Abstract: A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.

Abstract: A coil component comprising a core including a winding core having a shape extending in a constant direction, a first flange disposed at a first end in an extending direction of the winding core, and a second flange disposed at a second end in the extending direction of the winding core; first and second electrodes disposed on the first flange; third and fourth electrodes disposed on the second flange; and a coil including a first wire wound around the winding core and electrically connected to the first and third electrodes, and a second wire electrically connected to the second and fourth electrodes. The first and second flanges each have an inner surface facing the winding core, an outer surface facing toward the side opposite to the inner surface, a lower surface connecting the inner and outer surfaces, and an upper surface facing the side opposite to the lower surface.

Abstract: A coil component includes a body; a coil portion disposed inside the body; a noise removal portion disposed to contact a surface of the body; an insulating layer disposed inside the noise removal portion; first and second external electrodes each connected to the coil portion and disposed on the insulating layer to overlap the noise removal portion; and a third external electrode disposed to be spaced apart from the first and second external electrodes and contacting the noise removal portion.

Abstract: A common-mode choke coil is configured such that in one turn of a stranded portion, a number of times a first wire is disposed outside a second wire on a first side surface of a core is equal to a number of times the second wire is disposed outside the first wire on a second side surface that is opposite to the first side surface. Also, a number of times the first wire is disposed outside the second wire on a top surface of the core is equal to a number of times the second wire is disposed outside the first wire on a bottom surface that is opposite to the top surface.

Abstract: A coil component includes a support substrate including a through-hole disposed therein; a body including the support substrate embedded therein, and having a core disposed in the through-hole of the support substrate; a coil portion disposed on the support substrate, embedded in the body, and having a plurality of turns with reference to the core as an axis on the support substrate; and a shielding pattern disposed between an internal wall of the support substrate, by which the through-hole is defined, and the core.

Abstract: The present disclosure provides a radio frequency duplexer circuit and a radio frequency substrate. The radio frequency duplexer circuit includes a first terminal, a second terminal, a third terminal, a low-pass filter, and a high-pass filter. The low-pass filter includes N first filter sub-circuits coupled in series and a first tuning sub-circuit. Among the N first filter sub-circuits coupled in series, a first end of a 1st first filter sub-circuit is coupled to the first terminal, and a second end of a Nth first filter sub-circuit is coupled to the second terminal. The high-pass filter includes M second filter sub-circuits coupled in series and a second tuning sub-circuit. Among the M second filter sub-circuits coupled in series, a first end of a 1st second filter sub-circuit is coupled to the first terminal, and a second end of a Mth second filter sub-circuit is coupled to the third terminal.

Abstract: A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.

Abstract: A coil component includes a body and a coil conductor embedded in the body. The body includes a magnetic layer and a non-magnetic layer. The magnetic layer is formed of a composite material including a metal particle and a resin material, and the non-magnetic layer is arranged not to extend through a winding portion of the coil conductor or not to entirely extend through the body.

Abstract: A multiphase converter topology is used for the transmission of electrical energy from an AC voltage input with m grid phase connections to a DC voltage output or vice versa. It has a power part with half-bridges for switching currents, an AC voltage filter between the power part and the AC voltage input, and DC voltage block(s) connected between the power part and the DC output. The AC voltage filter has alternating voltage filter stage(s) with m+1 input connections, m+1 output connections and a ground connection. The m grid phase connections are thereby connected in parallel to one another and form a first phase connection for the connection of a single-phase AC voltage. A neutral conductor connection of the AC voltage filter forms a neutral conductor connection of the AC voltage input and a second phase connection for the connection of the single-phase AC voltage.

Abstract: A filter apparatus is disclosed. The filter apparatus may include a plurality of dielectric layers. The plurality of dielectric layers may include one or more first dielectric layers formed of a first dielectric material and one or more second dielectric layers formed of a second dielectric material. The second dielectric material of the one or more second dielectric layers being different than the first dielectric material of the one or more first dielectric layers. The filter apparatus may further include one or more thin-film metal layers arranged between at least one dielectric layer of the plurality of dielectric layers and an additional dielectric layer of the plurality of dielectric layers.

Abstract: A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.

Abstract: Provided is a filter capable of suppressing variation in characteristics. A filter has: a plurality of resonators each having a via electrode and a first strip line that is opposed to a first shielding conductor and connected to one end of the via electrode; a first coupling capacitive electrode that has a first comb-shaped electrode including a plurality of first electrodes and that is provided to the first resonator; and a second coupling capacitive electrode that is provided to the second resonator, that has a second comb-shaped electrode including a plurality of second electrodes, and that is formed on the same layer as that of the first coupling capacitive electrode, wherein the first and second electrodes are arranged so as to be adjacent to each other.

