Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.

Abstract: A Bernoulli gripper for ophthalmic lenses includes a gripper body with a first cavity corresponding in shape to an optic zone of an ophthalmic lens and a first channel formed within the gripper body. The first channel penetrates the first cavity at one end and includes a first port in the gripper body at another end of the first channel. The first channel is enabled to supply a fluid medium from the first port to the first cavity at a first velocity such that the ophthalmic lens positioned with the optic zone in proximity to the first cavity is subject to a first pressure force against the first cavity by the Bernoulli effect.

Abstract: A suction device that holds a member by suction in a stable manner is provided. The suction device includes a columnar main body, a flat end face formed on the main body, a concave part formed in the end face, a fluid flow-forming supply paths for forming a fluid swirl flow in the concave part by discharging fluid into the concave part, the fluid swirl flow generating negative pressure that applies suction to a member, and a linear guide groove formed on the end surface along a direction in which the fluid discharged into the concave part flows out of the concave part.

Abstract: An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

Abstract: A swirl-flow forming body includes a through-hole; a jetting port that is formed on an inner periphery facing the through-hole; a fluid passage that allows fluid to be discharged into the through-hole via the jetting port so as to form a swirl flow that generates negative pressure for applying suction to a target object; and a flange portion that is formed so as to protrude from the inner periphery, the flange portion allowing passage of fluid to which suction is applied by the negative pressure while preventing the fluid discharged via the jetting port from flowing out of the through-hole towards the target object. The inner periphery is formed so as to guide the fluid discharged via the jetting port, in a direction away from the target object, to be discharged from the through-hole.

Abstract: A non-contact handler includes an upper body portion and a lower body portion movably coupled to the upper body portion. The lower body portion includes a non-contact puck configured to lift an object and a plurality of containment fences extending downward from the puck. The plurality of containment fences are arranged around a periphery of the object to be lifted.

Abstract: A glass processing apparatus to convey a glass sheet along a conveyance path can include a plurality of air bars spaced apart from each other along a first direction extending perpendicular to a central axis. Each air bar can include a surface with a plurality of fluid outlet ports. The glass processing apparatus can include a plurality of plates, and at least one of the plurality of plates can be positioned between ones of the plurality of air bars. Each plate can include a surface with a plurality of fluid inlet ports. The plurality of air bars and the plurality of plates can be symmetrically arranged relative to the central axis. Methods of processing a glass sheet can include emitting fluid from the plurality of fluid outlet ports of each of the plurality of air bars, thereby providing a cushion of fluid.

Abstract: A method handles a workpiece with a removal tool. The method includes: generating at least one parameter for the removal tool; determining at least one characteristic variable from the at least one parameter and at least one item of workpiece information; creating a removal prediction taking into account the characteristic variable and at least one removal result from a removal result store; assessing the removal prediction; removing the workpiece in the event of a positive removal prediction; detecting the removal result; and storing the removal result in the removal result store.

Abstract: A non-contact handling tool for picking up an object, the tool comprising an ultrasonic transducer extending between a reflective side and a picking side configured to emit ultrasounds forming, in a near field area of the picking side, an excess-pressure wave, and a fluid suction system configured to suction a fluid towards the picking side, forming in said near field area an under-pressure. The fluid suction system comprises at least a fluid suction channel disposed in the ultrasonic transducer. The transducer has a height defined between the picking side and the reflective side corresponding to a half wavelength of the ultrasounds generated in the transducer.

Abstract: A transfer device for transferring a substrate is provided, including a base plate, at least one suction unit disposed on a side of the base plate to generate suction on the substrate, and a plurality of movement restriction units disposed on the side of the base plate to limit the movement of the substrate during transfer. Each of the movement restriction units includes a main body, an abutting member, and a pusher. The main body is attached to the base plate and has a chamber therein. The abutting member is movably received in the chamber and has an abutting portion that protrudes beyond the main body to abut the substrate. The pusher is received in the chamber and configured to push the abutting member to move toward the substrate.

Abstract: Baffle plate to be attached to fluid flow-forming body includes baffle plate main body that is attachable to and detachable from fluid flow-forming body. Baffle plate main body allows a fluid to which suction is applied by negative pressure generated by fluid flow-forming body to pass through, while preventing a member from entering concave part of fluid flow-forming body. Baffle plate also includes support member that is attached to main body of fluid flow-forming body at one end thereof, and supports baffle plate main body at the other end thereof such that baffle plate main body opposes end face of fluid flow-forming body. Support member supports baffle plate main body such that a gap between end face and baffle plate main body is maintained, and a fluid path is formed that allows a fluid flowing out of concave part to flow.

Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

Abstract: Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.

Abstract: A method and system for manufacturing a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using fluidic material as a transfer medium. The method may include releasing a first amount of fluidic material from a tip of a pick-up head to form a fluidic membrane on the tip, and bringing the fluidic membrane on the tip of the pick-up head in contact with a semiconductor device on a carrier substrate to attach the semiconductor device to the fluidic membrane. The method can further include releasing a second amount of the fluidic material from the tip of the pick-up head to separate the semiconductor device from the pick-up head and place the semiconductor device on a target substrate.

Abstract: A suction nozzle includes a suction pad portion at a tip of an air pipe formed to be larger than the air pipe, in which a resistance cavity which causes resistance and decreases air flow speed when a positive pressure is applied is formed between a flow path and a cavity portion. In the suction nozzle, since the resistance cavity is formed, a positive pressure is applied by the air whose flow speed is suppressed and the suction release of the component is performed. The resistance cavity may be a cavity having a slit shape.

Abstract: The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by a gas cushion. The gas cushion is generated by a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate.

Abstract: An apparatus for correcting the shape of a reticle, including: suckers; a sucker mounting frame; and a pneumatic control system, wherein the sucker mounting frame is disposed above a reticle stage, the suckers are mounted on a bottom of the sucker mounting frame in a manner of being spaced apart from one another; and the pneumatic control system is configured to control the suckers to retain the reticle by suction or to release the reticle. The suckers are so arranged that they do not block trapezoidal exposure fields of view on the reticle, thereby allowing a light beam to be fully (100%) incident on the reticle, which results in improved exposure efficiency. The apparatus is mounted separately from a photolithography tool by which it is employed, enabling a lower weight load on the reticle. Additionally, the apparatus is not in contact with any component disposed in the photolithography tool and will not introduce additional external vibration to the tool.

Abstract: A carrier apparatus positions a chuck member above a wafer mounted on a fine movement stage, relatively moves the chuck member and the fine movement stage in a vertical direction, makes the chuck member approach a position which is a predetermined distance away from the upper surface of the wafer, makes the chuck member hold the wafer from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer held in a non-contact manner from above by the chuck member on the fine movement stage.

Abstract: A transfer device for holding an object comprises: i) a housing; ii) at least one inlet conduit having an inlet for gas; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. The respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a center region relative to the respective sets of outlet conduits, so that a laminar gas flow that flows along the housing surface generates a pressure differential which creates a force towards the center region to hold the object against the housing surface.

Abstract: A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effector is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effector and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.

Abstract: An alignment device has a carriage, two rails on the carriage that are configured for a workpiece to pass therebetween, and a finger that protrudes a distance from the carriage. The finger is configured to be disposed on a carrier for the workpieces. The workpieces may be solar cells and may pass through the rails on a conveyor belt. The alignment device may move in order to align the workpieces as the workpieces are loaded into a carrier.

Abstract: Non-contacting conveyance equipment for conveying a plate-like member in a non-contacting manner comprises a plate-like base body and a plurality of swirl flow-forming bodies provided at the base body. Each of the plurality of swirl flow-forming bodies includes a column-shaped main body, a cylindrical chamber formed inside the main body, that has an opening at one end, a flat end face formed at a surface of the main body, in which the cylindrical chamber is opened, a jetting port provided at an inner circumferential surface of the cylindrical chamber, a fluid introduction port provided at an outer circumferential surface of the main body, and a fluid passage that connects the fluid introduction port to the jetting port.

Abstract: A device used for capturing micro-particles, which comprises a pressure regulator, a micro-jet nozzle, and a hydraulic device for providing injection liquid for the micro-jet nozzle; wherein the micro-jet nozzle is provided with an annular jet hole, the annular jet hole having a bottom end, a top end, an inner diameter, an entrance port located at the top end, and an injection port located at the bottom end, the output of the pressure regulator is connected to the entrance port of the micro-jet nozzle. Compared with the prior art, in the present invention, the liquid is taken as the medium, a kind of upward support on the micro-particles and a flow-around lift force perpendicular to the jet direction are generated by the micro-jet nozzle with the annular jet hole, which jointly act on the micro-particles, so as to achieve the micro-particle capture.

