Winding With Terminals, Taps, Or Coil Conductor End Anchoring Means Patents (Class 336/192)
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Patent number: 12131855Abstract: Disclosed herein is a circuit board that includes a substrate and a coil component mounted on the substrate. The coil component includes a core and a wire wound around the core. The substrate includes a dielectric and a capacitive electrode capacitively coupled to the wire through the dielectric and supplied with a ground potential.Type: GrantFiled: February 17, 2021Date of Patent: October 29, 2024Assignee: TDK CorporationInventors: Hanako Yoshino, Keigo Higashida
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Patent number: 12119626Abstract: The system and method involve an unmanned aerial vehicle, a pilot line, a winding mechanism, and a remote control device. The unmanned aerial vehicle is of the rotorcraft type and has a coupling for the pilot line. The pilot line is wound around the winding mechanism and connecting to the unmanned aerial vehicle. The remote control device accepts commands from a human operator and transmits control signals to the unmanned aerial vehicle, causing it to lift the pilot line over a support element. A payload line then is attached to the end of the pilot line. The human operator uses a winding device to wind the pilot line back around the winding mechanism, pulling the attached payload line over the support element.Type: GrantFiled: March 9, 2024Date of Patent: October 15, 2024Inventor: Henry Hardy Perritt, Jr.
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Patent number: 12112880Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.Type: GrantFiled: November 1, 2023Date of Patent: October 8, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Sik Shin, Jae Wook Lee, Sung Young Jo
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Patent number: 12082334Abstract: Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.Type: GrantFiled: April 14, 2022Date of Patent: September 3, 2024Assignee: Hamilton Sundstrand CorporationInventors: John Dickey, Kevin Kilroy
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Patent number: 12073970Abstract: A coil component includes a drum-shaped core including a core part having a circumferential surface including a first side surface and a second side surface parallel to each other; and a coil including two wires wound around the core part in the same direction. The coil has a first twisted wire part having the two wires twisted together on the first side surface, and a second twisted wire part having the two wires twisted together on the second side surface. The first twisted wire part and the second twisted wire part are identical in shape.Type: GrantFiled: December 12, 2019Date of Patent: August 27, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Itani, Seiji Karimori, Katsuyuki Takahashi, Masashi Miyamoto
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Patent number: 12062484Abstract: A coil component includes a body having one surface, and one end surface and the other end surface connected to the one surface and opposing each other; a coil portion including lead-out patterns within the body; slit portions respectively disposed in an edge portion between the one end surface and the one surface of the body and an edge portion between the other end surface and the one surface of the body to expose the lead-out patterns; external electrodes disposed to be spaced apart from each other on the one surface and respectively extending to the slit portions to be connected to the lead-out patterns; and surface insulating layers, respectively disposed on the one end surface and the other end surface of the body. The surface insulating layers include a first insulating thin film including silicon dioxide (SiO2), and a second insulating thin film including aluminum oxide (Al2O3).Type: GrantFiled: November 24, 2020Date of Patent: August 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Seung Mo Lim, Tae Jun Choi, Byung Soo Kang, Boum Seock Kim
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Patent number: 12051532Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and both end surfaces, opposing each other, a support substrate disposed inside the body, and including a core portion, and a support portion connected to the core portion, a coil portion disposed on the core portion, and a lead portion disposed on the support portion and connected to the coil portion to be exposed to one surface of the body. The support portion is disposed to be more adjacent to the one surface of the body than the core portion.Type: GrantFiled: April 5, 2021Date of Patent: July 30, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
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Patent number: 12046405Abstract: A coil component includes a body, a support substrate disposed in the body, a coil unit including a coil pattern disposed on the support substrate and perpendicular to a first surface of the body and first and second lead portions exposed to the first surface of the body and spaced apart from each other, and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to the first and second lead portions, respectively, wherein each of the first and second lead portions and the coil pattern includes a first metal layer disposed on the support substrate and each of the first and second lead portions further includes a second metal layer disposed on the first metal layer.Type: GrantFiled: January 27, 2021Date of Patent: July 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Ji Cho, Jae Hun Kim
