Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may measure at least one of a first height value and a first width value of a first eye diagram of a first signal; measure at least one of a second height value and a second width value of a second eye diagram of a second signal; determine at least one of a height difference value and a width difference value respectively between the at least one of the first height value and the first width value of the first eye diagram and the at least one of the second height value and the second width value of the second eye diagram; and determine that the at least one of the height difference value and the width difference value respectively meets or exceeds a height threshold value or a width threshold value.

Abstract: Methods for forming an electrode structure, which can be used as a biosensor, are provided in which the electrode structure has non-random topography located on one surface of an electrode base. In some embodiments, an electrode structure is obtained that contains no interface between the non-random topography of the electrode structure and the electrode base of the electrode structure. In other embodiments, electrode structures are obtained that have an interface between the non-random topography of the electrode structure and the electrode base of the electrode structure.

Abstract: A method for manufacturing parts is provided. The method includes cold rolling a substrate with work cylinders whose work surface has a roughness Ra2.5 of less than or equal to 3.6 ?m, depositing the metal coating on at least one face of the annealed substrate by electrodeposition to form the metal sheet and deforming the cut metal sheet to form the parts. The outer surface of the metal coating has a waviness Wa0.8 of less than or equal to 0.5 ?m after the deformation step. A part and vehicle are also provided.

Abstract: Methods for forming an electrode structure, which can be used as a biosensor, are provided in which the electrode structure has non-random topography located on one surface of an electrode base. In some embodiments, an electrode structure is obtained that contains no interface between the non-random topography of the electrode structure and the electrode base of the electrode structure. In other embodiments, electrode structures are obtained that have an interface between the non-random topography of the electrode structure and the electrode base of the electrode structure.

Abstract: Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Abstract: A method of manufacturing a fluidic structure is disclosed. A cavity that defines a shape of an element of the fluidic structure within a material is formed. The cavity is filled with liquid metal. The cavity is sealed. The fluidic structure behaves as an antenna. A fluidic antenna includes a material that defines a shape of the fluidic antenna by a cavity filled with liquid metal formed within the material, where the material further defines at least one mechanical property of the fluidic antenna.

Abstract: A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side surfaces of the insulation layer. The first blind via extends from the upper surface toward the second copper foil layer and exposes a portion of the second copper foil layer. The second blind via extends from the lower surface toward the first copper foil layer and exposes a portion of the first copper foil layer. The filling material is filled inside of the first blind via and the second blind via and covers the upper surface and the lower surface of the substrate.

Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

Abstract: Disclosed herein is a rigid flexible printed circuit board (PCB) including: a flexible area having a flexible copper foil laminate in which circuit layers are formed on an insulating material, and cover lays formed on the laminate; and rigid areas having insulating layers and copper layers built-up on both sides of the flexible area, and flattening materials to flatten outer surfaces of the insulating layers.

Abstract: The invention relates to a filter unit (600), a method for manufacturing such a filter unit, and a cartridge (690) comprising such a filter unit. The filter unit (600) is characterized in that it comprises a filter material (601) which is integrated into the aperture of at least one foil (602, 603, 604). In a preferred embodiment, the filter material (601) may be located in the aperture of an intermediate foil (604) which is embedded between a top foil (602) and a bottom foil (603). Such a filter unit (600) can readily be produced in cost-effective processes like roll-to-roll manufacturing technologies.

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 ?g/dm2. is formed on a surface of the copper foil on which the resin layer is not laminated.

Abstract: The invention relates to a laminated strip, in particular a decorative strip, comprising an upper layer (12) consisting of metal, preferably aluminum, whose upper face (22) is embossed with a structure in relief (18) and whose underside (24) is fixed to a reinforcement layer (14) consisting of plastic. During the production of the strip, the reinforcement layer (14) and the protective layer (16) are applied after the structure in relief (18) has been embossed on the upper layer (12).

Abstract: A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process.

Abstract: A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.

Abstract: A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.

Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: A piezoelectric component includes a main body, which is surrounded at least in part by an enclosure for protecting the main body. The enclosure includes a structured foil. A method for producing a component of this type is also specified, in which a main body of the component and a structured foil are provided. The structured foil is then wound around the main body.

Abstract: A method and apparatus for joining a first workpiece and a second workpiece. A layer of exothermic material is placed between the first workpiece and the second workpiece. A plurality of currents is applied to the layer of exothermic material in a plurality of locations and substantially at the same time such that an exothermic reaction occurs in the layer of exothermic material.

