Abstract: The present invention provides a high-frequency signal amplification device, in which insufficient isolation is compensated and which is made smaller, as well as a method for manufacturing the same. A substrate, in which a plurality of metal conductors arranged between the plurality of dielectric layers and/or at a surface of the dielectric multilayer substrate are exposed at a first region of the surface, and a metal surface that is arranged at a position lower than the plurality of metal conductors is exposed from a remaining portion of the first region not including the region on which the plurality of metal conductors are arranged, is used as a dielectric multilayer substrate. The semiconductor element is mounted in the first region such that a high-frequency signal is input into the semiconductor element via at least one of the plurality of metal conductors, and an amplified high-frequency signal is output from the semiconductor element via at least another one of the plurality of metal conductors.

Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a support, a power transistor chip arranged thereon, outer electrical connections projecting from the module, and inner electrical connections connected between said transistor chip and said outer connections, where at least one of said outer electrical connections is comprised of a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said power transistor module, a method for fabrication of a power amplifier, wherein said module is electrically connected to a circuit board mounted at a heat sink and is mounted at said heat sink, and finally a power amplifier manufactured according to the method.

Abstract: A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.

Abstract: According to one embodiment, a circuit is disclosed. The circuit comprises a solid state power amplifying device, an input impedance matching circuit and an output impedance matching circuit coupled to the solid state amplifying device. The input impedance matching circuit includes an input pitchfork trace pattern. The output impedance matching circuit includes an output pitchfork trace pattern. The circuit further discloses an input bias circuit and an output bias circuit.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: A low cost radio frequency interference filter assembly comprises a multiple layer structure including a middle trace layer disposed between an upper ground layer and lower ground layer. Non-conductive insulation layers are disposed between the middle trace layer and the upper and lower ground layers. The upper layer includes input contacts, signal contacts, and capacitors which are coupled to the signal contacts and an upper grounded substrate. The middle trace layer includes a grounded substrate and trace lines which are coupled to the signal contacts of the upper layer by signal vias. The lower layer includes a grounded substrate. Ground vias are formed through the insulation layers to couple the middle grounded substrate to the upper and lower grounded substrates. The filter assembly may be formed as an integral projection of a printed circuit board assembly.

Abstract: A constant voltage source includes a constant voltage supplying circuit including an operational amplifier for supplying an output voltage to a load and a feedback circuit for feeding back the output voltage to the operational amplifier; a first inductance unit disposed between the constant voltage supplying circuit and the load; and a first bypass capacitor of which one terminal is coupled between the first inductance unit and the load and the other terminal is coupled to a constant voltage unit.

Abstract: A side fed RF amplifier comprising a plurality of transistors connected in parallel such that the base, emitter, and collector leads of each transistor are electrically connected to the base, emitter, and collector leads, respectively, of all other transistors. A common, physical point interconnects the power amplifier current source and the base leads of every transistor. The transistors are arranged such that the impedance between the common physical point and the base lead of any one transistor is substantially equivalent to the impedance between the common point and the base lead of any other transistor within the power amplifier.

Abstract: A node for commonly supplying a ground potential in an amplification circuit (MMIC11) is formed. The input and output system ground surfaces of a printed wiring board (PWB) on which the amplification circuit (MMIC11) is to be mounted are electrically separated from each other on the printed wiring board (PWB). Since no ground pattern is present on the amplification circuit (MMIC11), the ground node of the amplification circuit (MMIC11) serves as a means for supplying a true ground potential. While a compact package is realized by preventing an increase in number of leads, oscillation is prevented, so a high gain can be realized.

Abstract: A microwave amplifier includes an amplifying device having a first contact region extending in a width direction, an output side impedance device spaced from the amplifying device in a transmission direction perpendicular to the width direction, the impedance device having a second contact region connected to the first contact region of the amplifying device, the second contact region extending in the width direction, and a smoothing circuit connected to one of the first and second contact regions for smoothing a distortion in a microwave signal to be amplified by the amplifying device.