Abstract: An apparatus and method for providing orthosonic lift by deflection includes a support surface and a wing surface in close proximity to the support surface. The space between the support surface and the wing surface defines a volume of air. An orthosonic lift generator causes the oscillating movement of air in the volume parallel to the wing surface. The oscillating movement of air results in a static air pressure on the wing surface of less than the ambient air pressure, resulting in a net force acting on the wing member.

Abstract: An improved silicon wafer transport system. More particularly, this invention relates to providing new wafer-transport apparatus having geometries configured to minimize damage to the wafer while assisting in maintaining multi-orientation positioning of the wafer during transport by the tool.

Abstract: A substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

Abstract: A material handling system includes a body including a first member and a second member. The first member and the second member define a hollow cavity within the body, and a gap disposed between the first member and the second member. The body is in flow communication with a first gas source to provide pressurized gas flow through the gap to generate a lifting force on an object placed adjacent to the body. The body has channels disposed within a central region of the body in flow communication with a second gas source. The channels are arranged to controllably disengage the object from the body.

Abstract: The invention relates to a method and device for the contactless seizing of glass sheets, characterized in that: a) the device comprises at least one oscillatory, rectangular, plate-shaped oscillating plate (1) comprising an oscillation generator (8), b) each partial surface (9) comprises a central opening for receiving a suction tube (2) which is installed on the upper side and which is used to suction air, c) a circular recess which is connected to the central opening is provided on the lower side of each partial surface (9), d) the plate-shaped oscillating plate (1) is connected to a central damping joint (5) by four connecting supports (7) that are respectively fixed to the suction tube (2) of one partial surface (9) and is assembled in the center of the oscillating plate (1), e) the central damping joint (5) is connected to a central fixation (6), f) a distance sensor and an optical sensor are housed in at least one suction tube.

Abstract: An apparatus configured to handle an object in a contactless manner, the apparatus includes a carrying body having a carrying surface which is configured to be directed towards the object, the carrying surface being provided with a plurality of traction members and a plurality of overpressure members, each overpressure member being provided with at least one exhaust opening, each traction member being provided with an indentation and at least two suction openings that are arranged in the indentation, the at least two suction openings of each traction member being configured to generate a pressure gradient between them so as to create a traction fluid flow in the indentation in a direction substantially parallel to the carrying surface; and a pressure controller configured to control the pressure gradient between the at least two suction openings of each traction member.

Abstract: A substrate chuck includes a frame forming a support adapted to support an adhering surface thereon, and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate. The Bernoulli chuck surface is axially moveable relative to the support between first and second positions. In the first position, the substrate is coupled to the adhering surface, and the substrate is separated from the adhering surface with movement of the Bernoulli chuck from the first position to the second position, without contact between the substrate and the Bernoulli chuck surface.

Abstract: Non-contact manipulating devices and methods can include a fluid distribution member including a first fluid port configured to dispense fluid and create a Bernoulli effect to attract an article to be manipulated by the manipulating device while maintaining a gap between the article and the fluid distribution member. The fluid distribution member can further include a second fluid port configured to dispense fluid to assist in maintaining the gap. The non-contact manipulating devices and methods can further include a controller configured to control a fluid flow through at least the second fluid port to help maintain the gap.

Abstract: An exemplary surface mount machine nozzle includes a mounting element, a pneumatic suction nozzle and a fixing pin. The mounting element defines one of a pivot hole and an elongated perforation in a sidewall thereof. The pneumatic suction nozzle defines another one of the pivot hole and the elongated perforation therein. The fixing pin horizontally extends through the pivot hole and the perforation for connecting the mounting element and the pneumatic suction nozzle together. The fixing pin is slidable along the elongated perforation such that the pneumatic suction nozzle is telescopically slidable relative to the mounting element.

Abstract: A device used for capturing micro-particles, which comprises a pressure regulator, a micro-jet nozzle, and a hydraulic device for providing injection liquid for the micro-jet nozzle; wherein the micro-jet nozzle is provided with an annular jet hole, the annular jet hole having a bottom end, a top end, an inner diameter, an entrance port located at the top end, and an injection port located at the bottom end, the output of the pressure regulator is connected to the entrance port of the micro-jet nozzle. Compared with the prior art, in the present invention, the liquid is taken as the medium, a kind of upward support on the micro-particles and a flow-around lift force perpendicular to the jet direction are generated by the micro-jet nozzle with the annular jet hole, which jointly act on the micro-particles, so as to achieve the micro-particle capture.

