With Electromagnetic Or Electrostatic Shield Patents (Class 331/67)
  • Patent number: 9628020
    Abstract: A semiconductor circuit includes an oscillation circuit; an output circuit that receives a first oscillation signal from the oscillation circuit and outputs a second oscillation signal; a DC circuit that receives a voltage based on a power supply voltage and outputs at least one of a DC voltage and a DC current; and a semiconductor substrate on which the oscillation circuit, the output circuit, and the DC circuit are formed. In a plan view of the semiconductor substrate, the DC circuit is disposed between the oscillation circuit and the output circuit.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 18, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hitoshi Kobayashi, Yoshiki Makiuchi, Takeshi Yasui
  • Patent number: 8786354
    Abstract: Embodiments relate to integrated circuits with protection. In one embodiment the protection is coupled between a first circuit provided to control a low power mode of the integrated circuit and a supply voltage. The protection comprises in an embodiment a transistor being one of a depletion transistor or a junction field effect transistor.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: July 22, 2014
    Assignee: Infineon Technologies AG
    Inventor: Mario Motz
  • Patent number: 8390362
    Abstract: Embodiments relate to an ultra-low-power, high-voltage integrated circuit (IC) that also has high electromagnetic compatibility (EMC). Embodiments address the desire for an ultra-low-power, high-voltage IC that also has high EMC and comprise a high-voltage EMC protection circuit with normal current consumption coupled to an ultra-low-power, low-voltage oscillator that controls a sleep/wake, or duty, cycle of a high-voltage circuit.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: March 5, 2013
    Assignee: Infineon Technologies AG
    Inventor: Mario Motz
  • Patent number: 7564319
    Abstract: An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: July 21, 2009
    Assignee: International Business Machines Corporation
    Inventors: Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu
  • Patent number: 7551040
    Abstract: A surface mount crystal oscillator comprises a package body having a first recess, a cover having a second recess, a crystal blank secured to an inner bottom surface of the second recess, and an IC chip secured to a bottom surface of the first recess. The IC chip has an oscillation circuit using the crystal oscillator integrated therein, and has IC terminals on one main surface for connection to the outside. A first and a second annular metal film are disposed to surround open end surfaces of the first recess and second recess, respectively. By bonding the first and second annular metal films with an eutectic alloy, the crystal blank and IC chip are hermetically sealed in a space defined by the integrated first and second recesses.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: June 23, 2009
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Hidenori Harima
  • Publication number: 20080129394
    Abstract: An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Jens Kissing, Dietolf Seippel
  • Patent number: 7323948
    Abstract: An LC tank structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: January 29, 2008
    Assignee: International Business Machines Corporation
    Inventors: Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu
  • Patent number: 7116179
    Abstract: A crystal oscillator comprises a rectangular circuit substrate for mounting circuit devices and its metal cover, said circuit substrate has grooves on each long side and on each short side and said metal cover has projections at each aperture end corresponding to the grooves, and which has a swelling from external to internal in each of the projections, wherein both the grooves provided on each short side and the projection of said metal cover are provided at one end of each long side or each short side.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: October 3, 2006
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Takashi Matsumoto
  • Patent number: 7053319
    Abstract: A weighing apparatus includes a SAW oscillator and a “push oscillator” to force the SAW oscillator into a desired mode of operation. A SAW temperature oscillator and a thermistor are also provided. The frequency of the “push oscillator” is made immune to temperature changes by generating it via a mixer mixing the SAW temperature oscillator with an adjustable fixed frequency oscillator. Long term stability of the SAW temperature oscillator is achieved by periodic calibration with the thermistor.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: May 30, 2006
    Assignee: Circuits and Systems, Inc.
