Abstract: A thin antenna includes an antenna element, a first spacer, a second spacer, a first ground plane and a second ground plane. The antenna element is formed in a column shape, and has a top surface and a bottom surface facing each other. The first and second spacers are made of an insulating material. The first ground plane is formed larger than the top surface of the antenna element. The second ground plane is formed larger than the bottom surface of the antenna element. The first ground plane is disposed to face the top surface of the antenna element via the first spacer. The second ground plane is disposed to face the bottom surface of the antenna element via the second spacer. A power is fed at one of the top surface and the bottom surface of the antenna element.

Abstract: A piezoelectric vibrator is a piezoelectric vibrator including a vibration portion. The vibration portion has an n-type Si layer which is a degenerated semiconductor and which has a resistivity of not less than 0.5 m?cm and not greater than 1.2 m?cm and preferably not greater than 0.9 m?cm.

Abstract: An optical filter system, preferably including an optical input, one or more sets of filters, and/or a control module. A method for optical filter operation, preferably including operating an optical filter system in a normal mode, assessing filter alignment, and/or shifting filter assignments.

Abstract: Provided is a method for manufacturing a wireless power-transmitting device including a power-transmitter having a transmission coil, and a power-receiver having a reception coil.

Abstract: The invention relates to an improved high-frequency filter having at least one coaxial resonator is characterized by, among other things, the following features: the coaxial resonator comprises an outer conductor housing (1), an outer conductor (1?) thus being formed; an inner conductor (3) is arranged in the outer conductor housing (1), which inner conductor is mechanically and galvanically connected to the outer conductor housing at one end of the inner conductor and ends in the direction of the outer conductor housing (1) or a housing cover (7) provided there that belongs to the outer conductor housing (1) at the opposite end of the inner conductor; the outer conductor housing (1) and the inner conductor (3) are made of electrically conductive material or are covered with an electrically conductive material; the end face (3a) of the inner conductor (3) and/or the additional surface (23) of the inner conductor (3) adjacent thereto is completely or partially covered with an encasing material (21), which enca

Abstract: The present invention relates to a band stop filter comprising: a resonating bar; a housing on the inside of which is formed a receiving space where the resonating bar is positioned, and which is made in a stepped form such that at least one part of an upper-end part is narrower than a lower-end part in terms of the internal width of the receiving space during the formation of the receiving space; a lower cover which has the resonating bar fitted thereto, is joined to the lower part of the housing and, when so joined, is assembled such that the resonating bar is inserted into the receiving space, and which forms the floor surface of the receiving space; and a hermetic-sealing cover which is provided within a recess pre-made in the housing in such a way as to couple with a resonator formed by the receiving space and the resonating bar on the inside of the receiving space, and is designed to hermetically seal the recess in the housing where a transmission line has been provided.

Abstract: A waveguide busbar for converting a plurality of high-frequency input signals into high-frequency output signals, includes a waveguide, a plurality of input ports, which are arranged along the waveguide, such that each input port is intended to receive a high-frequency input signal, an output port on the waveguide for delivering the high-frequency output signal and at least one parallel resonator, which is connected to the waveguide busbar between two input ports. The parallel resonator has a mechanically adjustable volume with which a phase relation of the waveguide is adjustable between the two input ports.

Abstract: A filter of longitudinal axis Z includes: at least one resonant cavity delimited by walls made of a material that has a non-zero expansion coefficient; a dielectric resonator mounted in the cavity transversally to the axis Z; a mechanical device for compensating at least one resonance frequency of the cavity as a function of the temperature. The compensation device comprises: at least one rotationally mobile finger for each mode and for each cavity, the mobile finger penetrating to a fixed depth into the cavity via a pivot link, and an external mechanical actuator mounted parallel to the axis Z and mechanically coupled to the mobile finger, the external mechanical actuator being made of a material that has a coefficient of thermal expansion at least five times lower than that of the walls of the filter.

Abstract: A method of manufacturing a MEMS resonator formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator. The method includes the steps of forming the resonator from the first material; applying the second material to the resonator; and controlling the quantity of the second material applied to the resonator by the geometry of the resonator.

