Abstract: A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Abstract: An oven-controlled crystal oscillator includes a base substrate, a power transistor, and a surface mount type crystal resonator. The base substrate has a bottom surface on which a mounting terminal for surface mounting is disposed. The power transistor is mounted on the base substrate. The surface mount type crystal resonator is mounted on the power transistor.

Abstract: An oscillator including a container, a first protrusion portion protruding from the container along a first direction, a second protrusion portion protruding from the container along the first direction, and a projection portion protruding from the container along the first direction. The second protrusion portion is shorter than the first protrusion portion in the first direction, and the projection portion is longer than the second protrusion portion and shorter than the first protrusion portion in the first direction.

Abstract: A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.

Abstract: An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit.

Abstract: Disclosed are microelectromechanical system (MEMS) devices and methods of using the same. In some embodiments, a MEMS device comprises a micro-oven comprising a MEMS oscillator configured to generate a reference signal. The device further comprises a control unit comprising at least one input node configured to receive a parameter set, where the parameter set comprises at least a first parameter indicative of a sensed ambient temperature, and where the control system is configured to (i) based on the parameter set, select from a plurality of pre-characterized operation temperatures an operation temperature for the MEMS oscillator, and (ii) generate a temperature-setting signal indicating the selected operation temperature. The device still further comprises a temperature control system communicatively coupled to the control unit and configured to (i) receive the temperature-setting signal and (ii) maintain the MEMS oscillator at the selected operation temperature.

Abstract: A temperature control circuit of an oven controlled crystal oscillator is a circuit in which a supply voltage is applied to a first terminal of a resistance R10, a first terminal of a resistance R11, and a first terminal of a heater resistance RH1, a second terminal of a thermistor TH1, a second terminal of a temperature sensing element, and a collector side of a transistor Q2 are connected to a common ground, a first terminal of a temperature sensing element ZZ is connected to an input terminal of an operational amplifier IC2, and a setting temperature in a thermostatic oven is controlled to gradually rise as an ambient operative temperature rises.

Abstract: A heater device includes a temperature detector, a heater control circuit, a heater, a voltage supply path, and an overheat prevention circuit. The overheat prevention circuit includes a positive-temperature-coefficient thermistor and a pull-up resistor. The positive-temperature-coefficient thermistor is interposed on the voltage supply path in a position for being heated by the heater. The pull-up resistor that includes: one end connected between the heater and the positive-temperature-coefficient thermistor, and another end connected to a direct current power source. The control voltage to be applied to the heater is restricted to a voltage at a connection point between the positive-temperature-coefficient thermistor and the pull-up resistor when the control voltage from the heater control circuit is abnormally decreased.

Abstract: Systems and techniques for oscillator control are described. A fixed or controlled oscillator feeds a plurality of evenly spaced tap points multiplexed to an output by a multiplexer. A phase change control circuit changes the multiplexer to a new tap point one phase tap at a time, with the change being made when an oscillator clock edge will not be repeated to an output. The phase change control circuit determines when to change the multiplexer setting based on the overflow of an accumulator, which is continuously summing an increment value. The sign of the accumulator increment value determines the direction of the multiplexor updates. The resulting output signal from the multiplexor is a new output frequency related to the oscillator frequency and the accumulator increment value. With a plurality of multiplexer controlled outputs and corresponding phase change control circuits, a plurality of output frequencies can be created from one oscillator.

Abstract: A display device is provided with a display panel; and a display panel driver driving the display panel in response to externally-provided image data. The display panel driver includes a display memory for storing the image data, and is configured to perform overdrive processing on the image data read from the display memory. The display panel driver includes an overdrive processing control circuit detecting writing of the image data into the display memory to control operation and halt of a circuit used for the overdrive processing.

Abstract: An oven controlled crystal oscillator includes a crystal unit, a temperature control circuit, and a circuit board. The temperature control circuit is configured to control a temperature of the crystal unit. The crystal unit includes a flange that projects outward to an entire outer periphery in one end. The circuit board includes a depressed portion in which the flange is partially inserted. The temperature control circuit includes a power transistor, a thermistor as a temperature sensor, and a metal pattern. The power transistor becomes a heat source. The metal pattern commonly connects a ground terminal of the crystal unit, a collector of the power transistor, and a ground terminal of the thermistor. The crystal unit is positioned in a state where the flange is partially inserted in the depressed portion. The crystal unit is connected to the metal pattern.

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract: An atomic oscillator includes: a gas cell which includes two window portions having a light transmissive property and in which metal atoms are sealed; a light emitting portion that emits excitation light to excite the metal atoms in the gas cell; a light detecting portion that detects the excitation light transmitted through the gas cell; a heater that generates heat; and a connection member that thermally connects the heater and each window portion of the gas cell to each other.

