Abstract: A tool and method for removing a film from a surface is provided, wherein the tool can include a frame, a handle operably coupled to the frame, a number of wheels operably coupled to the frame, a cylinder rotatably coupled to the frame, an arm rotatably coupled to the frame, and a number of separating devices operably coupled to the arm. In some embodiments, the wheels can rotate about one or more axes parallel to the surface. The cylinder, which collects the removed film, rotates about an axis that can also be parallel to the surface. The arm can rotate about an axis that can also be parallel to the surface.

Abstract: A clamp assembly selectively grips material. The clamp assembly is connectable to an object, and includes a housing and a gripping assembly. The housing has a first end, a second end, a first portion and a second portion. The first and second portions cooperate to define a material receiving slot. The first portion of the housing has an angular disposed channel and an angular disposed recessed portion. The second portion of the housing has a gripping surface. The gripping assembly is slidably disposed within the channel such that the recessed portion cooperates with the channel to define a travel path so that the gripping assembly can be selectively movable between a biased first position and a second position. In the biased first position, the gripping assembly extends into the material receiving slot. In the second position the gripping assembly is withdrawn from the material receiving slot.

Abstract: The present invention provides a technology for holding an object to be reliably conveyed for the sake of high speed conveyance not only in a low temperature environment but also in a high temperature environment, and for reducing dust while conveying the object to be conveyed. A conveying device includes a link mechanism, which can expand and contract, has a plurality of arms to which power from a drive source is transmitted, and a mounting section which is connected to an operating tip section of the link mechanism through a drive link section and on which a substrate is mounted. The mounting section has latch sections for making contact with and latching side portions of the substrate.

Abstract: A chuck hand 1 includes a pressing mechanism 14 having a pusher 25 which presses a semiconductor process wafer 3 in the direction of a front guide 12 to thereby grip the semiconductor process wafer 3. The pressing mechanism 14 further has a pusher supporting body 22 and a buffering member 28. The pusher supporting body 22 is configured such that it can advance and retract. The pusher supporting body 22 is disposed in the pusher 25 such that it can slide back and forth. A gap 26a is defined forward relative to the pusher supporting body 22. The buffering member 28, which has a low bounce and is elastically deformable, is interposingly placed in the gap 26a. When the pusher supporting body 22 moves forward, it pushes the pusher 25 through the buffering member 28 whereby the pusher 25 is moved forward. The pusher 25 is abutted and pressed against the semiconductor process wafer 3.

Abstract: The multiple pot carry device provides for carrying multiple plant pots with one hand, with substantially automatic pot lip engagement retained until released by a user. Ease of pot engagement and disengagement are key features of the device. The device is not limited to three clamps pivotally suspended from the carry bar. Clamps are substantially automatic in engagement and disengagement with pot lips.

Abstract: A drum lifter for lifting and moving empty and full chimed and unchimed drums. The lifter includes a cross member with grippers at each end. The grippers include a cam block with a cam rotatably mounted in the cam block.

Abstract: A device for gripping a load structure includes a first jaw member having a proximate end and a distal end, a second jaw member slidably mounted to the first jaw member and having a proximate end and a distal end. Each of the two jaw members is provided with a gripper. The device further includes a fulcrum member mounted to the first jaw member near the proximate end thereof and a flexible element secured to the second jaw member near the distal end thereof operatively coupled to the fulcrum member for causing an externally applied pulling force on the flexible element to move the distal end of the first jaw member towards the distal end of the second jaw member so as to yield a first inward force between the first and second grippers.

Abstract: When dishes are held by means of a robot hand (10), its fixed side engaging plate (13) and movable side engaging finger (14) are moved under horizontal state toward a dish (20) to be handled, and the outer circumferential edge side portion of the dish (20) is inserted between them. The distal end portion (14b) of the movable side engaging finger (14) is then bent by a predetermined amount to the side of the dish (20) and the robot hand (10) is raised. Consequently, the dish (20) is brought into a state where it is held by its own weight between the fixed side engaging plate (13) and the movable side engaging finger (14). Thereafter, the right and left first finger units (15, 16) are bent to the side of the dish (20) and the dish (20) is pushed by their dish pushing faces (15g, 16g), thus bringing about such a state as the dish (20) is held surely between the fixed side engaging plate (13) and the movable side engaging finger (14).