Abstract: An RF pallet ground comprises overhangs disposed at opposite ends. Each overhang includes a downwardly protruding ledge and a notch defined in a bottom surface of the pallet. The ledges and notches extend from one side of the pallet to the other. The ledge provides a positive connection directly to ground. The ledge has a length shorter than the length of the main body of the pallet. Fasteners are positioned on either side of an RF trace on the pallet, allowing positive pressure to be applied to the ground through the ledge.

Abstract: An amplifier having removable remote controls and the ability to easily couple with other amplifiers for easy mounting is disclosed. The amplifier includes removable remote controls and isocoupling systems that connect two or more amplifiers and that electrically insulate the mounting screws from the mounting surface. The amplifier may also be liquid cooled to dissipate heat generated by the amplifier.

Abstract: A single multi-layer carrier module is disclosed which carries the power amplifier components in a GSM mobile digital cellular telephone. In a first embodiment of the present invention the power amplifier and the power amplifier controller are placed upon a ceramic or laminate carrier module along with necessary connection circuitry. The carrier module is then connected to the RF board. In a second preferred embodiment of the present invention the power amplifier, the power amplifier controller and a voltage controlled oscillator are placed upon the carrier module.

Abstract: An radio frequency (RF)/microwave power amplification circuit is disclosed herein having improved power and frequency characteristics. The RF power circuit is characterized by having the output capacitance of the device resonate with a shunt inductance that is physically closer to the device than provided in conventional RF power circuits. This is realized by mounting a direct current (DC) bypass capacitor directly on the same metalized pad that the device terminal is mounted on. By doing this, the inductance associated with a wire bond connection from the device to the capacitor is eliminated or at least reduced. Also disclosed is a dual cell power circuit that consists of matching the impedance characteristics of the active cells to each other by adjusting the circuit parameters in which the active devices interact with.

Abstract: A method and apparatus for controlling the common mode impedance misbalance of an isolated single-ended circuit for all common mode paths, thereby allowing the balancing of the common mode impedances which reduces common mode effects while maintaining the advantages of the single-ended amplifier including circuit simplicity and the reference input connected to circuit ground. In one embodiment, two solid shields enclose the circuit as completely as possible with the inner shield connected to circuit ground which is also the reference for all other inputs to the circuit. A discrete capacitor is connected between the outer shield and each of the non-reference inputs. When the shield is complete, i.e., solid, almost solid with minimal holes or a fine mesh, the value of the discrete capacitor is selected to match the parasitic capacitance formed between the outer shield and the inner shield. In another embodiment, the shield may be incomplete, i.e.

Abstract: A microelectro-mechanical device which includes a fixed electrode formed on a substrate, the fixed electrode including a transparent, high resistance layer, and a moveable electrode formed with an anisotropic stress in a predetermined direction and disposed adjacent the fixed electrode. The device includes first and second electrically conductive regions which are isolated from one another by the fixed electrode. The moveable electrode moves to cover the fixed electrode and to electrically couple to the second conductive region, thus electrically coupling the first and second conductive regions, in response to a potential being applied across the fixed and moveable electrodes. The fixed electrode is transparent to electromagnetic signals or waves and the moveable electrode impedes or allows transmission of electromagnetic signals or waves.

Abstract: In a low-noise amplifying device, an antenna point is attached to a tip portion of a microstrip line and an end surface of a printed wiring board. The printed wiring board is fixed to a chassis by a screw, a rivet, a projecting portion of a frame or a conductive adhesive in the vicinity of a connection of the antenna pin to the microstrip line. Thereby, even a slight warp that might exist on the board is corrected, so that adhesion between the board and the chassis is reinforced and the low-noise amplifying device stably operates.