Abstract: Embodiments relate to a force arrangement (50, 60) adapted to be mounted on a surface of a radio frequency filter that comprises a housing and a filter part extending along a first axis (A), the filter part being connected to a first side of the housing arranged perpendicular to the first axis (A) in a connection, the connection forming a contact seam between the filter part and the first side of the housing, wherein the force arrangement (50, 60) comprises a first spring part (56, 62) that is arranged, when mounted against the first side of the housing, to provide a first force in a first direction along the first axis (A) being opposite a direction of a stress force on the contact seam generated along the first axis (A) due to expansion of the housing (20) along the first axis (A) in the opposite direction of the provided force.

Abstract: A compact thermoelastic actuator includes at least two identical force pieces and a securing piece, the securing piece having a coefficient of thermal expansion less than the coefficient of thermal expansion of the force pieces. The force pieces are mounted head-to-tail one beside the other parallel to a longitudinal axis Y and are linearly offset relative to one another, along the longitudinal axis Y. The securing piece has two ends respectively linked to external ends of each force piece and internal ends of each force piece are positioned under a median region of the securing piece. The actuator and device is applicable to waveguides of multiplexers incorporated in space equipment for satellites.

Abstract: A cavity filter has a resonator. The resonator is engaged by a rod having a mounting portion and a thermal dissipation portion. The mounting portion of the rod extends through the floor of the cavity filter to engage an internal surface of the resonator. The thermal dissipation portion dissipates heat from the resonator to the outside of the cavity filter.

Abstract: The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.

Abstract: The invention relates to a micromechanical device comprising a semiconductor element capable of deflecting or resonating and comprising at least two regions having different material properties and drive or sense means functionally coupled to said semiconductor element. According to the invention, at least one of said regions comprises one or more n-type doping agents, and the relative volumes, doping concentrations, doping agents and/or crystal orientations of the regions being configured so that the temperature sensitivities of the generalized stiffness are opposite in sign at least at one temperature for the regions, and the overall temperature drift of the generalized stiffness of the semiconductor element is 50 ppm or less on a temperature range of 100° C. The device can be a resonator. Also a method of designing the device is disclosed.

Abstract: The present invention relates to a flexible cap system optimized for thermally-compensated technology microwave resonators. More specifically, this invention proposes a multiple-membrane flexible wall system for thermally-compensated filters and OMUX. The use of a multi-membrane flexible wall, in particular as sealing cap for a resonant cavity of an OMUX channel, makes it possible: to reduce the thermal resistance of the flexible wall, while maintaining an equivalent level of mechanical stresses exerted on said wall for a given displacement; or to reduce the mechanical stresses exerted on the flexible wall for a given displacement, while maintaining one and the same thermal resistance for said wall; or to increase the deformation of the flexible wall by maintaining an equivalent level of mechanical stresses and by maintaining an equivalent thermal resistance.

Abstract: A (TM01) dielectric resonator has a metal housing, a dielectric insert, and a resilient element located between one end of the dielectric insert and the housing. The resilient element ensures physical contact between the housing and both ends of the dielectric insert over the entire operating temperature range of the resonator, thereby compensating for differences in the coefficients of thermal expansion of the materials used for the metal housing and the dielectric insert. In one embodiment, the dielectric insert is housed within a cylindrical tube between a top cover and a bottom end cap, the resilient element is an electrically non-conductive (silicone rubber) gasket, and the resonator has a thin, electrically conductive (aluminum) plate located (i) between the dielectric insert and the gasket and (ii) between the end cap and the tube to ensure a contiguous electrically conductive path from one end of the dielectric insert to the other.

Abstract: The invention relates to a micromechanical device comprising a semiconductor element capable of deflecting or resonating and comprising at least two regions having different material properties and drive or sense means functionally coupled to said semiconductor element. According to the invention, at least one of said regions comprises one or more n-type doping agents, and the relative volumes, doping concentrations, doping agents and/or crystal orientations of the regions being configured so that the temperature sensitivities of the generalized stiffness are opposite in sign at least at one temperature for the regions, and the overall temperature drift of the generalized stiffness of the semiconductor element is 50 ppm or less on a temperature range of 100° C. The device can be a resonator. Also a method of designing the device is disclosed.

