resistance by changing an alignment of metal particles of the magnetorheological fluid to alter a flow resistant structure. The helmet and/or helmet liner also includes an electronic control system that controls the flow resistance of the magnetorheological liquid of the at least one chamber compartment or bladder by changing an alignment of metal particles of the magnetorheological liquid to alter a flow resistant structure included in the at least one inner compartment, chamber or bladder. The helmet and/or helmet liner may also include a second compartment, chamber or bladder surrounding another compartment, chamber or bladder, with an internal sipe located between surfaces thereof.

Abstract: The present invention relates to an aqueous glycol-free heat transfer fluid comprising sebacic acid, benzotriazole, morpholine, and at least one of sodium nitrite and sodium molybdate dihydrate, wherein a sum of concentrations of sodium molybdate dihydrate, sebacic acid, benzotriazole, morpholine, sodium nitrite is equal to or less than 1% (w/w). Preferably, the sum of concentrations of sodium molybdate dihydrate, sodium nitrite, sebacic acid, benzotriazole and morpholine is less than 0.65% (w/w). Preferably, the respective concentration is: 0-0.134% (w/w) sodium molybdate dihydrate; 0-0.028% (w/w) sebacic acid; 0-0.028% (w/w) benzotriazole; 0.08-0.812% (w/w) morpholine and 0-0.134% (w/w) sodium nitrite.

Abstract: The present invention generally provides compositions including carbon-based nanostructures, catalyst materials and systems, and related methods. In some cases, the present invention relates to carbon-based nanostructures comprising a high density of charged moieties. Methods of the invention may provide the ability to introduce a wide range of charged moieties to carbon-based nanostructures. The present invention may provide a facile and modular approach to synthesizing molecules that may be useful in various applications including sensors, catalysts, and electrodes.

Abstract: A phase change device for controlling temperature within a confined environment, comprising a foam material, a phase change material, the phase change material being absorbed into the foam, and a protective covering encasing the foam material/phase change material. A method for making a phase change device for controlling temperature within a confined environment, comprising providing a phase change material, providing a foam material, absorbing the phase change material into the foam material, and sealing the foam material/phase change material within a protective covering.

Abstract: A heat transfer fluid comprising a carrier fluid and a nano-additive is provided. The heat transfer fluid is manufactured by dispersing the nano-additive in the carrier fluid. The nano-additive comprises nano-particles having a porous structure that provides dispersion stability of the nano-additive in the heat transfer fluid. The nano-additive structure has an aspect ratio of about 1.0 to about 10,000, a porosity of about 40% to about 85%, a density of about 0.4 g/cc to about 3.0 g/cc, an average pore diameter of about 0.1 nanometer to about 100 nanometers, and a specific surface area of about 1 m2/g to about 4000 m2/g. The nano-additive increases the heat transfer efficiency of the heat transfer fluid and also reduces the moisture content of the heat transfer fluid.

Abstract: A process for transferring heat from a heat source to a heat sink, comprising using as heat transfer medium a composition comprising: at least one fluorinated fluid free from functional groups (fluid (H)); at least one functional (per)fluoropolyether (functional PFPE(1)) comprising recurring units (R1), said recurring units comprising at least one ether linkage in the main chain and at least one fluorine atom (fluoropolyoxyalkylene chain), and at least one functional end group chosen between —COOH and —CONH2; at least one functional (per)fluoropolyether (functional PFPE(2)) comprising recurring units (R1) as defined above and at least one functional end group chosen between —COCF3 and its hydroxylated derivative —C(OH)2CF3.

Abstract: A thermally conductive sheet is a thermally conductive sheet 1 formed from a thermally conductive composition containing boron nitride particles 2 in a plate shape and a rubber component. The content ratio of the boron nitride particles 2 is 35 vol % or more and the thermal conductivity in a direction perpendicular to a plane direction PD of the thermally conductive sheet 1 is 4 W/m·K or more.

Abstract: Electrically and/or thermally conductive polymer composites and methods of preparing same are provided. In some embodiments, a method for preparing an electrically and/or thermally conductive polymer composite may include (1) mixing a polymer, a conductive particulate filler, and a solvent compatible with the polymer to form a non-conductive polymer solution or melt; (2) processing, the non-conductive polymer solution or melt to form a non-conductive polymer network composition; wherein the presence of solvent during three-dimensional network formation manipulates the polymer network structure; and (3) removing the solvent from the non-conductive polymer network composition to form an electrically and/or thermally conductive polymer composite. The altered polymer chain structure present in the non-conductive polymer network composition is maintained in the composite, and offsets the impact of particulate filler addition including increased modulus, decreased elasticity, and decreased elongation at break.

