Method Or Apparatus With Electroplating Patents (Class 29/DIG12)
  • Patent number: 5966803
    Abstract: An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: October 19, 1999
    Assignee: International Business Machines Corporation
    Inventor: James Warren Wilson
  • Patent number: 5966805
    Abstract: A connecting end portion of a planar circuit body and method of making same in which an end portion is directly formed into a terminal thereby improving conductivity and simplifying the connection. According to one embodiment, a connecting end portion of a flat cable is formed by laminating a rectangular circuit conductor with an insulating cover material, a terminal member is fixedly secured to the planar circuit conductor at an end portion of the circuit conductor with a conductive adhesive agent, and plated metal layer is formed thereon.
    Type: Grant
    Filed: November 1, 1996
    Date of Patent: October 19, 1999
    Assignee: Yazaki Corporation
    Inventors: Yoshinobu Akiha, Hitoshi Ushijima
  • Patent number: 5839190
    Abstract: Methods for making a printed wiring device including a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected by a metal layer plated on the lead and on the member and forming an electrically conductive path between the lead and the member.
    Type: Grant
    Filed: October 10, 1996
    Date of Patent: November 24, 1998
    Inventor: Kenneth W. Sullivan
  • Patent number: 5784779
    Abstract: A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: July 28, 1998
    Assignee: Robert Bosch GmbH
    Inventors: Werner Gruenwald, Ralf Haug, Martin Seyffert, Frank-Dieter Hauschild
  • Patent number: 5758412
    Abstract: A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material; c) forming holes through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; and f) treating the board with a metallic plating solution to deposit conductive metal in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements. This may be in two stages, with an initial thin layer of copper being deposited, followed by a main layer of nickel to the desired thickness.
    Type: Grant
    Filed: October 15, 1996
    Date of Patent: June 2, 1998
    Assignee: MacDermid, Incorporated
    Inventor: John Frederick Knopp
  • Patent number: 5737837
    Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: April 14, 1998
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5737043
    Abstract: A liquid crystal display panel holding metal fixture that prohibits the flow of solder through a gap at its corner portion when it is soldered to a printed circuit board. The liquid crystal display panel holding metal fixture has bottom and side surfaces that are formed by bending a metal plate cut into a predetermined shape. The bottom surface has corner portions where the cut surfaces of the metal plate are close to each other. The metal plate is plated to impart solder wettability thereto when the metal plate is made of a material having poor solder wettability, and is thereafter cut into the predetermined shape to expose the poor wettability material at the cut portions that prohibit the flow of solder through the gap. Alternatively, the metal plate is made of a material having good solder wettability, and the cut surfaces are subjected to a surface treatment for reducing solder wettability.
    Type: Grant
    Filed: April 25, 1996
    Date of Patent: April 7, 1998
    Assignee: NEC Corporation
    Inventor: Kei Takaya
  • Patent number: 5622612
    Abstract: A process is recited for plating elongated current collectors with indium. The current collectors have particular utility in alkaline electrochemical cells, particularly zinc/manganese dioxide alkaline cells containing "zero-added" mercury. The process of the invention involves electroplating conductive wire with indium and then drawing the plated wire to a lesser diameter. The drawn plated wire may then be cut to the desired lengths, typically in the shape of a nail, for use as current collectors within the alkaline cell.
    Type: Grant
    Filed: November 16, 1995
    Date of Patent: April 22, 1997
    Assignee: Duracell Inc.
    Inventors: David R. Mihara, Stephen J. Rose, Robert E. Gustar, David V. Adamson, Paul Barton
  • Patent number: 5475918
    Abstract: Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: December 19, 1995
    Assignee: Electroplating Engineers of Japan Ltd.
    Inventors: Tsuneo Kubota, Kazuhiro Taniguchi
  • Patent number: 5428331
    Abstract: This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component substrate according to the invention has at least two magnet poles, oriented toward the components and having opposite polarity. The magnet field lines extend from one magnet pole to the other magnet pole through the components only in the vicinity of a contact faces of the components oriented toward the magnet poles. This prevents ferromagnetic particles from depositing on the ends of the components remote from the contact faces. The apparatus according to the invention is especially suitable for holding a plurality of components during electrolytic surface coating of the components.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: June 27, 1995
    Assignee: Robert Bosch GmbH
    Inventors: Juergen Graner, Norbert Keim, Martin Maier, Manfred Nitsch, Josef Weber
  • Patent number: 5377404
    Abstract: A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers, stacking and laminating the drilled board layers utilizing conformal mapping digital imaging in a computer, and then finish drilling the holes. The invention also provides a method for correcting artwork to compensate for lamination distortion.
    Type: Grant
    Filed: December 10, 1993
    Date of Patent: January 3, 1995
    Inventor: N. Edward Berg
  • Patent number: 5206991
    Abstract: A method for producing a copper brazed hose coupling assembly from a plurality of members in which one of the members is electroplated with copper is provided. A stem member is press fitted to a collet member and subsequently brazed together in a furnace. The copper material being located adjacent the joint between the stem and collet members results in a high quality braze joint to be provided with a predetermined minimum amount of copper. The copper brazed hose coupling is particularly suited for use in a fluid operated system.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: May 4, 1993
    Assignee: Caterpillar Inc.