    Inventors: Vyacheslav D. Kats, Arnold S. Gordon
  • Patent number: 7049897
    Abstract: In an oscillator used in a high frequency band such as the microwave band, the millimeter wave band, etc., an oscillation element and circuit components such as a resonator coupled to the oscillation element, etc., are provided inside a casing, the oscillation element is disposed inside a cavity having at least one opening portion, and a part or the whole of the resonator is disposed outside the cavity.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: May 23, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kazumasa Haruta
  • Patent number: 6978537
    Abstract: A charged species source and a charged species drain are provided. A moveable component is positioned proximate to the charged species source and the charged species drain. A first protrusion and a second protrusion are provided in contact with the moveable component, wherein at least one of the moveable component, the first protrusion and the second protrusion have a size of a micrometer scale or smaller. The moveable component is moved relative to the charged species source and the charged species drain to transfer electrical charge between the source and the drain.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: December 27, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Gary A. Gibson
  • Patent number: 6777613
    Abstract: A multifunctional crystal unit in which in the same container constituted by a container body having a recess therein and a cover, a plurality of crystal blanks are hermetically encapsulated. In the container, the crystal blanks are respectively held in different spaces, which are isolated from one another by a shielding member. Hereby, respective crystal blanks are electrically shielded from one another. As the plurality of crystal blanks, a crystal blank of AT cut for generating a communication frequency signal, and a tuning fork type crystal blank for generating a clock signal are preferably used.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: August 17, 2004
    Assignee: Nihon Dempa Kogyo Co., Ltd
    Inventor: Masanobu Okazaki
  • Patent number: 6689670
    Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: February 10, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masato Kawanishi
  • Patent number: 6528866
    Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: March 4, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masato Kawanishi
  • Patent number: 6118347
    Abstract: An electronic apparatus is comprised of a main board 1 having a main-circuit mounting region 6 and an oscillating-circuit mounting region 2; a shielding case 5 for covering the oscillating-circuit mounting region by being attached to the main board; a sub-board 10 on which circuit components 3 and 4 constituting an oscillating circuit portion 11 are mounted and which is supported at a position spaced part from the main board inside the shielding case; and a connector 12 for electrically connecting the sub-board and the main board.
    Type: Grant
    Filed: January 26, 1999
    Date of Patent: September 12, 2000
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Kazuhide Ohira
  • Patent number: 6104107
    Abstract: This invention relates to the field of electrical technology, and relates particularly to a method for the continuous transformation of electrical energy with its subsequent transmission from an initial source (transformer) to a consuming device, and also to an apparatus for the implementation of this method of transformation and the supplying of power to electrical devices through a transmission line which does not form a closed circuit, ie consists of a single conducting wire.
    Type: Grant
    Filed: January 11, 1995
    Date of Patent: August 15, 2000
    Assignee: Uniline Limited
    Inventors: Stanislav Avramenko, Konstantin Avramenko
  • Patent number: 6034571
    Abstract: An oscillator includes a multi-layered base. Circuit patterns are formed on a first main surface and the inside of the multi-layered base. Holes through which wiring patterns of the individual layers of the base are connected are formed within the multi-layered base. Electronic components are mounted on the first main surface of the multi-layered base. First and second reverse electrodes, which serve as external terminals to be connected to an external source, are formed on a second main surface of the multi-layered base. The first reverse electrode serves as a ground electrode, and the second reverse electrodes serve as terminal electrodes. The reverse electrodes are electrically connected to the circuit patterns via the holes. The reverse electrodes are located farther inward than the lateral surfaces of the multi-layered base. A shield cover is placed to tightly cover the first main surface of the multi-layered base.
    Type: Grant
    Filed: September 8, 1998
    Date of Patent: March 7, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masao Uno
  • Patent number: 5958557
    Abstract: A contoured panel section for a radome for use with a center frequency corresponding to a wavelength equal to .lambda., the panel section comprising a solid body portion of a thickness which is an integral multiple of .lambda./2 and which has opposing first and second ends for interconnecting with corresponding second and first ends, respectively, of a mating panel section, wherein a combined thickness of the first and second ends is equal to the thickness of the body portion. The panel section is preferably formed of thermoplastic material having a high dielectric constant and is thermoformed using a double mold.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: September 28, 1999
    Inventor: Menachem Naor
  • Patent number: 5898344
    Abstract: Downward projections made on two side walls of a cap are fitted into recesses in two opposed side faces of a substrate. Lower margins of two end walls of the cap are soldered to ground electrodes provided on a part mounting face of the substrate. Lower margins in the proximity of projections of the side walls of the cap are soldered to ground electrodes provided on the part mounting face above recesses of the substrate. Therefore, it is provided a high-frequency module that can produce a good electromagnetic shielding effect even in a high-frequency band.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: April 27, 1999
    Assignee: TDK Corporation
    Inventor: Katsuhiko Hayashi
  • Patent number: 5661441
    Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: August 26, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takayoshi Morino, Yukiro Kashima
  • Patent number: 5654676
    Abstract: A voltage controlled oscillator module (100) (400) provides tuning capability for the VCO in a shielded environment. The module includes a trimmable capacitor (110) (410) having metal plates (112, 114), (412, 414, 416) capacitively coupled through the substrate. One of the metal plates (114) (416) is a trimmable plate which can be trimmed to tune the VCO frequency. The trimmable metal plate (114) (416) remains exposed on the bottom surface (108) (408) of the substrate (104) (404) so that the frequency of the VCO can be tuned while the reminder of the oscillator circuitry (102) (402) on the top surface (106) (406) is encapsulated by a ground shield (116) (418).