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Patent number: 12046411Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface, a winding coil disposed in the body and having a lead-out portion exposed to the one end surface of the body, a first insulating layer disposed on the one end surface of the body and having one region and the other region spaced apart from each other in the other direction, perpendicular to the one direction, an external electrode having a connection portion, disposed between the one region and the other region of the first insulating layer to be connected to the lead-out portion, and an extension portion extending from the connection portion to the one surface of the body, and a second insulating layer covering the first insulating layer and the connection portion on the one end surface of the body.Type: GrantFiled: December 1, 2020Date of Patent: July 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Wook Lee, Sung Sik Shin, Sung Young Jo
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Patent number: 12033790Abstract: A coil component includes a body; first and second external electrodes; an insulating substrate; a first coil layer and a second coil layer disposed in the body; a third coil layer and a fourth coil layer disposed on a first surface and a second surface of the insulating substrate, respectively; a first terminal portion disposed on the first surface of the insulating substrate, and connected to the first external electrode; a first insulating layer covering the third coil layer and the first terminal portion; a second terminal portion disposed on the second surface of the insulating substrate, and connected to the second external electrode; a second insulating layer covering the fourth coil layer and the second terminal portion; and vias.Type: GrantFiled: April 1, 2021Date of Patent: July 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myoung Soon Park, Sung Hee Kim, Han Kyeol Kim, Ji Young Park
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Patent number: 12020837Abstract: A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.Type: GrantFiled: April 6, 2023Date of Patent: June 25, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Tomohiro Kido, Shimpei Tanabe, Yoshiyuki Oota
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Patent number: 12002616Abstract: A coil device includes a bobbin, a terminal, and a terminal block. The bobbin includes a winding portion for winding a wire around an outer circumference of the winding portion. The terminal is connectable with an end of the wire. The terminal block holds the terminal. The terminal is movable both in a first axis and a second axis of the bobbin.Type: GrantFiled: November 5, 2020Date of Patent: June 4, 2024Assignee: TDK CORPORATIONInventors: Toshiyuki Horikawa, Masaaki Iwakura, Masaru Kumagai, Shoichi Sasaki
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Patent number: 12003018Abstract: A thin, flexible antenna module is provided for use in a smartphone. When the antenna module is assembled in the smartphone, the antenna module provides an MST antenna and an NFC antenna. For this, the antenna module includes a flexible PCB containing coils and further includes a magnetic sheet engaged with flexible PCB. The flexible PCB and the magnetic sheet are attached to each other to form a single body.Type: GrantFiled: June 29, 2023Date of Patent: June 4, 2024Assignee: AQ CorporationInventors: Sang Hoon Lee, Kyoung Jun Choi, Sae Rom Lee
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Patent number: 11996771Abstract: A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.Type: GrantFiled: December 22, 2022Date of Patent: May 28, 2024Assignee: Infineon Technologies Austria AGInventors: Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew Sawle, Maciej Wojnowski, Xaver Schloegel, Josef Hoeglauer
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Patent number: 11978579Abstract: The coil component includes a magnetic body containing a metallic material and a resin material, a coil conductor embedded in the magnetic body, and a pair of outer electrodes electrically connected to ends of the coil conductor. The coil conductor includes an exposed portion at each end portion of the coil conductor, and a covered portion covered with an insulating substance disposed between the exposed portions. The covered portion is disposed inside a face of the magnetic body on which the outer electrodes are disposed.Type: GrantFiled: September 15, 2020Date of Patent: May 7, 2024Assignee: Murata Manufacturing Co., Ltd.Inventor: Kenichi Araki
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Patent number: 11955270Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.Type: GrantFiled: May 3, 2023Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Sik Shin, Jae Wook Lee, Sung Young Jo
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Patent number: 11948725Abstract: A wire-wound coil component is an electronic component including a core main body, such as a molded body, containing a magnetic powder resin in which a resin serves as a binder, and an oxide film covering at least a portion of the surface, such as the lower surface, of the core main body. The electronic component further includes an external electrode including a base layer formed on the surface of the oxide film. The base layer is a metal layer having high affinity for oxygen.Type: GrantFiled: November 27, 2018Date of Patent: April 2, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Keijiro Kojima, Yuya Ishida, Hiroyuki Sugie, Katsuyuki Takahashi
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Patent number: 11942264Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.Type: GrantFiled: December 8, 2020Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: No Il Park, Byung Soo Kang, Seung Mo Lim, Byeong Cheol Moon, Boum Seock Kim, Yong Hui Li, Seung Min Lee
