Abstract: A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

Abstract: A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second

Abstract: A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.

Abstract: A machine for winding sutures into a suture tray package comprises a base platform, a plurality of package nests, a first workstation for placing an empty tray onto one of the package nests, a further workstation for feeding a needle with an attached suture in the tray and parking said needle in the tray, a winding station for winding the suture into a winding channel of the tray, a lid placement station for placing a lid onto one of the package nests, a lid attachment station for attaching the lid to the tray, and an offloading station for removing said trays from the package nests. The further workstation comprises two tweezer grippers, at least one of said tweezer grippers having a V- or U-shaped notch, said V- or U-shaped notch being located at the inside of the notched tweezer gripper facing the second tweezer gripper.

Abstract: The tape feeder set-up system has a tape feeder, having an electric motor, for feeding a carrier tape wound on a reel and accommodating multiple components in a predetermined feed direction; a loading table on which the tape feeder can be loaded; a scheduled use determination section for determining whether a component in the tape feeder loaded on the loading table is scheduled to be used based on a component usage schedule, and a control section for reversing the carrier tape in a direction opposite to the predetermined feed direction by controlling the electric motor of the tape feeder when the scheduled use determination section determines that the component is not scheduled to be used.

Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.

Abstract: A board insertion device includes a holder; and an insertion guider which is slidably provided in the holder in an insertion direction of the board into the connector and includes a distal end portion protruding in the insertion direction from a first end surface of the board held in the holder and abutting against the connector during insertion of the board into the connector. Furthermore, the board insertion device includes an abutting portion; and a conversion mechanism converting a change of a relative position between the holder and the insertion guider into a movement of the abutting portion for changing a position of the ejector from a closed position to an open position. in which the conversion mechanism is provided in the insertion guider and engaged with the holder or is provided in the holder and engaged with the insertion guider.

Abstract: A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Abstract: An apparatuses, methods, and systems of determining a configuration of a lighting fixture are disclosed. One embodiment method includes setting a lighting control level of a first channel control line of the lighting fixture to a plurality of levels, setting a lighting control level of a second channel control line of the lighting fixture to a plurality of levels, sensing an amount of power dissipated by the lighting fixture, comparing the sensed amount of power dissipated for each of the plurality of levels, and determining a configuration of the lighting fixture based upon the comparing of the sensed amount of power for each of the plurality of lighting control levels for the first channel and the second channel.

Abstract: A production management apparatus of a board production line, which can prevent malfunction of the board production device in a test production process, and appropriately maintain the production environment, including: a permission determination section that, before transition from a test production process, in which the inspection device inspects a regulated number of initial boards produced by the board production device as a target, to a later main production process, determines permission for performing an operation command received by the board production device, based on a detection state and a detection result of an initial board by an inspection device; and a processing management section that controls processing of the operation command in the board production device based on a determination result by the permission determination section.

Abstract: A cable fitting transfer unit includes a holding arbor configured to accommodate cable fittings thereon; a conveyor configured to transport cable fittings to the holding arbor; a cable fitting fitter configured to receive cable fittings from the holding arbor; and, a force transducer operatively connected to measure accommodation force in the holding arbor during the accommodation of cable fittings, the force transducer being situated at the holding arbor.

Abstract: A panel device including a panel for performing at least one of input and output of information related to operation of a work machine, a panel-side support axis fixed to the panel, a connecting arm that is swingably held by the two support axes, a guide rail formed on the work machine side, a bolt that moves along the guide rail, and a regulating arm attached to the bolt and held so as to be oscillatable by the panel-side support axis. When the connecting arm is oscillated, the oscillation of the connecting arm and the angle of the panel is regulated by the regulating arm.

Abstract: Provided is a contactor that can be manufactured easily and secure a long stroke. A contactor includes: a flexible board; a plurality of contact point portions that are provided in the flexible board; a plurality of springs that urge the contact point portions respectively toward an inspection target device; and a housing that receives the plurality of springs. Each of the springs has a flat winding portion that is provided at least at an end portion of the spring on the contact point portion side, and a diagonal tight winding portion that is provided at a longitudinally intermediate portion of the spring. A gap is present between the flat winding portion and the diagonal tight winding portion in an uncompressed state of the spring.

Abstract: A production management apparatus of a board production line, which can prevent malfunction of the board production device in a test production process, and appropriately maintain the production environment, including: a permission determination section that, before transition from a test production process, in which the inspection device inspects a regulated number of initial boards produced by the board production device as a target, to a later main production process, determines permission for performing an operation command received by the board production device, based on a detection state and a detection result of an initial board by an inspection device; and a processing management section that controls processing of the operation command in the board production device based on a determination result by the permission determination section, is provided.