Abstract: An in-line distortion generator is coupled to an RF amplifier on a single PC board for producing an output signal of useful amplitude but with low composite triple beat and cross modulation distortions. The backplane under the section of the PC board upon which the distortion circuit resides is removed and the portion of the heat sink under the removed portion of the backplane is also removed. This eliminates any parasitic capacitances that could degrade the performance of the RF amplifier, thereby making the distortion circuit transparent to the RF amplifier. Furthermore, the layout of the predistortion circuitry has been specifically designed to enhance the performance of the circuitry without inducing any negative operating characteristics on the associated RF amplifier.

Abstract: For use with RF circuitry in which a DC bias circuit provides bias voltage is provided to impedance-matched circuitry, a structure is provided, in which a dielectric member, having a high dielectric constant, is selectively placed adjacent to a bias feed line coupled between the DC bias circuit and the remainder of the circuitry, to maintain high RF impedance while reducing impedance at lower frequencies. The invention has particular applicability to RF amplifiers, to be used for amplifying modulated carriers, such as video signals made up of an RF carrier and a lower-frequency modulation. Where the carrier has a predetermined wavelength, the physical length of the bias feed line and the dielectric constant of the dielectric member are chosen such that an effective length of the bias feed line is a quarter of the wavelength of the carrier.

Abstract: A new amplifier module construction enhances the manufacturer's ability to repetitively construct multiple copies of millimeter microwave amplifiers having performance characteristics that are consistent with one another, particularly in input VSWR ratio characteristic, and which performance characteristic do not significantly change following any necessary rework of the amplifier module, including any MMIC chip replacement. In this module, a waveguide to microstrip transition is formed of a backshort member that is separate from the metal base or cover and that backshort member is held pressed in place against the substrate by force exerted by the module's cover plate through a spring member against the exterior of the backshort member. The spring member is formed by a resilient compressible gasket.

Abstract: A high frequency power amplifier including: a multi-layer printed-circuit board, a transistor for amplifying an input signal and outputting the amplified signal, a first print circuit pattern for receiving the input signal and supplying the input signal to the transistor, a second print circuit pattern for supplying a supply voltage to the transistor, a ground terminal, and concentrated constant elements connected to the transistor on the multi-layer printed-circuit board is disclosed, wherein at least two layers of the multi-layer printed-circuit board are connected to the ground terminal, the first and second print circuit patterns are sandwiched on one layer of the multi-layer print circuit between the at least two layers, a first shielding circuit pattern, connected to the ground terminal, arranged around the first print circuit pattern on the one layer is further provided; and a second shielding circuit pattern, connected to the ground terminal, arranged around the second print circuit pattern on the one

Abstract: A semiconductor microwave amplifier includes input- and output-side microstrip lines formed on a printed-circuit board to oppose each other, input and output electrodes formed on the microstrip lines to be parallel to the microstrip lines, a pair of ground electrodes formed in a direction perpendicular to the input and output electrodes to oppose each other, and a semiconductor amplification device connected to all of the electrodes. This amplifier further has a metal plate connected to the ground electrodes to ensure high-frequency isolation between the input electrode and the output electrode and shield electromagnetic connection, and a through hole for connecting a ground portion of the semiconductor device to a ground surface for the microstrip lines, the ground surface being formed on the printed-circuit board.

Abstract: In a device comprising an amplifier with short circuit protection, and a resistor-capacitor (RC) filter connected to the amplifier output, an inductor is arranged in parallel with the filter resistor to protect the resistor.

Abstract: A high-frequency amplifier has a transistor having a transistor input terminal, a transistor output terminal, and ground radiation fins, a first dielectric board having a transistor input matching circuit, and a second dielectric board having a transistor output matching circuit. The transistor is mounted by bringing the ground radiation fins into tight contact with a common ground surface member. The first and second dielectric boards being mounted on the common ground surface member. The first and second dielectric boards are respectively formed with first and second ground conductors on common ground surface member sides thereof. The transistor input terminal and the transistor input matching circuit are connected to each other and so are the transistor output terminal and the transistor output matching circuit.