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Patent number: 11942262Abstract: In an inductor component, an inductor wire is in an element body and extends on a virtual flat plane passing inside the element body. A wire main body of the inductor wire has an oblong rectangular shape elongated in a length direction in the top view, and thus, a wire width perpendicular to the extending direction is constant. From each edge of the wire main body in a width direction, protrusions having an oblong rectangular shape in the top view protrude and extend, from a center of the wire main body in the extending direction of the wire main body, in a direction perpendicular to the extending direction, on both sides in the width direction of the wire main body, with the extending direction sandwiched between the protrusions. An area ratio of a protrusion area of the protrusions to an area of the wire main body is within 7.2%.Type: GrantFiled: March 3, 2021Date of Patent: March 26, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Isamu Miyake, Yoshimasa Yoshioka
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Patent number: 11915853Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.Type: GrantFiled: November 6, 2020Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
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Patent number: 11901112Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer.Type: GrantFiled: August 12, 2020Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Seung Mo Lim, No Il Park, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11887770Abstract: A coil component includes a wound coil having a winding portion, having at least one turn, and a lead-out portion extending from an end portion of the winding portion to provide a separation space together with the winding portion and a body including an insulating resin and magnetic powder particles and embedding the wound coil therein. The body has a low-density portion disposed in the separation space and having magnetic powder particle density lower than average magnetic powder particle density of an entirety of the body.Type: GrantFiled: October 30, 2020Date of Patent: January 30, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyeon Yu Song, Hyung Ho Kim, Sung Jin Park, Sang Ho Shin
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Patent number: 11887769Abstract: An inductor includes a body, a coil pattern embedded in the body, a first external electrode and a second external electrode disposed on one surface of the body to be respectively connected to both ends of the coil pattern, and a support member disposed inside the body to support the coil pattern, wherein b/a?1.5, in which “a” denotes a distance from a central surface between top and bottom surfaces of the support member to a top surface of the body, and “b” denotes a distance from the central surface of the support member to a bottom surface of the body.Type: GrantFiled: October 9, 2019Date of Patent: January 30, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Hee Kim, Jong Min Lee
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Patent number: 11876520Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.Type: GrantFiled: July 30, 2021Date of Patent: January 16, 2024Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Andrew T. D'Amico
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Patent number: 11842843Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.Type: GrantFiled: June 11, 2020Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Sik Shin, Jae Wook Lee, Sung Young Jo
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Patent number: 11842834Abstract: A coil component includes a body, a support substrate embedded in the body and having one end surface exposed to an external surface of the body, a coil portion disposed on the support substrate to be embedded in the body and having one end portion exposed to the external surface of the body together with the one end surface of the support substrate, and an external electrode disposed on the external surface of the body to be connected to the one end portion of the coil portion. The external electrode has an opening exposing at least a portion of the one end surface of the support substrate.Type: GrantFiled: April 30, 2020Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Young Sun Kim, Jong Min Lee
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Patent number: 11830665Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.Type: GrantFiled: August 2, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11830653Abstract: A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.Type: GrantFiled: August 1, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Byung Soo Kang, Yoon Mi Cha, Byeong Cheol Moon
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Patent number: 11823829Abstract: [Problem] To prevent peeling of a terminal electrode from a base portion and to improve precision in assembling a terminal electrode on a base portion. [Solution] Provided is a coil component comprising: a base portion having a first surface and a second surface connected to the first surface, a first virtual plane including the first surface and a second virtual plane including the second surface intersecting at an obtuse first angle; a coil portion formed by a conductor wound around the base portion; and a first terminal electrode connected electrically to the coil portion, the terminal electrode being made of a plate-shaped first metal plate having a first portion fixed to the first surface of the base portion by a first bonded portion, and a second portion bent towards the first portion and coming into contact at the leading end with the second surface of the base portion.Type: GrantFiled: August 18, 2020Date of Patent: November 21, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Tetsuya Oga, Katsuyuki Horie