Abstract: A constant-temperature piezoelectric oscillator includes: a piezoelectric vibrator; an oscillation circuit; a frequency voltage control circuit; a temperature control section; and an arithmetic circuit, wherein the temperature control section includes a temperature-sensitive element, a heating element, and a temperature control circuit, the frequency voltage control circuit includes a voltage-controlled capacitance circuit capable of varying the capacitance value in accordance with the voltage, and a compensation voltage generation circuit, and the arithmetic circuit makes the compensation voltage generation circuit generate a voltage for compensating a frequency deviation due to a temperature difference between zero temperature coefficient temperature Tp of the piezoelectric vibrator and setting temperature Tov of the temperature control section based on a frequency-temperature characteristic compensation amount approximate formula adapted to compensate the frequency deviation, and then applies the voltage t

Abstract: A temperature control circuit of oven-controlled crystal oscillator includes a heater resistor, a first resistor, a thermistor, a second resistor, a third resistor, a differential amplifier, a PNP-type power transistor, and a PNP-type current-limiting transistor. The thermistor outputs a voltage depending on a temperature. The differential amplifier amplifies a difference between the voltage received by the one input terminal and the voltage received by the other and output as a control voltage. The PNP-type power transistor includes an emitter where the other end of the heater resistor is connected, a base that receives an output of the differential amplifier, and a grounded collector. The PNP-type current-limiting transistor has an emitter where a power voltage is supplied, a base that receives a voltage between the other end of the heater resistor and the emitter of the power transistor, and a collector connected to the base of the power transistor.

Abstract: An oscillating device includes an atomic oscillator, an oven controlled crystal oscillator, a correcting unit configured to correct an output signal of the oven controlled crystal oscillator on the basis of an output signal of the atomic oscillator, a housing configured to house the atomic oscillator and the oven controlled crystal oscillator, and a temperature adjusting unit configured to adjust the temperature in the housing to a predetermined temperature.

Abstract: A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit.

Abstract: A crystal unit and a thermistor with negative resistance-temperature characteristics are housed in a thermostatic oven heated by a heater. A transistor driving the heater is controlled by an output of a differential amplifier, the thermistor is placed between a power supply voltage and an inverting input of the amplifier, and a first resistor used to adjust the temperature of a zero temperature coefficient point of the crystal unit is installed between the inverting input and a ground point. A second resistor is installed between the power supply voltage and a non-inverting input of the amplifier and a third resistor is installed between the non-inverting input and ground point. One of the second and third resistors is a resistor assembly made up of a plurality of resistance elements and one of these resistance elements is provided with positive resistance-temperature characteristics and adapted to detect ambient temperature.

Abstract: A heater device includes a temperature detector, a heater control circuit, a heater, a voltage supply path, and an overheat prevention circuit. The overheat prevention circuit includes a positive-temperature-coefficient thermistor and a pull-up resistor. The positive-temperature-coefficient thermistor is interposed on the voltage supply path in a position for being heated by the heater. The pull-up resistor that includes: one end connected between the heater and the positive-temperature-coefficient thermistor, and another end connected to a direct current power source. The control voltage to be applied to the heater is restricted to a voltage at a connection point between the positive-temperature-coefficient thermistor and the pull-up resistor when the control voltage from the heater control circuit is abnormally decreased.

Abstract: A temperature invariant digitally controlled oscillator is disclosed. The digitally controlled oscillator is configured to generate an output clock with stable frequency. The temperature invariant digitally controlled oscillator comprises a digitally controlled oscillator, a temperature sensor, a temperature decision logic circuit, and a temperature conditioner. The digitally controlled signal is provided to adjust the oscillation frequency of the digitally controlled oscillator by changing its capacitances. The stabilization of the silicon temperature is achieved with the temperature sensor, the temperature decision logic circuit, and the temperature conditioner.

Abstract: An electronic device may include a voltage controlled oscillator (VCO) and a temperature sensor. The electronic device may also include a controller configured to cooperate with the VCO and the temperature sensor to determine both a temperature and a frequency error of the VCO for each of a plurality of most recent samples. Each of the most recent samples may have a given age associated therewith. The controller may also be configured to align the temperature, the frequency error, and the given age for each of most recent samples in a three-dimensional (3D) coordinate system having respective temperature, frequency error and age axes. The controller may also be configured to estimate a predicted frequency error of the VCO based upon the aligned temperature, frequency error, and given age of the most recent samples.