Abstract: A coil device having high bonding strength and bonding reliability has a core member including a winding core and a flange, wires wound around the winding core and one end being positioned at the flange, and terminal electrodes provided to the flange. Each of the terminal electrodes has a wire connecting part where one ends of the wires are connected, and a mounting part continuously formed with the wire connecting part at the side close to the winding core with respect to the wire connecting part along the axis direction of the winding core. The wire connecting part is provided at a position lower than the mounting part along the height direction of the flange.

Abstract: A coil component includes a body having a first surface and a second surface facing each other, and having a plurality of wall surfaces connecting the first surface to the second surface; an insulating substrate; a coil portion comprising a first lead-out pattern and a second lead-out pattern each covered with the body and disposed on the insulating substrate; a first external electrode and a second external electrode disposed on the first surface of the body and spaced apart from each other; a first connection electrode and a second connection electrode respectively extending from the first and second lead-out patterns to the first and second external electrodes; and a first support portion and a second support portion respectively extending from the coil portion to be exposed to one of the plurality of wall surfaces, and respectively disposed to be spaced apart from the first and second lead-out patterns.

Abstract: A multilayer electronic device may include a plurality of dielectric layers and a signal path having an input and an output. An inductor may include a conductive layer formed on one of the plurality of dielectric layers and may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The inductor may include an outer perimeter that includes a first straight edge facing outward in a first direction and a second straight edge parallel to the first straight edge and facing outward in the first direction. The second straight edge may be offset from the first straight edge by an offset distance that is less than about 500 microns and less than about 90% of a first width of the inductor in the first direction at the first straight edge.

Abstract: A coil component includes a body having one surface and the other surface opposing each other in one direction, and a plurality of walls each connecting the one surface to the other surface; a coil portion buried in the body, and having both ends exposing to one of the plurality of walls of the body; first and second external electrodes respectively including first and second terminal electrodes disposed on one surface of the body and spaced apart from each other, and first and second connection electrodes respectively connecting the first and second terminal electrodes to both ends of the coil portion; a first external insulating layer disposed on the other surface of the body; and a first shielding layer disposed on the external insulating layer.

Abstract: Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

Abstract: A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

Abstract: A power tool comprising: a conductive tube; a rear unit located at a rear end of the tube; a front unit located at a front end of the tube; a battery interface comprising a plurality of terminals, wherein the battery interface is located in the rear unit; a motor located in the front unit; at least one power line for supplying power from the rear unit to the front unit, wherein at least a portion of the power line is located within the tube; and an electromagnetic interference (EMI) suppressor for suppressing EMI from the at least one power line, the EMI suppressor comprising an electrical component electrically connecting the tube to a first terminal of the plurality of terminals.

Abstract: A multiphase converter topology is used for the transmission of electrical energy from an AC voltage input with m grid phase connections to a DC voltage output or vice versa. It has a power part with half-bridges for switching currents, an AC voltage filter between the power part and the AC voltage input, and DC voltage block(s) connected between the power part and the DC output. The AC voltage filter has alternating voltage filter stage(s) with m+1 input connections, m+1 output connections and a ground connection. The m grid phase connections are thereby connected in parallel to one another and form a first phase connection for the connection of a single-phase AC voltage. A neutral conductor connection of the AC voltage filter forms a neutral conductor connection of the AC voltage input and a second phase connection for the connection of the single-phase AC voltage.

Abstract: A coil electronic component includes a body having a first surface and a second surface, opposing each other, and a third surface connecting the first surface and the second surface to each other, an insulating substrate disposed inside the body, a coil portion disposed on the insulating substrate, a first lead-out portion extending from one end portion of the coil portion and having a first spaced portion and a second spaced portion separate from each other by a first slit, whereby the first and second spaced portions are respectively exposed to the first surface and the third surface of the body, and a second lead-out portion extending from the other end portion of the coil portion and having a third spaced portion and a fourth spaced portion separate from each other by a second slit, whereby the third and fourth spaced portions are respectively exposed to the second surface and a third surface of the body.

Abstract: A mounting structure of a multilayer ceramic capacitor includes a multilayer ceramic capacitor and a mounting substrate on which the multilayer ceramic capacitor is mounted. The multilayer ceramic capacitor includes a laminate including a plurality of dielectric layers and a plurality of internal electrodes alternately laminated, and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode provided on a surface of the laminate. The plurality of internal electrodes include a first internal electrode, a second internal electrode, and a third internal electrode. The first external electrode, the third external electrode, and the fourth external electrode are bonded to the mounting substrate, and current is not directly supplied from the mounting substrate to the second external electrode.

