Cutting Covering Material Only Patents (Class 29/33.52)
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Patent number: 11611161Abstract: A tool for soldering an electrical conductor with a connection device includes a deformation unit plastically deforming the connection device around the electrical conductor. The deformation unit has a fixed deformation module and a movable deformation module that is movable with respect to the fixed deformation module. The fixed deformation module has an anvil with an electrical contact area on which the electrical conductor and the connection device are disposed. An electric current circulates through the electrical conductor and the connection device by passing through an electrically conductive first part of the anvil that is electrically insulated from a rest of the anvil.Type: GrantFiled: October 10, 2019Date of Patent: March 21, 2023Assignee: Tyco Electronics France SASInventor: Alain Bednarek
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Patent number: 11469564Abstract: A joint crimping apparatus adapted to crimp a joint to an end of a cable includes a base, a fixed die detachably mounted on the base, a movable die configured to reciprocate relative to the fixed die, and a separation mechanism. The fixed die has a first groove adapted to receive a portion of a joint in an un-crimped state. The movable die has a second groove adapted to cooperate with the first groove to crimp the joint to the end of the cable. The separation mechanism is configured to remove the cable jammed in the second groove and crimped with the joint from the second groove.Type: GrantFiled: November 19, 2020Date of Patent: October 11, 2022Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbHInventors: An Yang, Lvhai Hu, Sun Kyu Pak, Roberto Francisco-Yi Lu, Yun Liu
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Patent number: 9888579Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.Type: GrantFiled: March 5, 2015Date of Patent: February 6, 2018Assignee: Invensas CorporationInventors: Reynaldo Co, Grant Villavicencio, Wael Zohni
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Patent number: 8561381Abstract: A system for unstrapping and unsleeving a tray is provided. The system comprises a tray-transport configured to transport a tray in the system, a strap cutter configured to cut a strap on the tray, a strap-removal portion configured to remove the strap cut by the strap cutter, and an unsleeving station configured to remove a sleeve from the tray. The unsleeving station is configured to remove the sleeve from the tray after the strap-removal portion removes the cut strap.Type: GrantFiled: June 14, 2010Date of Patent: October 22, 2013Assignee: United States Postal ServiceInventors: Donald R. Close, Robert D. Lundahl, William D. Finch, Robert Cutlip, Dwight Koogle, Mark Bankard
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Publication number: 20090283168Abstract: A reinforcing bar binding machine is provided with: a guide tube for guiding a wire from a wire reel mounted on a binding machine body; a curl guide; a wire cutting mechanism disposed between the guide tube and the curl guide; a first guide pin that is disposed at an end portion of the guide tube or in a vicinity of the end portion of the guide tube, and guides an outer side surface which is an outer side of a wire curve; a second guide pin that is disposed at the end portion of the guide tube or in a vicinity of the end portion of the guide tube, and guides an inner side surface which is an inner side of the wire curve; and a third guide pin that is disposed inside of the curl guide and guides the outer side surface. The wire is brought into contact with the first guide pin, the second guide pin, and the third guide pin, when the wire is fed around a reinforcing bar.Type: ApplicationFiled: May 14, 2009Publication date: November 19, 2009Applicant: MAX CO., LTD.Inventor: Ichiro Kusakari
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Publication number: 20080282522Abstract: A portable optical fiber processing apparatus is disclosed. The portable optical fiber processing apparatus of the present invention includes a base (1), which provides a space in which components are installed, and a sheathing stripping unit (10), which is provided on the base and strips sheathing from an optical fiber (R). The apparatus further includes an optical fiber cutting unit (40), which is provided on the base and cuts a portion of the optical fiber, from which the sheathing has been stripped, using a sliding cutter (43) in a direction perpendicular to the longitudinal direction of the optical fiber, and a welding unit (50), which is provided on the base and welds junction portions of two optical fibers. The present invention is characterized in that a process of stripping sheathing from an optical fiber and cutting, cleaning and welding processes can be conducted using a single apparatus.Type: ApplicationFiled: April 20, 2006Publication date: November 20, 2008Inventors: Jae Seop Song, Sang Chul Jun, Young Bae Seo
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Patent number: 7152296Abstract: The invention relates to a process and a device for forming a planiform piece intended, in particular, for the interior fittings of motor vehicles, in which a layer of support material (1) is covered, at least on one of its faces (2) and in the area of a portion (3), at least, of its contour, or so-called portion to be bordered, with a cladding sheet (4) and said support (1) is cut along said portion to be bordered (3) in such a way that said cladding (4) projects from said support (1) in the area of said portion. According to the invention, a cutting tool (5) is pre-positioned between said cladding (4) and said support (1) along said portion to bordered (3) said cutting is effected with said cutting tool (5), when the support (1) is covered by the cladding (4).Type: GrantFiled: March 22, 2001Date of Patent: December 26, 2006Assignee: Visteon Global Technologies, Inc.Inventors: Marc Saelen, Jean-Yves Delattre, Bernard Freycon
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Patent number: 6912762Abstract: An automated de-banding machine which can perform by scanning the surface of the pallet to determine the number and position of bands to be removed. The machine also is capable of analyzing to determine the overlay bands from underlay bands. The overlay bands are removed first and typically fed individually to a chopper which chops the bands into pieces for recycling. The band information may be recorded and used to facilitate handling of a similar type of pallet in future operations to eliminate any stoppage for determination of retooling or adjustment.Type: GrantFiled: February 7, 2003Date of Patent: July 5, 2005Assignee: R. A. Pearson CompanyInventors: Richard R. Lile, Daniel V. Brown
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Publication number: 20040068851Abstract: A cable-processing machine includes a swiveling device with a swiveling arm and a gripper for moving cable-ends to and from processing stations. A belt-drive advances a cable supplied from a reel or drum to a cutting and stripping station where the leading and the trailing cable-ends are cut from the cable and stripped to form a cable-length. After the leading cable-end has been processed, the cable-length is laid on a continuously driven cable transportation belt and the trailing cable-end is processed. After processing, the cable-length is laid in a cable tray.Type: ApplicationFiled: September 25, 2003Publication date: April 15, 2004Inventors: Alois Lustenberger, Matthias Luscher