Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: A fully automated method is performed on a structure having a confined space. The structure has a location that is identifiable from within the confined space and from outside the confined space. A first robotic system moves a first end effector inside the confined space such that the first end effector is positioned over the location. A first vector corresponding to the location is generated. A second robotic system moves a second end effector outside the confined space such that the second end effector is positioned over the location. A second vector corresponding to the location is generated. The first and second vectors are used to move the first and second end effectors to a new location such that the first and second end effectors are in working opposition. The first and second end effectors perform a synchronous operation at the new location.

Abstract: An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

Abstract: A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.

Abstract: A method of manufacturing an electronic-charge-transferring device includes providing a charged species source and a charge species drain and providing a movable component for transferring charge to the charged species drain. A first protrusion proximate to the moveable component and a second protrusion proximate to the moveable component are also provided. The moveable component is positioned in close proximity to the charged species source, and at least one of the moveable component, the first protrusion and the second protrusion is of a micrometer scale or smaller.

Abstract: A charged species source and a charged species drain are provided. A moveable component is positioned proximate to the charged species source and the charged species drain. A first protrusion and a second protrusion are provided in contact with the moveable component, wherein at least one of the moveable component, the first protrusion and the second protrusion have a size of a micrometer scale or smaller. The moveable component is moved relative to the charged species source and the charged species drain to transfer electrical charge between the source and the drain.

Abstract: A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each mounted at one end adjacent the substrate support, and each having a loose end. When the portions of the fiber adjacent the loose fiber ends are each brought into contact with the under surface of the substrate, Van der Waals forces are exerted between the substrate and the fibers to urge the substrate toward the underlying substrate support. In a preferred embodiment, the substrate and portions of the fiber adjacent the loose fiber ends are first vertically brought into physical contact with one another, and then a horizontal force is applied to horizontally move, with respect to one another, the substrate and the portions of the fibers adjacent the loose fiber ends.

Abstract: Method and apparatus for effecting an interference fit of a first part and a second part, wherein a thrust force is applied to the second part in a direction toward the first part to thereby accelerate the second part for applying a kinetic energy to the second part to cause abutting contact of the second part with the first part for achieving the interference fit of the first and second parts, and wherein the initiation of acceleration of the second part by the thrust force is inhibited until the thrust force has been increased to a predetermined threshold, and is permitted when the thrust force has been increased to the predetermined threshold.

Abstract: A thin film composed of a silane-based compound comprising an alkyl group or a fluoroalkyl group is bonded to the surface of an electrically insulating substrate through a covalent bond, thus obtaining an electrically chargeable substrate maintaining a charged state for a long time regardless of relative humidity of an atmosphere. A glass plate for placing a sheet in an overhead projector is dipped into a solution comprising CF3(CF)7(CH2)2SiCl3. As a result, a molecular composed of CF3(CF2)7(CH2)2Si(O)3—is chemically bonded to the glass surface. A high charged state, a water-repelling property having a static contact angle of pure water on the thin film formed on the glass surface of 110 degrees and a volume electric resistivity in the range of 1×1011−1×1019&OHgr;·cm are provided.

Abstract: There is disclosed an apparatus and method for bonding a sheet material to an elongated base material, in which the sheet material is transferred by a transferring device towards the base material, and the sheet material is bonded by a bonding device to the base material. A static electricity generating device is attached to the bonding device for generating static electricity on the sheet material to cause the sheet material to adhere to the bonding device, so that the sheet material is prevented from falling from the bonding device prior to the bonding step. Furthermore, an apparatus and method for manufacturing a flexible flat cable, applying the above bonding apparatus and method is also disclosed. In this apparatus and method, a pair of insulating tape sheets are transferred towards electric conductors.

Abstract: There is disclosed an apparatus and method for bonding a sheet material to an elongated base material, in which the sheet material is transferred by a transferring device towards the base material, and the sheet material is bonded by a bonding device to the base material. A static electricity generating device is attached to the bonding device for generating static electricity on the sheet material to cause the sheet material to adhere to the bonding device, so that the sheet material is prevented from falling from the bonding device prior to the bonding step. Furthermore, an apparatus and method for manufacturing a flexible flat cable, applying the above bonding apparatus and method is also disclosed. In this apparatus and method, a pair of insulating tape sheets are transferred towards electric conductors.

Abstract: A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil with a sheet of plastic film. The film is removably joined with the foil as a result of the essential absence of gaseous material between the film and the foil. Thus, the film conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of the foil with the film adhering tightly thereto. The absence of air between the film and the foil is produced by oppositely statically electrically charging the film and the foil such that they are forced together sufficiently to squeeze the air out from therebetween.

Abstract: An electrostatic-clamping robotic-type semiconductor wafer-holding blade designed to optimize the electrostatic clamping force and decrease the required clamping voltage. The wafer blade includes: a base; interleaved electrodes formed on the base, alternating electrodes being connected in common electrically; and preferably a layer of dielectric material such as Al.sub.2 O.sub.3 having a thickness ranging between 2 mils and 15 mils disposed over the interleaved electrodes and the base to minimize the applied voltage necessary to flatten the wafer against the blade, without dielectric breakdown. The ratio of electrode width to the distance between electrodes ranges from 3/1 to 2/1 to optimize the electrostatic clamping force exerted by the blade.

Abstract: An electrostatic chuck (1) for holding a semiconductor wafer (5) has a dielectric layer (4) on an electrode (2) and surrounded by an annulus (3) for electrically contacting the wafer. The wafer is located on the dielectric layer but at its periphery contacts the annulus. By applying a potential difference (V) from an external voltage source between the annulus and the electrode the wafer is electrostatically clamped against the chuck. The wafer is displaced rotationally, perpendicularly, and/or laterally on the chuck while the voltage is still connected. This enchances the clamping effect due to charge retention in the dielectric layer after the voltage source has been disconnected.

Abstract: Films (12) of gold, copper, silicon nitride, or other materials are firmly bonded to insulator substrates (12) such as silica, a ferrite, or Teflon (polytetrafluorethylene) by irradiating the interface with high energy ions. Apparently, track forming processes in the electronic stopping region cause intermixing in a thin surface layer resulting in improved adhesion without excessive doping. Thick layers can be bonded by depositing or doping the interfacial surfaces with fissionable elements or alpha emitters.