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract: An oscillating device includes an atomic oscillator, an oven controlled crystal oscillator, a correcting unit configured to correct an output signal of the oven controlled crystal oscillator on the basis of an output signal of the atomic oscillator, a housing configured to house the atomic oscillator and the oven controlled crystal oscillator, and a temperature adjusting unit configured to adjust the temperature in the housing to a predetermined temperature.

Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.

Abstract: A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.

Abstract: A constant-temperature piezoelectric oscillator includes: a piezoelectric vibrator; an oscillation circuit; a frequency voltage control circuit; a temperature control section; and an arithmetic circuit, wherein the temperature control section includes a temperature-sensitive element, a heating element, and a temperature control circuit, the frequency voltage control circuit includes a voltage-controlled capacitance circuit capable of varying the capacitance value in accordance with the voltage, and a compensation voltage generation circuit, and the arithmetic circuit makes the compensation voltage generation circuit generate a voltage for compensating a frequency deviation due to a temperature difference between zero temperature coefficient temperature Tp of the piezoelectric vibrator and setting temperature Tov of the temperature control section based on a frequency-temperature characteristic compensation amount approximate formula adapted to compensate the frequency deviation, and then applies the voltage t

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board comprising a crystal oscillation circuit is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin. The outer circuit board has a temperature control circuit and a power supply circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A through slot is formed through the outer circuit board, and the thermostatic bath is inserted into the through slot. By inserting the thermostatic bath into the through slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract: Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

Abstract: A crystal unit and a thermistor with negative resistance-temperature characteristics are housed in a thermostatic oven heated by a heater. A transistor driving the heater is controlled by an output of a differential amplifier, the thermistor is placed between a power supply voltage and an inverting input of the amplifier, and a first resistor used to adjust the temperature of a zero temperature coefficient point of the crystal unit is installed between the inverting input and a ground point. A second resistor is installed between the power supply voltage and a non-inverting input of the amplifier and a third resistor is installed between the non-inverting input and ground point. One of the second and third resistors is a resistor assembly made up of a plurality of resistance elements and one of these resistance elements is provided with positive resistance-temperature characteristics and adapted to detect ambient temperature.

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract: The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals.

Abstract: An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract: The invention relates to an oven controlled crystal oscillator for surface mounting with reduced height (low profile). The oven controlled crystal oscillator for surface mounting comprises: a flat first substrate made of ceramic and on which are installed a crystal device and a heat resistor; and a second substrate made of a glass epoxy resin which is quadrangular in plan view and which faces the first substrate and has a larger external shape in plan view than the first substrate. The second substrate has an opening into whose center the crystal device is inserted, and has terminal sections on four locations corresponding to the surface outer periphery of the first substrate and the peripheral surfaces of the opening in the second substrate, and the terminal sections of the first substrate and second substrate are connected by solder.

Abstract: A low-price, compact oscillating device having a good temperature characteristic of a frequency intermediate between a temperature compensated crystal oscillator (TCXO) and an oven-controlled crystal oscillator (OCXO) is provided. The oscillating device having a TCXO is provided with a base on which the TCXO is mounted, that is formed into a box shape having a recess, with a plane area substantially equal to that of the TCXO; and a semiconductor chip including a temperature control circuit, a temperature sensor, and a heating element, mounted in the recess. An opening of the recess is provided in a surface opposite a surface in which the temperature compensated crystal oscillator is mounted, and sealed by a cover. A temperature of the TCXO can be kept constant to provide a oscillating device having an excellent temperature characteristic of a frequency compared with the single TCXO.

Abstract: A surface mounted oven controlled crystal oscillator includes a crystal oscillator shell, a crystal oscillation circuit, several functional pins and a base plate. The crystal oscillation circuit is accommodated in a cavity that is formed by the crystal oscillator shell and the base plated and electrically connects with the functional pins. The functional pins drill through the base plate from the cavity. An insulating layer is formed between each functional pin and the base plate. The surface mounted oven controlled crystal oscillator further includes several pads formed at an outer surface of the base plate. The insulating layer is also formed between each pad and the base plate, and the functional pins are electrically connected with the corresponding pads respectively. Added pads, the oven controlled crystal oscillator has high stability, simple manufacturing process, and low manufacturing cost.

Abstract: A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.

Abstract: A thermostatic-chamber temperature control device includes: a heating element for heating a thermostatic chamber; a bridge circuit having a temperature sensitive element whose resistance value varies in accordance with the temperature of the heating element; a detection circuit for detecting an unbalanced voltage of the bridge circuit; a PWM signal generating circuit for generating a PWM signal corresponding to the unbalanced voltage detected by the detection circuit; and a switching element that has a current output terminal connected to the heating element and a current input terminal connected to a power supply circuit and is driven on the basis of the PWM signal generated by the PWM signal generating circuit.