Abstract: A blade handling apparatus includes a mount frame; a stinger boom carried by the mount frame; and a lift block assembly including a lift block carried by the stinger boom; a pair of rod housings carried by the lift block; a pair of push rods slidably carried by the pair of rod housings, respectively; and a pair of blade lock pins carried by the pair of rod housings, respectively, and engaged by the pair of push rods, respectively.

Abstract: A bundle gripper for a palletizing machine for picking up respectively at least one bundle and depositing the bundle on a pallet. The bundle gripper including a frame, an adjustable end stop, and at least one gripper finger such that the gripper finger has a front end and is adjustable on the frame. The gripper finger being movable between a first position and a second position. The bundle gripper also including a hold-down clamp coupled to the frame and positioned against the end stop for clamping the bundle against the gripper finger such that a distance between the end stop and the front end of the gripper finger in the second position is changeable to adapt to different lengths of the bundles. The end stop and the gripper finger are each movable to change the distance and the hold-down clamp is correspondingly adjustable to accommodate different lengths of the bundles.

Abstract: A clamp mechanism includes a base defining two first sliding grooves, a sliding member slidable relative to the base and two second sliding grooves corresponding to the first sliding grooves respectively, a pair of first connecting members slidably received in the first sliding grooves respectively, a pair of second connecting members slidably received in the second sliding grooves respectively, a first clamp member connected to one first connecting member and one second connecting member, a second clamp member connected to the other first connecting member and the other second connecting member, an impelling member fixed to the sliding member; and a driver capable of driving the sliding member along with the first and second clamp members to move toward or away from each other in order to clamp or release an object, and the impelling member capable of removing the object when the object is released.

Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: An industrial robot may include a robot hand structured to mount a transfer object, a multi-joint arm section having at least two arms including a robot hand supporting arm structured to support the robot hand to be rotatable; and a main section structured to support the multi-joint arm section to be rotatable. The robot hand may include a grasping part structured to contact and grasp the transfer object and a biasing member structured to bias the grasping part in a direction for grasping the transfer object. The robot hand supporting arm may include an eccentric member fixed to the robot hand supporting arm at a position being eccentric from a turning center of the robot hand in relation to the supporting arm.

Abstract: A hand 1 is constituted by a hand base 4 serving as a base portion, a rocking hand 3 disposed to be superposed on the hand base 4 and serving to support a substrate 2, and a rocking mechanism 5 provided between the hand base 4 and the rocking hand 3 and serving to support the rocking hand 3 to be tiltable and movable in parallel with respect to the hand base 4.

Abstract: A chuck hand 1 includes a pressing mechanism 14 having a pusher 25 which presses a semiconductor process wafer 3 in the direction of a front guide 12 to thereby grip the semiconductor process wafer 3. The pressing mechanism 14 further has a pusher supporting body 22 and a buffering member 28. The pusher supporting body 22 is configured such that it can advance and retract. The pusher supporting body 22 is disposed in the pusher 25 such that it can slide back and forth. A gap 26a is defined forward relative to the pusher supporting body 22. The buffering member 28, which has a low bounce and is elastically deformable, is interposingly placed in the gap 26a. When the pusher supporting body 22 moves forward, it pushes the pusher 25 through the buffering member 28 whereby the pusher 25 is moved forward. The pusher 25 is abutted and pressed against the semiconductor process wafer 3.

Abstract: A holding apparatus for holding a semiconductor wafer comprises a pneumatic cylinder, a plunger movably connected to the pneumatic cylinder, an inlet pipe connected to the pneumatic cylinder, and a relief valve connected to the inlet pipe. Clean dry air is pumped into the pneumatic cylinder through the inlet pipe to impel the plunger in a first direction to contact the wafer. A part of the air in the inlet pipe is discharged through the relief valve to regulate air pressure to the pneumatic cylinder.