Abstract: A non-contact transport apparatus includes a housing and a plate which is fitted into a circular recess formed at a central portion in a lower surface of the housing. The housing is formed in an octagonal shape corresponding to the shape of a workpiece to be transported. In the plate, a plurality of nozzles are arranged radially at equal angular intervals. The nozzles include first nozzle grooves and second nozzle grooves having cross sectional areas that are determined in proportion to distances between a principal side of the housing and the nozzle and between an oblique side of the housing and the nozzle for making the flow rates of the pressure fluid through the first nozzle groove and the second nozzle groove different.

Abstract: A medication delivering device includes a delivering unit and a negative pressure unit. The delivering unit includes a cylinder, a retractable part and a tip element. The cylinder has a first opening and a second opening. The retractable part connects the cylinder with the tip element. The tip element has a first end, a second end and a channel. The first end passes through the first opening and is received within the cylinder. The second end is located at an outlet of a pill container. The channel penetrates from the first end to the second end to link with the interior of the cylinder. The negative pressure unit connects to the second opening for providing negative pressure to the interior of the cylinder and the channel of the tip element, so that the tip element sucks up a pill on the outlet of the pill container.

Abstract: Non-contact manipulating devices and methods can include a fluid distribution member including a first fluid port configured to dispense fluid and create a Bernoulli effect to attract an article to be manipulated by the manipulating device while maintaining a gap between the article and the fluid distribution member. The fluid distribution member can further include a second fluid port configured to dispense fluid to assist in maintaining the gap. The non-contact manipulating devices and methods can further include a controller configured to control a fluid flow through at least the second fluid port to help maintain the gap.

Abstract: Non-contact manipulating devices and methods can include a fluid distribution member including a first fluid port configured to dispense fluid and create a Bernoulli effect to attract an article to be manipulated by the manipulating device while maintaining a gap between the article and the fluid distribution member. The fluid distribution member can further include a second fluid port configured to dispense fluid to assist in maintaining the gap. The non-contact manipulating devices and methods can further include a controller configured to control a fluid flow through at least the second fluid port to help maintain the gap.

Abstract: A gripper for grasping a bag has a frame with two clamping components and two fingers which are pivotably connected to the frame. The gripper further includes a suction pad which is displaceably connected to the frame. By first grasping the bag with the suction pad and lifting it, the bag can subsequently be clamped in a simple manner by turning the gripper until the bag is located between the clamping components and the extremities of the fingers. Since the suction pad is freely movable, the bag continues to hold the same position while the gripper is being turned. The gripper further has four pins which can be stuck through the bag so as to hold it in the vertical position of the gripper.

Abstract: A seed handling tool includes a handle connected to a working body. The working body includes a working surface, which further includes a plurality of seed retention points. A seed retention source is provided to allow the seed handling tool to pick up and retain seeds at the seed retention points. In some embodiments, the seeds may also be released from the seed retention points. A method for retaining a plurality of seeds by the seed handling tool includes moving the seed handling tool to a position where the working surface is adjacent to a plurality of seeds, and picking up and retaining seeds at a plurality of seed retention points fixed at the working surface. In some embodiments, the method may also include releasing the plurality of seeds from the seed retention points.

Abstract: A gripper for holding two-dimensional components with a low degree of loading, has a clamping ring connected to a controllable robot arm with a baffle plate connected to the clamping ring by a funnel-shaped component and has a gripping face which communicates with a flow system which passes through the funnel-shaped component and the baffle plate. After an excess pressure has been applied to the gripper, a negative pressure is produced on the gripping face in order to attach by suction a wafer to be gripped. A rubberized bearing surface of a bearing ring integrated in the gripping face provides a slip-resistant movement of the wafer. A sensor detects the wafer hat is attached to the gripping face by suction.

Abstract: A method for manufacturing a vacuum cup mount including the steps of providing a housing having a mount base and a generally upstanding wall extending from the mount base, providing a retainer having an aperture that extends from an upper side of the retainer to a lower side of the retainer and a plurality of recesses formed on the lower side of the retainer in communication with the aperture, placing the retainer on the mount base so that the lower side of the retainer faces the mount base, and bending at least a portion of the generally upstanding wall so that the bent portion of the generally upstanding wall engages the upper surface of the retainer to secure the retainer with respect to the mount base.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.