    Inventor: Barry L. Barley
  • Patent number: 5109589
    Abstract: Processes for making metal prototype parts are described. The key steps of the invention include: making a computer aided design (CAD) file of the prototype part; modifying such file a first time to produce a file of a first mandrel upon which the part will be formed; modifying such file a second time to produce a second mandrel upon which a metal anode will be formed, the anode and first mandrel then being used in an electroplating process to form the prototype. Stereolithographic techniques are preferred for making the mandrels out of polymeric materials.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: May 5, 1992
    Assignee: United Technologies Corporation
    Inventors: Paul S. Cramer, Gary M. Lomasney, Joseph J. Parkos, Jr.
  • Patent number: 4808275
    Abstract: A rotor of a disc brake is coated with a nickel coating containing ceramic particles in a dispersed state and having a thickness not less than 2 .mu.m, thereby improving corrosion resistance while minimizing torque fluctuation of the rotor during braking. The nickel coating is formed on the surface of the rotor by composite plating in which nickel and the ceramic particles are simultaneously electrodeposited on the surface of the rotor. An annular jig surrounding the outer periphery of the rotor is used to insure a uniform coating thickness.
    Type: Grant
    Filed: November 2, 1987
    Date of Patent: February 28, 1989
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Takashi Ohzora, Yoshio Otsuka, Kazuo Hoshino
  • Patent number: 4645360
    Abstract: A plain bearing comprising a metal backing, an aluminium based bearing alloy layer and a sacrificial overlay of pure tin applied directly to the bearing material without a nickle interlayer. The bearing alloy comprises by weight, 1 to 11% silicon, 8 to 35% tin, 0.2 to 2% copper with the balance being aluminium.
    Type: Grant
    Filed: December 18, 1985
    Date of Patent: February 24, 1987
    Assignee: AEPLC
    Inventors: Barry J. Eastwood, David R. Eastham
  • Patent number: 4492020
    Abstract: In the disclosed method for fabricating corrugated microwave components, a billet assembly is formed of electrically conductive plates sandwiched with chemical etching sensitive spacer material and clamped together. An inside surface is formed in the billet and a mandrel inserted. An outer contoured surface is then formed on the mandrel-billet assembly. The outer surface is then plated to a desired thickness. The mandrel is removed and the spacers chemically etched away leaving the finished component. With the disclosed method, microwave device fabrication for frequencies including 100 GHz and higher is possible.
    Type: Grant
    Filed: September 2, 1982
    Date of Patent: January 8, 1985
    Assignee: Hughes Aircraft Company
    Inventor: Jack M. Cobb
  • Patent number: 4275767
    Abstract: A fluid resistor with a fluid tight structure including two planar members having a surface of each contacting in close proximity. One of the planar members has a laminated structure including a substrate and at least one thin layer of substantially uniform thickness formed on the substrate. A groove extends through the layer. The groove and the surface of the other planar member define a capilliary passageway of substantially constant depth for restricted fluid flow.
    Type: Grant
    Filed: October 27, 1976
    Date of Patent: June 30, 1981
    Assignee: Sybron Corporation
    Inventor: Norman R. Westfall
  • Patent number: 4067103
    Abstract: A method for making a plug-in fuse assembly like that disclosed and claimed in U.S. Pat. No. 3,909,767, granted Sept. 30, 1975 for Miniature Plug-In Fuse having different desired fuse ratings. The method comprises the steps of providing a strip of fuse metal which is initially preferably provided throughout its length with a continuous longitudinally extending portion of reduced thickness having a fixed thickness dimension and from which fuse link portions of fuse elements are to be stamped. Various selected areas of the strip, those which preferably are not the portions of reduced thickness and from which the terminal portions of the fuses are to be formed, are covered with a non-oxidizable conductive coating, preferably tin plating.
    Type: Grant
    Filed: February 7, 1977
    Date of Patent: January 10, 1978
    Assignee: Littelfuse, Inc.
    Inventor: Allen L. Ciesmier
  • Patent number: 4028785
    Abstract: A bimetallic tube comprising a copper-base alloy and a reactive metal such as titanium, is produced by assembling concentrically a tubular member of each of such materials and interposing a layer of copper, nickel or silver between them, forming a bond between the reactive metal and the copper, nickel or silver and extruding the assembly. The bimetallic tube is useful for heat exchange purposes when corrosive fluids are involved and has better heat transfer properties than an all-reactive metal tube.
    Type: Grant
    Filed: May 30, 1974
    Date of Patent: June 14, 1977
    Assignee: Yorkshire Imperial Metals Limited
    Inventors: Kenneth Thomas Jackson, Lance Porter
  • Patent number: 3956814
    Abstract: A process for forming stepped lids for microelectronic circuit cases. A plurality of interconnected lids is etched in a metal sheet with the lids oversize. Individual lids are stamped from the sheet to the desired size, providing substantially square corners at the edge of the lid and a substantially flat rim for engagement with the case.
    Type: Grant
    Filed: May 21, 1975
    Date of Patent: May 18, 1976
    Assignee: Bliss & Laughlin Ind., Inc.
    Inventor: Robert L. Peet