Abstract: An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.

Abstract: A connecting end portion of a planar circuit body and method of making same in which an end portion is directly formed into a terminal thereby improving conductivity and simplifying the connection. According to one embodiment, a connecting end portion of a flat cable is formed by laminating a rectangular circuit conductor with an insulating cover material, a terminal member is fixedly secured to the planar circuit conductor at an end portion of the circuit conductor with a conductive adhesive agent, and plated metal layer is formed thereon.

Abstract: Methods for making a printed wiring device including a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected by a metal layer plated on the lead and on the member and forming an electrically conductive path between the lead and the member.

Abstract: A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.

Abstract: A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material; c) forming holes through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; and f) treating the board with a metallic plating solution to deposit conductive metal in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements. This may be in two stages, with an initial thin layer of copper being deposited, followed by a main layer of nickel to the desired thickness.

Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.

Abstract: A liquid crystal display panel holding metal fixture that prohibits the flow of solder through a gap at its corner portion when it is soldered to a printed circuit board. The liquid crystal display panel holding metal fixture has bottom and side surfaces that are formed by bending a metal plate cut into a predetermined shape. The bottom surface has corner portions where the cut surfaces of the metal plate are close to each other. The metal plate is plated to impart solder wettability thereto when the metal plate is made of a material having poor solder wettability, and is thereafter cut into the predetermined shape to expose the poor wettability material at the cut portions that prohibit the flow of solder through the gap. Alternatively, the metal plate is made of a material having good solder wettability, and the cut surfaces are subjected to a surface treatment for reducing solder wettability.

Abstract: A process is recited for plating elongated current collectors with indium. The current collectors have particular utility in alkaline electrochemical cells, particularly zinc/manganese dioxide alkaline cells containing "zero-added" mercury. The process of the invention involves electroplating conductive wire with indium and then drawing the plated wire to a lesser diameter. The drawn plated wire may then be cut to the desired lengths, typically in the shape of a nail, for use as current collectors within the alkaline cell.

Abstract: Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.

Abstract: This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component substrate according to the invention has at least two magnet poles, oriented toward the components and having opposite polarity. The magnet field lines extend from one magnet pole to the other magnet pole through the components only in the vicinity of a contact faces of the components oriented toward the magnet poles. This prevents ferromagnetic particles from depositing on the ends of the components remote from the contact faces. The apparatus according to the invention is especially suitable for holding a plurality of components during electrolytic surface coating of the components.

Abstract: A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers, stacking and laminating the drilled board layers utilizing conformal mapping digital imaging in a computer, and then finish drilling the holes. The invention also provides a method for correcting artwork to compensate for lamination distortion.

Abstract: A method for producing a copper brazed hose coupling assembly from a plurality of members in which one of the members is electroplated with copper is provided. A stem member is press fitted to a collet member and subsequently brazed together in a furnace. The copper material being located adjacent the joint between the stem and collet members results in a high quality braze joint to be provided with a predetermined minimum amount of copper. The copper brazed hose coupling is particularly suited for use in a fluid operated system.

Abstract: Processes for making metal prototype parts are described. The key steps of the invention include: making a computer aided design (CAD) file of the prototype part; modifying such file a first time to produce a file of a first mandrel upon which the part will be formed; modifying such file a second time to produce a second mandrel upon which a metal anode will be formed, the anode and first mandrel then being used in an electroplating process to form the prototype. Stereolithographic techniques are preferred for making the mandrels out of polymeric materials.

Abstract: A rotor of a disc brake is coated with a nickel coating containing ceramic particles in a dispersed state and having a thickness not less than 2 .mu.m, thereby improving corrosion resistance while minimizing torque fluctuation of the rotor during braking. The nickel coating is formed on the surface of the rotor by composite plating in which nickel and the ceramic particles are simultaneously electrodeposited on the surface of the rotor. An annular jig surrounding the outer periphery of the rotor is used to insure a uniform coating thickness.

Abstract: A plain bearing comprising a metal backing, an aluminium based bearing alloy layer and a sacrificial overlay of pure tin applied directly to the bearing material without a nickle interlayer. The bearing alloy comprises by weight, 1 to 11% silicon, 8 to 35% tin, 0.2 to 2% copper with the balance being aluminium.

Abstract: In the disclosed method for fabricating corrugated microwave components, a billet assembly is formed of electrically conductive plates sandwiched with chemical etching sensitive spacer material and clamped together. An inside surface is formed in the billet and a mandrel inserted. An outer contoured surface is then formed on the mandrel-billet assembly. The outer surface is then plated to a desired thickness. The mandrel is removed and the spacers chemically etched away leaving the finished component. With the disclosed method, microwave device fabrication for frequencies including 100 GHz and higher is possible.

Abstract: A fluid resistor with a fluid tight structure including two planar members having a surface of each contacting in close proximity. One of the planar members has a laminated structure including a substrate and at least one thin layer of substantially uniform thickness formed on the substrate. A groove extends through the layer. The groove and the surface of the other planar member define a capilliary passageway of substantially constant depth for restricted fluid flow.

Abstract: A method for making a plug-in fuse assembly like that disclosed and claimed in U.S. Pat. No. 3,909,767, granted Sept. 30, 1975 for Miniature Plug-In Fuse having different desired fuse ratings. The method comprises the steps of providing a strip of fuse metal which is initially preferably provided throughout its length with a continuous longitudinally extending portion of reduced thickness having a fixed thickness dimension and from which fuse link portions of fuse elements are to be stamped. Various selected areas of the strip, those which preferably are not the portions of reduced thickness and from which the terminal portions of the fuses are to be formed, are covered with a non-oxidizable conductive coating, preferably tin plating.

Abstract: A bimetallic tube comprising a copper-base alloy and a reactive metal such as titanium, is produced by assembling concentrically a tubular member of each of such materials and interposing a layer of copper, nickel or silver between them, forming a bond between the reactive metal and the copper, nickel or silver and extruding the assembly. The bimetallic tube is useful for heat exchange purposes when corrosive fluids are involved and has better heat transfer properties than an all-reactive metal tube.

Abstract: A process for forming stepped lids for microelectronic circuit cases. A plurality of interconnected lids is etched in a metal sheet with the lids oversize. Individual lids are stamped from the sheet to the desired size, providing substantially square corners at the edge of the lid and a substantially flat rim for engagement with the case.