Having Significant Physical Structure Patents (Class 333/185)
  • Patent number: 11329545
    Abstract: The invention, which relates to a choke arrangement (1) for application in an EMC filter, has as its objective specifying a choke arrangement (1) that is mechanically robust and that enables improved insulation of the windings (4, 5). The objective is attained by disposing about the toroidal core (10) a two-part enclosure (15) and by disposing an insulation web (19) in the two-part enclosure (15).
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: May 10, 2022
    Assignee: Hanon Systems
    Inventors: Stephan Werker, Stefan Tydecks
  • Patent number: 11315726
    Abstract: An LC resonator includes an external connection terminal, an inductor, a capacitor, and a via conductor pattern. The inductor winds around an axis orthogonal to a laminated direction. The capacitor is connected to the inductor. The via conductor pattern extends from the inductor in the laminated direction, and the inductor is connected to the external connection terminal with the via conductor pattern. The inductor includes a columnar conductor pattern extending in the X-axis direction. The area of the columnar conductor pattern in a plan view from the X-axis direction is greater than or equal to the area of the via conductor pattern in a plan view from the Z-axis direction.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: April 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Masuda
  • Patent number: 11303153
    Abstract: A wireless charging pad includes a ferrite plate, a coil disposed at the ferrite plate, and a resonance tank that includes a flat type capacitor. The flat type capacitor is configured to reduce an impedance of the coil.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 12, 2022
    Assignee: LG Electronics Inc.
    Inventors: Jongseok Baek, Byunghyuk Lee, Yongnam Cho, Yonghwan Shin, Bohwan Choi
  • Patent number: 11303261
    Abstract: A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: April 12, 2022
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Tomoyuki Shirasaki, Hironori Nomura, Noriko Kanou, Susumu Maniwa, Jun Onohara
  • Patent number: 11264965
    Abstract: Provided is a noise filter that can enhance noise removal performance with a simple configuration. A noise filter (10) includes a connector (20) that houses a terminal fitting (22) connected to an input/output wire (WH) in a state in which the input/output wire (WH) is lead out from the connector (20). The noise filter (10) includes a coil (40) that is connected to the input/output wire (WH), a capacitor (30) that is electrically connected to the coil (40), and a magnetic member (50). The noise filter (10) includes a case (60) that houses the capacitor (30), the coil (40), and the magnetic member (50), and a holding member (70) that holds the magnetic member (50) in a state in which the magnetic member (50) is positioned with respect to the coil (40).
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: March 1, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takeshi Aizawa, Asato Hibino
  • Patent number: 11264162
    Abstract: A coil component includes a first coil and a second coil that are magnetically coupled to each other. The coil component includes a multilayer body, first wiring patterns, second wiring patterns, and third wiring patterns. The first coil includes a portion in which the first wiring patterns and the third wiring patterns are electrically connected to each other by a first via conductor and a second via conductor through the first wiring patterns and the third wiring pattern to connect the wiring patterns in parallel. The second coil includes a portion in which the second wiring patterns and the third wiring patterns are electrically connected to each other by a third via conductor and a fourth via conductor through the second wiring patterns and the third wiring pattern to connect the wiring patterns in parallel.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: March 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Toujo
  • Patent number: 11258160
    Abstract: Provide is an LC resonant antenna including: an inductor layer provided with a coil-shaped inductor; and a capacitor layer provided with a capacitor and laminated on the inductor layer. The capacitor includes a plurality of electrode plates that are aligned with the inductor in a laminating direction of the inductor layer and the capacitor layer and that extend in a surface direction orthogonal to the laminating direction. The inductor is formed to have an axis of a coil center extending in a direction that coincides or substantially coincides with the laminating direction. The plurality of electrode plates each have a passage area that corresponds in the laminating direction to an internal area surrounded by the inductor and allows magnetic flux to pass therethrough.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 22, 2022
    Assignee: SK-Electronics Co., Ltd.
