Abstract: An image sensing device includes a wafer of semiconductor material having a first surface and a second surface. The first surface has a central portion comprising a membrane, which is surrounded by a rim. The membrane is of lesser thickness than the rim. An improved support assembly for the device comprises a lower support member in contact with the rim portion of the second surface of the wafer near the periphery thereof, and an upper tensioning member having a target contact portion which forcibly abuts the rim portion of the first surface of the wafer adjacent to the membrane and urges the wafer against the lower support member thereby tensioning the membrane. Centering brackets center and secure the lower support member and the upper tensioning member within the device.

Abstract: A pick-up tube includes a generally cylindrical envelope having a faceplate at one end thereof and a cathode in the other end. A photoconductive target electrode is adjacent to the faceplate and a mesh assembly is disposed in spaced relation adjacent to the target electrode, between the target electrode and the cathode. The mesh assembly comprises a mesh electrode disposed between a frusto-conically shaped mesh support ring and a bow-shaped mesh damping ring. The mesh damping ring is fixedly attached at a plurality of points around its outer periphery to the mesh electrode and the mesh support ring. The inner periphery of the mesh damping ring is formed into a plurality of arcuately shaped regions extending therearound. Each of the arcuately shaped regions is interconnected by a portion of the damping ring which is in contact with the mesh electrode.