Abstract: Various exemplary embodiments relate to a temperature compensation structure for use in a dielectric resonator that permits a support to be thermally efficient in rapidly transferring heat generated by a central puck in the resonator. The temperature compensation structure may have an extension shaped to promote heat from the puck into the support, thereby permitting high power operation of the dielectric resonator without overheating.

Abstract: A cavity filter has a resonator. The resonator is engaged by a rod having a mounting portion and a thermal dissipation portion. The mounting portion of the rod extends through the floor of the cavity filter to engage an internal surface of the resonator. The thermal dissipation portion dissipates heat from the resonator to the outside of the cavity filter.

Abstract: A resonator having an effective spring constant (kz) and comprising a beam having a beam spring constant (kB) adapted to resonate in an oscillation direction, and extending at a non-zero angle (?) to the oscillation direction, wherein the resonator has a predetermined geometry and is formed from one or more materials, the or each material having a coefficient of thermal expansion (CTE), the CTE of the or each material together with the predetermined geometry of the resonator causing ? to vary with temperature, such that the temperature dependence of the beam spring constant is compensated for, resulting in the effective spring constant of the resonator remaining substantially constant within an operating temperature range.

Abstract: Tunable resonator systems and methods for tuning resonator systems are disclosed. In one aspect, a resonator system includes an array of resonators disposed adjacent to a waveguide, at least one temperature sensor located adjacent to the array of resonators, and a resonator control electronically connected to the at least one temperature sensor. Each resonator has a resonance frequency in a resonator frequency comb and channels with frequencies in a channel frequency comb are transmitted in the waveguide. Resonance frequencies in the resonator frequency comb are to be adjusted in response to ambient temperature changes detected by the at least one temperature sensors to align the resonance frequency comb with the channel frequency comb.

Abstract: A cavity resonator having temperature compensation which comprises a pot and a cover, which together enclose a cavity resonance volume. The pot comprises a first material, which has a first temperature expansion coefficient and the cover comprises a second material, which has a second temperature expansion coefficient. The second temperature expansion coefficient is greater than the first temperature expansion coefficient, and an expansion of the pot and a deformation of the cover results upon a temperature increase, which each independently and also together cause an enlargement of the cavity resonance volume. Simultaneously, the resonance frequency remains essentially constant.

Abstract: Various exemplary embodiments relate to a temperature compensation structure for use in a dielectric resonator that permits a support to be thermally efficient in rapidly transferring heat generated by a central puck in the resonator. The temperature compensation structure may have an extension shaped to promote heat from the puck into the support, thereby permitting high power operation of the dielectric resonator without overheating.

Abstract: A temperature compensation apparatus for a cavity filter including a plunger barrel, a compensation barrel having a first coefficient of thermal expansion, wherein the compensation barrel is housed with the plunger barrel, a tuning rod housed primarily within the compensation barrel, the tuning rod having a second coefficient of thermal expansion, and wherein the compensation barrel is physically in contact with the plunger barrel and the tuning rod for allowing a direct transfer of heat between the compensation barrel, the tuning rod, and the plunger barrel.

Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxide. Further embodiments comprise additional devices, systems and methods.

Abstract: A TEM mode resonator (12) comprising a tuneable cavity (13) defined by an electrically conducting cavity wall (14), the cavity wall comprising a grounding face (15), a capacitor face (16) and a surrounding wall (17) extending therebetween; an electrically conducting resonator member (18) within the cavity extending from the grounding face (15) part way to the capacitor face; a tuning member (19) within the cavity between the resonator member and capacitor face adapted to be displaced towards and away from the capacitor face along a displacement axis to tune the resonator; the capacitor face (16) further comprising an electrically conducting temperature compensation plate (25), the temperature compensation plate being connected to the capacitor face at two spaced apart points (23, 24) and forming a bowed surface therebetween; the temperature compensation plate having a smaller coefficient of thermal expansivity than the capacitor face.