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Patent number: 11769614Abstract: A coil component that can maintain a high magnetic permeability and improve a DC superposition characteristic, and a method for producing a magnetic powder-containing resin material used to provide such a coil component. A coil component according includes an element body including a coil conductor and a magnetic portion. The coil conductor is formed of a wound conductor wire. The magnetic portion containing metal magnetic material grains covered with an insulating coating, a resin, and insulator grains. The coil component further includes an external electrode electrically connected to an extended portion of the coil conductor and disposed on a surface of the element body. The insulator grains have a relative permeability lower than a relative permeability of the metal magnetic material grains, and the insulator grains and the insulating coating are a compound whose main component is the same.Type: GrantFiled: September 29, 2020Date of Patent: September 26, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Keiichi Ishida, Koichi Ida, Hideaki Ooi
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Patent number: 11756724Abstract: A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.Type: GrantFiled: September 27, 2019Date of Patent: September 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Dong Jin Lee, Young Ghyu Ahn
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Patent number: 11749447Abstract: An electronic component including an element body having a magnetic body; an internal electrode embedded in the element body and whose end portion is exposed from an end surface of the element body; and an external electrode on an outer surface of the element body. The external electrode has a bottom surface portion on a bottom surface of the element body, and an end surface portion extending to an end surface of the element body that intersects perpendicularly with the bottom surface. The end surface portion is connected to the internal electrode exposed from the end surface. The bottom surface portion includes a first bottom surface portion arranged on the element body side, and a second bottom surface portion arranged on an outer side of the first bottom surface portion. The first bottom surface portion is a resin electrode containing a resin and a conductive filler.Type: GrantFiled: September 28, 2020Date of Patent: September 5, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Minoru Gibu
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Patent number: 11735353Abstract: An inductor component comprising an insulating layer containing no magnetic substance, a spiral wiring formed on a first principal surface of the insulating layer and wound on the first principal surface, and a magnetic layer in contact with at least a portion of the spiral wiring.Type: GrantFiled: January 9, 2019Date of Patent: August 22, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Shinya Hirai, Koki Okamura, Akinori Hamada, Tomohiro Kido
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Patent number: 11705270Abstract: In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.Type: GrantFiled: May 19, 2020Date of Patent: July 18, 2023Assignee: TDK CORPORATIONInventors: Miyuki Asai, Hokuto Eda, Masazumi Arata, Hitoshi Ohkubo
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Patent number: 11705273Abstract: A coil component includes a core that includes a core part having a first end portion and a second end portion; and a first wire and a second wire that are wound around the core part from the first end portion to the second end portion in substantially helical shapes so as to have substantially the same number of turns. The first wire is wound so as to form a first layer that contacts the peripheral surface of the core part, the second wire is wound such that at least part of the second wire forms a second layer on the outside of the first layer, and a first coil length formed by the first wire is longer than a second coil length formed by the second wire.Type: GrantFiled: September 18, 2019Date of Patent: July 18, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Kohei Kobayashi, Shizuka Moriya, Yuki Nakamura
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Patent number: 11676757Abstract: An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.Type: GrantFiled: July 15, 2020Date of Patent: June 13, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Shinji Otani, Yuuta Hoshino, Toshihiko Kobayashi, Tomotaka Gotohda
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Patent number: 11657955Abstract: A surface mount inductor includes a coil including a conducting wire winding portion with both ends on the outer circumference and a pair of extension portions that extend from the outer circumference, a molded body containing a metal magnetic powder and the coil embedded, and a pair of outer terminals disposed on the molded body and connected to the extension portions. The molded body has principal surfaces, end surfaces, and side surfaces. One principal surface serves as a mounting surface including a recessed portion with an elevated region and a lowered region. The coil is embedded in the molded body with the winding axis of the winding portion parallel to the recessed portion, and the pair of extension portions extend from the outer circumference toward the mounting surface to be exposed at the lowered region and connected to the pair of outer terminals in the lowered region.Type: GrantFiled: April 2, 2019Date of Patent: May 23, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryota Watanabe, Masaki Kitajima, Takeo Ohaga
