Abstract: An improved DC and/or audio-frequency output for RF paths has the following features: an earth connection is provided, in particular in the form of an electrically conductive housing (17), an output path (13) branches off from a connection point (117, 117?) on an RF path (3, 5), the output path (13) comprises a branch line (7, 9), originating from the connection point (117, 117?), in the form of a ?/4 line, where ? represents a wavelength which corresponds to a wavelength within the RF band to be transmitted on the RF path (3, 5), and having a capacitor device (27a, 27b), which is connected to the branch line (7, 9), in the form of a low-pass filter and/or an RF short, with at least one sealed dipole connection (127a, 127h) also being provided on the output path (13), in addition to the at least one capacitor device (27a, 27b).

Abstract: A circuit device having an inductor and a capacitor in parallel connection includes a planar inductor embedded in an insulating material layer, wherein the planar inductor has a winding wire portion, a first connection terminal and a second connection terminal. The first connection terminal and the second connection terminal are located at different elevations and have an overlapping region. A capacitor dielectric layer is located within the overlapping region between the first connection terminal and the second connection terminal, and the capacitor dielectric layer and the first connection terminal and the second connection terminal together form a capacitor.

Abstract: A dual bandstop filter affects frequencies in a lower passband, first and second stopbands separated by a middle passband, and an upper passband. The filter includes two legs. In one version, one leg is a highpass filter while the other leg is a bandstop filter outputting into a lowpass filter. In a second version, one leg is a lowpass filter while the other leg is highpass filter outputting into a bandstop filter. The first version is preferred when the upper value of the lower passband is around 100 MHz or less, while the second version is preferred when the upper value of the lower passband is around 100 MHz or more. In a third version, one leg is a highpass filter while the other leg is a bandstop filter sandwiched between two lowpass filters, preventing second resonances from the lowpass filter from interfering with desired frequencies in the upper passband.

Abstract: A dual bandstop filter affects frequencies in a lower passband, first and second stopbands separated by a middle passband, and an upper passband. The filter includes two legs. In one version, one leg is a highpass filter while the other leg is a bandstop filter outputting into a lowpass filter. In a second version, one leg is a lowpass filter while the other leg is highpass filter outputting into a bandstop filter. The first version is preferred when the upper value of the lower passband is around 100 MHz or less, while the second version is preferred when the upper value of the lower passband is around 100 MHz or more. In a third version, one leg is a highpass filter while the other leg is a bandstop filter sandwiched between two lowpass filters, preventing second resonances from the lowpass filter from interfering with desired frequencies in the upper passband.

Abstract: A method and apparatus for dynamically varying the impedance of a tank circuit whereby, over time, the response of the circuit to a received signal is maximized.

Abstract: A resonator that can alleviate restrictions in usage and design due to the bias voltage dependency and for which usage and design conditions can be easily determined. The resonator comprises a fixed electrode, a movable electrode opposite and sandwiching the fixed electrode, and an extension of the fixed electrode or the movable electrode that extends along a plane crossing the opposite surfaces of the fixed electrode and the movable electrode. With being displaced vertically relative to the fixed electrode, the movable electrode is vibrated.

Abstract: A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.

Abstract: A superconducting tunable filter is disclosed that has a center frequency and a bandwidth able to be adjusted separately. The superconducting tunable filter includes a superconducting resonator filter pattern formed on a dielectric substrate; a dielectric or magnetic plate above the resonator filter pattern and having a through-hole; a dielectric or magnetic rod inserted in the through-hole; and a position controller which separately controls the position of the dielectric or magnetic plate and the position of the dielectric or magnetic rod relative to the resonator filter pattern.

Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.

Abstract: Filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell.

Abstract: A technique to provide a compact integration of inductor-capacitor resonator a capacitor having a top plate and a bottom plate embedding a dielectric layer. The top and bottom plates are substantially parallel to each other. An inductor having a first end is coupled to the capacitor at the bottom plate. The inductor has N turns surrounding the bottom plate in a spiral geometry. The inductor is co-planar to one of the top and bottom plates and ends at a second end.