Abstract: A substrate holding apparatus includes a base plate with a two-pronged portion, a holding plate arranged above the base plate, a driving portion provided therebetween, a holding portion formed by a tip end of the two-pronged portion and a tip end of the holding plate, and a guide portion provided at the tip end of the two-pronged portion for guiding a part of the substrate. The driving portion includes an urging means for always urging a basal end side of the holding plate upward, an electric magnetic portion for drawing the holding plate toward the base plate, and a bearing portion arranged at on the tip end side of the base plate. The guide portion has a guide groove which comes into contact with a part of a periphery of the substrate.

Abstract: A lift member safety latch combination is disclosed. The lift member safety latch combination has a lift member that supports a drive mechanism and an actuator that is positioned adjacent to the drive mechanism. The lift member safety latch combination also has a confinement member that is in sliding communication with the lift member. The confinement member's position is responsive to the drive mechanism and has a state that is responsive to the actuator.

Abstract: A mixed size product end of arm tooling is used in conjunction with a robot to pick mixed size product and place the product onto a pallet or layers resting on top of a pallet. The end of arm tooling includes two center rails/forks mounted to a base. Two outer rails/forks are mounted to linear bearings that guide the outer rails/forks when moving inwardly or outwardly from the center rails for pre-sizing to the product. Pusher arms are formed of two outer pusher arms and one center pusher arm. These pusher arms are attached to linear bushings that guide the pusher arms forward and backward. The pusher arms push off the product simultaneously as the robot is withdrawing the rails.

Abstract: The tree and post remover is a removably attachable accessory for an operating vehicle, such as a skid-steer machine, tractor, or similar working machine having hydraulic power output. The tree and post remover has a mounting plate having a fixed jaw assembly extending therefrom and a movable jaw assembly captured and sliding laterally within the fixed jaw assembly. A hydraulic strut resides within the movable jaw assembly, and has one end attached to the movable jaw assembly and its opposite end attached to the fixed jaw assembly. Actuation of the hydraulic strut drives the movable jaw assembly toward or away from the fixed jaw assembly to close or open the jaws relative to one another. Each jaw assembly preferably includes a plurality of individual jaw members, opposite jaw members meshing with one another to allow the jaws to close upon objects of relatively small diameter.

Abstract: Apparatus, devices, systems and methods for removing automatically removing fixed carpeting such as glued down carpeting from spaces. The apparatus can include a motor powered winch having a hook end that can grip about a raised edge of the carpet. The winch can be anchored to a doorway by clamping ends of a telescopic bar to doorjamb members about the doorway opening. An operator can operate the winch by remote control and be spaced outside the room that the carpet is being removed from. Another version can include a U-shaped telescopic clamp arrangement so that the winch is also spaced outside the room from which the carpet is being removed. Another version includes a carpet grabbing plate adapter having hooks on a top side and carpet grabbing teeth extending below. The clamp ends of the telescopic bar can be locked to the upper hooks on the carpet grabbing plate. Another version has a double jawed carpet grabber with a pair of handles and teeth with channel members for enhanced carpet edge grabbing.

Abstract: Apparatus for gripping and handling a length of pipe includes first and second pipe gripping members supported on a frame. The first pipe gripping member is movable along a straight line path from an open position to a closed position closer to the second pipe gripping member. The first pipe gripping member is supported on a movable transfer plate having an engagement member connected thereto and to a piston rod of a hydraulic cylinder.

Abstract: A disk chucking mechanism constructed with first, second and third link members forms a slider crank mechanism and the third link member is rotated by a drive of a forward/rearward actuator such as an air cylinder and chucking nails are provided which protrude perpendicularly to a longitudinal direction of the first or second link member. A rotation of the chucking nail protruded perpendicularly is stopped by engagement with a disk and a spring member is bent by further forward or rearward movement of the second link member to energize a first chucking nail in a direction for maintaining an engagement with the disk. The disk is chucked with a predetermined force by only the drive of the forward/rearward actuator.