Abstract: In a multilayer filter, a first LC parallel resonance unit, a second LC parallel resonance unit, and an LC circuit unit are configured in an element body, in which the LC circuit unit is connected between the first LC parallel resonance unit and the second LC parallel resonance unit in a path between a first terminal electrode and a second terminal electrode, a conductor pattern constituting an inductor of the LC circuit unit is not disposed between a conductor pattern constituting a first inductor of the first LC parallel resonance unit and a conductor pattern constituting a second inductor of the second LC parallel resonance unit in the element body, and the first inductor of the first LC parallel resonance unit and the second inductor of the second LC parallel resonance unit are magnetically coupled.

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Abstract: An electronic device comprises a multilevel metallization structure over a semiconductor layer and including a first region, a second region, a pre-metal level on the semiconductor layer, and N metallization structure levels over the pre-metal level, N being greater than 3. The electronic device also comprises an isolation component in the first region, the isolation component including a first terminal and a second terminal in different respective metallization structure levels, as well as a conductive shield between the first region and the second region in the multilevel metallization structure, the conductive shield including interconnected metal lines and trench vias in the respective metallization structure levels that at least partially encircle the first region.

Abstract: The invention, which relates to a choke arrangement (1) for application in an EMC filter, has as its objective specifying a choke arrangement (1) that is mechanically robust and that enables improved insulation of the windings (4, 5). The objective is attained by disposing about the toroidal core (10) a two-part enclosure (15) and by disposing an insulation web (19) in the two-part enclosure (15).

Abstract: An LC resonator includes an external connection terminal, an inductor, a capacitor, and a via conductor pattern. The inductor winds around an axis orthogonal to a laminated direction. The capacitor is connected to the inductor. The via conductor pattern extends from the inductor in the laminated direction, and the inductor is connected to the external connection terminal with the via conductor pattern. The inductor includes a columnar conductor pattern extending in the X-axis direction. The area of the columnar conductor pattern in a plan view from the X-axis direction is greater than or equal to the area of the via conductor pattern in a plan view from the Z-axis direction.

Abstract: A wireless charging pad includes a ferrite plate, a coil disposed at the ferrite plate, and a resonance tank that includes a flat type capacitor. The flat type capacitor is configured to reduce an impedance of the coil.

Abstract: A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.

Abstract: Provided is a noise filter that can enhance noise removal performance with a simple configuration. A noise filter (10) includes a connector (20) that houses a terminal fitting (22) connected to an input/output wire (WH) in a state in which the input/output wire (WH) is lead out from the connector (20). The noise filter (10) includes a coil (40) that is connected to the input/output wire (WH), a capacitor (30) that is electrically connected to the coil (40), and a magnetic member (50). The noise filter (10) includes a case (60) that houses the capacitor (30), the coil (40), and the magnetic member (50), and a holding member (70) that holds the magnetic member (50) in a state in which the magnetic member (50) is positioned with respect to the coil (40).

Abstract: A coil component includes a first coil and a second coil that are magnetically coupled to each other. The coil component includes a multilayer body, first wiring patterns, second wiring patterns, and third wiring patterns. The first coil includes a portion in which the first wiring patterns and the third wiring patterns are electrically connected to each other by a first via conductor and a second via conductor through the first wiring patterns and the third wiring pattern to connect the wiring patterns in parallel. The second coil includes a portion in which the second wiring patterns and the third wiring patterns are electrically connected to each other by a third via conductor and a fourth via conductor through the second wiring patterns and the third wiring pattern to connect the wiring patterns in parallel.

Abstract: Provide is an LC resonant antenna including: an inductor layer provided with a coil-shaped inductor; and a capacitor layer provided with a capacitor and laminated on the inductor layer. The capacitor includes a plurality of electrode plates that are aligned with the inductor in a laminating direction of the inductor layer and the capacitor layer and that extend in a surface direction orthogonal to the laminating direction. The inductor is formed to have an axis of a coil center extending in a direction that coincides or substantially coincides with the laminating direction. The plurality of electrode plates each have a passage area that corresponds in the laminating direction to an internal area surrounded by the inductor and allows magnetic flux to pass therethrough.

Abstract: The present disclosure discloses an inductive device having electromagnetic radiation shielding mechanism. The inductive device includes an inductive unit and a shielding structure. The shielding structure forms at least one closed shape that encloses the inductive unit. The shielding structure has a width thereof and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value.

Abstract: The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended.

Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.