Abstract: A printed circuit board (PCB) embedded filter is utilized to provide a low-pass filter characteristic using minimal lumped circuit elements. Microstrips extend on top layer of the PCB to conductive vias to form a first series connected inductive element, while microstrips extend from conductive vias to conductive vias to form a second series connected inductive element. Shunt capacitance is employed on a lower layer using striplines extending outwardly and symmetrically from conductive vias. An absorption circuit is implemented using microstrips on back layer of the PCB and capacitive plates on inner layers of the PCB. A surface mount resistor may be installed between pads to complete the absorption circuit.

Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.

Abstract: In a tuning circuit constituted by connecting a coil L and two capacitors C1 and C2 into a ? type, a total capacitance value obtained by adding respective capacitance values of an input capacitance Cin and the first capacitor C1 which are connected to one of terminals of a coil L is set to be equal to a capacitance value of the second capacitor C2 connected to the other terminal of the coil L (C2=Cin+C1). Consequently, a capacitance value on one terminal side of the coil L and a capacitance value on the other terminal side are set to be equal to each other and are thus balanced, and a level difference between two output signals on a parallel resonance point of the ? type tuning circuit is reduced even if the capacitance values of the two capacitors C1 and C2 are decreased.

Abstract: A noise filter array includes filter elements, each of which includes an LC parallel resonant circuit having a coil and a capacitor and an LC series resonant circuit having a coil and a capacitor, are arranged substantially parallel to one another in an array and integrally provided. Grounding capacitors that define the filter elements are arranged so that a common ground-side electrode faces signal-side electrodes and is connected to an inductance adjusting conductor that defines the LC series resonant circuits along with the capacitors through a via hole. The lengths of the inductance adjusting conductor from a connection location within the via hole to ground terminals are substantially equal in each of the filter elements.

Abstract: System for high-Q integrated RF filters. A filter system is provided that comprises a resonate LC filter and a Q-enhancement circuit coupled to the resonate LC filter, wherein the Q-enhancement circuit operates to improve a quality factor of the filter system.

Abstract: Two second-order bandpass filter are connected serially to obtain a dual bandpass filter. One is inductive and the other is capacitive. One has a low passband and the other has a high passband. Between them, a finite transmission zero is formed to suppress noise. The present invention achieves a passband as wide as 1 gigahertz so that it can be applied to a wireless local network, communication equipments and electronic devices.

Abstract: Disclosed is a filter comprising an unbalanced input terminal and two balanced output terminals (a first balanced output terminal and a second balanced output terminal. A capacitor is connected between the first balanced output terminal and the GND, another capacitor is connected between the second balanced output terminal and the GND, and a first coil is connected between the first balanced output terminal and the second balanced output terminal.

Abstract: A hybrid diplex bandstop filter includes a lowpass filter circuit which passes a first range of frequencies and a highpass filter circuit passes a third range of frequencies. The filter blocks a second range of frequencies. The third range of frequencies is higher than the second range and the first range. A tuning circuit tunes at least one re-resonance of a frequency inside the first range of frequencies to either within the second range of frequencies or outside an industry specified upper limit which is in the third range of frequencies.

Abstract: A band pass filter circuit, wherein the band pass filter passes a frequency band between a first cutoff frequency and a second cutoff frequency with respect to an input frequency of an input signal, the band pass filter circuit includes: a first resonant circuit; a second resonant circuit; a third resonant circuit; at least one of a capacitive circuit and an inductive circuit. The first resonant circuit is connected to a signal line in series and sets a first resonant frequency as the first cutoff frequency. The second resonant circuit is connected to the signal line in series and sets a second resonant frequency as the second cutoff frequency. The third resonant circuit is connected to the signal line in parallel at a node where the first and second resonant circuits are connected, and sets a third resonant frequency as a band-pass center frequency between the first and second cutoff frequencies.