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Patent number: 11651888Abstract: A flange portion includes a projecting surface that is positioned in a leading end of a projection projecting toward a mounting substrate and that faces the mounting substrate, and a principal surface that extends in a direction crossing the projecting surface and that faces a direction in which the pair of flange portions are aligned. A metal terminal includes a mounting portion opposed to the projecting surface and an end surface portion opposed to the principal surface. An angle ? between the mounting portion and the end surface portion satisfies the relationship 85 degrees??<90 degrees. The angle ? between the mounting portion and the end surface portion is smaller than an angle ?1 between the projecting surface and the principal surface.Type: GrantFiled: January 31, 2019Date of Patent: May 16, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Akio Igarashi, Kazuhiko Takenaka, Shigeto Yamamoto, Ryota Hashimoto, Yuki Kanbe
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Patent number: 11640870Abstract: A coil component includes a body having one surface and the other surface opposing each other in a first direction; an internal insulating layer buried in the body; a coil portion disposed in the internal insulating layer, and forming at least one turn centering on an axis in a second direction perpendicular to the first direction; first and second external electrodes disposed on one surface of the body and spaced apart from each other, and connected to the coil portion; an external insulating layer covering the body and exposing the first and second external electrodes. Lengths of the first and second external electrodes taken in the second direction are shorter than a length of the external insulating layer taken in the second direction.Type: GrantFiled: February 21, 2019Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 11615905Abstract: A shielded inductor and a method of making a shielded inductor are provided. The shielded inductor includes a core body surrounding a conductive coil, leads in electrical communication with the coil, and a shield covering at least parts of the outer surface of the core body. An insulating material may be provided between parts of the core body and parts of the shield. A method of making a shielded inductor is also provided.Type: GrantFiled: October 11, 2019Date of Patent: March 28, 2023Assignee: Vishay Dale Electronics, LLCInventors: Darek Blow, Timothy M. Shafer, Chris Gubbels, Benjamin M. Hanson
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Patent number: 11610727Abstract: A coil component 100 includes a first coil element 111 and a second coil element 112 each formed in an angular-tubular shape and disposed in parallel by winding and laminating a single flat wire 101 in one direction with edgewise-winding between one end portion 101A and another end portion 101B and bending the wound and laminated coil into two, and includes an interconnection part 113 for connecting the both elements. The interconnection part 113 includes a coil element winding end portion side raised part 123A, a coil element winding start portion side raised part 123B, and an intermediate part 123C extended between the two raised parts 123A and 123B.Type: GrantFiled: January 24, 2019Date of Patent: March 21, 2023Assignee: SUMIDA CORPORATIONInventor: Hiroshi Kawashima
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Patent number: 11610716Abstract: A transformer comprises an iron core, a support module, a winding unit, a potting box. The potting box includes an inner wall, an outer wall and a bottom plate and the inner wall is sleeved in the outer wall. The bottom plate is connected to a bottom portion of the inner wall and a bottom portion of the outer wall and a potting space is defined by the outer wall, the inner wall and the bottom plate. The winding unit is disposed in the potting space and a magnetic pole of the iron core penetrates through an inner side of the inner wall of the potting box. The support module is disposed between at least one end surface of the potting box and a cover of the iron core to form an insulation clearance. The support module is close to the inner wall of the potting box.Type: GrantFiled: March 31, 2020Date of Patent: March 21, 2023Assignee: Delta Electronics (Shanghai) CO., LTDInventors: Yong Zeng, Teng Liu, Jianxing Dong
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Patent number: 11587716Abstract: A inductive component is provided, which comprises a magnetic core, an insulation body formed of an electrically insulating material and having the magnetic core accommodated therein, and a coil body having at least one winding wound thereon. The insulation body comprises at least two mechanically connected insulation wall sections, which each face, at least partially, a respective side surface section of the magnetic core. The coil body comprises at least one contact element attached to a side surface section of the coil body and used for establishing an electric connection to the at least one winding, and a magnetic core accommodation in which the magnetic core accommodated in the insulation body is partially accommodated. A side surface section of the magnetic core, which faces the contact element, is covered, at least partially, by an insulation wall section of the insulation body.Type: GrantFiled: November 20, 2018Date of Patent: February 21, 2023Assignee: SUMIDA COMPONENTS & MODULES GMBHInventors: Christoph Spath, Johannes Hofbauer, Rainer Pilsl