    Type: Grant
    Filed: June 10, 1996
    Date of Patent: August 5, 1997
    Assignee: Motorola, Inc.
    Inventors: Branko Avanic, Anthony J. Suppelsa, David C. Everest, III
  • Patent number: 5652550
    Abstract: An oscillator is isolated from external mechanical and thermal effects by rrounding the oscillator on all sides with an aerogel insulation structure that provides both thermal insulation and vibrational isolation above some predetermined low frequency limit which is a function of the mass of the oscillator and the nature of the aerogel insulation structure.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: July 29, 1997
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: John R. Vig
  • Patent number: 5650755
    Abstract: A voltage controlled oscillator module assembly (300) minimizes microphonics in a low profile package. Included within the module (300) are a substrate (302), VCO circuitry (308), and a ground shield (314) encapsulating the VCO circuitry. Included within the VCO circuitry (308) is at least one resonator (310) which is solderable on at least two of its surfaces. One surface of the resonator (310) is soldered to the substrate (302) while another surface of the resonator is soldered to the shield (314). An improved ground is thus provided to the resonator (310) which reduces the occurrences of microphonics while providing a low profile package for the module (300).
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: July 22, 1997
    Assignee: Motorola, Inc.
    Inventors: Branko Avanic, Anthony J. Suppelsa, David C. Everest, III
  • Patent number: 5374779
    Abstract: For sufficiently shielding an undesired electro-magnetic wave from penetrating into a communication apparatus, for instance, a car telephone through stray coupling, or leaks therefrom, an electronic circuit substrate and a case of the communication apparatus are formed of flat plates which consist of insulating material comprising magnetic material. One side surface of the flat plates are covered with conductive films. The communication apparatus itself is accommodated in the case and an electric power source connecting cable is wrapped by a similar arrangement, so as to remarkably reduce obstructions caused by undesired waves and other communications in comparison with the conventional arrangement.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: December 20, 1994
    Assignee: Uniden Corporation
    Inventor: Yoshihiro Konishi
  • Patent number: 5373262
    Abstract: In a voltage controlled oscillator, a dielectric resonator is mounted on a circuit board and a metal case is mounted on the circuit board to shield the dielectric resonator. The dielectric resonator comprises a C-shaped first electrode which is provided in a dielectric body, second and third electrodes which are arranged on upper and lower sides of the first electrode, a signal connecting pattern which is extended from the first electrode toward a side surface of the dielectric body, and earth connecting patterns which are extended from the first, second and third electrodes toward the side surface of the dielectric body, to provide predetermined impedance between the earth connecting pattern and the signal connecting pattern. The dielectric resonator is arranged with the second and third electrodes in parallel with a major surface of the circuit board, and the second electrode is upwardly exposed.
    Type: Grant
    Filed: January 27, 1993
    Date of Patent: December 13, 1994
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroyuki Yamamoto, Atsushi Inoue, Tatsuo Bizen
  • Patent number: 5357218
    Abstract: A shielded microstrip assembly (100)includes a substrate 102 having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: October 18, 1994
    Assignee: Motorola, Inc.