Abstract: An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12) overlies the additional substrate (11), an electronic device (15) overlying the substrate (12) and electrically coupled to the interconnect line (14) of the substrate (12), and an additional electronic device (17) having a lead (23) and an additional lead (26) wherein the lead (23) overlies the substrate (12) and is electrically coupled to the interconnect line (14) of the substrate (12) and wherein the additional lead (26) overlies the additional substrate (11) and is electrically coupled to the interconnect line (13) of the additional substrate (11).

Abstract: A liquid cooling system cools a plurality of RF power amplifiers utilized in a high power AM broadcast transmitter. Each RF power amplifier includes a thermally conductive block to which the power transistors associated with that amplifier are physically mounted. The heat generated by the power transistors is conductively transferred to the thermally conductive block. A liquid cooled plate comprising a thermal block and coolant pipes running through the thermal block is also provided. The liquid cooled plate is positioned so that the thermal block is in contact with the thermally conductive block of the RF power amplifier. A pump circulates liquid coolant through the coolant pipes. The liquid cooling system cools the power transistors by transferring the heat from the thermally conductive block through the thermal block of the liquid cooled plate to the liquid coolant flowing through the coolant pipes.

Abstract: A microwave amplifier for amplifying microwave signals, such as the microwave signals received by a microwave repeater station. The amplifier is formed of solid state amplifier-transistors to which the microwave signals are applied by way of transmission lines. The amplification circuitry and transmission lines are formed upon a circuit board which is housed within a heat-dissipative housing. The amplifier can be used in substitution for a conventional travelling wave tube, conventionally utilized to amplifier microwave signals received at a microwave repeater station.

Abstract: A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.

Abstract: An electronic power device for a juke box or the like comprises a highly thermally conductive heat sink defining a first cavity on one side thereof and a second cavity on the other side thereof, with the first and second cavities having a common, thermally conductive wall. A printed circuit board carries substantially non-heat generating components thereon and is located within the first cavity. At least one heat generating electronic component is provided, located in the second cavity. The circuit board and the generating electronic component are in electrical connection through the common, thermally conductive wall.

Abstract: A module for use with a radial combiner comprised of a compartment on one side of a base that contains a plurality of amplifiers located on a printed circuit board having conductive patterns respectively coupling the amplifiers between points along a serial splitter and points along a serial combiner in which operating potential for the amplifiers is derived from storage capacitors connected between two conductors on a separate board via conductive spring fingers having one end attached to one of said conductors and the other end bearing against a conductive pad on the printed circuit board that is coupled to an electrode of an amplifier and in which a plenum is mounted along one edge of the module for conducting cooling air to a duct on the other side of the base.

Abstract: Switched transistors (T1 . . . through T4 . . .) are arranged in a bridge circuit such that a plurality of transistors (T1 . . . through T4 . . .) are connected in parallel in every bridge branch. These transistors are secured on a thermally and electrically conductive ring (R, R'), are symmetrically distributed over this ring (R1, R1'), and have a respective terminal electrically connected thereto. The connection to further terminals of the transistors (T1 . . . through T4 . . .) occurs essentially in rotationally-symmetrical fashion via large-area printed circuit boards (LE1 through LE6). Short connecting paths with low values of inductance are achieved with this arrangement. Furthermore, the waste heat from all transistors (T1 . . . through T4 . . .) is uniformly carried off via the rings (R1, R1'), so that all transistors (T1 . . . through T4 . . .) work at the same temperature. A uniform current division onto all transistors (T1 . . . through T4 . . .

Abstract: The ease of manufacture and performance of printed circuit board RF amplifier and other electronic apparatus requiring a high degree of internal shielding is improved by distributing DC or other signals through rigid conduits having at least one flat side and containing the desired power or signal wires. The rigid conduit is typically soldered, flat side down, at multiple locations to an AC ground plane. The wires exit the conduit through side exit holes and end holes. Side holes are desirably provided at regular intervals. The flat side prevents or reduces rolling or other misalignment of the conduit during assembly, thereby easing circuit board construction. Conduits with square cross-sections are preferred.