Abstract: A component mounting apparatus having a feature in which the component mounting apparatus includes a component mounting unit including a nozzle and a distance detector for optically detecting a distance between a component held by the mounting nozzle and a board, and an illuminated region formed by the distance detector is located in a vicinity of a portion obtained by projecting the mounting nozzle onto the board.

Abstract: An alternative to additive manufacturing is disclosed, introducing an end-to-end workflow in which discrete building blocks are reversibly joined to produce assemblies called digital materials. Described is the design of the bulk-material building blocks and the devices that are assembled from them. Detailed is the design and implementation of an automated assembler, which takes advantage of the digital material structure to avoid positioning errors within a large tolerance. To generate assembly sequences, a novel CAD/CAM workflow is described for designing, simulating, and assembling digital materials. The structures assembled using this process have been evaluated, showing that the joints perform well under varying conditions and that the assembled structures are functionally precise.

Abstract: A terminal crimping device includes crimp tooling comprising an anvil and a ram. A crimp zone is defined between the anvil and the ram. The crimp zone is configured to receive a wire and a terminal. The crimp tooling crimps the terminal to the wire during a crimp stroke. The terminal crimping device also includes an ultrasonic transducer module having at least one ultrasonic transducer held by at least one of the anvil or the ram. The ultrasonic transducer generates a plurality of ultrasonic pulses during the crimp stroke and directs the ultrasonic pluses through the terminal. The ultrasonic transducer receives the ultrasonic pulses and generates ultrasonic data based on the received ultrasonic pulses. The terminal crimp tooling also includes a crimp quality module communicatively coupled to the ultrasonic transducer module. The crimp quality module performs coherent processing of the ultrasonic data to determine a crimp quality.

Abstract: An electronic circuit component mounter equipped with a moving type component supply device which supplies electronic circuit components to a component holding tool and which is moved together with the component holding tool. In a state with passage-equipped component case is attached to the head main body, a dropped component catch plate is positioned below the rotational axis path of a suction nozzle and catches dropped components, while the raising/lowering of the suction nozzle is allowed at the component mounting position by opening and components are mounted on a board. Further, a sheet is affixed that prevents the movement of dropped components, and a dropped component catch plate is attached/detached to/from the head main body together with passage-equipped component case, and dropped components are removed in a state removed from the head main body.

Abstract: An automated robotic assembly system is configured to assemble a device by fitting a first component made of a material liable to deformation by external force with a second component by means of a robot, and the first component is provided with a distortion detection unit for detecting distortion thereof. If the distortion detected by the distortion detection unit exceeds a predetermined value, a signal for notifying abnormality is output to stop an automated assembly operation by the robot.

Abstract: A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.

Abstract: A strip of semiconductor devices includes a plurality of leadframes electrically isolated from each other, a plurality of semiconductor chips, and an encapsulation material. Each leadframe has a first surface and a second surface opposite to the first surface. At least one semiconductor chip of the plurality of semiconductor chips is electrically coupled to the first surface of each leadframe. The encapsulation material encapsulates each semiconductor chip and at least portions of each leadframe.

Abstract: A process and apparatus for collecting data for nondestructive evaluation of the quality of a crimped wire connector are provided. The process involves providing a crimping tool having an anvil and opposing jaw for crimping a terminal onto a stranded wire, moving the jaw relative to the anvil to close the distance between the jaw and the anvil and thereby compress the terminal against the wire, while transmitting ultrasonic waves that are propagated through the terminal wire combination and received at a receiving ultrasonic transducer as the jaw is moved relative to the anvil, and detecting and recording the position of the jaw relative to the anvil as a function of time and detecting and recording the amplitude of the ultrasonic wave that is received at the receiving ultrasonic transducer as a function of time as the jaw is moved relative to the anvil.

Abstract: For aligning an electronic component to a required orientation, the electronic component is picked up and it is inspected while it is being held to determine its initial orientation. A précising mechanism is then rotated to correspond to the initial orientation of the electronic component. After the electronic component is secured on the précising mechanism in the initial orientation, the précising mechanism is rotated to align the electronic component to the required orientation. Thereafter, the electronic component that has been aligned to the required orientation may be picked up for further testing and/or processing.

Abstract: A displacement device is for preparing a bag for its installation at a filling point (or second location) of packaging equipment. The displacement device grabs the bag from the pick-up location (or stack) (at which first position and orientation parameters have been previously measured), displaces the bag while measuring second position and orientation parameters of the bag, adjusting the operation and displacement of the displacement device for displacing and installing the bag at the filling point; at the same time, the measurement of the next bag's first position and orientation parameters is done to adjust the operation and displacement of the displacement device for grabbing the next bag on the stack. Such a double location evaluation, which is concomitant on two different bags, allows savings in processing time.

Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.

