Abstract: Disclosed is a transition apparatus for transitioning wide frequency band electromagnetic waves between the metal waveguide and the laminated waveguide. The transition apparatus includes a top conductive layer, a bottom conductive layer, a conductive wall, and a transition interior. The conductive wall is formed along a substrate of the laminated waveguide and electrically connected the top conductive layer and the bottom conductive layer. The transition interior is defined by the top conductive layer, the bottom conductive layer, and the conductive wall. The conductive wall further comprises a plurality of stubs extending from an inner side of the wall into the transition interior, the plurality of stubs divide the transition interior into three or more resonator cavities for transitioning wide frequency band electromagnetic waves between the metal waveguide and the laminated waveguide.

Abstract: An antenna adapter, for an antenna with a recessed adapter seat with a feed bore is provided as a base with a feed aperture, the base dimensioned to seat within the adapter seat, the feed aperture aligned coaxial with the feed bore. The base may be provided with interlock cavities dimensioned to receive retaining elements of the adapter seat as the base is inserted into the adapter seat, retaining the base within the adapter seat. The base may include a coupler cavity, coupling the feed aperture to two or more output ports. The coupler cavity may have sidewall slots.

Abstract: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.

Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furthermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.

Abstract: A high-frequency member assembly has two high-frequency members of which surfaces are attached to each other. Each member has a rectangular waveguide hole penetrating through the member and two choke grooves opened on the attaching surface. The waveguide holes communicate with each other to form a rectangular waveguide. An electromagnetic wave is transmitted through the waveguide. Each choke groove extends straight along a side of an end of the waveguide hole opened on the attaching surface to be away from the end of the waveguide hole by one quarter of the wavelength of the wave. The depth of each choke groove is equal to one quarter of the wavelength. The choke grooves of one member communicate with the choke grooves of the other member to substantially surround the waveguide with the choke grooves in an attaching area between the member.

Abstract: An electrolytic corrosion prevention structure at a flange connection part in which the occurrence of an electrolytic corrosion is suppressed without increasing the number of the airtight and/or watertight parts and that can be easily processed is provided. a pair of pipe members 21 and 22, which has flanges 21a and 22a at the end of pipes and which has a groove surrounding the end of the pipe formed between the flanges 21a and 22a by jointing the flanges 21a and 22a; an annular seal member 23 which places in an outer circumference of the joint part of the flanges 21 a and 22a in the groove: and an interposition member 24 which places in an outer circumference of the seal member 23; wherein the electric potential difference which occurs when either material of the pair of pipe members 21 and 22 and the material of the interposition member 24 are contacted, smaller than the electric potential difference when the materials of the pair of pipe member 21 and 22 are contact with each other.

Abstract: A waveguide circuit is provided, in which fixing a metal cover to a waveguide body with screws can prevent radiowave leakage suitably without any application of the conductive adhesive, solder and braze as a material for the radiowave leakage prevention. A metal plate is provided at the end of an aperture of a waveguide body in a radiowave traveling direction and overlaps with the end of a metal cover.

Abstract: A waterproof communication apparatus comprises a core part and a separate external housing. The core part is a combination having at least one seam, and is used to transmit electromagnetic waves. The separate external housing covers the core part to prevent environmental moisture from entering the inside of the communication apparatus through the seam. A pair of engaging parts having complementary shapes is equipped with the seam of the combination so as to further prevent the molten material of the separate external housing from entering the inside of the communication apparatus during the manufacturing process. In another embodiment, the core part and separate external housing are made of metals and are combined by a metallurgic method.

Abstract: A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about ?/4 away from a long side edge of the first waveguide, where ? is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about ?. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about ?g/4, where ?g is an in-substrate effective wavelength of the signal wave.