Abstract: Hybrid RF amplifiers of improved performance are obtained by arranging film resistors, metallization and other components on a circuit board so that symmetrical parts of the electrical circuit are arranged in a mirror symmetrical fashion about a line extending along the circuit board and by aligning symmetrical resistors either parallel or orthogonal to this line and by utilizing common ground metal regions to terminate resistors that are aligned and orthogonal to the mirror line and spaced apart but joined to a common ground at a single location.

Abstract: There is disclosed a compact high power modular RF Semi-Conductor systems package suitable for constructing RF sources of high power and compact size comprising a liquid coolant conduit incorporating side-by-side input and discharge conduits, said conduit attached at one end to a master coolant conduit; liquid cooled microwave semi-conductor device modules comprising input and output liquid coolant connectors at one end and RF output coupling means at the other end, said modules being mounted on two opposing surfaces of said liquid conduit there being multiple adjacent modules in close proximity to each other on each side, and along the length of said conduit, each module having input and discharge liquid couplers fastened respectively to corresponding input and discharge conduits of said conduit, there being RF coupling means mounted on the opposing ends of said module from said coolant connectors, said RF coupling means joining adjacent modules in such manner that the sum of the RF power output of all modul

Abstract: An amplifying circuit for amplifying a bipotential input signal, including an insulating housing having a conductive input contact mounted on the housing and adapted to engage a human body so that the bipotential input signal applied to the contact; a lead amplifier having inverting and non-inverting inputs, one of which is coupled to the input contact, and an output; first and second diodes connected in parallel inverse polarity across the inputs of the lead amplifier; third and fourth diodes connected in parallel inverse polarity from the inverting input of the lead amplifier to a circuit common potential; and an output resistor connected from the inverting input to the output of the lead amplifier. Portions of the input contact are surrounded by a voltage drive shield connected to the output of the lead amplifier.

Abstract: A low noise, high gain differential amplifier suitable for EEG amplification is constructed in a shielded metal enclosure, preferably on a ground plane circuit board. The amplifier is battery powered to eliminate all possibility of noise from the power system. The amplifier utilizes a pair of operational amplifiers to provide high input impedance for each of two input signals. A differential amplifier generates an internal signal which is filtered and amplified by a pair of bandpass amplifiers and overlapping low pass and high pass amplifiers.

Abstract: A variable power amplifier having a constant current differential amplifier driving a cascaded driving amplifier, a variable power amplifier including a vacuum tube for selectively amplifying output signals wherein the drive of the variable power amplifier is determined by the plate shunt resistive loading of the vacuum tube, a push-pull amplifier including an output transformer operatively coupled to the variable power amplifier and to an amplifier output terminal to amplify and apply to the amplifier output terminal a selectively amplified output signal, and a variable damping circuit including a sensing element for sensing the loading on the output tranformer and a circuit for defining a feedback loop for producing a feedback signal having magnitude and polarity which are determined by the sensing element and wherein the variable damping circuit includes a circuit for applying the feedback signal as an input to the constant current differential amplifier to control the current level thereof as a function o

Abstract: A feedforward amplifier arranged as a unitized gain block particularly suitable for use in cable communication systems. The feedforward amplifier includes a single circuit board integrally mounting the directional couplers, delay lines and attenuator circuitry in a symmetrical arrangement. The main and error amplifiers are mounted separately from the main circuit board via releasable connectors and each amplifier is arranged on its substrate as a mirror image of the other to provide a symmetrical signal path. The amplifiers and the circuit board are enclosed within a compact metal housing which provides heat sinking for the amplifiers and facilitates removal of the amplifiers for servicing.

Abstract: A packaging technique for radio-frequency circuits, such as feed-forward amplifiers, in which a single ground plane is formed between active components of the circuit and a circuit board bearing passive components of the circuit. The ground plane comprises a metallized face of the circuit board and a metal heat sink attached to each active component. The assembly, including the circuit board, heat sinks and active and passive components, is supported on a ledge in the walls of a metal housing, such that heat is conducted laterally through the ground plane and directly into the walls of the housing. The walls of the housing, including an intermediate wall between active amplifier components, also serve to isolate the active components from each other and from the environment. The plane also serves to isolate the active components from the passive ones.

