Thin Film Or Resoldering (e.g., Eutetic Alloy) Patents (Class 337/152)
  • Patent number: 9852858
    Abstract: A contact of a vacuum interrupter comprises a contact body portion formed in the shape of a circular plate, having a contact surface in a flat shape on one surface thereof, and provided with a plurality of cut portions formed in a spiral shape from a center of the contact surface toward an outer side in a radial direction, and an inclination area formed between the contact surface and an outer circumferential surface of the contact body portion, wherein the inclination area is provided with multi-stage inclined portions each forming a multi-stage inclination along the outer side of the contact body portion in the radial direction.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: December 26, 2017
    Assignee: LSIS CO., LTD.
    Inventor: Byungchul Kim
  • Patent number: 9504142
    Abstract: A flexible flat circuit includes a pair of insulation sheets, and a plurality of conductors that are held between and covered with the pair of insulation sheets in a state that the plurality of conductors are separated to each other. Among from the plurality of conductors, at least conductors with different current capacities are different in thickness to each other.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: November 22, 2016
    Assignee: YAZAKI CORPORATION
    Inventor: Hisashi Hanazaki
  • Patent number: 8941461
    Abstract: A circuit protection device includes a substrate with first and second electrodes connected to the circuit to be protected. The circuit protection device also includes a heater element between the first and second electrodes. A sliding contact is connected by a sensing element to the first electrode, second electrode, and heater element, thereby bridging and providing a conductive path between each. A spring element is held in tension by, and exerts a force parallel to a length of the substrate against, the sliding contact. Upon detection of an activation condition, the sensing element releases the sliding contact and the force exerted by the spring element moves the sliding contact to another location on the substrate at which the sliding contact no longer provides a conductive path between the first electrode, second electrode, and heater element.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: January 27, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Anthony Vranicar, Martyn A. Matthiesen, Wayne Montoya
  • Patent number: 7109839
    Abstract: A fuse link, especially for low voltage, high-breaking-capacity fuses, includes at least one fusible conductor having a soldering substance in a solder depot of a carrier, the solder being tin-based and the carrier being copper-based. The solder contains a tin alloy as an active substance, the tin alloy having two other constituents. The first constituent, which is the larger of the two in weight percent but which is smaller in weight percent than the proportion of the base substance tin, is selected for lowering the fusion temperature of the solder. The second constituent, which is the smaller of the two in weight percent, is a substance which does not dissolve in tin. Crystal nuclei are formed when said substance is cooled from the liquid state to the solid state, creating a fine structure and preventing the structure from becoming coarse under a load.
    Type: Grant
    Filed: September 11, 2001
    Date of Patent: September 19, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Etschmaier, Helmut Wieser
  • Patent number: 6791448
    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12).
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: September 14, 2004
    Assignee: ABB Research LTD
    Inventors: Uwe Kaltenborn, Pal Kristian Skryten
  • Publication number: 20030098770
    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12).
    Type: Application
    Filed: November 1, 2002
    Publication date: May 29, 2003
    Inventors: Uwe Kaltenborn, Pal Kristian Skryten
  • Patent number: 6064293
    Abstract: A thermal fuse, preferably for a high-temperature battery, comprising leads and a body therebetween having a melting point between approximately 400.degree. C. and 500.degree. C. The body is preferably an alloy of Ag--Mg, Ag--Sb, Al--Ge, Au--In, Bi--Te, Cd--Sb, Cu--Mg, In--Sb, Mg--Pb, Pb--Pd, Sb--Zn, Sn--Te, or Mg--Al.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: May 16, 2000
    Assignee: Sandia Corporation
    Inventors: Rudolph G. Jungst, James R. Armijo, Darrel R. Frear
  • Patent number: 5939969
    Abstract: A preformed thermal fuse comprising two electrodes, first and second layers of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse. The melting temperatures of the first and second layers of solder are selected to allow reflow soldering of the device.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: August 17, 1999
    Assignee: Microelectronic Modules Corporation
    Inventors: Bernhard E. Doerrwaechter, Keck C. Pathammavong, Kurt M. Krachenfels
  • Patent number: 5923239
    Abstract: A printed circuit board assembly comprising a printed circuit board having a plurality of conductive traces deposited on a surface thereof to define a plurality of electrical circuit geometries. A plurality of thin film fuses are deposited on the printed circuit board, each fuse providing circuit protection to one of the plurality of conductive traces.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: July 13, 1999
    Assignee: Littelfuse, Inc.