    Inventors: Hideki Kobayashi, Kiyoshi Ohshima
  • Patent number: 11239025
    Abstract: The present disclosure discloses an inductive device having electromagnetic radiation shielding mechanism. The inductive device includes an inductive unit and a shielding structure. The shielding structure forms at least one closed shape that encloses the inductive unit. The shielding structure has a width thereof and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 1, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 11171454
    Abstract: The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: November 9, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tongjie Li, Ke Ai, Bei Fu
  • Patent number: 11114994
    Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 7, 2021
    Assignee: AVX Corporation
    Inventors: Kwang Choi, Marianne Berolini
  • Patent number: 11108368
    Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: August 31, 2021
    Assignee: AVX Corporation
    Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
  • Patent number: 11070187
    Abstract: A multilayer band pass filter includes first and second LC parallel resonators. The first and second LC parallel resonators include a first inductor and a second inductor, respectively. The first inductor includes a first line conductive pattern, a first via conductive pattern, and a second via conductive pattern. The first line conductive pattern extends in the X-axis direction on a first dielectric layer. The first via conductive pattern and second via conductive pattern extend from the first line conductive pattern toward a second dielectric layer. The second inductor includes a third via conductive pattern extending in the Z-axis direction.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: July 20, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Mitsutoshi Imamura
  • Patent number: 11043724
    Abstract: Embodiments provide a filtering device, to effectively simplify assembly and tuning processes. The filtering device includes: a housing, including an inner cavity; a resonant conductor, having a resonance function, and disposed inside the inner cavity; and a pressing element, having one end disposed on the housing and another end suspended, and facing a position of an open-circuit end of the resonant conductor. A distance between the pressing element and the resonant conductor is changeable when the pressing element is pressed or drawn to adjust a resonant frequency. The filtering device provided in various embodiments is applicable to a plurality of communications devices for selecting a signal frequency.
    Type: Grant
    Filed: June 9, 2019
    Date of Patent: June 22, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Liangyong Deng, Dantao Cai
  • Patent number: 10998129
    Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Ishima, Shinichi Kondo, Shunji Aoki, Yasushi Matsuyama, Yusuke Onezawa, Hajime Azuma
  • Patent number: 10985724
    Abstract: A radio frequency filtering circuitry includes a first inductor, a second inductor, and a conductive loop. The first inductor receives a first current that induces a second current in the second inductor upon receiving the first current. The first inductor and/or the second inductor induce a third current in the conductive loop. The conductive loop adjusts the third current to reduce a first gain peak of an output signal to correlate to a second gain peak of the output signal.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: April 20, 2021
    Assignee: Apple Inc.
    Inventors: Hongrui Wang, Sohrab Emami-Neyestanak, Saihua Lin
  • Patent number: 10971821
    Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: April 6, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Hee Choi, Sang Jong Lee
  • Patent number: 10958232
    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 23, 2021
    Assignee: TDK CORPORATION
    Inventors: Eiko Wakata, Kenichi Yoshida
  • Patent number: 10944375
    Abstract: A multilayer band pass filter includes a first LC parallel resonator electrically connected to a first input/output terminal, a second LC parallel resonator electrically connected to a second input/output terminal, and a third LC parallel resonator is magnetically coupled to the first LC parallel resonator. The first LC parallel resonator includes a first inductor. The second LC parallel resonator includes a second inductor. The third LC parallel resonator is magnetically coupled to the second LC parallel resonator. A bypass connects the first inductor and the second inductor to each other.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: March 9, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Mitsutoshi Imamura
  • Patent number: 10917063
    Abstract: A multilayer LC filter includes a multilayer body in which dielectric layers are laminated, first linear conductive patterns, second linear conductive patterns, third linear conductive patterns, capacitor conductive patterns, ground conductive patterns, and via conductors. When the multilayer body is seen through in the direction in which the dielectric layers are laminated, the first linear conductive patterns and the third linear conductive patterns in a first inductor intersect with each other, and the first linear conductive patterns and the third linear conductive patterns in a second inductor intersect with each other.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: February 9, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akihito Oishi
  • Patent number: 10911014
    Abstract: An electronic component includes a first terminal, a second terminal, a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode. The third capacitor electrode is connected to the first terminal. The first capacitor electrode defines a first capacitor along with the third capacitor electrode. The second capacitor electrode defines a second capacitor along with the third capacitor electrode. The second capacitor electrode is connected to the second terminal. A plurality of dielectric layers include a connection layer where a first portion of the first terminal and a second portion of the second terminal are disposed. An inductance of a path from the second capacitor electrode to the second portion is lower than an inductance of a path from the third capacitor electrode to the first portion.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: February 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tetsuo Taniguchi, Kiyohiro Kashiuchi