Abstract: Process for producing DCB substrates having in each case at least one ceramic layer which is essentially made up of aluminium nitride (AlN) and is provided on at least one surface side with an intermediate layer which is essentially made up of aluminium oxide and also has at least one metallization formed by a metal layer or metal foil on the intermediate layer

Abstract: Method for producing an aluminum foil with integrated security features. An aluminum foil is rolled to a thickness of less than 150 ?m in multiple cold rolling passes, and simultaneously a texture which runs in the rolling direction is produced on both faces of the foil. A loose composite formed from at least two of the aluminum foils, is fed into a pair of working rollers in a final cold rolling pass, wherein the relief-like surface structure which is produced in the rolling direction via a polishing process has been reduced by 10 to 50% with respect to the average roughness height in one region in a contrast- and motif-dependent manner on at least one roller surface in order to form a motif for a security feature. The security feature is transferred onto the aluminum foil face facing the roller surface, and the loose composite of aluminum foils is separated.

Abstract: A method for manufacturing an ammonia storage cartridge includes a step for supplying a material by ammonia absorption or adsorption by absorbent salts, a step for producing an intermediate element, including compacting the materials to form the intermediate element, a step for stacking at least two intermediate elements in a shell of the cartridge, and a step for compressing the stack of intermediate elements in the shell.

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

Abstract: A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.

Abstract: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

Abstract: A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate.

Abstract: A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step.

Abstract: An LED lighting device and a method for making the LED lighting device are provided. A PCB board is configured over a cooling substrate provided on top of a metallic heat-dissipation lamp cup. LED light sources that include a positive electrode and a negative electrode are provided on the PCB board and are connected to a power supply. Screws are used to attach the PCB board to the cooling substrate on top of the metallic heat-dissipation lamp cup. At least one screw includes a screw head electrically connected to one of the positive electrode and the negative electrode, and a screw body electrically connected to the metallic heat-dissipation lamp cup, such that the at least one screw provides a bypass discharge path between the LED light sources and the metallic heat-dissipation lamp cup to release leakage current and to protect the LED light sources.

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

Abstract: A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.

Abstract: A mechanical amplifier and method for converting a small motion amplitude to a larger motion amplitude are disclosed. The method includes using two or more beams which are connected in series at angles to each other. Undesirable movements arising in the structure are absorbed by the structure through torsion. Each beam is a mechanical motion amplifier, and by connecting these in series, the total amplification is the product of the amplification of the comprised beams. The disclosure also pertains to a device comprising two or more beams connected together at an angle of 90 degrees in one embodiment.

Abstract: An antenna is provided, having a foil sheet, an antenna structure and a connector. The foil sheet includes a front side and a back side, while the antenna structure is printed on the front side using a conductive ink. The antenna structure includes a contact pad. The connector is connected to the contact pad and includes a metallic blade extending through the foil sheet and the contact pad.

Abstract: A method for manufacturing a wiring substrate includes forming a through-hole penetrating a core layer from one to another surface of the core layer, forming a first metal layer covering the one and the other surface of the core layer and an inner wall surface of the through-hole, forming a second metal layer on the first metal layer, and forming a patterned third metal layer on the second metal layer toward the one surface of the core layer along with forming a patterned fourth metal layer on the second metal layer toward the other surface of the core layer. The forming of the second metal layer includes covering the one and the other surfaces of the core layer and the first metal layer in the through-hole with the second metal layer and closing up a center part of the through-hole with the second metal layer.

Abstract: A manufacturing method of a circuit board is provided. In the manufacturing method, an electrically insulating layer and at least one electrically insulating material are formed on a plane of a thermally conductive plate, and a metal pattern layer located on the electrically insulating layer is formed. The electrically insulating layer partially covers the plane, and the electrically insulating material covers the plane where is not covered by the electrically insulating layer. The electrically insulating material touches the thermally conductive plate. A thermal conductivity of the electrically insulating material is larger than that of the electrically insulating layer.

Abstract: Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum.

Abstract: A method is provided for producing a metallic catalyst support. In producing the metallic catalyst support, a first metal foil having a planar profile or slightly corrugated profile, a second metal foil having a corrugated profile and an external cylinder are prepared. The first and second metal foils are rolled up in a multilayered superimposed state to form a honeycomb body with a spiral roll form. The honeycomb body is fitted into the external cylinder, which has an inside diameter larger than an outside diameter of the honeycomb body. Pressure is simultaneously applied to the external cylinder into which the honeycomb body has been fitted and to the honeycomb body from outside towards inside of the external cylinder to squeeze-down and to induce plastic deformation in an outside edge section of the honeycomb body so that tight contact is made with the external cylinder.