    Inventors: David J Krueger, Andrew J. Neuhalfen
  • Patent number: 5900798
    Abstract: In the metal piece 32 which diffuses into the fuse element so that an alloy layer is generated, there is formed an expanding slot 30, which is inserted and pressured in the fusing portion 25b of the fusible body 25 which forms the fuse element. Due to the foregoing, the metallic mass 32 of low fusing point is fixed to the fusible body 25 while it surrounds the circumferential surface of the fusing portion 25b.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: May 4, 1999
    Assignee: Yazaki Corporation
    Inventors: Hisashi Hanazaki, Kenji Muramatsu, Mitsuhiko Totsuka, Toshiharu Kudo
  • Patent number: 5883560
    Abstract: A fusible member of a fusible link element used as a large-current fuse comprises a sealed box-shaped structure having a pouring hole through an upper wall thereof. Molten tin is poured into this sealed box-shaped structure through the pouring hole, and is solidified to be integrated with the sealed box-shaped structure.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: March 16, 1999
    Assignee: Yazaki Corporation
    Inventors: Goro Nakamura, Kenji Muramatsu
  • Patent number: 5844477
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 1, 1998
    Assignee: Littelfuse, Inc.
    Inventors: Vladmir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5790008
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate with a groove on side surfaces and a plurality of conductive terminal pad layers. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: January 14, 1997
    Date of Patent: August 4, 1998
    Assignee: Littlefuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5760674
    Abstract: The fuse link includes a first and second interconnect, with interconnects each being substantially longer than deep. The interconnects are disposed toward each other with a insulator region between them. A fusible conductor, spanning the insulator region, is attached at the top of the interconnects. The present device allows the length of the fusible conductor to be shortened, and results in a fuse link that can be consistently blown with a single laser pulse. Additionally, the fuse link can be used in a staggered layout. The staggered layout of parallel fuse links allows a high number of links in a relatively small area, with or without the use of tungsten barriers, and allows accessing all fuse links through a single fuse blow window.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: June 2, 1998
    Assignee: International Business Machines Corporation
    Inventors: Richard A. Gilmour, Ronald R. Uttecht, Erick G. Walton
  • Patent number: 5748067
    Abstract: There is provided a fusing portion constituted by a high-melting point fusible metal element for coupling a pair of box-type terminals in the form of a link, and a low-melting point fusible metal element disposed at a substantially center portion of the high-melting point fusible metal element and containing a reducing element.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: May 5, 1998
    Assignee: Yazaki Corporation
    Inventors: Takashi Ishii, Naoki Matsuoka
  • Patent number: 5552757
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: September 3, 1996
    Assignee: Littelfuse, Inc.
    Inventors: Vladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5546066
    Abstract: The present invention provides a delayed-fusion fuse by which its predetermined durability can be reliably ensured, and its stable pre-arcing time-current characteristics can be obtained, even when a current exceeding the steady-state current such as a motor lock current frequently flows in the fuse. The delayed-fusion fuse includes a pair of electric connecting sections formed on both sides of a fusible section having a narrow fusing portion made of an electrically conductive metal. Also, the delayed-fusion fuse includes a metallic chip made of low fusing point metal for absorbing heat generated in the fusible section, and a covering and adhering section for holding the metallic chip on the fusible section. A thin metallic layer forms a solid solution with the low fusing point metal, where the solid solution requires an energy of formation which is higher than that of the formation of a solid solution made of the electrically conductive metal and the low fusing point metal.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: August 13, 1996
    Assignee: Yazaki Corporation
    Inventors: Hiroki Kondo, Mitsuhiko Totsuka, Toshiharu Kudo, Hisashi Hanazaki
  • Patent number: 5115220
    Abstract: A fuse including a fuse casing, an end cap terminal at an end of the casing, a substrate supporting a thin film fusible element thereon, and a springy metal connecting strip made of sheet metal and providing electrical connection between the element and the terminal and mechanical support for the substrate.
    Type: Grant
    Filed: January 3, 1991
    Date of Patent: May 19, 1992
    Assignee: Gould, Inc.
    Inventors: David E. Suuronen, Jean C. Terry
  • Patent number: 4405914
    Abstract: A thermal fuse is comprised of a pair of internested, flat, thin metallic plates, each plate having peripheral upturned flanges along opposite edges of the plate. The flanges of the lower plate each have a notch formed therein and the upper plate has a tab extending transversely from each side through a respective notch. The notches each have a side inclined to the plate to form a ramp, the edge corners of the tabs being cammed up the ramp of the respective notches when the plates are pulled apart in a direction parallel to the plane of the plates, to lift the upper plate perpendicularly away from the lower plate so that the flat confronting surfaces of the plates are drawn apart.
    Type: Grant
    Filed: September 18, 1981
    Date of Patent: September 20, 1983
    Inventor: Donald R. Ruegsegger