Abstract: A device includes at least one piezoacoustic resonator element (21-29) having at least one piezoelectric layer (21a-29a) and two electrodes (21b-29b, 21c-29c) applied to the piezoelectric layer (21a-29a). The piezoacoustic resonator element (21-29) is configured in such a manner that, when a voltage is applied to the piezoelectric layer (21a-29a) by electrodes (21b-29b, 21c-29c), a bulk wave of the piezoelectric layer (21a-29a) is induced with a resonant frequency. The device also includes a heating device with a heating element (211-219), integrated into the piezoacoustic resonator element (21-29), for controlling the working temperature of the device.

Abstract: The present invention relates to a mechanical compensating device for a waveguide (1). More precisely, the present invention provides a technology for ensuring phase stability in a waveguide (1) subject to expansions and contractions owing to temperature changes. To do this, actuators, which may consist of pairs of prongs (8-9, 10-11), connected to longitudinal ribs (2, 3) cut in the body of the waveguide (1) and integral therewith, cause, because of a large difference between the respective coefficients of thermal expansion of the waveguide (1) and of the actuators, a rotation of the longitudinal ribs (2, 3) about themselves, deforming the short sides (4, 5) of the waveguide (1) when said waveguide (1) expands or contracts according to the changes in temperature.

Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.

Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.

Abstract: A high Q cavity resonator loaded with a metallic post and a ceramic disc, the resonator comprising an inner conductive post having a length less than a quarter wavelength. The resonance frequency of the resonator is tunable by changing a distance between a) an outer plate and b) a ceramic disc and an end cap where the ceramic disc is located between the outer plate and the end cap. The resonance frequency can be tuned when the outer plate, ceramic disc, and end cap are in contact with each other by varying a pressure between the contact surfaces of the ceramic disc, the end cap and the outer plate. Temperature compensation allows the resonator to hold a resonance frequency over a range of tunable frequencies despite changes in temperature, and can be achieved by selecting thermal coefficients of expansion of components holding or placing the ceramic disc and end cap relative to the outer plate.

Abstract: A device comprises a microwave resonator having at least one cavity having a predefined resonant frequency. The device also comprises a temperature compensation system that is made from a material having a coefficient of thermal expansion that is very low compared to that of the material from which the cavity is made and includes a structure for counteracting the effects of temperature variations on the resonator so that the resonant frequency of the cavity remains within a predetermined range. The device further comprises a temperature compensation adjustment device adapted to modify the volume of the cavity to adjust the value of the resonant frequency to a predefined value.

Abstract: A temperature compensation apparatus for a cavity filter including a plunger barrel, a compensation barrel having a first coefficient of thermal expansion, wherein the compensation barrel is housed with the plunger barrel, a tuning rod housed primarily within the compensation barrel, the tuning rod having a second coefficient of thermal expansion, and wherein the compensation barrel is physically in contact with the plunger barrel and the tuning rod for allowing a direct transfer of heat between the compensation barrel, the tuning rod, and the plunger barrel.

Abstract: An interface that provides minimum changes in contact pressure over a thermal range is disclosed. The interface is a mated joint of given material, typically metallic, joined by a mechanical fastener or fasteners. The fastener(s) create contact pressure at the joint surface wherein the contact pressure variation over a temperature range is minimized by the use of a thermal compensator having a predetermined length. The thermal compensator's length is chosen by setting the thermally induced expansion delta to offset an equal delta created by the fastener and interface configuration. The difference in expansion of the mated joint and fastener is canceled by the equal, but negative, difference between compensator and fastener. This cancellation of expansion minimizes the change in contact pressure at the joint interface. Maintaining a constant pressure provides PIM reliability during temperature changes.