Abstract: A system and a wand are disclosed for the transport of a semiconductor wafer. The system and wand include a plate and a locator. The plate includes a plurality of plate outlets for directing gas flow against the wafer to hold the wafer using the Bernoulli principle. The locator extends from the plate and includes a locating outlet for directing a gas flow to locate the wafer laterally relative to the plate. The plate outlets and the locating outlet operate to prevent the wafer from contacting the plate or the locator. In some embodiments, a plurality of locators are used to locate the wafer laterally relative to the plate.

Abstract: A noncontact type suction gripping device suitable for lifting a flat object in a noncontact manner includes a housing section including a pressing part which forms a closed surface when being placed to closely face one surface of a flat object, an R part which extends from the pressing part to be convexly rounded when viewed from the flat object, a sidewall part which is formed such that at least a portion thereof linearly extends from the R part in a direction facing away from the flat object, and an air inlet part which is connected to the sidewall part to introduce air, supplied from the outside, into the housing section; and a nozzle section including a nozzle tip which is separated from an inner surface of the sidewall part by a predetermined gap such that air supplied through the air inlet part can be discharged toward the perpendicular direction on the flat object, and an inclined surface which is formed to have a gradually decreasing diameter from the nozzle tip toward the air inlet part, the nozzle

Abstract: A Bernoulli Effect pick-up device (1) for the handling of products (20) comprises a surface (4) adapted such that gaseous fluid flow across said surface (4) provides a pick-up force to be generated, by the Bernoulli Effect, in a direction towards said surface (4), and a conduit (2) for the supply of the gaseous fluid. The conduit (2) has an outlet opening (5) at the surface (4) and is adapted to supply gaseous fluid in a direction opposed to the pick-up direction. The outlet (5) of the conduit (2) is associated with a deflector (9) for directing gaseous fluid across the surface (4) and preventing direct impingement of the fluid on a product (2) that has been picked-up by the device (1). The product (20) may for example be a slice of a foodstuff, e.g. tomato or hard-boiled egg.

Abstract: The invention relates to a gripper (1), in particular a Bernoulli gripper for holding two-dimensional components such as silicon-based wafers (2) with a low degree of loading, having a clamping ring (4) connected to a controllable robot arm (3), having a baffle plate (6) which is connected to the clamping ring (4) by means of a funnel-shaped component (5) and has a gripping face (7) which communicates with a flow system (8) which passes through the funnel-shaped component (5) and the baffle plate (6) and by means of which, after an excess pressure has been applied to the Bernoulli gripper (1), a negative pressure is to be produced on the gripping face (7) of the baffle plate (6) in order to attach by suction the wafer (2) to be gripped, having a rubberized bearing surface (9) of a bearing ring (10) which is integrated in the gripping face (7) and provides a slip-resistant movement of the wafer (2) attached to the gripping face (7) by suction, and having a sensor (11) for detecting the wafer (2) attached to th

Abstract: Non-contact manipulating devices and methods can include a fluid distribution member including a first fluid port configured to dispense fluid and create a Bernoulli effect to attract an article to be manipulated by the manipulating device while maintaining a gap between the article and the fluid distribution member. The fluid distribution member can further include a second fluid port configured to dispense fluid to assist in maintaining the gap. The non-contact manipulating devices and methods can further include a controller configured to control a fluid flow through at least the second fluid port to help maintain the gap.

Abstract: A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.

Abstract: A thermal treatment system comprising at least one apparatus for thermally treating an object, the apparatus comprising: one platform or two substantially opposite platforms, where at least one of the platforms has at least one thermal means for heating or cooling of the object; and at least one of the platforms has fluid-mechanical means for supporting the object without contact. The platform has an active surface comprising at least one of a plurality of basic cells, each basic cell having at least one of a plurality of pressure outlets and at least one of a plurality of fluid-evacuation channels. At least one of the pressure outlets of each basic cell is fluidically connected through a flow restrictor to a high-pressure fluid supply, the pressure outlets providing pressurized fluid for maintaining a fluid-cushion between the object and the active-surface of the platform. The flow restrictor characteristically exhibits fluidic return spring behavior.