Abstract: A lifting tool (10) is provided for supporting an oilfield riser during relocation by a crane having a support line (14). The tool body (12) has an inverted U-shaped configuration with a central opening (18) and a downwardly facing throat (20). A powered drive (26) rotates the arcuate member between the open position and the closed position.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A device to remove an archery arrow or arrowhead from a target or receiving support is fitted to a knife at one or more suitable points and comprises a gripper which can be fitted to and/or receive an archery arrowhead or arrow that penetrates the target or the receiving support. The device installed on a knife is employed to grip the arrow or arrowhead so that the knife can be pivoted like a lever such that the tip of the knife rests on the target or receiving support. In this way, the arrow or arrowhead can be removed by tilting the knife.

Abstract: Disclosed is an improved transfer mechanism that transfers, in a vertical heat treatment system, process objects W between a container (carrier), and a holder (boat) holding plural process objects at vertical intervals. The transfer mechanism includes plural substrate support devices spaced at intervals, and each of the substrate support devices has a gripping mechanism for gripping a process object on the under side. The gripping mechanism includes a fixed engagement member on a distal end of the substrate support device, and a movable engagement member movably attached to a proximal end of the substrate support device.

Abstract: The invention provides a thin plate supporting container clamping device for fixing a thin plate supporting container when the thin plate supporting container in which semiconductor wafers are stored therein for transportation is placed on a loading port at a destination thereof for unloading and loading the semiconductor wafers automatically, including a hook member to be engaged with a retaining member of the thin plate supporting container; a drive unit for supporting the retracted thin plate supporting container in a state in which the hook member is supported so as to be capable of moving in the vertical direction and the hook member is engaged with the retaining member; and a control unit for adjusting a force to retract the hook member. The control unit adjusts the force to retract the hook member on the basis of detection values of a thickness sensor, a position sensor, and a retracting force detection sensor.

Abstract: A semiconductor material handling system including a frame mounting a wafer cassette and a plurality of load ports thereon, and a wafer moving robot including a robot body which has a lifting member mounted in the frame and vertically moving along a predetermined lifting shaft, an articulated arm which has a driving link mounted in the lifting member and a plurality of driven links whose end part transversely moving along the frame having the load ports, a swing unit which is mounted in the end part of the driven links and rotates along a vertical rotation shaft, and a crossing arm which comprises a base mounted in the swing unit, a plurality of sliding units mounted in the base and reciprocating transversely, and a wafer hand mounted in the sliding units and picking up a wafer from the wafer cassette and storing the wafer back in the wafer cassette.

Abstract: The clamp comprises a balancing module that provides one degree of freedom between the mounting and the mobile subassembly that connects together the fixed and mobile arms and a main actuator, and this module has a device for moving this mobile subassembly relative to the mounting in this degree of freedom, for example in translation, the balancing system comprising a flexible device which is connected to the mobile subassembly and which applies a force, in said degree of freedom, to at least one member connected to the mounting, and, in addition, at least one balancing actuator for moving the mobile subassembly to a balanced position relative to the mounting. Particularly applicable to electrical resistance welding clamps.

Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: A supporting structure is mounted on a hand body facing a circumferential edge of a substrate from below the substrate to support the substrate. First and second guiding members are mounted on the hand body, and having guiding surfaces in contact with an imaginary cylinder having an axis aligned with a reference axis of the hand body. First and second movable members are capable of moving in an imaginary plane perpendicular to the reference axis and are disposed on the radially outer-side of the circumferential edge of the substrate so as to face the circumferential edge. A driving unit simultaneously displaces the first and second movable members in the imaginary plane. The first and second guiding members and the first and second movable members are spaced apart on the circumference of the imaginary cylinder at intervals greater than the length of the arc of a segment in a substrate holding state.

Abstract: A pick and place device for picking up and re-positioning an article (11) carried by a support surface, comprising a first part which includes a plate portion (8, 8?) which is movable parallel to the support surface so that a leading edge thereof penetrates below the article, between the article and the support surface, and a belt of flexible material (9, 9?) which is wrapped around at least the leading edge of the plate portion so that it is sandwiched between the plate and the article when the former penetrates therebelow and as the plate portion moves below the article there is substantially no relative sliding movement between the sandwiched portion of the belt and the article.