Abstract: A high frequency module reduces the inhibition in magnetic flux generated in an inductor and stray capacitance while simultaneously attaining shorter height and smaller size. The high frequency module includes a passive circuit having an inductor and a capacitor. One component part of the passive circuit is mounted as an electronic part on the substrate, while the other component part f the passive circuit is formed within the substrate. A ground electrode is further provided between the one component part of the passive circuit and the other component part.

Abstract: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

Abstract: A planar circuit having a conductive film on either main surface of a substrate. The conductive film on one of the main surfaces is patterned with two-dimensionally and repeatedly arranged unit cells, which are basic conductor patterns. Each of the unit cells has a capacitive region at the center thereof. Capacitance is induced between the center area and the conductor film formed on the main surface of the substrate opposite the center area. An area located near the middle of each of sides in the peripheral portion serves as an inductive region. In any two adjacent unit cells, the inductive regions have a multiple spiral-shaped conductor pattern, in which the center ends thereof are connected to each other at a halfway position between the two unit cells, and the outer peripheral ends thereof are connected to the capacitive regions.

Abstract: Multiple tank elements disposed along a common axis and multiple conductive pads disposed along opposing sides of the tank elements define a serpentine transmission path. The tank elements, each having a capacitor and an inductor in parallel communication, define respective portions of the serpentine transmission path that cross the common axis. In a circuit element having multiple tank elements defining a transmission path in which each tank element is preceded or followed by a next neighbor tank element, inductors of next neighbor tank elements are structured to generate directionally opposing magnetic fields upon passage of electrical current progressing along the transmission path.

Abstract: A multi-band band pass filter, including: first and second multi-order asynchronous resonators connected to each other by a coupling resonator and connected to respective first and second matching resonators, the first matching resonator connected to a signal-in terminal and second matching resonator connected to a signal-out terminal respectively; a first reference resonator connected between the signal-in terminal and a reference-in terminal and a second reference resonator connected between the signal-out terminal and a reference-out terminal, the first multi-order asynchronous resonator connected between the first matching resonator and the coupling resonator to the first reference terminal and the second multi-order asynchronous resonator connected between the second matching resonator and the coupling resonator to the reference-out terminal, the reference-in terminal connected to the reference-out terminal; and a feedback resonator connected between the signal-in terminal and the signal-out terminal.

Abstract: A tuned filter having enhanced high frequency response includes a circuit board having first and second opposed major surfaces and first and second opposing sides. The opposed major surfaces are substantially parallel to a single plane and are bisected by a longitudinal axis. The first and second opposing sides are substantially parallel to the longitudinal axis. An input terminal and an output terminal are connected to the single circuit board. A filter section is associated with the first major surface. At least two ground paths are associated with the second major surface. One of the ground paths extends along a portion of the first side, and another one of the ground paths extends along a portion of the second opposing side. An isolation region separates the at least two ground paths, and extends along the longitudinal axis.

Abstract: The present invention relates to a board receiving at least one connector, said board being constituted by a dielectric substrate comprising, on a first face, a first ground plane and on a second face, at least two transmission lines between which the connector and a footprint are mounted, characterized in that the footprint comprises a first element positioned between the two transmission lines under the connector, said first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element, said second elements each extending by a second ground plane, the second ground planes being connected to the first ground plane. The invention applies notably to printed circuit boards with integrated test connectors.

Abstract: A narrowband filter comprises an input terminal, an output terminal, and an array of basic resonator structures coupled between the terminals to form a single resonator having a resonant frequency. The resonator array may be arranged in a plurality of columns of basic resonator structures, with each column of basic resonator structures having at least two basic resonator structures. The basic resonator structures in each column may be coupled between the terminals in parallel or in cascade. Two or more resonator arrays may be coupled to generate multi-resonator filter functions.

