Abstract: The present invention relates to a new PTC device having a configuration with which protrusion of solder paste and/or an excess portion of epoxy resin do not adversely affect a jig. Such PTC device 30 comprises a PTC member 32 and leads 34 and 36 electrically connected to both sides of the PTC member the PTC member comprises a PTC element 38 and metal electrodes 40 and 42 placed on both sides of the PTC element respectively, each lead is electrically connected to the metal electrode respectively via an electrically conductive connection portion 50, and at least one 36 of the leads has a concave portion which is defined with a bottom portion 44 located adjacently to the metal electrode of the PTC member and a wall portion 46 surrounding the electrically conductive connection portion which connects the leads to the metal electrode.

Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.

Abstract: The present invention relates to a new PTC device having a configuration with which protrusion of solder paste and/or an excess portion of epoxy resin do not adversely affect a jig. Such PTC device 30 includes a PTC member 32 and leads 34 and 36 electrically connected to both sides of the PTC member. The PTC member includes a PTC element 38 and metal electrodes 40 and 42 placed on both sides of the PTC element respectively, and each lead is electrically connected to the metal electrode via an electrically conductive connection portion 50. At least one of the leads 36 has a concave portion which is defined with a bottom portion 44 located adjacently to the metal electrode of the PTC member and a wall portion 46 surrounding the electrically conductive connection portion which connects the leads to the metal electrode.

Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.

Abstract: A circuit protection device includes a substrate with first and second electrodes connected to the circuit to be protected. The circuit protection device also includes a heater element between the first and second electrodes. A sliding contact is connected by a sensing element to the first electrode, second electrode, and heater element, thereby bridging and providing a conductive path between each. A spring element is held in tension by, and exerts a force parallel to a length of the substrate against, the sliding contact. Upon detection of an activation condition, the sensing element releases the sliding contact and the force exerted by the spring element moves the sliding contact to another location on the substrate at which the sliding contact no longer provides a conductive path between the first electrode, second electrode, and heater element.

Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to an electric power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. The insulation cover 14 is provided with an opening porting 20 made of a through hole which is opposite to the soluble conductor 13. The flux 19 comes into contact with a peripheral edge part of the opening portion 20, retaining the flux 19 at a predetermined position on the soluble conductor 13.

Abstract: A circuit protection device includes a conductive layer which is connected to first and second terminals. A spring is electrically connected to the first and second terminals. When an over-voltage or over-temperature condition occurs within a charging circuit, one or more heat generating resistive elements melts material associated with one or more of the ends of the spring thereby releasing the spring to create an open circuit.

Abstract: A load drive controller for controlling a heat generating member by a switching element includes a temperature detection portion for detecting a physical quantity of a level corresponding to a temperature of the switching element, a protection function portion for outputting an abnormality signal corresponding to an overheated state of the switching element when the physical quantity detected by the temperature detection portion is larger than a value, a control portion for causing the heat generating member to generate heat by driving the switching element via a driving portion. Furthermore, the control portion causes a temperature adjustment portion to increase the temperature of the heat generating member when the abnormality signal is input from the protection function portion.

Abstract: An arrangement for releasably securing or connecting together at least two components includes a securing element that interconnects the components and that can be melted, thermally decomposed or otherwise separated by applying heat thereto. The securing element is preferably a monofilament or multifilament thread of natural or synthetic material, such as high strength polymer material. The arrangement further preferably includes a compression bracing structure such as a housing that bears compression forces between the components, while the securing element bears tension forces. The arrangement further preferably includes an electric resistance heating element that can be electrically energized and is arranged to apply heat to the thread, so as to melt or decompose and separate the thread and thereby release and separate the two interconnected components.

Abstract: A protective element contains a heat-generating member and a low melting metal member on a substrate, in which the low melting metal member is molten by the heat generated by the heat-generating member and flows onto electrodes, which causes the low melting metal member to blow out, Formula (1) below is satisfied: (cross-sectional area of the low melting metal member)/(surface area of the blowout-effective electrode)≦0.15  (1) Alternatively, Formula (2) below is satisfied: 2.5≦(inter-electrode distance)/(cross-sectional area of the low melting metal member)≦30  (2) wheren the inter-electrode distance is defined as the distance between two electrodes, among the low melting metal member electrodes onto which the molten low melting metal member flows, which are adjacent to each other with the low melting metal member interposed therebetween.

Abstract: An improved PTC fuse assembly is described. The PTC fuse assembly includes a PTC fuse having a PTC material. To expedite heating of the PTC material, the improved PTC fuse assembly includes a die package in thermal communication with the PTC material. The die package includes a die which is responsible generating heat once a threshold has been reached. To mount the die package to a printed circuit board, the die package includes leads. The leads are sufficiently flexible such that the heat generated by the die does not compromise performance of the PTC protection circuit.

Abstract: Circuit protection device having a PTC element in series with a fusible element. The device includes a PTC element having first and second electrodes in electrical contact with the PTC element. An insulating layer is disposed on the first and second electrodes. Portions of the insulating layer are removed to form first and second contact points. A first conductive layer is in electrical contact with the first electrode and wraps around the PTC element. A portion of the first conductive layer forms a fusible element. A second conductive layer is in electrical contact with the second electrode. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device. The wrap-around configuration also permits current to flow in series through the PTC element and the fusible element for added protection from overcurrent conditions.