    Inventors: William J. Wingfield, Mark A. Crandall, Leng H. Ooi
  • Patent number: 5332979
    Abstract: An RF power-generator system for the frequency range of 2 to 30 MHz and a programmable sinusoidal power output of 0 to 1000 W. The system is constructed of modules (10, 30, 50, 70 and 90) accommodated in a shallow parallelepipedal housing (1) with a capacity of 4.6 l. The housing essentially comprises two lateral lengths (4) of structural section, a sheet-metal front (6), a sheet-metal bottom (5), and a lid. A crystal-controlled power-oscillator module (10) communicates by way of an RF line (121) with an intermediate module (30). The intermediate-amplifier module communicates by way of still another RF line (122) with a terminal power-amplifier module (50). The terminal power-amplifier module communicates by way of still another RF line (123) with a high-power filter (70). The filter communicates by way of still another RF line (124) with a high-power directional coupler (90). The RF power output can be intercepted at an RF plug (2).
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: July 26, 1994
    Inventors: Janusz Roskewitsch, Matthias Huttl
  • Patent number: 5302921
    Abstract: A piezoelectric oscillator in which radiation of higher harmonic components is reduced. A piezoelectric vibrator and a semiconductor device are provided in an oscillation circuit for making the piezoelectric vibrator oscillate, as is a filter for cutting components in a predetermined frequency band or higher harmonic components of an oscillation signal outputted from the semiconductor device. The piezoelectric vibrator, the semiconductor device and the filter are packed in one package. Radiation of the higher harmonic components is reduced by placing the filter close to the oscillator, by providing a shielding or by operating portions of the oscillator output circuit with a reduced supply voltage.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: April 12, 1994
    Assignee: Seiko Epson Corporation
    Inventors: Mikio Shigemori, Toru Oida, Shigeru Hirasawa, Katsumi Yamamura
  • Patent number: 5291152
    Abstract: An inductive type proximity switch (S) includes an open-ended loop (L3) adjacent to the inductor (L1, L2) of the parallel resonant circuit of its main (LC) oscillator. A high speed bistate switch (S1) is connected between the ends of the loop (L3). A pulsed input to the switch (S1) causes sequential making and breaking of a connection between the ends of the loop (L3) whereby the loop (L3) functions as a Faraday shield to inhibit mutual inductive linking of the inductor (L1, L2) with an inductor (L4) of a passive (LC) resonant circuit (L4, C4) of a target (T) when the target (T) is in proximity with the proximity switch (S) and the connection between the ends of the loop (L3) is made by the bistate switch (S1).
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: March 1, 1994
    Assignee: Vaseal Electronics Limited
    Inventor: Allen Seale
  • Patent number: 5172077
    Abstract: In an oscillator employing a triplate type stripline, earth (ground) electrodes are formed only on an opposite pair of side surfaces of a substrate in which the stripline is embedded. An oscillation circuit mounted on the substrate is covered with a shielding case and the remaining side surfaces of the substrate, which are provided with no earth electrodes, are covered with shielding plates which are provided on the shielding case. Connecting portions of the shielding case are electrically connected with the earth electrodes by soldering. Thus, the stripline is electromagnetically shielded in a simple manner so that it is possible to easily manufacture an oscillator employing a stripline at a low cost.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: December 15, 1992
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yo Funada
  • Patent number: 5153531
    Abstract: An arrangement for stabilizing the oscillation frequency and phase of a high frequency oscillator comprising a shielding case of aluminum formed by die casting and having side walls and a base, a plurality of partition walls integrally formed with the shielding case, a printed circuit board securely mounted on the partition walls, and a high frequency oscillator securely mounted on the printed circuit board. The high frequency osilllator is encompassed with and shielded by the side walls and base of the shielding case, the partition walls, and the printed circuit board.