Abstract: Various embodiments provide for waveguide assemblies which may be utilized in wireless communication systems. Various embodiments may allow for waveguide assemblies to be assembled using tools and methodologies that are simpler than the conventional alternatives. Some embodiments provide for a waveguide assembly that comprises a straight tubular portion configured to be shortened, using simple techniques and tools, in order to fit into a waveguide assembly. For instance, for some embodiments, the waveguide assembly may be configured such that the straight portion can be shortened, at a cross section of the portion, using a basic cutting tool, such a hacksaw. In some embodiments, the straight portion may be further configured such that regardless of whether the straight tubular portion is shortened, the waveguide assembly remains capable of coupling to flanges, which facilitate coupling the straight tubular portion to connectable assemblies, such as other waveguide assemblies, radio equipment, or antennas.

Abstract: A connecting structure of a waveguide converter includes a circuit substrate in which a hollow waveguide that propagates a high frequency signal is formed in a pierced manner; and an antenna substrate that is layered on the circuit substrate, and in which a converter that is arranged at a connecting point with the hollow waveguide and a strip line that extends from the converter and that propagates the high frequency signal are provided. A choke circuit to shield a leak of the high frequency signal is arranged around the hollow waveguide on a surface of the circuit substrate opposing to the antenna substrate so as to surround the hollow waveguide keeping a predetermined interval from the hollow waveguide, and the circuit substrate and the antenna substrate are fixed to each other by adhesive that is arranged at a position outside the choke circuit, between the substrates.

Abstract: A printed wiring board having at least one connector includes a dielectric substrate that has, on a first face, a first ground plane, and on a second face, at least two transmission lines between which the connector and a footprint are mounted. The footprint includes a first element positioned between the two transmission lines under the connector. The first element forming with the first ground plane, a capacitive element and, at each extremity of the first element, second elements forming with the first element, a self-inductive and capacitive element. The second elements each extending by a second ground plane, the second ground planes which are connected to the first ground plane.

Abstract: A waterproof communication apparatus comprises a core assembly having at least one seam, configured to transmit an electromagnetic wave; and a seamless enclosure enclosing the core assembly, configured to prevent the ingress of atmospheric moisture through the at least one seam into the inside of the core assembly. In one embodiment, the core assembly and the enclosure are made of metallic materials, and a metallurgical bond is formed between the core assembly and the enclosure.

Abstract: A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about ?/4 away from a long side edge of the first waveguide, where ? is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about ?. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about ?g/4, where ?g is an in-substrate effective wavelength of the signal wave.

Abstract: An adjustable assembly apparatus includes a waveguide phase shifter and a waveguide multiplexer. The waveguide phase shifter has a first flange structure and the waveguide multiplexer has a second flange structure. The second flange structure and the first flange structure are embedded, and the polarization directions of the waveguide phase shifter and the waveguide multiplexer are orthogonal. In an embodiment, the first flange structure includes a bulge, the second flange structure includes a recess, and the bulge is embedded in the recess. The polarization directions of the bulge of the waveguide phase shifter and the recess of the waveguide multiplexer differ by 90 degrees.

Abstract: A waveguide includes a first waveguide member and a second waveguide member. The second waveguide member is combined with the first waveguide member to form a through hole. The first waveguide member includes a first shell and two first wing portions connected to the first shell, and the two first wing portions form a first plane. The second waveguide member includes a second shell and two second wing portions connected to the second shell, and the two second wing portions form a second plane. Bulged strips are formed at the inner rims of the second plane neighboring the through hole and extend along a longitudinal direction of the through hole, and the bulged strips protrude the second plane.

Abstract: A device includes a first section, a second section, a hinge section, an antenna, a radiowave transceiver section, and a waveguide assembly. The hinge section couples the first section to the second section and allows the first section to be pivoted with respect to the second section. The antenna is located within the first section and the radio wave transceiver section is located in the second section. The waveguide assembly provides coupling through at least a portion of the first section, at least a portion of the second section, and the hinge section such that the antenna is electrically coupled to the radio wave transceiver section.

Abstract: Provided is an apparatus for transitioning a millimeter wave between dielectric waveguide and transmission line using a millimeter wave transition structure formed by the dielectric waveguide, the transmission line, and a slot to transition a signal with lower losses. The apparatus includes: transmission lines disposed respectively at input and output terminals on an uppermost dielectric substrate in a signal transition direction and adapted to transition a signal; a dielectric waveguide formed by a via array disposed between top and bottom ground surfaces of a lowermost dielectric substrate in the signal transition direction as a signal transition path; and slots disposed at a signal transition path of an upper ground surface of each dielectric substrate to connect the transmission lines to the dielectric waveguide so as to transition a signal from the transmission line of the input terminal to the transmission line of the output terminal through the dielectric waveguide.