Abstract: With narrow-band amplifiers whose output line is located close to the input line, an unwanted feedback may be produced which results in self-excitation of the circuit or at least in a reduction of the bandwidth. According to the invention, a supply line is arranged between the two lines, which supply line is completed with a capacitor to provide a resonant circuit which resonates at the signal frequency of the narrow-band amplifier. As result thereof, energy is withdrawn from the feedback path, causing the feedback to be reduced.

Abstract: The previously unknown cause of significant non-linear distortion by non-linear discrete and stray capacitances located in portions of an amplifier circuit where Miller effect enhancement of such capacitance occurs is minimized by one or more means, such as utilizing unique discrete capacitor arrangements and positioning of transistor terminal leads, and unique printed circuit board constructions and selectively applied solder mask coatings which minimize or eliminate non-linear stray capacitance effects which were not heretofore considered to be a problem in audio amplifier circuits. Non-linearities in capacitance-voltage characteristics are reduced by the reduction in voltage gradients achieved by connecting two or more capacitors in series to produce the overall desired capacitor value heretofore supplied by only a single capacitor.

Abstract: A UHF amplifier device interfaces between an antenna and a signal receiver. A circuit board has first and second planar input and output transformers formed within first and second grounding planes on the circuit board. An amplifier is formed intermediate the first and second planar transformers for amplifying UHF signals received from the antenna. Each of the input and output planar transformers include a first rectilinear leg and a rectilinear helix disposed in the same plane.

Abstract: An easily installed thermal coupler inserted in the extruded section of a heat sink on which a transistor amplifier is mounted and positioned on a circuit board in thermal contact with diode biasing means coupled to the transistor amplifier. By thus thermally coupling the biasing means with the amplifier in a self-correcting, negative feedback loop, stable transistor operation is achieved and thermal runaway prevented. Employing a unitized metallic heat conducting member having a base plate including connecting studs for circuit board mounting and an upright member extending therefrom, the heat coupler may be used as either a heat sink or heat transfer device in carrying heat either out of or into the circuit board.

Abstract: In a push-pull power amplifier which amplifies an audio-frequency signal supplied thereto and supplies its output signal to a load, a pair of output transistors constituting the push-pull circuit are alternately turned on and off according to the polarity of the input signal. In the power amplifier, current flowing through the current path leading from a DC power source to each of the output transistors includes many harmonic components besides its fundamental wave component. These harmonic components of current are introduced through a stray magnetic field into the signal path in the power amplifier thereby producing distortion of the signal supplied to the load.

Abstract: A radio frequency power amplifier includes a flat ceramic substrate having a conductive coating on one side and a plurality of conductors on the other side arranged in a predetermined pattern. At least one conductor is connected through the substrate to the conductive coating which is grounded. A plurality of components are connected to the conductors on the substrate including a transistor die, chip capacitors, air wound coils, a chip inductor and resistors. Conductors on the substrate are of a configuration to provide spiral inductors, some of which are connected in series with the air wound coils, which have tuning segments adapted to be severed to control the inductance after assembly of the components. Conducting bridges are also provided to join conductors which are spaced from, and insulated from, an intermediate conductor.

Abstract: An audio amplifier arrangement comprises an amplifier unit containing an amplifier circuitry, and a manipulation unit, independent of said amplifier unit, having manipulation elements for controlling the operation of the amplifier unit. These two units can be detachably directly coupled together both electrically and mechanically by terminal connectors and by mechanical locking means provided on these two units for operation as a complete amplifier assembly. These two units, furthermore, are operable also in their separate state or in a "remote-control" mode of operation by electrically coupling said terminal connectors together by the use of a connector-equipped cable means applied between these two units.