Abstract: A compact bandpass filter within a multilayered low temperature co-fired ceramic (LTCC) substrate is provided. Each resonator comprises an inductor and a capacitor connected in parallel. A top ceramic substrate comprises a top conductive plate to form a first RF ground plane. A bottom ceramic substrate comprises a bottom conductive plate to form a second RF ground plane. A first ceramic substrate is between the top and bottom ceramic substrates. All inductors of the resonators are serpentine conductive traces on the first ceramic substrate. A second ceramic substrate is between the first and bottom ceramic substrates, having a plurality of conductive plates to form a plurality of capacitors that transmit RF signal from an input node of the bandpass filter to an output node of the bandpass filter. The resonators are located between the too and bottom conductive plates.

Abstract: A band-pass filter (10) for reducing harmonic electromagnetic signals includes an input line (100), an output line (120), at least one first resonator (140), and at least one second resonator (160). The input line inputs electromagnetic signals. The output line outputs electromagnetic signals. The first resonator includes a first grounded end (141), electronically connected to the input line, and a first open end (142). The second resonator is disposed parallel to the first resonator. The second resonator includes a second grounded end (161), electronically connected to the output line, and a second open end (162). The first grounded end is disposed in the same direction as the second grounded end, and the first open end is disposed in the same direction as the second open end.

Abstract: A radio frequency (“RF”) harmonic filter circuit as disclosed herein is fabricated using integrated passive device (“IPD”) technology. The RF harmonic filter circuit is configured to provide second, third, and fourth harmonic rejection while providing good input and output impedance matching. The RF harmonic filter circuit employs only one IPD loop inductance (preferably used for a second harmonic resonance circuit), which results in a significant die/package size reduction. The RF harmonic filter circuit also employs a combined circuit that performs input and/or output impedance matching and third harmonic rejection.

Abstract: An L-C resonant circuit with an adjustable resonance frequency, having a capacitor and a first inductor electrically coupled together and a second inductor magnetically coupled to the first inductor. Additionally, there is a control circuit to sense a signal representing a first current flowing through the first inductor and to force through the second inductor a second current that is a replica of the first current for setting the adjustable resonance frequency of the L-C resonant circuit.

Abstract: A multi-band band pass filter, including: first and second multi-order asynchronous resonators connected to each other by a coupling resonator and connected to respective first and second matching resonators, the first matching resonator connected to a signal-in terminal and second matching resonator connected to a signal-out terminal respectively; a first reference resonator connected between the signal-in terminal and a reference-in terminal and a second reference resonator connected between the signal-out terminal and a reference-out terminal, the first multi-order asynchronous resonator connected between the first matching resonator and the coupling resonator to the first reference terminal and the second multi-order asynchronous resonator connected between the second matching resonator and the coupling resonator to the reference-out terminal, the reference-in terminal connected to the reference-out terminal; and a feedback resonator connected between the signal-in terminal and the signal-out terminal.

Abstract: A switchable dual-band filter comprises first and second switchable resonators, a coupling structure having two ends respectively connecting the first and the second switchable resonators, an input impedance conversion circuit connecting an input terminal and the first resonator, and an output impedance conversion circuit connecting an output terminal and the second resonator. The coupling structure couples the first resonator to the second resonator, and vice versa. The input/output impedance conversion circuit converts the impedance on the input/output terminal into two distinct impedances that correspond to a first and a second operating frequency. The filter is simple in structure, occupies a smaller circuit area, and is cost-effective in manufacturing. The impedance at both operating passbands can also be matched properly.

Abstract: A small and inexpensive signal detector is provided, which can be simply used for noise detection as a development tool for development engineers of systems and devices. A signal suppression filter (22) of inhibiting high-frequency signals contained in power voltage and a signal separation filter (23) of inhibiting transmission of the high-frequency signals are provided in series in power lines (21A), (21B) connected to a power input terminal (T1), and high-frequency signals contained in power voltage between a power output terminal (T2) and the signal separation filter (23) are outputted from signal output terminals (T3) to (T5). High-frequency signals from a power source can be blocked by the signal suppression filter (22) and the signal separation filter (23), so that influence of power noise on a measurement system can be eliminated.