Abstract: Burn-in (BI) stress using stress patterns with pin-specific power characteristics. A control device for each conductive pathway from BI board (BIB) contacts to device under test (DUT) connectors/contacts can adjust power delivered to a respective connector/contact responsive to a controller. The control devices can be included in the BIB or an interposer (IP) can be used with existing equipment. Each control device can include a regulator, such as a latchable array of field effect transistors that can regulate power delivered to a respective package connector.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: An apparatus for assembling a lens module and an image sensor to form a camera module. The apparatus comprises i) a positioning system for adjusting a relative arrangement between the lens module and the image sensor; and ii) an inspection system operative to view fiducials of the lens modules and the image sensor. In particular, the positioning system is configured to align the lens module and the image sensor based on a relative alignment of the respective fiducials of the lens module and the image sensor as viewed by the inspection system. A method of assembling a lens module and an image sensor to form a camera module is also disclosed.

Abstract: A carrier disassembling apparatus which disassembles a test carrier including a base member and a cover member coming into close contact with each other, includes: a first reversing arm which sucks and holds the cover member; and a disassembly table which sucks and holds the base member. The first reversing arm can approach and separate from the disassembly table. The first reversing arm includes a first contract surface which comes into contact with the cover member. The first contract surface includes a protrusion which protrudes toward the cover member.

Abstract: A system for determining the quality of an electrical wire crimp between a wire and ferrule includes an ultrasonically equipped crimp tool (UECT) configured to transmit an ultrasonic acoustic wave through a wire and ferrule, and a signal processor in communication with the UECT. The signal processor includes a signal transmitting module configured to transmit the ultrasonic acoustic wave via an ultrasonic transducer, signal receiving module configured to receive the ultrasonic acoustic wave after it passes through the wire and ferrule, and a signal analysis module configured to identify signal differences between the ultrasonic waves. The signal analysis module is then configured to compare the signal differences attributable to the wire crimp to a baseline, and to provide an output signal if the signal differences deviate from the baseline.

Abstract: A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.

Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

Abstract: Device (12) for mounting a glove (106) in a cell flange (4) of a containment cell including a sleeve (14) configured to be attached to the cell; a piston (16) sliding in the sleeve (14); a first seal (18) between the piston (16) and the sleeve (14) so as to ensure tight sliding of the piston (16) in the sleeve (16) and seal the internal passage of the sleeve (14) tightly; control means configured to sliding the piston inside the sleeve; a second seal (20) between the sleeve (14) and the cell wall; the sleeve (14); the piston (16), the first (18) and second seals (20), the cell and the glove (6, 106) forming a detection volume (V); and a sensor (22) of the pressure (22) of the detection volume.

Abstract: Methods and systems for fabricating platelets of a monochromator for X-ray photoelectron spectroscopy (XPS) are disclosed. For example, a method of fabricating a platelet of a monochromator for X-ray photoelectron spectroscopy involves placing a crystal on a stage of an X-ray measuring apparatus, the crystal having a top surface. The method also involves measuring, by X-ray reflection, an orientation of a crystal plane of the crystal, the crystal plane beneath the top surface of the crystal and having a primary axis. The method also involves measuring a surface angle of the top surface of the crystal by measuring a light beam reflected from the top surface of the crystal.

Abstract: A terminal crimping device includes crimp tooling comprising an anvil and a ram movable toward the anvil with a crimp zone being defined between the anvil and the ram configured to receive a wire and a terminal configured to be crimped to the wire by the crimp tooling. An ultrasonic transmitting transducer is coupled to at least one of the anvil and the ram that transmits acoustic signals through the wire and terminal.

Abstract: Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.

Abstract: A system for rebalancing a generator rotor includes a temporary bearing shield configured to support a non-drive end of the generator rotor, and a pony motor assembly configured for attachment to a drive end of the generator rotor. The pony motor assembly is configured to rotate the generator rotor during a rebalancing operation. The temporary bearing shield and the pony motor assembly enable the generator rotor to be rotated during an in-situ rebalancing operation.

Abstract: An automated pallet inspection station includes a frame, a transport system carried by the frame for transporting a pallet to be inspected, and at least one pallet feature sensing head adjacent the transport system for inspecting the pallet. The at least one pallet feature sensing head includes a downward looking pallet feature sensing head positioned above the transport system for inspecting a top surface of the pallet, and an upward looking pallet feature sensing head positioned below the transport system for inspecting a bottom surface of the pallet.

Abstract: An electronic component mounting system includes a screen printing device, an inspection device, an electronic component mounting device, a feedback part that generates, based on inspection data formed by the inspection device, first information about corrections on control parameters pertinent to positioning of a mask to a substrate in the screen printing device, and a feedforward part that generates, based on the inspection data, second information about corrections on electronic component mount coordinates in the electronic component mounting device. The feedback part generates the first information based on the first print displacement value. The feedforward part generates the second information based on the second print displacement value.