Abstract: A multilayer band pass filter includes first and second LC parallel resonators. The first and second LC parallel resonators include a first inductor and a second inductor, respectively. The first inductor includes a first line conductive pattern, a first via conductive pattern, and a second via conductive pattern. The first line conductive pattern extends in the X-axis direction on a first dielectric layer. The first via conductive pattern and second via conductive pattern extend from the first line conductive pattern toward a second dielectric layer. The second inductor includes a third via conductive pattern extending in the Z-axis direction.

Abstract: Embodiments provide a filtering device, to effectively simplify assembly and tuning processes. The filtering device includes: a housing, including an inner cavity; a resonant conductor, having a resonance function, and disposed inside the inner cavity; and a pressing element, having one end disposed on the housing and another end suspended, and facing a position of an open-circuit end of the resonant conductor. A distance between the pressing element and the resonant conductor is changeable when the pressing element is pressed or drawn to adjust a resonant frequency. The filtering device provided in various embodiments is applicable to a plurality of communications devices for selecting a signal frequency.

Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.

Abstract: A radio frequency filtering circuitry includes a first inductor, a second inductor, and a conductive loop. The first inductor receives a first current that induces a second current in the second inductor upon receiving the first current. The first inductor and/or the second inductor induce a third current in the conductive loop. The conductive loop adjusts the third current to reduce a first gain peak of an output signal to correlate to a second gain peak of the output signal.

Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.

Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.

Abstract: A multilayer band pass filter includes a first LC parallel resonator electrically connected to a first input/output terminal, a second LC parallel resonator electrically connected to a second input/output terminal, and a third LC parallel resonator is magnetically coupled to the first LC parallel resonator. The first LC parallel resonator includes a first inductor. The second LC parallel resonator includes a second inductor. The third LC parallel resonator is magnetically coupled to the second LC parallel resonator. A bypass connects the first inductor and the second inductor to each other.

Abstract: A multilayer LC filter includes a multilayer body in which dielectric layers are laminated, first linear conductive patterns, second linear conductive patterns, third linear conductive patterns, capacitor conductive patterns, ground conductive patterns, and via conductors. When the multilayer body is seen through in the direction in which the dielectric layers are laminated, the first linear conductive patterns and the third linear conductive patterns in a first inductor intersect with each other, and the first linear conductive patterns and the third linear conductive patterns in a second inductor intersect with each other.

Abstract: An electronic component includes a first terminal, a second terminal, a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode. The third capacitor electrode is connected to the first terminal. The first capacitor electrode defines a first capacitor along with the third capacitor electrode. The second capacitor electrode defines a second capacitor along with the third capacitor electrode. The second capacitor electrode is connected to the second terminal. A plurality of dielectric layers include a connection layer where a first portion of the first terminal and a second portion of the second terminal are disposed. An inductance of a path from the second capacitor electrode to the second portion is lower than an inductance of a path from the third capacitor electrode to the first portion.

Abstract: A variable-frequency LC filter (1A) includes a multilayer circuit board, a series arm capacitor (11) formed in the multilayer circuit board and disposed in a series arm path that connects an input electrode to an output electrode, and a parallel arm inductor (21) formed in the multilayer circuit board and disposed in a parallel arm path that connects a ground electrode to a node (N1) in the series arm path. When the multilayer circuit board is viewed in plan, of the series arm capacitor (11) and the parallel arm inductor (21), only the parallel arm inductor (21) overlaps with the ground electrode.

Abstract: An inductor has a conductor layer formed by multiple concentric co-planar turns of a first metal layer (e.g., ultra-thick metal (UTM)) adapted to receive current at a frequency of at least one gigahertz. The multiple turns of the first metal layer proceed from an innermost turn to an outermost turn, and a stacking layer of a second metal is provided over each of the first metal layer turns except at least the innermost turn, thereby optimizing the Q of the inductor.

Abstract: A multilayer body includes a first inductor and a second inductor provided in a first planar region, and a third inductor and a fourth inductor provided in a second planar region when viewed in a lamination direction of dielectric layers of the multilayer body. When the multilayer body is viewed in a direction perpendicular or substantially perpendicular to the lamination direction of the dielectric layers, the first inductor and the fourth inductor are provided in a first thickness region, and the second inductor and the third inductor are provided in a second thickness region.

Abstract: A multilayer LC filter includes one via conductor on a second edge side and two via conductors on a fourth edge side that are connected to line-shaped conductor patterns of a first inductor, and two via conductors on the second edge side and one via conductor on the fourth edge side that are connected to line-shaped conductor patterns of a second inductor, and the third to fifth inductors also have this same relationship.