Abstract: The present invention relates to a light emitting diode fixture assembly, having at least one component made out of thermally conductive thermoplastic which is comprised of a thermally conductive thermoplastic composition which is comprised of at least one thermoplastic polymer and at least one thermally conductive filler. The light emitting diode fixture assembly is comprised of (1) at least one light emitting diode, (2) a lens covering a portion of the light emitting diode, (3) a back plate to which the light emitting diode is affixed, (4) the housing for the light emitting diode and the base plate, and (5) electrical connectors which are in electrical communication with the light emitting diode and an electrical supply source with a enclosing cup/sleeve.

Abstract: A heat dissipating material and a method for preparing the same, of which the method comprises the following steps: providing paraffin wax, boron nitride, graphite, and a modified multi-walled carbon nanotube; heating the paraffin wax until the paraffin wax is softened; and mixing the boron nitride, the graphite, the modified multi-walled carbon nanotube and the paraffin wax. Wherein, based on the total weight of the heat dissipating material, the content of the paraffin wax is from 50 to 60% by weight; the content of boron nitride is from 20 to 40% by weight; the content of the graphite is from 3 to 15% by weight; and the content of the modified multi-walled carbon nanotube is from 1 to 5% by weight.

Abstract: An electrically insulating material for high voltage generators is provided. The electrically insulating material comprises a polymer based dielectric material filled with nanoparticles, wherein the voltage at which partial discharges start in the polymer based dielectric material is greater than the voltage at which partial discharges start in an unfilled polymer based dielectric material.

Abstract: The disclosed concept relates to compositions and methods for the manufacture of electrically resistive, thermally conductive electrical switching apparatus. The composition includes a polymer component and a nanofiber component. The thermal conductivity of the nanofiber component is higher than the thermal conductivity of the polymer component such that the electrical switching apparatus which includes the composition of the disclosed concept has improved heat dissipation as compared to an electrical switching apparatus constructed of the polymer component in the absence of the nanofiber component. Further, the disclosed concept relates to methods of towering the internal temperature of an electrically resistive, thermally conductive electrical switching apparatus by forming the internals of the apparatus, e.g., circuit breakers, and/or the enclosure from the composition of the disclosed concept.

Abstract: An inorganic aqueous solution for use in a phase-change heat transfer device comprises an aqueous solution of potassium permanganate (KMnO4), potassium dichromate (K2Cr2O7), chromium trioxide (CrO3), silver chromate (Ag2CrO4), strontium hydroxide (Sr(OH)2), calcium hydroxide (Ca(OH)2), magnesium hydroxide (Mg(OH)2) and sodium hydroxide (NaOH).

Abstract: According to an implementation of the present subject matter, a method for producing stable nanofluids is described. The method includes mixing of a base fluid with a dispersant and a metal oxide powder to form a primary mixture. The base fluid is a heat transfer fluid and the metal oxide powder includes particles of size greater than 100 nm. The method further includes grinding the primary mixture to obtain a concentrated nanoparticle suspension where the dispersant is added to the primary mixture during the grinding after every pre-determined time period.

Abstract: Systems, methods, and devices of the various embodiments provide thermoset (or thermoplastic)/carbon nanotube (CNT) sheet nanocomposites fabricated by resistive heating assisted infiltration and cure (RHAIC) of a polymer matrix resin. In an embodiment, resin infusion may achieved by applying a first lower voltage to a CNT reinforcement. Once the resin infusion process is complete, the voltage may be increased to a second higher voltage which may rapidly cure the polymer matrix. In an embodiment, an epoxy SC-85 and hardener may be used. In another embodiment, present a bismaleimide (BMI) may be used for the matrix material.

Abstract: An impregnated fiber tow comprising multiple unitary graphene-based continuous graphitic fibers impregnated with a matrix material, wherein at least one of the continuous graphitic fibers comprises at least 90% by weight of graphene planes that are chemically bonded with one another having an inter-planar spacing d002 from 0.3354 nm to 0.4 nm as determined by X-ray diffraction and an oxygen content less than 5% by weight, wherein the graphene planes are parallel to one another and parallel to a fiber axis direction and the graphitic fiber contains no core-shell structure, has no helically arranged graphene domains or domain boundary, and has a porosity level less than 5% by volume.