Abstract: A method for installing a heated piston into a cylinder sleeve that is initially smaller than the piston includes: receiving the engine block at a heating station, heating the engine cylinder sleeve with heated air for a predetermined time at a predetermined temperature such that a temperature of the cylinder sleeve is equal to or greater than a temperature of the piston, and inserting the piston into the heated cylinder sleeve.

Abstract: A method is provided for evaluating a crimp procedure in a manufacturing process. In one embodiment, the method includes, but is not limited to, completing a crimp procedure on a single wire. The method further includes, but is not limited to, evaluating a quality of the crimp procedure based on time-domain reflectometry. The method still further includes, but is not limited to, generating reporting data based on the evaluating.

Abstract: Various embodiments include a service apparatus for a turbomachine. The service apparatus can include: a frame for coupling to an opening in the turbomachine; a bridge member operably coupled to the frame and spanning a width of the frame, the bridge member being substantially movable along a length of the frame; and a crane member operably coupled to the bridge member, the crane member being substantially movable along the width of the frame, wherein the crane member includes at least one attachment device for attaching to an object within the turbomachine.

Abstract: Provided are a system and method for measuring a vehicle gap or step, where a vehicle body to which a hood, a door, and a trunk lid are assembled is seated on a carrier and moved along transfer lines. The system may be installed over the transfer lines and may include one or more door regulating units attached between the vehicle body and the door, upper rails in both sides above a workplace corresponding to the transfer lines, a moving frame movable below the upper rails, a forward/backward moving unit above the moving frame, a horizontal moving unit to move installation frames, a vertical moving unit in the installation frames to reciprocally move a sliding plate upwardly and downwardly, a measurement module movable and rotatable to measure the gap or the step, and an electronic tag on a roof of the vehicle body.

Abstract: A method of monitoring a crimping process is disclosed, which determines whether an actual force stroke progression (Fa)/force-time progression is, a) above, or, b) below an ideal force stroke progression (Fi)/force-time progression in at least one point. The method shifts an upper border (Bu) and/or the lower border (Bl) of a tolerance band upwards in case a) and downwards in case b), utilizing four zones (Z1-Z4) of determined force progression. Additionally, there are is an absolute upper limit (Lu), at which an upward shifting of the upper border (Bu) is inhibited, and an absolute lower limit (Ll), at which a downward shifting of the lower border (Bl) is inhibited. Moreover, a crimping press and a computer program product embodying the method are disclosed.

Abstract: A printed board working apparatus includes a transport device which transports a printed board in a horizontal direction, and a moving member which moves in a horizontal direction above the transport device. The printed board working apparatus includes a plurality of component attaching portions which are aligned in the installation direction and move together with the moving member. The printed board working apparatus also includes at least one working head which performs work on the printed board held by the transport device. The working head is attached to at least one component attaching portion out of the plurality of component attaching portions, and can change a position relative to the moving member in the installation direction. A region where the working head cannot perform work as the number of working heads increases is reduced.

Abstract: An assembly method suitable for assembling a portable electronic device having a housing with an undercut portion is disclosed. The method includes aligning a non-display portion of a display assembly with the undercut portion of the housing, the display assembly comprising a display, a protective top layer covering a top side of the display portion and the non-display portion and a battery module attached to an underside of the display assembly, electrically connecting the battery to a circuit previously installed in the housing, angling the display assembly in relation to a front opening of the housing in a tilted configuration such that the non-display portion is partially inserted into the undercut portion of the housing, and in the tilted configuration, performing a pre-install functional test on the display and fully inserting the display assembly into the housing only when the pre-install functional test is successfully completed.

Abstract: A device for assembling or disassembling a first threaded pipe (1) to or from a second threaded pipe (2) is described, the device including a first machine (12) arranged to lift the first threaded pipe (1), and the device being characterized by the first machine (12) being arranged to lift the first threaded pipe (1) with a force corresponding to the net weight of the first threaded pipe (1); and the first machine being arranged to lift the first threaded pipe (1) with a force equal to the difference between the weight force from the net weight of the first threaded pipe and a desired axial contact force between the first threaded pipe (1) and the second threaded pipe (2) during the make-up or break-out operation, the desired axial contact force being smaller than the weight force from the net weight of the first threaded pipe (1). A method of assembling or disassembling threaded pipes (1, 2) is described as well.

Abstract: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.

Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Abstract: An automated pallet inspection and repair apparatus comprises an inspection station and a repair station. The inspection station comprises a laser that illuminates a pallet, a camera that collects the reflected light and a computer system. The computer system analyses the output of the camera and acquires the pallet's geometry and topography. The design of the pallet is determined by the computer software. A decision to repair the pallet is made by comparing acquired pallet data against the design criteria. If the pallet needs repair, a recipe of repair steps is constructed by inspecting each of the pallet's elements. The recipe is transmitted to the automated repair station.