  • Patent number: 10873309
    Abstract: A variable-frequency LC filter (1A) includes a multilayer circuit board, a series arm capacitor (11) formed in the multilayer circuit board and disposed in a series arm path that connects an input electrode to an output electrode, and a parallel arm inductor (21) formed in the multilayer circuit board and disposed in a parallel arm path that connects a ground electrode to a node (N1) in the series arm path. When the multilayer circuit board is viewed in plan, of the series arm capacitor (11) and the parallel arm inductor (21), only the parallel arm inductor (21) overlaps with the ground electrode.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 22, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hirotsugu Mori
  • Patent number: 10854372
    Abstract: An inductor has a conductor layer formed by multiple concentric co-planar turns of a first metal layer (e.g., ultra-thick metal (UTM)) adapted to receive current at a frequency of at least one gigahertz. The multiple turns of the first metal layer proceed from an innermost turn to an outermost turn, and a stacking layer of a second metal is provided over each of the first metal layer turns except at least the innermost turn, thereby optimizing the Q of the inductor.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: December 1, 2020
    Assignee: Intel IP Corporation
    Inventors: Chi-Taou Robert Tsai, Lillian G. Lent, Curtiss D. Roberts, Cindy Muir
  • Patent number: 10848120
    Abstract: A multilayer body includes a first inductor and a second inductor provided in a first planar region, and a third inductor and a fourth inductor provided in a second planar region when viewed in a lamination direction of dielectric layers of the multilayer body. When the multilayer body is viewed in a direction perpendicular or substantially perpendicular to the lamination direction of the dielectric layers, the first inductor and the fourth inductor are provided in a first thickness region, and the second inductor and the third inductor are provided in a second thickness region.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: November 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Masuda
  • Patent number: 10840871
    Abstract: A multilayer LC filter includes one via conductor on a second edge side and two via conductors on a fourth edge side that are connected to line-shaped conductor patterns of a first inductor, and two via conductors on the second edge side and one via conductor on the fourth edge side that are connected to line-shaped conductor patterns of a second inductor, and the third to fifth inductors also have this same relationship.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 17, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akihito Oishi
  • Patent number: 10797741
    Abstract: A radio frequency module includes a first receive circuit that processes a receive signal in the first frequency band. The first receive circuit includes a first substrate, a first low noise amplifier, and a first filter circuit. The first low noise amplifier is mounted on a principal surface of the first substrate. The first filter circuit is connected to an output end of the first low noise amplifier. At least a portion of the first filter circuit is provided on the principal surface of the first substrate. The first filter circuit attenuates spurious components occurring due to a transmit signal in the first frequency band received by the first low noise amplifier. The spurious components are included in the transmit signal in the first frequency band and have a frequency bandwidth that overlaps, includes, or is included in the frequency bandwidth of the receive signal in the second frequency band.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: October 6, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Naniwa, Hideki Muto
  • Patent number: 10726999
    Abstract: A composite electronic component includes a body including a capacitor unit and an inductor unit and having a plurality of insulating layers stacked in a first direction perpendicular to a mounting surface of the body. A plurality of external electrodes are on external surfaces of the body. The capacitor unit includes first and second internal electrodes alternately stacked with insulating layers interposed therebetween. The inductor unit includes a coil including coil patterns having a spiral shape, on respective insulating layers, and connected together.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Han Kim, Seung Hee Hong, Min Ki Jung, Su Bong Jang
  • Patent number: 10704987
    Abstract: A smart mechanical component has a mechanical part main body; a mechanical part secondary body located inside of the mechanical part main body; a three dimensional three-dimensional (3-D) reserved space located between the mechanical part main body and the mechanical part secondary body; at least one connecting unit connecting the mechanical part main body and the mechanical part secondary body; wherein the mechanical part main body, the mechanical part secondary body and the three dimensional three-dimensional (3-D) reserved space form a capacitor; the connecting unit forms an inductor; the inductor and the capacitor forms an inductor-capacitor circuit.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: July 7, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sung-Yueh Wu, De-Yau Lin, An-Li Chen, Ching-Chih Lin, Chuan-Sheng Chuang, Wei-Chin Huang
  • Patent number: 10701823
    Abstract: An enclosure for electronics includes a base, a base cover, a gasket, and an enclosure cover. The base receives one or more electronic elements. The base cover is mounted over the first base to secure the electronic elements within the base and form a unit having a groove in at least a part of the periphery of the unit. The gasket resides within the groove of the first unit. The enclosure cover is mounted over the first unit and the gasket and applies a compressive force to the gasket such that the gasket (i) forms a seal for the enclosure and (ii) applies force that secures at least a part of the periphery of the first base cover to at least a part of the periphery of the first base. In a single-unit assembly, the enclosure cover is an assembly cover that attaches to the unit. In a dual-unit assembly, each unit functions as the enclosure cover for the other unit in a clam-shell configuration.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 30, 2020
    Assignee: Nokia Shanghai Bell Co., Ltd.