Abstract: A micro-manipulator has a handling mechanism for gripping micro-material with two gripping fingers. The handling mechanism has a fixed finger with an end effecter for touching the micro-material, a movable finger with an end effecter capable of rotating around a rocking shaft for touching the micro-material, and an actuator for rotating the movable finger. The actuator drive moves the movable finger so as to be capable of touching a leading end of the movable finger end effecter to a leading end of the fixed finger end effecter. The micro-manipulator can securely and quickly grip a micro-material in a microscope visual field.

Abstract: A stack gripper has two pairs of support elements, which are arranged next to one another and are adjustably fastened to a transverse carrier. A drive is provided for an adjustment apparatus, with which the spacing between the two pairs can be changed without the lateral spacing of the support elements of a pair being changed.

Abstract: A wafer transfer apparatus may include a robot arm unit configured to be operated by a driving means, a blade configured to support a wafer and having a fix finger at a first end, and a clamping member attached to the robot arm. The clamping arm may also include a movable finger configured to hold a peripheral edge of the wafer, and a moving pusher attached to the movable finger and configured to guide the movable finger and the wafer on the blade towards the fix finger.

Abstract: A robot hand 23 having a hand body 30 having a reference axis J1 is provided with fixed holding members 40 and 41 and a movable holding member 42. The holding members 40, 41 and 42 are arranged on the hand body at angular intervals about the reference axis J1. Each of the fixed holding members 40 and 41 has a first guide part 50 and a second guide part 51 defining a V-shaped groove. The movable holding member 42 has a first guide part 60 and a second guide part 61 defining a V-shaped groove. Peripheral parts 19 of a wafer 22 are fit in the V-shaped grooves of the holding members 40 to 42 to grip the wafer 22 by the robot hand 23. The first guide parts 50 and 61 are provided at their lower ends with protrusions 55 and 65 protruding toward the reference axis J1, respectively. The protrusions 55 and 65 prevent the wafer 22 from slipping off the holding members 40 to 42.

Abstract: A robotic head for use in palletizing products includes a body having opposed ends. A portion of a first clamping assembly is pivotably connected at one end of the body and extends to a first lip, the portion having an axis of rotation that is substantially parallel to the first lip. A second clamping assembly is disposed at the opposite end of the body and is movable both toward and away from the first clamping assembly. The second clamping assembly includes a second segment having a second lip, the second segment being pivotably connected with respect to the rest of the second clamping assembly. The second segment has an axis of rotation that is substantially parallel to the second lip of the second segment. The first and second clamping assemblies are independently operable, and capable of manipulating a box or a tray pack containing products.

Abstract: A clamp assembly selectively grips material. The clamp assembly includes a housing, a gripping assembly and means for connecting the clamp assembly to an object. The housing has a first end, a second end, a first portion and a second portion. The first and second portions cooperate to define a material receiving slot. The first portion of the housing has an angular disposed channel and an angular disposed recessed portion. The second portion of the housing has a gripping surface. The gripping assembly is slidably disposed within the channel such that the recessed portion cooperates with the channel to define a travel path so that the gripping assembly can be selectively movable between a biased first position and a second position. In the biased first position, the gripping assembly extends into the material receiving slot. In the second position the gripping assembly is withdrawn from the material receiving slot.

Abstract: A test tube pick system for picking and placing test tubes in a rack that includes a hand-held pick unit that communicates with a host device that assists in instructing the picking and placement of test tubes, the hand-held pick unit having a housing with a hand grip portion, a control portion with an actuator control and a display for displaying alphanumeric characters for pick and placement locations, a pick portion having four extending fingers with bent ends forming four parallel spaced end prongs, and an actuator mechanism that displaces and spreads at least two of the four end prongs when the actuator control is activated by a user.

Abstract: A clamping device suitable for lifting and handling of sheet like-objects has a fixed jaw parallel to a movable jaw. The movable jaw is supported for reciprocating, linear movement towards and away from the fixed jaw responsive to a tensile actuating force. The movable jaw comprises a clamping plate inclined at an angle of about 8 to 12 degrees with respect to first and second clamping surfaces. The clamping plate maintains said angle during movement to and from the fixed jaw. A tensile force transmitting member is guided and supported at an upper location of the clamping plate that substantially aligns with or overhangs the second clamping surface.