Abstract: An interface that provides minimum changes in contact pressure over a thermal range is disclosed. The interface is a mated joint of given material, typically metallic, joined by a mechanical fastener or fasteners. The fastener(s) create contact pressure at the joint surface wherein the contact pressure variation over a temperature range is minimized by the use of a thermal compensator having a predetermined length. The thermal compensator's length is chosen by setting the thermally induced expansion delta to offset an equal delta created by the fastener and interface configuration. The difference in expansion of the mated joint and fastener is canceled by the equal, but negative, difference between compensator and fastener. This cancellation of expansion minimizes the change in contact pressure at the joint interface. Maintaining a constant pressure provides PIM reliability during temperature changes.

Abstract: Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes at or near a selected turnover temperature. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

Abstract: A method and an arrangement for temperature compensation at circular resonators with dual mode utilization, which includes a material with a low coefficient of thermal expansion and for which the tensile or compressive forces are transferred to the resonator wall and produce elastic deformations there. The resonator wall is deformed in two mutually perpendicular directions in each case by the same absolute amount at one or more places along the axial e extent, the deformation forces being introduced into the resonator war over at least one flange. This has the advantage that the peripheral shape of the casing of the circular resonator is deformed so that both orthogonal dual modes experience uniform shortening with simultaneous expansion of the material, as a result of which a high compensation effect is achieved.

Abstract: An interface that provides minimum changes in contact pressure over a thermal range is disclosed. The interface is a mated joint of given material, typically metallic, joined by a mechanical fastener or fasteners. The fastener(s) create contact pressure at the joint surface wherein the contact pressure variation over a temperature range is minimized by the use of a thermal compensator having a predetermined length. The thermal compensator's length is chosen by setting the thermally induced expansion delta to offset an equal delta created by the fastener and interface configuration. The difference in expansion of the mated joint and fastener is canceled by the equal, but negative, difference between compensator and fastener. This cancellation of expansion minimizes the change in contact pressure at the joint interface. Maintaining a constant pressure provides PIM reliability during temperature changes.

Abstract: An RF cavity resonator that includes: a resonator chamber for containing an RF field; an RF coupling element coupled to the resonator chamber for introducing the RF field into and extracting the RF field from the resonator chamber; a tuning assembly for causing the RF field to resonate at a desired frequency, wherein at least a portion of the tuning assembly is coupled within the resonator chamber; and a heat transport element included in the tuning assembly for transporting heat from the RF cavity resonator, the heat transport element comprising a phase change material, a housing for enclosing the phase change material, means for circulating the phase change material within the housing, and an electrically conductive surface for isolating the phase change material from the RF field, wherein the phase change material undergoes a phase change during circulation within the housing.

Abstract: A dielectric-based filter includes a thermally insulated housing, at least one filter formed from a dielectric material disposed inside the insulated housing, and a temperature maintenance device having a heating component and a cooling component for maintaining the temperature of the filter inside of the insulated housing within a temperature range. In a preferred aspect of the invention, the temperature maintenance device includes a thermoelectric cooler. The device permits the use of temperature-dependent low loss, high dielectric constant materials in filtering/resonator applications. During operation of the device, the dielectric-based filter is maintained at substantially room temperature.

Abstract: A high Q RF cavity resonator loaded with a ceramic disc, the resonator comprising an inner conductive post having a length less than a quarter wavelength. The resonance frequency of the resonator is tunable by changing a distance between a) an outer plate and b) a ceramic disc and an end cap where the ceramic disc is located between the outer plate and the end cap. The resonance frequency can be tuned when the outer plate, ceramic disc, and end cap are in contact with each other by varying a pressure between the contact surfaces of the ceramic disc, the end cap and the outer plate. Temperature compensation allows the resonator to hold a resonance frequency despite changes in temperature, and can be achieved by selecting thermal coefficients of expansion of components holding or placing the ceramic disc and end cap relative to the outer plate.