Abstract: A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about ?/4 away from a long side edge of the first waveguide, where ? is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about ?. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about ?g/4, where ?g is an in-substrate effective wavelength of the signal wave.

Abstract: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.

Abstract: A cable to waveguide transition apparatus having a signal accumulation form of a backshort is disclosed. The cable to waveguide transition apparatus having a signal accumulation form of a backshort, includes: a waveguide; a RF probe for transferring a radio frequency (RF) signal to the waveguide; and a backshort having the signal accumulation form for reflecting the RF signal excited from the RF probe, wherein the backshort reflects a first fundamental frequency signal excited from the RF probe to have a phase identical to a phase of a second fundamental frequency signal excited from the RF probe to an aperture of the waveguide, and reflects a first 2-order harmonic frequency signal excited from the RF probe to have a phase reverse to a phase of a second 2-order harmonic frequency signal excited to an aperture of the waveguide in order to eliminate the 2-order harmonic frequency signal.

Abstract: In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.

Abstract: A waveguide includes: a first tubular waveguide path that transmits electromagnetic waves having a predetermined wavelength; and a stub that is formed such that a depth thereof becomes a quarter of the predetermined wavelength, an open end of the stub making internal contact with a contour line, and the contour line being spaced apart from an inner wall part of one end of the first tubular waveguide path in a radially outward direction by only a quarter of the predetermined wavelength.

Abstract: A waveguide, configured to attach with a printed circuit board, includes a body, a waveguide channel, at least one flange portion, and a plurality of protrusions. The waveguide channel is formed through the body. The at least one flange portion is connected with an end portion of the body. The plurality of protrusions are disposed on a surface of the at least one flange portion and a surface of the end portion and abut against the surface of the printed circuit board.

Abstract: A waveguide connector is provided. The connector includes a connecting portion having a plurality of conductive convex portions that are deformable by an external force. The convex portions are formed with a height and an interval less than ¼ wavelength of a propagating electromagnetic wave to be propagated inside waveguides.

Abstract: A vertical coupling structure for non-adjacent resonators is provided. The vertical coupling structure has a first resonator and a second resonator. At least one side of the first resonator is formed as a first bent extension structure, and the first bent extension structure includes a slot. The second resonator is not adjacent to the first resonator, and the side of the second resonator opposite to the first bent extension structure of the first resonator further includes a slot, such that the two sides are electrically connected.

Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4) and a second surface-mountable waveguide part (5), each waveguide part (4, 5) comprising a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a dielectric carrier material (1), all the walls (7, 8, 9; 10, 11, 12) together essentially forming a U-shape, where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mounted waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other.

Abstract: A transceiver (20) for a millimeter wave signal, consisting of a PCB (140) having PCB microstrip lines (141) and PCB waveguide apertures (159), and one or more transmitter modules (22) and one or more receiver modules (24, 26, 28) mounted on the PCB. Each module has a single microstrip-waveguide transition (34, 48) and a microstrip-microstrip transition (47, 49). The microstrip-waveguide transition of each module couples to one of the PCB waveguide apertures via a PCB-module waveguide-waveguide transition (167). The microstrip-microstrip transition of each module couples to one of the PCB microstrip lines via a PCB-module microstrip-microstrip transition (165). The PCB-module transitions are low tolerance, facilitating implementation of the transceiver.

Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other.

Abstract: An electrolytic corrosion prevention structure at a flange connection part in which the occurrence of an electrolytic corrosion is suppressed without increasing the number of the airtight and/or watertight parts and that can be easily processed is provided. a pair of pipe members 21 and 22, which has flanges 21a and 22a at the end of pipes and which has a groove surrounding the end of the pipe formed between the flanges 21a and 22a by jointing the flanges 21a and 22a; an annular seal member 23 which places in an outer circumference of the joint part of the flanges21 a and 22a in the groove: and an interposition member 24 which places in an outer circumference of the seal member23; wherein the electric potential difference which occurs when either material of the pair of pipe members 21 and 22 and the material of the interposition member 24 are contacted, smaller than the electric potential difference when the materials of the pair of pipe member 21 and 22 are contact with each other.

Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furthermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.

Abstract: A waveguide interface for millimeter wave and sub-millimeter wave applications adapted to couple and uncouple abutting waveguide sections wherein said waveguide interface acts as both a mating surface and a precision alignment mechanism. The waveguide interface comprises a first member having a first waveguide defined therein, a second member having a second waveguide similar in cross-section to said first waveguide defined therein, a means for mating said first member and said second member comprising a centrally located precision mating surface through which propagates electromagnetic energy and additionally comprising at least one pair of diametrically opposed rotational alignment pins and holes located a specified distance from said centrally located precision-mating surface, and wherein said pins and holes are in mating relation of looser fitment than said centrally located precision mating surface.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Abstract: Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

Abstract: A heat insulating transmission line includes a first waveguide with a first aperture end, a second waveguide with a second aperture end, and a reflector. The second waveguide is arranged coaxially with the first waveguide. The second aperture end faces the first aperture end through an air gap. The reflector is provided outside the air gap, and controls radiation power from the air gap. In addition, the reflector is substantially parallel to a portion of a virtual plane connecting an inner wall of the first aperture end of the first waveguide and an inner wall of the second aperture end of the second waveguide. When a mean frequency of a signal transmitting through the heat insulating transmission line is expressed as ?, a distance between the virtual surface and the reflector is not less than N×?/2?0.05? and not more than N×?/2+0.2? (N is a positive integer).

Abstract: A transformer between waveguide and transmission-line includes a high-frequency circuit module, transmission-lines, a waveguide, and feed pins. The high-frequency circuit module has differential-pair terminals to input and output a differential signal. The transmission-lines are connected to the differential-pair terminals. The waveguide includes a first to third metal walls. The feed pins are connected to the transmission-lines inside of the waveguide. The feed pins have a first distance of approximately (?g/2) from each other. One of the feed pins has a second distance of approximately (?g*(1+2 ?)/4) from the third metal plane. “?g” is a wavelength in the waveguide and “?” is an integer which is equal or larger than “0”. Each of the feed pins has a third distance of approximately (a/2) from the first or second wall. “a” is length of the waveguide along the third metal wall.

Abstract: A waveguide assembly comprising at least two waveguide components. The waveguide assembly comprising a first waveguide portion and a second waveguide portion each comprising an interior surface and an exterior surface. The interior surface of the first waveguide portion defining a first portion of a first microwave component and a first portion of a second microwave component. The interior surface of the second waveguide portion defining a second portion of the first microwave component and a second portion of the second microwave component. The first waveguide portion and the second waveguide portion being adapted for being coupled together to form the waveguide assembly such that, when coupled together, the waveguide assembly comprises at least the first microwave component and the second microwave component.

Abstract: An adaptation apparatus comprises a closing-off body and an enlargement. The closing-off body comprises a generated surface which is adapted to establish contact with an external conductor of a waveguide. The enlargement is arranged on the generated surface. The enlargement is adapted such that the enlargement spaces apart an electrical short circuit at a predetermined space from the generated surface of the closing-off body.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: An RF interconnection between RF Printed Wiring Boards (PWBs) includes a waveguide transmission line coupled between the RF PWBs. The waveguide feeds are provided as integral parts of each PWB. In one embodiment, the waveguide interconnecting the PWBs is provided as an integral part of a support structure which supports the PWBs. By providing the interconnecting waveguide and the feeds at each end of the waveguide as integral pieces of other already existing structures, a reliable, low cost RF interconnection between RF PWBs having relatively few separate pieces is provided.

Abstract: A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about ?/4 away from a long side edge of the first waveguide, where ? is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about ?. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about ?g/4, where ?g is an in-substrate effective wavelength of the signal wave.