Abstract: A temperature controlled oscillator is provided with a circuit substrate having a crystal resonator, an oscillating circuit, and a temperature control circuit, arranged on one or both principal surfaces, and a container main body that accommodates the circuit substrate and has mount terminals on an outer bottom surface thereof. The temperature control circuit includes at least a first temperature sensor that detects an operating temperature of the crystal resonator, a second temperature sensor that detects a surrounding temperature of the container main body, and a heating resistor that applies heat to the crystal resonator, and lead wires extend from the circuit substrate and are connected electrically to the mount terminals. An insulation groove that passes through the circuit substrate in a thickness direction is formed between: a first lead wire closest to the second temperature sensor, and the second temperature sensor; and the heating resistor.

Abstract: There is provided a surface mount oscillator of a junction type in which the size of an IC chip is increased while maintaining high performance thereof, and the outer dimension of the oscillator in plan view are small.

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract: The crystal oscillator device includes an air-tight case (1) forming a vacuum chamber (23), a piezoelectric resonator element (11), oscillation circuitry, a temperature sensor, and a heating unit implemented in an integrated-circuit (IC) chip (13) with an active surface (13a). The piezoelectric resonator element (11) and the oscillation circuitry are connected together to form an oscillation circuit. Furthermore, the temperature sensor and the heating unit are enclosed in the vacuum chamber (23) with the piezoelectric resonator element (11). The piezoelectric resonator element is attached in a heat conductive manner to the active surface (13a) of the integrated-circuit chip (13) in such a way that the IC chip provides mechanical support for the piezoelectric resonator element.

Abstract: The present invention is a Chip Scale Atomic Clock (CSAC)-enabled Time and Frequency Standard (CTFS) architecture. The CTFS architecture includes a microcontroller, a Time Compensated Crystal Oscillator (TCCO) circuit which is connected to the microcontroller, and a Chip Scale Atomic Clock (CSAC) which is connected to the microcontroller. The microcontroller is configured for selectively causing the CTFS to provide a TCCO circuit-based output frequency when the CTFS has not locked to a predetermined atomic resonance, and is further configured for causing the CTFS to provide a CSAC-based output frequency when the CTFS has locked to a predetermined atomic resonance.

Abstract: Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier outputs a signal according to a difference between the output of the thermistor and a reference signal, a power transistor amplifies the output of the operational amplifier, and a heater generates heat based on a collector voltage of the power transistor, is provided with a temperature sensor circuit having a transistor with a base to which the output of the operational amplifier is input. The control circuit outputs a collector voltage of the transistor as an internal temperature signal which changes according to a temperature inside the oscillator.

Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.

Abstract: A system and method for providing temperature compensation in a oscillator component (such as a crystal oscillator component) that includes a closely-located temperature sensing device. The crystal oscillator component in example systems and methods is exposed to a temperature profile during a calibration procedure. Temperature and frequency data are collected and applied to coefficient generating function according to a temperature compensation model to generate a set of coefficients that are used in the temperature compensation model in an application device. The generated coefficients are stored in a coefficient memory accessible to an application device during operation.

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract: A constant-temperature type crystal oscillator includes: a surface-mount crystal unit, in which a crystal element is housed in a case main body to hermetically encapsulate the crystal element with a metal cover, and which includes a crystal terminal serving as a mounting terminal that is electrically connected to at least the crystal element on an outer bottom face of the case main body; a thermistor that detects an operational temperature of the surface-mount crystal unit; and a circuit substrate, on which elements forming an oscillator circuit and elements forming a temperature control circuit along with the thermistor are installed. The thermistor includes a first and second terminal electrode and a temperature detecting electrode that is electrically independent of the first and second terminal electrode. The temperature detecting electrode is electrically connected to the crystal terminal of the surface-mount crystal unit through a circuit pattern formed on the circuit substrate.

Abstract: An apparatus for providing oscillator frequency stability is disclosed. The apparatus includes an internally ovenized oscillator module having an oscillator and an inner heater to maintain the oscillator at a first temperature during operation. The apparatus also includes a thermally conductive cover for forming a first compartment to contain the internally ovenized oscillator module along with multiple heaters. The heaters are in thermal communication with the thermally conductive cover and the substrate to form an oven to keep the internally ovenized oscillator module at a stable second temperature during operation. In addition, the apparatus includes a thermally insulative cover for forming a second compartment to contain the first compartment.