    Inventor: Jari Taskila
  • Patent number: 10693432
    Abstract: A three-dimensional (3D) solenoid structure includes a first inductor portion having a first surface and a second surface opposite the first surface. The 3D solenoid structure further includes a first capacitor portion, a first inductor pillar, at least one capacitor pillar, a second inductor portion, a second inductor pillar and a first inductor bonding interface. The first inductor pillar is coupled to the first surface of the first inductor portion. The capacitor pillar(s) is coupled to the first capacitor portion. The second inductor portion includes a first surface and a second surface opposite the first surface. The second inductor pillar is coupled to the first surface of the second inductor portion. The first inductor bonding interface, between the first inductor pillar and the second inductor pillar, couples together the first inductor portion and the second inductor portion.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: June 23, 2020
    Assignee: QUALCOMMM Incorporated
    Inventors: Nosun Park, Changhan Hobie Yun, Jonghae Kim, Niranjan Sunil Mudakatte, Xiaoju Yu, Wei-Chuan Chen
  • Patent number: 10653000
    Abstract: An electrical connector assembly includes a circuit board; a first connector which includes a first insulating body and a first terminal group, where the first terminal group is provided on the first insulating body along a longitudinal direction, the first terminal group includes multiple first signal terminals and at least one first power terminal, and the first power terminal is closer to one of two edges of the first connector along the longitudinal direction than the first signal terminal; a chip provided on the circuit board and electrically connected to the first signal terminals; and a filter provided on the circuit board and electrically connected to the first power terminal. The filter is arranged right behind the first power terminal. The chip is provided right behind the first signal terminals.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: May 12, 2020
    Assignee: LINTES TECHNOLOGY CO., LTD
    Inventors: Wei Zen Lo, Shih Chi Kuan
  • Patent number: 10650958
    Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: May 12, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Hui Jo, Han Lee, Mi Sun Hwang, Jeong Min Cho, Myung Sam Kang, Seok Hwan Ahn, Tae Hoon Kim
  • Patent number: 10643985
    Abstract: An integrated circuit (IC) includes a capacitor array in at least one first back-end-of-line (BEOL) interconnect level. The capacitor array includes a pair of capacitor manifolds coupled to parallel capacitor routing traces and capacitors coupled between each pair of parallel capacitor routing traces. The IC also includes an inductor trace having at least one turn in at least one second BEOL interconnect level. The inductor trace defines a perimeter to overlap at least a portion of the capacitor array.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: May 5, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Zhang Jin
  • Patent number: 10614942
    Abstract: Aspects of the present disclosure provide three-dimensional (3D) through-glass-via (TGV) inductors for use in electronic devices. In some embodiments, a first portion of a 3D TGV inductor may be formed in a first wafer and a second portion of a 3D TGV may be formed in a second wafer. The first portion and second portion may be bonded together in a bonded wafer device thereby forming a larger inductor occupying relatively little wafer space on the first and the second wafers.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 7, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Mario Francisco Velez, Nosun Park, Wei-Chuan Chen, Niranjan Sunil Mudakatte, Xiaoju Yu, Paragkumar Ajaybhai Thadesar, Jonghae Kim
  • Patent number: 10600571
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with the respective dielectric layers disposed therebetween, and first and second external electrodes disposed on first and second external surfaces of the ceramic body to be connected to corresponding internal electrodes, respectively. A longest distance from the first external electrode to the second external electrode is denoted by La, a shortest distance from the first external electrode to the second external electrode is denoted by Lb, and Lb/La is greater than zero to 0.6 or less.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hee Moon, Chae Min Park, Ji Hea Kim, Ki Won Kim, Han Eol Cho, Yu Bi Han
  • Patent number: 10601390
    Abstract: A small-sized balance filter includes an unbalanced terminal and two pairs of balanced terminals and has a low signal insertion loss. An unbalanced terminal, a first balanced terminal including first and second terminals, and a second balanced terminal Rx including first and second terminals are provided. An unbalanced-side inductor is provided between the unbalanced terminal and the ground, first balanced-side inductors are provided between the first and second terminals of the first balanced terminal, second balanced-side inductors are provided between the first and second terminals of the second balanced terminal, and the unbalanced-side inductor is electromagnetic-field-coupled to each of the first and second balanced-side inductors.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: March 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10594287
    Abstract: A noise filter (A) includes a case (10) and capacitors (20) accommodated in the case (10). Substantially flat surfaces of the capacitors (20) serve as ground-side electrodes (23). A ground terminal (17) is connected directly to the ground-side electrodes (23), and input/output terminals (15) are connected to input/output-side electrodes (21) of the capacitors (20). A routing space for leads for connecting the capacitors (20) and the ground terminal (17) is not necessary in the case (10). Therefore, the case (10) can be miniaturized.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: March 17, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takeshi Aizawa, Yoshito Sakai
  • Patent number: 10566945