Abstract: A gripper 1 comprising a support 5, 6 for attachment to a robotic arm, outer gripping plates 2, 3 mounted for movement on the support, drive means 13, 14, 15 for independently moving the outer plates 2 and 3 with respect to an intermediate gripping plate 4 mounted for pivotal movement towards and away from the outer plates 2, 3, the arrangement allowing for separate articles or groups of articles to be gripped between each of the outer plates 2, 3 and the intermediate plate 4 to increase the capacity of the gripper 1.

Abstract: The present invention provides an apparatus and a method for lifting a single joint of pipe. The single joint elevator of the present invention comprises, in one embodiment, a pair of deployable jaws cooperating with a pair of static jaws to secure a pipe within the slot of a generally horseshoe-shaped body. The deployable jaws of the single joint elevator of the present invention may be rotatably deployable or translatably deployable, or both. In one embodiment, each jaw, including the static jaws and the deployable jaws, comprises a pipe slip movably disposed within the jaw to secure a pipe segment within the slot and to self-tighten as the weight of the pipe segment secured within the single joint elevator is transferred to the slips and the jaws.

Abstract: A carpet removal or stripping method and system (machine) employs a common dolly. The backside of the dolly member has a plurality of teeth. A motorized winching system is coupled to the front side of the dolly member. A dual purpose safety shield covers the teeth during transportation and serves as a protective screen for the user during carpet removal operation of the invention machine. The winching system automates carpet peeling activity with the dolly member lying backside down during operation, and the teeth provide an anchoring effect. A pull bar removably grasps the subject carpet. A cable is coupled between the winching system and the pull bar. The winching system takes up or pulls the cable and hence the pull bar, such that the carpet is peeled away and separated from the subfloor.

Abstract: An LPG tank insertion apparatus for automobiles includes a rotary column with a lift body, a support arm mounted to the lift body, an actuating cylinder hingedly connected to the support arm, and a kingpin connected to the support arm. The actuating cylinder and the kingpin are both attached to a rotating plate that rotates in response to the actuating cylinder. The rotating plate is connected to a clamping device that selectively clamps an LPG tank which, in turn, rotates in response to the actuating cylinder so that it can be inserted in an automobile trunk whose opening is smaller than the length of the tank.

Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.

Abstract: The present invention comprises a distal rest pad for supporting a portion of a wafer seated on an end effector. In one embodiment, the rest pad includes a bottom support pad and an edge stop. Each element is mounted separately to the distal end of a support plate. The bottom support pad includes an inclined surface that transitions to a substantially horizontal surface at its distal end. The edge stop has a substantially vertical wafer contact surface that the peripheral edge of a wafer eventually contacts as the wafer is urged towards the distal rest pad. In another embodiment, the bottom support pad comprises an inclined surface. In yet another embodiment, the distal rest pad comprises a single structure. This distal rest pad includes a backstop portion and a bottom support separated by a particle collection groove. The bottom support may include an inclined lead-in surface that transitions into a flat contact surface or only comprise an inclined lead-in surface.

Abstract: A gripping device for gripping work pieces which is connectable to a robotized manipulating system includes a box-shaped body for supporting a first and a second gripping member, at least one of which being angularly movable, and a linear actuator operatively connected to the movable gripping member by a toggle-lever mechanism. The toggle-lever mechanism in turn includes a first and a second articulated connecting link, angularly movable with respect to each other, pivotally connected to a control rod of the actuator, respectively to the angularly movable gripping member. The device also includes a guiding element for guiding the angular movement of the second connecting link, and a limiting element for limiting the relative angular movement between the first and the second connecting link.

Abstract: The present invention is directed toward a bottle gripping device that grips a bottle at discrete points comprising a minimal area of the bottle. More specifically, the gripping device typically contacts the bottle at four discrete points and such total area of contact is preferred to be less than 25% of the total circumference of the bottle neck.