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Patent number: 11581120Abstract: A core component is made of a sintered body of an inorganic powder, in which the core component includes a columnar winding portion and a flange portion integrally formed with the columnar winding portion at both axial ends of the columnar winding portion, in which when observed in a cross section perpendicular to an axial direction, a surface layer portion of the columnar winding portion and a surface layer portion of the flange portion have a void occupancy area smaller than a void occupancy area of an inside of the columnar winding portion and of an inside of the flange portion, respectively.Type: GrantFiled: July 29, 2019Date of Patent: February 14, 2023Assignee: KYOCERA CorporationInventors: Hitomi Ochiai, Masamichi Shingu, Yuki Kitagawa, Hideki Mori, Mitsuya Takayama
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Patent number: 11569016Abstract: A coil assembly for a magnetic actuator is described, the coil assembly comprising: —a tubular coil holder (100) comprising a first (110) and second open distal end (120); —the first open distal end comprising an outer circular rim (112) and an inner circular rim (114) separated by a circular groove (116); —the second open distal end comprising an outer circular rim (122); the tubular coil holder further comprising a central circular rim (130) arranged substantially halfway between the inner circular rim of the first open distal end and the outer circular rim of the second open distal end; —a coil (140) formed of a single wire (150) the coil comprising a first coil section (142) arranged in a first winding area (144) between the inner circular rim of the first open distal end and the central circular rim, and a second coil section (146) in a second winding area (148) between the central circular rim and the outer circular rim of the second distal end; the first coil section and the second coil section being wType: GrantFiled: February 11, 2019Date of Patent: January 31, 2023Assignee: MAGNETIC INNOVATIONS B.V.Inventor: Johannes Adrianus Antonius Theodorus Dams
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Patent number: 11562852Abstract: A coil component includes a body having one surface and the other surface and a plurality of wall surfaces, first and second insulating substrates spaced apart from each other, first and second recesses disposed in both end surfaces of the body and extending to one surface of the body, first and second coil portions disposed on the first and second insulating substrates, one ends and the other ends of the first and second coil portions being exposed to the first and second recesses, first and second external electrodes disposed along an inner surface of the first recess and one surface of the body and connected to one ends of the first and second coil portions, and third and fourth external electrodes disposed along an inner surface of the second recess and one surface of the body and connected to the other ends of the first and second coil portions.Type: GrantFiled: September 13, 2019Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: No Il Park, Seung Mo Lim, Tai Yon Cho, In Young Kang, Byeong Cheol Moon, Doo Ho Park, Jeong Hoon Ryou, Tae Jun Choi
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Patent number: 11546994Abstract: A voltage regulator module with a vertical layout structure includes a circuit board assembly, an electroplated region and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. The printed circuit board includes a first surface, a second surface, a plurality of lateral surfaces, an accommodation space and a conductive structure. The switch element is disposed on the first surface. A conduction part is formed on the second surface. The conductive structure is perpendicular to the printed circuit board and disposed within the accommodation space. The electroplated region is formed on the corresponding lateral surface, arranged between the conduction part and the first surface, and electrically connected with the conduction part and the switch element. The magnetic core assembly is accommodated within the accommodation space. Consequently, an inductor is defined by the conductive structure and the magnetic core assembly collaboratively.Type: GrantFiled: October 16, 2020Date of Patent: January 3, 2023Assignee: DELTA ELECTRONICS, INC.Inventors: Xueliang Chang, Shengli Lu, Mingyun Yang, Qinghua Su
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Patent number: 11545295Abstract: A coil component includes first and second wires wound around a winding core portion of a core, and third and fourth wires wound around outside a portion of the first and the second wires wound around the winding core portion in an opposite direction to a winding direction of the first and second wires. The portion of the first and second wires wound around the winding core portion has a first twisted wire portion twisted together. A length of the first wire or a length of the second wire of the portion of the first and second wires wound around the winding core portion is configured to be equal to a length of the third wire or a length of the fourth wire of the portion of the third and fourth wires wound around outside the portion of the first and second wires wound around the winding core portion.Type: GrantFiled: December 19, 2019Date of Patent: January 3, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Akio Igarashi
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Patent number: 11521790Abstract: A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.Type: GrantFiled: March 26, 2019Date of Patent: December 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Gu Yeo, Byeong Cheol Moon
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Patent number: 11495392Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.Type: GrantFiled: September 11, 2019Date of Patent: November 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ye Eun Jeong, Jin Ho Hong