Abstract: An RF cavity resonator (400) that includes: a resonator chamber (410) for containing an RF field; an RF coupling element (450, 452) coupled to the resonator chamber for introducing the RF field into and extracting the RF field from the resonator chamber; a tuning assembly (420) for causing the RF field to resonate at a desired frequency, wherein at least a portion of the tuning assembly is coupled within the resonator chamber; and a heat transport element (440) for transporting heat from the RF cavity resonator, wherein at least a portion of the heat transport element is coupled within the resonator chamber, the heat transport element including a phase change material, a housing for enclosing the phase change material, means for circulating the phase change material within the housing, and an electrically conductive surface for isolating the phase change material from the RF field.

Abstract: The specification discloses embodiments of an apparatus comprising a film bulk acoustic resonator (FBAR) filter comprising a piezoelectric membrane having a portion thereof sandwiched between a first electrode and a second electrode, the piezoelectric membrane being suspended from at least two edges thereof, and a heat transfer layer placed on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Also disclosed are embodiments of a process comprising sandwiching a portion of the piezoelectric membrane between a first electrode and a second electrode, suspending a piezoelectric membrane from at least two edges thereof, and placing a heat transfer layer on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Other embodiments are disclosed and claimed.

Abstract: A dielectric resonator has a metallic casing having an opening, a metallic cover which covers the opening, and a dielectric resonance element having a pair of flat surfaces formed opposite from each other, one of the pair of flat surfaces being brought into contact with a bottom portion of the casing. At least one of the cover and the bottom portion has a resilient portion which supports the dielectric resonance element and presses one of the pair of flat surfaces by a biasing force so as to follow expansion or contraction of the dielectric resonance element due to a change in temperature. The biasing force applied from the resilient portion is obtained by warping of a portion of the cover or a portion of the bottom portion that one of the pair of flat surfaces or an edge portion of the flat surface contacts.

Abstract: A resonant cavity device comprises a waveguide body having a lateral wall extending in a longitudinal direction, having a first coefficient of thermal expansion, and delimiting a resonant cavity in conjunction with opposite first and second end walls. The first end wall has a second coefficient of thermal expansion lower than the first coefficient and has an internal face fastened to a first assembly comprising at least one main plate having a third coefficient of thermal expansion lower than the first coefficient and dimensions in a plane perpendicular to the longitudinal direction less than but substantially equal to those of the cavity.

Abstract: A waveguide assembly for operation over a range of temperatures includes a waveguide body and a plurality of restraining strips coupled to the waveguide body. The waveguide body includes a pre-curved narrow sidewall of material having a first coefficient of thermal expansion (CTE). The restraining strips are coupled to the waveguide body at first and second lateral points on either side of the pre-curved narrow sidewall laterally and are spaced apart along the length of the waveguide body, and are made from a material having a second CTE much less than the first CTE.

Abstract: A multi-layer microwave resonator (10) comprises a cavity (12) having an inner surface formed from an electrically conductive material. Pieces (16a-16e) of dielectric materials stacked on top of each other form a conriguous body (14) that is provided in the cavity (12). The dielectric materials of the pieces (16a-16e) are chosen such that the dielectric constant of the pieces (16a-16e) alternate between a relatively high dielectric constant and a relatively low dielectric constant.

Abstract: The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized.

Abstract: A vacuum electron device with a photonic bandgap structure that provides the ability to tune the behavior of the device to a particular mode of a plurality of modes of propagation. The photonic bandgap structure comprises a plurality of members, at least one of which is movable, and at least one of which is temperature controlled. The photonic bandgap structure makes possible the selection of one mode of propagation without the necessity to build structures having dimensions comparable to the wavelength of the propagation mode.

Abstract: A bandpass filter makes use of at least one waveguide cavity that is thermally compensated to minimize drift of a resonant frequency of the cavity with thermal expansion of cavity components. The compensation relies on deformation of the shape of at least one cavity surface in response to thermally-induced dimensional changes of the cavity. A control rod is used to limit the movement of a point on the deformed surface, while the rest of the surface moves with the thermal expansion. The control rod is made of a material having a coefficient of thermal expansion that is significantly different than that of other filter components. The rod may also be arranged to span more thermally expandable material than defines the filter such that, as the filter expands, the point of deflection is moved toward the interior of the filter beyond its original position.