Abstract: In a circuit (1) comprising first and second transmission lines (11,12) with first and second line widths, the transmission lines (11,12) are coupled to each other via a coupling (13,14) with first and second coupling widths at its ends, such that a smaller one of the line widths and a larger one of the coupling widths are combined, and such that a larger one of the line widths and a smaller one of the coupling widths are combined. Such a coupling (13,14) introduces relatively small reflection coefficients, for example for distances between ends of the transmission lines (11,12) smaller than a wavelength of frequency signals to be exchanged via the transmission lines (11,12) and the coupling (13,14). The circuit (1) can then become more compact. The coupling (13,14) may comprise one single taper or may comprise a first taper (13) with a first, larger coupling width and a second taper (14) with a second, smaller coupling width.

Abstract: Waveguide flanges for joining waveguide sections or components are designed to achieve mechanical strength and exhibit desired electrical properties such as relatively low insertion loss and high return loss. The present invention contemplates waveguide interfaces with a new choke flange designed to engage with a shield flange and provide a joint with improved electrical properties. The new choke designs produce a virtual continuity through the waveguide joints and minimize electrical energy leakage. The electrical and mechanical properties of the joint in the waveguide interfaces are robust and able to tolerate lower levels of parts precision, imperfect mating of the flanges without metal-to-metal contact and gaps up to 0.06? or more between the mating flange surfaces.

Abstract: A cable to waveguide transition apparatus having a signal accumulation form of a backshort is disclosed. The cable to waveguide transition apparatus having a signal accumulation form of a backshort, includes: a waveguide; a RF probe for transferring a radio frequency (RF) signal to the waveguide; and a backshort having the signal accumulation form for reflecting the RF signal excited from the RF probe, wherein the backshort reflects a first fundamental frequency signal excited from the RF probe to have a phase identical to a phase of a second fundamental frequency signal excited from the RF probe to an aperture of the waveguide, and reflects a first 2-order harmonic frequency signal excited from the RF probe to have a phase reverse to a phase of a second 2-order harmonic frequency signal excited to an aperture of the waveguide in order to eliminate the 2-order harmonic frequency signal.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.

Abstract: A high-frequency member assembly has two high-frequency members of which surfaces are attached to each other. Each member has a rectangular waveguide hole penetrating through the member and two choke grooves opened on the attaching surface. The waveguide holes communicate with each other to form a rectangular waveguide. An electromagnetic wave is transmitted through the waveguide. Each choke groove extends straight along a side of an end of the waveguide hole opened on the attaching surface to be away from the end of the waveguide hole by one quarter of the wavelength of the wave. The depth of each choke groove is equal to one quarter of the wavelength. The choke grooves of one member communicate with the choke grooves of the other member to substantially surround the waveguide with the choke grooves in an attaching area between the member.

Abstract: Disclosed herein is a system for the variable attenuation of broadband differential signals. An exemplary system of variable attenuation of broadband differential signals includes attenuation devices arranged such that an attenuation device on the positive side of the differential signal has a corresponding attenuation device on the negative side of the differential signal with both of the corresponding attenuation devices on the same semiconductor die.

Abstract: Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

Abstract: A connecting system can couple two waveguides to one another, wherein each of the waveguides comprises a flange or a protruding rim. When the waveguides are connected together, the flanges can face one another in an adjoining arrangement. The connecting system can comprise two members, each having a groove, recess, or slot that receives a circumferential area of the adjoining flanges. The two members can be disposed on opposite lateral sides of the waveguides with each groove embracing a peripheral area of the adjoining flanges. A fastener or another apparatus can bring the two members towards one another, thereby causing the flanges to move deeper into the grooves. That is, the two members can clamp around opposing sides of the flanges. In response to the flanges moving deeper into the grooves, the sidewalls of the grooves can compress the flanges together to attach the waveguides to one another.

Abstract: A waveguide connector is provided. The connector includes a connecting portion having a plurality of conductive convex portions that are deformable by an external force. The convex portions are formed with a height and an interval less than ¼ wavelength of a propagating electrical wave to be propagated inside waveguides.