    Type: Grant
    Filed: October 30, 1991
    Date of Patent: October 6, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hirotaka Fujisaki
  • Patent number: 4831211
    Abstract: A conductive and mechanical energy absorbing gasket is used between an electronics package and a cover of an enclosure to provide microphonics isolation. The electronics package is secured to the cover via a gasket using isolation damping grommets and screws, so that the only substantial transmission of mechanical energy from the case to the electronic package is through the screws themselves. The conductivity of the gasket places the entire enclosure at the same potential as the metal in the electronic package and as the mounting screws, and thus helps prevent the screws from acting as RF antennas.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: May 16, 1989
    Assignee: Rockwell International Corporation
    Inventors: Larry D. McPherson, Eliseo Saenz
  • Patent number: 4797614
    Abstract: A meter for sheet conductance measurements does not touch the conductive surface of a sample. A probe having a resonant tank coil is positioned against a parallel supporting surface of the sample, which may be flat or curved and of unrestricted area. An oscillator incorporating the tank coil is controlled to stabilize oscillator amplitude in response to eddy current loading by the sample. An electrostatic shield in a finger configuration prevents capacitive coupling between the tank coil and the sample without hindering magnetic coupling. A readout of sheet conductance is driven by the oscillator control. Direct current can be coupled to the tank coil for temperature control preventing undesired resistance changes in the tank coil. The oscillator can be controlled by an optically coupled variable gain element. Measurements can be made with the tank coil up to at least 0.75 inch from the conductive surface of the sample.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: January 10, 1989
    Assignee: Sierracin Corporation
    Inventor: Roger E. Nelson
  • Patent number: 4588964
    Abstract: A microwave solid-state oscillator includes a casing hermetically enclosing a microwave oscillation device and a dielectric resonator electromagnetically coupled with the microwave oscillation device, an output terminal leading out an oscillation output from said casing, and a microwave terminal electromagnetically coupled to the dielectric resonator, one end of which is connected to a microwave line having a terminating admittance at the outside of the casing.
    Type: Grant
    Filed: October 10, 1984
    Date of Patent: May 13, 1986
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Hirai, Hideki Torizuka
  • Patent number: 4583056
    Abstract: In an apparatus having an insulative substrate, a power circuit is mounted on one surface of the substrate and connected to receive power from a mains supply for rectifying the AC energy of the supply and supplying the rectified energy to a pair of power lines. A high frequency source is mounted on the same surface as the power circuit and electrically connected to the power lines for converting the rectified energy into oscillation energy. A shield casing, which is electrically connected to one of the power lines which is lower in impedance than the other, encases the high frequency source. A conductor, printed on the other surface of the substrate, is substantially aligned with a portion of the shield casing which is positioned between the power circuit and the high frequency source, the conductor being electrically connected to the power line having the lower impedance to suppress radiation which would otherwise leak through a gap between the shield casing and the substrate.
    Type: Grant
    Filed: September 13, 1984
    Date of Patent: April 15, 1986
    Assignee: Matsushita Seiko Co., Ltd.
    Inventors: Masaaki Takeda, Yasutoshi Kawaguchi
  • Patent number: 4338576
    Abstract: Noise potentials and radiation in an ultrasonic nebulizer are reduced by separating the oscillator and power supply and shielding the former, with one of the DC power lines to the oscillator passing through an aperture in the metal casing that shields the oscillator, while the other power supply line is connected to that casing. Oscillator control may be achieved by an unshielded variable resistor coupled by conductors of extended length to the oscillator by a filter circuit.
    Type: Grant
    Filed: July 3, 1979
    Date of Patent: July 6, 1982
    Assignee: TDK Electronics Co., Ltd.
    Inventors: Minoru Takahashi, Sadao Mitsui
  • Patent number: 4160959
    Abstract: An N-channel MOS monolythic R.F. Modulator for use in television games or the like is provided which internally generates an R.F. carrier signal and modulates same in accordance with the composite video output signal from the T.V. interface chip. The modulator utilizes two depletion mode MOSFETs connected in a cascode configuration, the output circuits of which are connected in series with an inductor, between a voltage source and ground. The input terminal of one of the transistors receives the composite video signal. The input terminal of the second transistor is connected to a resonant frequency circuit. The resonant frequency circuit is electromagnetically coupled to the inductor such that the current flowing through the inductor impresses a current in the resonant frequency circuit to cause same to generate the R.F. carrier signal.
    Type: Grant
    Filed: March 23, 1978
    Date of Patent: July 10, 1979
    Assignee: General Instrument Corporation
    Inventor: Stephen G. T. Maine