    Abstract: The present invention provides a noise suppression device and equivalent circuit thereof. The noise suppression device comprises a metal plate and at least one first resonance unit. The first resonance unit comprises a plurality of first resonators. Each of the first resonators comprises a first metal segment and at least one first conductive connection segment, the first metal segment is connected to the first conductive connection segment. When the first resonance unit is configured on the metal plate, each of the first metal segments is electrically connected to the metal plate by the corresponding first conductive connection segment. When the resonance of the first resonator occurs, a noise transmitted on the metal plate can be conducted to the first resonator and suppressed by the first resonator.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: February 18, 2020
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Ying-Cheng Tseng
  • Patent number: 10566947
    Abstract: A filter for both a differential mode and a common mode is provided. A filter for both a differential mode and a common mode according to an embodiment of the present invention comprises: a pair of series inductors having a plurality of coil patterns; two pairs of parallel capacitors connected to opposite ends of the pair of inductors, respectively; and a pair of series capacitors connected to the pair of inductors in parallel. Therefore, the filter can be used in both a common mode and a differential mode, and can remove noise without using an additional filter in an application having a comparatively high data processing speed.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: February 18, 2020
    Assignee: AMOTECH CO., LTD.
    Inventors: Jong Soo Kim, Jae Su Ryu, Yoon Ho Hwang
  • Patent number: 10560066
    Abstract: An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: February 11, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Kosuke Ishida
  • Patent number: 10542622
    Abstract: A printed wiring board of the present disclosure includes a power supply layer and a ground layer. A power supply layer pattern to be formed partially on the power supply layer includes a branch and a power supply layer electrode. The branch is a direct-current power feeding path for connecting adjacent electromagnetic band gap (EBG) unit cells, and the power supply layer electrode is connected through a slit provided along the branch. A capacitive coupling element disposed to oppose the power supply layer electrode with an interlayer being provided therebetween has a structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being connected to the branch in the power supply layer pattern through a via.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: January 21, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Xingxiaoyu Lin, Toshiyuki Kaneko, Masanori Naito, Toshihisa Uehara
  • Patent number: 10530322
    Abstract: A resonant circuit includes a first inductor and a first capacitor which define a first series circuit and a second inductor connected in parallel to the first series circuit. The first inductor and the second inductor are coupled via a magnetic field in a direction in which magnetic fluxes passing through the inductor and the second inductor strengthen each other to effectively increase steepness in a transient band.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: January 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Nishida, Kenichi Ishizuka
  • Patent number: 10515750
    Abstract: A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region. A distance between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance between adjacent patterns of the coil pattern.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 10498307
    Abstract: An integrated device that includes a substrate, a first interconnect over the substrate and a second interconnect comprising a first portion and a second portion. The integrated device further comprising a first dielectric layer between the first interconnect and the first portion of the second interconnect such that the first interconnect vertically overlaps with the first dielectric layer and the first portion of the second interconnect. The integrated device also includes a second dielectric layer formed over the substrate. The first interconnect, the first dielectric layer and the first portion of the second interconnect are configured to operate as a capacitor. The first portion and the second portion of the second interconnect are configured to operate as an inductor.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: December 3, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy, Shiqun Gu, Chengjie Zuo
  • Patent number: 10461716
    Abstract: A low-pass filter includes first and second input/output ports, first and second LC parallel resonators connected in series and provided between the first and second input/output ports, and first to third paths. The first path includes a first LC series resonator and connects a first end of the first LC parallel resonator closest to the first input/output port to a ground. The second path includes a second LC series resonator and connects a second end of the second LC parallel resonator closest to the second input/output port to the ground. The third path includes a third-path capacitor and connects a connection point between the first and second LC parallel resonators to the ground.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 29, 2019
    Assignee: TDK CORPORATION
    Inventors: Manabu Kitami, Noriyuki Hirabayashi
  • Patent number: 10454445
    Abstract: A common mode filter includes: a body including a filter portion; first and second external electrodes each including an electrode layer including conductive particles, intermetallic compound (IMC) formation particles, and a resin, and disposed on an external surface of the body; and first and second coils disposed in the filter portion, the first and second coils being connected through lead portions to the electrode layers of the first and second external electrodes, respectively. The conductive particles include a first conductive particle and a second conductive particle having a diameter smaller than that of the first conductive particle.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon Lee, Bon Seok Koo, Kun Hoi Koo, Sung Ryong Ma, Sung Jin Park, Ha Yoon Song
  • Patent number: 10454444
    Abstract: An analog time delay filter circuit including a first delay circuit block arranged in a modular layout, having a first time delay filter, a first input, a first output, and first and second pass-throughs; and a second delay circuit block arranged in the same modular layout, having a second time delay filter, a second input, a second output, and third and fourth pass-throughs.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: October 22, 2019
    Assignee: Kumu Networks, Inc.
