Abstract: An enhanced identification tag produces an identification (ID) signal, i.e., a radio frequency (RF) signal carrying identification information, capable of being interpreted by an electronic reader device. An identification tag in accordance with the invention is characterized by a flexible substrate, programmable encoder circuitry formed on said substrate defining identification information, an antenna, and signal generator circuitry carried by said substrate responsive to said encoder circuitry for applying a radio frequency signal bearing said identification information to said antenna. A preferred tag is fabricated using a printing process to mark a conductive pattern, e.g., comprised of a conductive ink based on silver, carbon, etc., on a flexible substrate, e.g., polytethyline, polyvinyl chloride or other plastic type material.

Abstract: A marker device for merchandise items has blanks of high magnetic coercivity material spaced along a strip of high magnetic permeability material. The strip and blanks are the same width, produced from three ribbons of material, one ribbon of the high coercivity material, another of the high permeability material, and a third having a pressure sensitive adhesive surface in one process embodiment, and the third being a heat activated adhesive film in another process embodiment. The strip and blanks are thereby adhesively connected. Multiple strips of the marker devices are produced simultaneously by running adhesively connected ribbons through a gang of slitter knives.

Abstract: A method and system for producing a plurality of integrated circuit packages having heat spreaders attached thereto. A planar metal sheet having predefined openings allows the addition of discrete bypass capacitors to the integrated circuit package. The planar metal sheet laminates to a plurality of laminated printed wiring boards. The metal sheet is then cut into sections resulting in individual packages. Each package has a cavity in which an integrated circuit die is placed therein. The integrated circuit die is in close thermal communication with the heat spreader of the package and connects to the conductive paths of the printed wiring boards. The invention is especially advantageous in manufacturing in quantity plastic pin grid array (PPGA) and plastic ball grid array (PBGA) integrated circuit packages.

Abstract: Disclosed is a method of making capsules of dehydrated sludge which can omit conventionally required unit operations, reduce or eliminate the cost of the equipment and power, heat energy and consumables required for operation, and assures simple operation. The method includes the steps of shaping a steel strip into the form of a channel, supplying sludge into the channel formed in the previous step, shaping the channel formed steel strip with the sludge charged therein such that it has practically a circular cross-section to enclose the sludge, pressing and crushing an outer periphery of a steel tube shaped in the previous step to form a constriction, pressing and cutting the constriction and repeating series of the above-described steps.

Abstract: A method of manufacturing metallic strip which differs in composition across its width includes feeding a cutting tool continuously into the peripheral surface of a rotating workpiece comprising a plurality of cylindrical components of differing composition to produce a continuous strip peeled from the surface of the workpiece, and collecting the peeled strip by winding it under tension around a coiler.

Abstract: This specification discloses a method of and apparatus for forming concrete reinforcing elements having enlarged ends and also discloses a reinforced composite incorporating such elements. In one embodiment the enlarged ends are formed by folding the edges of a strip of sheet metal onto itself while in another form the enlarged ends are formed by edge rolling a strip. In both cases the reinforcing element is formed by transversely shearing the strip after its edge has been modified. The reinforcing elements as described above are shown to have a greater pull-out resistance than plain elements.

Abstract: A process for forming stepped lids for microelectronic circuit cases. A plurality of interconnected lids is etched in a metal sheet with the lids oversize. Individual lids are stamped from the sheet to the desired size, providing substantially square corners at the edge of the lid and a substantially flat rim for engagement with the case.