Abstract: An integrated circuit chip has on-chip millimeter wave (mmW) circuitry. An on-chip electro static discharge, ESD, protection network couples a signal pad of the chip to the mmW circuitry. The ESD protection network has a shorted stub being a low impedance path to ground for ESD events. Other embodiments are also described and claimed.

Abstract: According to one exemplary embodiment, a switching module includes a first harmonic phase tuning filter coupled to a first input of an RF switch. The first harmonic phase tuning filter is configured to provide an output impedance that substantially matches an input impedance of the RF switch at approximately a fundamental frequency and to provide a low impedance at approximately a harmonic frequency generated by the RF switch. The first harmonic phase tuning filter includes an LC circuit coupled between an output terminal of the first harmonic phase tuning filter and a ground and tuned to provide the low impedance at approximately the harmonic frequency generated by the RF switch. The RF switching module further includes a second harmonic phase tuning filter coupled to a second input of the RF switch. The first and second harmonic phase tuning filters can be fabricated on a single semiconductor die.

Abstract: According to one exemplary embodiment, a switching module includes a first harmonic phase tuning filter coupled to a first input of an RF switch. The first harmonic phase tuning filter is configured to provide an output impedance that substantially matches an input impedance of the RF switch at approximately a fundamental frequency and to provide a high impedance at approximately a harmonic frequency generated by the RF switch. The first harmonic phase tuning filter includes an LC circuit coupled between input and output terminals of the first harmonic phase tuning filter and tuned to provide the high impedance at approximately the harmonic frequency generated by the RF switch. The RF switching module further includes a second harmonic phase tuning filter coupled to a second input of the RF switch. The first and second harmonic phase tuning filters can be fabricated on a single semiconductor die.

Abstract: An LC filter structure and method for its fabrication, in which multiple shunt capacitors, multiple shunt inductors and multiple coupling inductors are printed on a metal layer formed on a thin dielectric substrate. The capacitors have first electrodes that are formed as spatially separated regions of the metal layer, and a common second electrode formed by a ground plane on the substrate. The shunt inductors are formed as spiral traces connected to the separated regions and to the ground plane, through conductive vias. The coupling inductors are similarly formed as spiral traces in the gaps between the separated regions, the ends of each coupling inductor being connected to respective adjacent regions of the metal layer.

Abstract: Coil(s) 11 and coil(s) 12 of LC resonant circuit(s) are oriented such that their centers are mutually perpendicular. For example, coil 11 might be mounted so as to stand upright on printed wiring board, and coil 12 might be mounted so as to lie flush against printed wiring board. Such configuration permitting lines of magnetic force from coil 11 and coil 12 to be oriented so as to be mutually perpendicular, lines of magnetic force from coil 11 and coil 12 do not merge, and coil 11 and coil 12 are not electromagnetically coupled. Accordingly, inductances of respective coils 11, 12 are unchanged; impedance frequency characteristics of respective LC resonant circuits are maintained at what they should be; and resonant impedance(s) is/are not lowered.

Abstract: An electronic signal filter is provided, including a first filter housing having a filter cavity, a circuit board having a slot positioned within the filter cavity, and a ground clip. The ground clip includes a slot-retaining portion positioned within and in contact with an inner edge of the circuit board slot, at least one grounding arm engaged in solderless grounding contact with an inner surface of the filter cavity, and at least one grounding leg. Upon assembly, an end portion of a distal end of the slot-retaining portion intimately contacts a portion of the grounding leg interposed between the filter housing and the circuit board to achieve secure ground contact between the circuit board and the filter housing in a solderless manner.

Abstract: A lamination type electronic component includes spiral conductor patterns which are substantially quadrilateral and are electrically connected to each other through a via hole formed in a ceramic insulating layer so as to constitute a coil. The conductor patterns are arranged so that the center in the width direction of the sides extending in the Y-axis direction of the one conductor pattern may be positioned at the inside edges of the sides extending in the Y-axis direction of the other conductor pattern.