Abstract: Methods of producing corrosion-inhibiting aluminum foil products suitable for culinary use involve metallurgical sequestration of aluminum radicals by applying a copper-containing barrier metal layer to a substrate aluminum foil, followed by application of a biocompatible, lipid-based sealant layer to seal any gaps in the barrier layer and provide a non-stick coating. The sealant, which has a vegetable cooking oil, or oil mixture, as its primary ingredient, may also function as a natural antimicrobial and/or anti-fungal agent. Various sealant additives may increase the thermal stability of the oil base, enhance the antimicrobial properties thereof, and increase shelf life. Aluminum foil products include a coated aluminum foil with a copper-containing barrier layer applied to an aluminum substrate layer, with a sealant layer applied to the barrier layer. The coated foil may be wound in a coil around a hollow tube which contains a desiccant.

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract: The present invention provides a method for producing a lithium secondary battery in which peeling of an active substance can be prevented and the generation of metal powder can be prevented when a power collection foil is processed at an electrode production step. The method for producing the lithium secondary battery includes an electrode-producing step of producing a positive electrode and a negative electrode; a step of forming a group of electrodes by layering the positive electrode and the negative electrode on each other through a separator, or winding the positive electrode and the negative electrode through a separator; and a step of immersing the group of the electrodes in an electrolyte.

Abstract: A reference foil comprises an unsymmetric marker foil device which advantageously includes spatially separated pieces of a marker material foil in unsymmetric arrangement and/or at least one unsymmetric integral piece of the marker material foil. The reference foil and a carrier device for the same may be used for example in image-guided surgery.

Abstract: A medical probe is provided that has a single longitudinally uniform interconnect that provides a connection between a distal end and a proximal end of the probe. The interconnect is obtained by forming a thin uniform film as a spiral on a wafer and subsequently applying this spiral as a helix on a base element of a medical probe. The thin film spiral is manufactured with multiple connecting wires to enable connection between an electronics module and a multiplicity of electrodes (an electrode array) at the distal end of the medical probe.

Abstract: A microneedle array device and its fabrication method are provided. The microneedle array device comprises a supporting pad and a plurality of microneedles. Each microneedle has a top portion with a via thereon, thereby the microfluid may flow in or out. The intersection between the top portion and the inner tube of a microneedle forms a convex needle structure, and is almost perpendicular to the upper surface. For each microneedle, a hollow closed tube is formed between the top portion and the supporting pad. The fabrication method uses substrates with high transmittance and a plurality of convex area thereon as upper and lower caps, and applies a photolithography process to fabricate a microneedle array mold. It then sputters or electroplates metal material on the mold. The microneedle array is formed after having taken off the mold.

Abstract: The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.

Abstract: A method and apparatus for strip casting sheet metal and then conditioning the surfaces of the sheet metal strip to remove iron oxide scale employs first brushing the surfaces with stainless steel brushes to remove the scale without requiring pickle and oil, and then brushing the surfaces with aluminum oxide brushes to further clean and smooth the surfaces of the cast metal strip.

Abstract: Disclosed is a flexible foil including a thin and flexible foil that isolates electromagnetic waves. The foil has a smooth surface and an opposite surface on which a plurality of three-dimensional raised projections is formed and consecutively lined up. A slicing-facilitated, flexible thinned layer is formed between adjacent ones of the projections. The foil can be deflected to enclose an electronic device that generates electromagnetic waves with the projections facing the electronic device so that the electromagnetic waves are confined inside the enclosure formed by the foil and dispersed and dissipated by reflection and diffraction in multiple angles caused by the projections so as to prevent leakage of electromagnetic waves and to protect electronic components close to the electromagnetic wave generating device from interference by the electromagnetic waves.

Abstract: A process for refurbishing a worn surface of a shroud support component of a turbomachine, as well as a shroud support component refurbished with the process. The process generally entails removing a surface region of the worn surface so as to define a repair surface on the component. A braze tape formed from a slurry to comprise a braze material and a wear-resistant alloy is then applied to the repair surface, followed by a heat treatment to cause the braze tape to diffusion bond to the repair surface so as to define a built-up surface. The built-up surface is then machined to define a wear-resistant coating on the component.

Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10?6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).