    Inventors: Wilhelm Steffen Hahn, Alfred Riddle, Ernie Landi
  • Patent number: 10439584
    Abstract: A common mode noise filter includes a laminated body having insulator layers therein and first and second spiral conductors provided on layer planes different from each other. The first spiral conductor includes a first spiral conductor line, a first pad provided at an outer end of the first spiral conductor line, and a second pad provided at an inner end of the first spiral conductor line. The second spiral conductor includes a second spiral conductor line, a third pad provided at an outer end of the second spiral conductor line, and a fourth pad provided at an inner end of the second spiral conductor line. The first spiral conductor line faces the second spiral conductor line. Each of the second pad and the sixth pad overlaps none of the fourth pad and the eighth pad viewing from above.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: October 8, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshiharu Oomori, Atsushi Shinkai, Masakatsu Nawate
  • Patent number: 10424866
    Abstract: A waterproof connector includes a base and a guiding seat. The base includes a seat. The seat includes a bottom plate and a guiding sleeve is connected to the bottom plate. A first waterproof sealing ring is disposed in the connection of the guiding sleeve and the bottom plate. A conductive member is disposed within the guiding sleeve. The conductive member extends through a first fixing seat. A second waterproof sealing ring allows the conductive member to extends therethrough and overlaps the first fixing seat. The second waterproof sealing ring has two grooves formed on two surfaces thereof. The conductive member extends through a second fixing seat, and the second fixing seat overlaps the second waterproof sealing ring. Finally the guiding seat is connected to the guiding sleeve. The guiding seat has a through groove, and the first waterproof sealing ring is sandwiched between an inner surface of the through groove and the outer surface of the guiding groove for the first waterproof element.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: September 24, 2019
    Assignee: F TIME TECHNOLOGY INDUSTRIAL CO., LTD.
    Inventors: Chang-Lin Peng, Xin-Fu Liu, Yen-Hua Huang, Chih-Hsuan Tung
  • Patent number: 10388452
    Abstract: Disclosed herein is a coil component that includes a coil conductor part, and first and second high permeability parts provided respectively on both sides of the coil conductor part in a coil axis direction. The second high permeability part has a larger thickness in the coil axis direction than the first high permeability part. A low permeability part that segments at least a part of a magnetic path exists between the first and second high permeability parts in an outer diameter area of the coil conductor part when viewed in the coil axis direction.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: August 20, 2019
    Assignee: TDK CORPORATION
    Inventors: Toshio Tomonari, Sachiko Takano, Shigeki Sato
  • Patent number: 10354791
    Abstract: An electronic component includes a multilayer body, a primary coil including an n-number primary coil conductor layers and one series coil conductor layer, a secondary coil including an n-number secondary coil conductor layers, and a tertiary coil including an n-number tertiary coil conductor layers. The arrangement includes one primary coil conductor layer, one secondary coil conductor layer, and one tertiary coil conductor layer in this order from a first side to a second side of a laminating direction. The series coil conductor layer is electrically connected in series to the n-number primary coil conductor layers and is provided at the second side of the laminating direction with respect to the tertiary coil conductor layer closest to the second side of the laminating direction.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: July 16, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Katsufumi Sasaki