Abstract: A filter for CATV applications includes a housing and two interface caps, each with an annular groove in a header portion thereof. A circuit board having a grounding bus along an edge of the board is disposed inside the housing. A split ring grounding clamp is disposed inside the housing such that a plurality of split rings are adjacent the grounding bus. The interface caps are press fitted into the ends of the housing, forcing the plurality of split rings into uniform contact with the grounding bus. The ends of the housing are then crimp-rolled such that a ridge is formed in the housing where the grooves in the headers are located in the interface caps, thereby sealing the ends of the housing to the interface caps.

Abstract: A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation positioned in two or more of the at least two thin-film layers and the second inductor comprises a coil having a clockwise rotation positioned in two or more of the at least two thin-film layer. In this case, the first inductor is coupled to the second inductor in at least one of the at least two thin-film layers when the bandpass filter is energized. In another embodiment, the first inductor has a clockwise rotation and the second has a counter-clockwise rotation positioned. In this case, the first inductor is coupled to the second inductor in at least two of the at least two thin-film layers when the bandpass filter is energized.

Abstract: A band pass filter circuit, wherein the band pass filter passes a frequency band between a first cutoff frequency and a second cutoff frequency with respect to an input frequency of an input signal, the band pass filter circuit includes: a first resonant circuit; a second resonant circuit; a third resonant circuit; at least one of a capacitive circuit and an inductive circuit. The first resonant circuit is connected to a signal line in series and sets a first resonant frequency as the first cutoff frequency. The second resonant circuit is connected to the signal line in series and sets a second resonant frequency as the second cutoff frequency. The third resonant circuit is connected to the signal line in parallel at a node where the first and second resonant circuits are connected, and sets a third resonant frequency as a band-pass center frequency between the first and second cutoff frequencies.

Abstract: A semiconductor device interconnecting unit for inputting/outputting a high-frequency signal having a millimeter wave band to/from a semiconductor device includes a part of a band pass filter and a remainder is provided. The part of a band pass filter is configured to pass therethrough the high-frequency signal having a millimeter wave band by using an LC resonance circuit. The part and the remainder are separated from each other by a capacitive portion, the part is provided inside the semiconductor device, and the remainder is provided outside the semiconductor device.

Abstract: An improved integrated LC resonator and methods for making and using the same are disclosed. The resonator includes (i) a first capacitor plate; (ii) an inductor over and in electrical communication with the first capacitor plate; and (iii) a second capacitor plate over and in electrical communication with the inductor. The method of making includes sequentially forming a first capacitor plate, a first dielectric layer thereon, a first via and an inductor, a second dielectric layer on the inductor, and a second via and a second capacitor plate. Each of the capacitor plates and the inductor are generally formed in different integrated circuit layers (for example, different metallization layers). Embodiments of the present invention can advantageously provide an integrated LC resonator tank having: (i) relatively high Q by reducing or minimizing parasitic effects; and (ii) relatively high shielding from the semiconductor substrate.

Abstract: A bandpass filter having a transmission coefficient—frequency spectrum characteristic curve with a notch on each side of the passband is disclosed.

Abstract: Inductor topologies for filters used in broadband applications are described. In one implementation, an apparatus, such as an interface module includes a printed circuit board and a filter. The filter includes a generally circular high Quality factor (Q) value spiral planar inductor etched directly into the printed circuit board. The generally circular high Q value spiral planar inductor is configured to operate in a broadband application. Other implementations involve the use of decoupling structures with respect to the planar inductors as well as a design methodology for the filters.

Abstract: One pair of resonant electrodes is formed in a loop shape or a spiral shape in a substrate stacking direction symmetrically to each other. This allows a longitudinal space in substrate to be reduced. A first capacitor having an electrode connected to the grounding conductor layer, an electrode connected to an open-end side of the resonant electrode, and a dielectric layer is provided. A second capacitor having an electrode connected to the grounding conductor layer, an electrode connected to an open-end side of the resonant electrode, and a dielectric layer is also provided. This results in having a desired characteristic even if a length of the resonant electrode is short.